CN100377625C - 布线电路衬底及其制造方法 - Google Patents
布线电路衬底及其制造方法 Download PDFInfo
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- CN100377625C CN100377625C CNB001296817A CN00129681A CN100377625C CN 100377625 C CN100377625 C CN 100377625C CN B001296817 A CNB001296817 A CN B001296817A CN 00129681 A CN00129681 A CN 00129681A CN 100377625 C CN100377625 C CN 100377625C
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- wired circuit
- protuberance
- circuit substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
Abstract
Description
Claims (21)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP289277/99 | 1999-10-12 | ||
JP28927799A JP2001111189A (ja) | 1999-10-12 | 1999-10-12 | 配線回路基板とその製造方法 |
JP289277/1999 | 1999-10-12 | ||
JP374462/1999 | 1999-12-28 | ||
JP374462/99 | 1999-12-28 | ||
JP37446299A JP3981227B2 (ja) | 1999-12-28 | 1999-12-28 | 多層配線基板とその製造方法 |
JP142658/2000 | 2000-05-16 | ||
JP142658/00 | 2000-05-16 | ||
JP2000142658A JP2001326459A (ja) | 2000-05-16 | 2000-05-16 | 配線回路基板とその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1292635A CN1292635A (zh) | 2001-04-25 |
CN100377625C true CN100377625C (zh) | 2008-03-26 |
Family
ID=27337500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001296817A Expired - Fee Related CN100377625C (zh) | 1999-10-12 | 2000-10-12 | 布线电路衬底及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (6) | US6528874B1 (zh) |
EP (4) | EP2278865B1 (zh) |
KR (1) | KR100495957B1 (zh) |
CN (1) | CN100377625C (zh) |
TW (1) | TW512467B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103199077A (zh) * | 2012-01-04 | 2013-07-10 | 联发科技股份有限公司 | 模塑插入层封装及其制造方法 |
CN110418508A (zh) * | 2019-07-15 | 2019-11-05 | 宁波华远电子科技有限公司 | 一种铜基板电路板的制作方法 |
Families Citing this family (105)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW512467B (en) * | 1999-10-12 | 2002-12-01 | North Kk | Wiring circuit substrate and manufacturing method therefor |
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- 2000-10-11 EP EP10011151.7A patent/EP2288244B1/en not_active Expired - Lifetime
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US9040359B2 (en) | 2012-01-04 | 2015-05-26 | Mediatek Inc. | Molded interposer package and method for fabricating the same |
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CN110418508A (zh) * | 2019-07-15 | 2019-11-05 | 宁波华远电子科技有限公司 | 一种铜基板电路板的制作方法 |
CN110418508B (zh) * | 2019-07-15 | 2021-08-31 | 宁波华远电子科技有限公司 | 一种铜基板电路板的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
US20030143833A1 (en) | 2003-07-31 |
US20070209199A1 (en) | 2007-09-13 |
KR100495957B1 (ko) | 2005-06-17 |
US7721422B2 (en) | 2010-05-25 |
EP2278865A1 (en) | 2011-01-26 |
EP2278865B1 (en) | 2016-05-11 |
US7096578B2 (en) | 2006-08-29 |
EP1093329A3 (en) | 2006-01-18 |
US20060258139A1 (en) | 2006-11-16 |
EP2288244B1 (en) | 2013-06-26 |
US7546681B2 (en) | 2009-06-16 |
US20030151067A1 (en) | 2003-08-14 |
EP2288244A1 (en) | 2011-02-23 |
US20040197962A1 (en) | 2004-10-07 |
US6528874B1 (en) | 2003-03-04 |
US6646337B2 (en) | 2003-11-11 |
EP1093329A2 (en) | 2001-04-18 |
EP2306797B1 (en) | 2017-04-05 |
EP2306797A1 (en) | 2011-04-06 |
CN1292635A (zh) | 2001-04-25 |
US6828221B2 (en) | 2004-12-07 |
KR20010050954A (ko) | 2001-06-25 |
TW512467B (en) | 2002-12-01 |
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