CN100383986C - 具有封装内的定量和光谱检测能力以及数字信号输出的多片式发光二极管封装件 - Google Patents

具有封装内的定量和光谱检测能力以及数字信号输出的多片式发光二极管封装件 Download PDF

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CN100383986C
CN100383986C CNB028029917A CN02802991A CN100383986C CN 100383986 C CN100383986 C CN 100383986C CN B028029917 A CNB028029917 A CN B028029917A CN 02802991 A CN02802991 A CN 02802991A CN 100383986 C CN100383986 C CN 100383986C
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light
transducer
led
signal output
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CN1636280A (zh
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G·W·布鲁宁
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20Controlling the colour of the light
    • H05B45/22Controlling the colour of the light using optical feedback
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40Details of LED load circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

一个多片式发光二极管组件,具有:支撑件;至少两个设置在支撑件上的发光二极管芯片;至少一个设置在支撑件上的传感器,该传感器用来向控制器报告有关发光二极管的光输出的量和光谱信息;信号处理电路,其包括设置在支撑件上的模拟-数字转换器逻辑电路,用来将传感器产生的模拟信号输出转换为数字信号输出。

Description

具有封装内的定量和光谱检测能力以及数字信号输出的多片式发光二极管封装件
技术领域
本发明涉及多片式放光二极管(LED)封装件,尤其涉及一种多片式LED封装件,该多片式LED封装件具有安装两个或者更多LED芯片的支撑件,一个或者多个用来测量LED输出光的量和光谱特征的反馈传感器,包括一个模拟/数字的转换器逻辑电路的数字信号处理电路,该电路用来提供从传感器到封装件外部的控制器的数字信号输出,控制器控制LED的输出流明和颜色分量。
背景技术
多片式LED组件在现有技术中已有应用,如白光照明装置。例如,Schoniger等人的美国专利No.5136483描述了一个白光照明装置如头灯,该白光照明装置采用红,绿和蓝的LED,它们被同时使用且其颜色相互补充以产生白光。
在Turnbull等人的美国专利No.5803579中说明了另一种白光照明装置。本专利中的照明装置包括多个位于支撑件上的LED。当所有的LED被通电,呈现首先被察觉到的色调例如蓝-绿的照明被从多个LED中的至少一个发射出来,并与多个剩余的LED中的至少一个发射出来的呈现之后被察觉到的色调例如黄色的照明重叠和混合。这样重叠并混合的灯彩形成白色。
这些装置通常采用一种控制器,用来至少是“开”和“关”LED。LED的光输出和颜色还可以通过控制器可调节地控制。这需要运用某些类型的外部光学传感器来感测装置的输出流明和颜色(波长),并且将该信息提供给控制器。
使用外部光学传感器会给装置带来不想要的尺寸和成本上的增加。另外,在这些现有的装置中无法测量LED的工作温度。LED工作温度是很重要的,因为工作温度的改变能影响LED输出的量和光谱,因此影响所述装置。
因此,需要一个多片式LED封装件,其基本克服如上所述的现有技术中的多片式LED封装件的缺点,并且在成本、空间和制造方便程度方面进一步提高。
发明内容
一种多片式发光二极管封装件,包括一个支撑件,设置在支撑件上的至少两个发光二极管芯片,和设置在支撑件上的至少一个传感器,该传感器用来向一个控制发光二极管的光输出的控制器报告量和光谱信息,所述传感器包括一个光学反馈传感器和一个热反馈传感器。
本发明的一个方面包括一个设置在支撑件上的信号处理电路,用来准备由传感器产生的模拟信号输出以用于由控制器进行数字处理。
本发明的另外一个方面包括一个在上述信号处理电路中提供的模拟/数字转换器逻辑电路,用来将传感器产生的模拟信号输出转化为数字信号输出。
附图说明
当考虑结合附图详细描述的说明性的实施例后,本发明的优点、特性和多种辅助特征将更充分地呈现出来。
图1是根据本发明的示范性实施例的一个多片式LED封装件的透视图。
具体实施方式
图1示出了一个根据本发明示范性实施例的多片式LED封装件10。多片式LED封装件10包括:一个支撑件12,其安装了两个或者更多LED芯片或“管芯”14(图中示出4个);至少一个反馈传感器15,用来向封装件10外部的控制器30报告的量和光谱信息;信号处理电路20,用于准备由一个或者更多个传感器15产生的信号以用于由控制器30进行数字处理。光学装置22可以安装在支撑件12上的LED芯片14、传感器16、18和信号处理电路20上方,用来在光学上处理组件10产生的光。
支撑件12是一个热传导元件,包括:正电和负电电源端口26,用来使LED芯片14和外部电源28(如图所示每一个LED芯片14均配置一个正电端口,使得为每一个芯片14提供的电能都能单独地调节)相连接;至少一个数字信号输入/输出(I/O)端口32,用来使至少一个反馈传感器15和信号处理电路20与外部控制器30相连接。在本发明的另外一个实施例中,数字信号I/O端口32可以被两个数字端口(未示出)代替,即一个输入端口和一个输出端口。在本发明的一个示范性实施例中,支撑件12可以包括印刷电路板,陶瓷衬底,外壳或者其他能支撑单独的LED芯片并且同时将LED芯片与电源端口电连接的结构,将一个或者更多传感器与信号处理电路电连接,并将信号处理电路连接到数字信号端口。
用在封装件10中的LED芯片14可以包括任何一组有用的LED颜色和任一有用的LED芯片数量,使得多片式LED封装件10工作以产生白色或者其它颜色的光。为了说明目的而不是限制,用在多片式LED封装件中,尤其是准备用来产生白光的多片式LED封装件中的LED芯片14可以包括常规的绿、红和蓝色LED芯片,它们相应地发射出绿、红和蓝光。任意数量的LED芯片可以用来优化由封装件10产生的白光的品质。例如,LED芯片14可以包括一个红色LED芯片,两个绿色LED芯片和一个蓝色LED芯片。
所述一个或者更多的反馈传感器15可以包括一个或者更多光学传感器,一个或者更多热传感器,更好的是如图所示的至少一个光学传感器16和至少一个热传感器18的组合。光学传感器16向外部控制器30报告LED14的量(光强度)和光谱(波长)方面的输出。在封装件内设置光学传感器可以减小光源LED模块的尺寸和成本,该LED模块可以采用本发明的多片式LED封装件。为说明而非限定的目的,光学传感器可以包括一个常规的光敏元件,如光电二极管。
热传感器18可以包括一个半导体二极管结点,一个带隙基准电路或者任一其它用于集成电路技术中热感应元件。热传感器18通过测量支撑件12的温度将LED14输出的量和光谱报告给外部控制器30,该温度又与LED芯片14的工作温度相关。LED芯片14的工作温度变化能影响其输出量和光谱。因此,当LED芯片14的工作温度发生变化时,通过由热传感器18报告给控制器,然后对输送到LED14的电源电流进行了调整,从而能够使LED芯片14输出的量和光谱保持不变。
热传感器18还可以用作安全保护装置。但只是举例而不限于此,热传感器18可以被用来保扩LED14以防止过热和持续的损害。
信号处理电路20将由一个或者更多传感器15(光学和热传感器16和18)产生相关的低压模拟信号输出,以用于通过将其按比例放大和为数字变换将其编码而进行数字化处理。在“封装件内部”设置A/D转换器逻辑电路能有利地减少封装件内的元件重复,并能减少封装件的成本和空间需要。信号处理电路20可以以模拟或者数字的形式实现,并且最好包括一个模拟到数字(A/D)的转换器逻辑电路24,用来将一个或者更多传感器15的已被按比例放大和编码的模拟信号输出转换为数字信号输出。由于这些电路的多种变化在本领域内是众所周知的,因此没有必要详细描述这些电路的结构和功能,在此不再赘述。
光学装置22可以包括一个或者更多光学元件,用来在光学上控制由多片式LED封装件10产生的光。例如,光学装置22可以包括一个准直仪,其将由封装件10的LED芯片14产生的光汇聚和/或成形。这样的光学元件在本领域是众所周知的,可以用塑料或者玻璃进行常规的制造。
尽管上面结合实施例对本发明进行了说明,但在不背离本发明精神的情况下还可以做出各种各样修正和改变。例如但不限于此,热传感器18可以结合到信号处理电路20中。另外,一个热传感器18可以提供给每一个LED芯片14。这些和任何一个其它的这样修正和改变都被认为是在随后的权利要求范围之内的。

