CN100392978C - Preparation method of vibration cavity of plate ceramic frequency device and special platform for adhering it - Google Patents
Preparation method of vibration cavity of plate ceramic frequency device and special platform for adhering it Download PDFInfo
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- CN100392978C CN100392978C CNB2004100165890A CN200410016589A CN100392978C CN 100392978 C CN100392978 C CN 100392978C CN B2004100165890 A CNB2004100165890 A CN B2004100165890A CN 200410016589 A CN200410016589 A CN 200410016589A CN 100392978 C CN100392978 C CN 100392978C
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Abstract
The present invention discloses a method for manufacturing a vibration cavity of a sheet piezoelectric ceramics frequency device, and a special paster workbench. The method is characterized in that adhesive paper is used as a mask film for a ceramic plate; concave pits are formed on the ceramic plate by sand, which avoids affecting the concave pit precision by the contraction nonuniformity in the sintering process of the ceramic plate. The manufacture process is carried out on the special paster workbench, the concave pit precision on the ceramic plate and the gluing precision of the ceramic plate and a piezoelectric vibrator are guaranteed, and thus, the precision of the vibration chamber is guaranteed. The present invention has the advantages of good technology repetitiveness and simple operation.
Description
Technical field
The present invention relates to the preparation method of ceramic frequency device, be specifically related to the preparation method and the used paster workbench of this implementation method of the vibration cavity of sheet type piezoelectric ceramic frequency device.
Background technology
The piezoelectric ceramic frequency device is mainly used in fields such as communication, TV, computer, industrial automation, is used to produce the time-base oscillation frequency or carries out frequency-selecting in these fields.
The piezoelectric ceramic frequency device is that the principle of utilizing piezoelectric ceramic can produce mechanical oscillation under the effect of alternating electric field is made.Therefore, it is not influenced by outside electromagnetic interference.In use, do not need as other frequency element for preventing that electromagnetic interference from carrying out complicated shielding.To the miniaturization of electronic product, integrated considerable meaning arranged.
Because piezoelectric ceramic vibrator carries out work with the mechanical oscillation mode.Therefore, it must have an oscillation space, just the vibration cavity of our the ceramic frequency device that will say.Piezoelectric vibrator should occupy the centre position of vibration cavity in theory, sees Fig. 1.Therefore, in the actual fabrication process, how to control the big or small position of two halves vibration cavity up and down, just become ceramic frequency device key of success.Common manufacture method is: the mould of making a band array pit earlier, then ceramic powder is pressed into the living embryonic plate that has the array pit in opening the mould that makes in advance, become ceramic wafer through about 1200 ℃ high temperature sintering again, between two ceramic wafers, clamp the piezoelectric ceramic vibrator sheet again by adhesive, cut into junior unit then, constitute piezoelectric ceramic vibration chamber.This preparation method's disadvantage is exactly that the positioning accuracy of pit is subjected to ceramic post sintering to shrink uneven the influence, and that can not do is very high.In addition, because product is very little, the vibration cavity diameter is generally all about 2～3mm, and it is difficult that the groove position of two ceramic wafers is accurately aimed at relatively, if the location of pit is inaccurate, will directly have influence on the performance and the qualification rate of product.And product minor issue is big more more, limited the production and the development of product greatly.
Summary of the invention
The purpose of this invention is to provide a kind of performance that can improve chip pottery frequency device and qualification rate the piezoelectric ceramic frequency device vibration cavity the preparation method and for realizing the used paster workbench of this method.
For achieving the above object, the preparation method of vibration cavity of the present invention is as follows:
A. the planar dimension according to the chamber requires to make a m * n array high accuracy towards the paper matrix tool, m=1,2,3 ..., n=1,2,3,
B. utilize this mould and punch press to go out m * n array hole on commercially available sticking paper, the size in this hole is exactly the planar dimension of vibration cavity;
C. prepare two two parallel ceramic wafers, the ceramic wafer planar dimension is identical with sticking paper;
The sticking paper that D. will have the array hole is placed on the paster workbench, sticking paper down, substrate up, and two limits that will glue paper are close to three alignment pins on the paster workbench, open the negative pressure device of workbench, will glue paper and suck, tweezer lightly then substrate is removed, the both sides of ceramic wafer are close to three alignment pins again and are put into subsides jail on the sticking paper, close negative pressure device, this moment, sticking paper transferred the mask of ceramic wafer to;
The ceramic wafer that E. will have mask is placed on and carries out sandblast on the sand-blasting machine, forms the pit array the same with sticking paper precision at last on ceramic wafer, and the degree of depth of pit is decided as required;
F. remove mask paper, the piezoelectric vibrator sheet is clipped between two ceramic wafers with identical array pit, make pit relative, be placed on the bonding die workbench, coated with adhesive between them, and make their two limits be close to three alignment pins on the paster workbench, pressurization makes three to be bonded into one, cut into junior unit then, constitute piezoelectric ceramic vibration chamber.When this step, do not need to open the negative pressure device of workbench.
For realizing the used paster workbench of said method, by a platform, there is a chain-wales with many apertures that protrudes the centre of platform.On two orthogonal limits of chain-wales three alignment pins are arranged, wherein two alignment pins are close to long limit, and an alignment pin is close to minor face, have one to provide the air extractor of negative pressure for chain-wales under chain-wales.
Characteristics of the present invention are:
1. the pit on the ceramic wafer is processed after becoming porcelain, and positioning accuracy can be done quite highly.
2. produce the pit of high position precision with " paster sand-blast ", cost is inefficient high.
3. special-purpose paster workbench has guaranteed the positioning accuracy of pit on the ceramic wafer, and the bonding precision of ceramic wafer and piezoelectric vibrator sheet makes good process repeatability, and complicated technology has been oversimplified.
Description of drawings
Fig. 1 is the cross-sectional view of sheet type piezoelectric ceramic frequency device vibration cavity;
Fig. 2 is the perspective view in the piezoelectric vibration chamber of sheet type piezoelectric ceramic frequency device;
Fig. 3 is the ceramic wafer and the piezoelectric vibrator bond graph of band array pit;
Fig. 4 is the structural representation of paster workbench;
Fig. 5 is the arrangement schematic diagram in sticking paper array hole;
Fig. 6 is the arrangement schematic diagram of ceramic wafer array pit.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail:
As shown in drawings, the piezoelectric vibration chamber is by last ceramic wafer 1, following ceramic wafer 2, and piezoelectric vibrator 3 and cavity 4 are formed.The preparation process of said upward ceramic wafer 1 and following ceramic wafer 2 is basic identical, and different is to go up on the ceramic wafer 1 tin electrode of making by printing 5 is arranged.
Used bonding die workbench is by a platform 6, and there is a chain-wales 8 with many apertures 7 that protrudes the centre of platform, and the projection of chain-wales is taking, putting of for convenience sticking paper and potsherd.On two orthogonal limits of chain-wales, three alignment pins 9 are arranged, wherein be close to long limit for two, be close to minor face for one, an air extractor 10 is arranged under chain-wales,, be used for fixing sticking paper for chain-wales provides negative pressure.
When adopting method for preparing piezoelectric vibration chamber, steps A, B, array hole 401 positional precisions of sticking paper are very important, the high more effect of positional precision is good more, generally must reach ± 