Claims (6)

1.一种多片式发光二极管封装件(10),包括:
支撑件(12);
至少两个设置在支撑件(12)上的发光二极管芯片(14);
至少一个设置在支撑件(12)上的传感器(15),用来向控制器(30)报告信息,该信息是与发光二极管(14)的光输出有关的,所述传感器(15)包括一个光学反馈传感器(16)和一个热反馈传感器(18)。
2.如权利要求1所述的多片式发光二极管封装件(10),其中至少一个传感器(15)产生模拟信号输出,并进一步包括设置在支撑件(12)上的信号处理电路(20),该信号处理电路用来将由至少一个传感器(15)产生的模拟信号输出转换为数字信号输出。
3.如权利要求2所述的多片式发光二极管封装件(10),其中信号处理电路(20)包括模拟/数字转换器逻辑电路(24)。
4.如权利要求1所述的多片式发光二极管封装件(10),进一步包括至少一个数字信号端口(32),用来将至少一个传感器(15)的输出电连接到控制器(30)。
5.如权利要求1所述的多片式发光二极管封装件(10),进一步包括光学装置(22),其用来操纵发光二极管(14)的光输出。
6.一种光发生器,包括:
至少一个根据权利要求1-5之一所述的多片式发光二极管封装件(10)。
CNB028029917A 2001-07-26 2002-07-23 具有封装内的定量和光谱检测能力以及数字信号输出的多片式发光二极管封装件 Expired - Lifetime CN100383986C (zh)

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US09/915,700 US6617795B2 (en) 2001-07-26 2001-07-26 Multichip LED package with in-package quantitative and spectral sensing capability and digital signal output

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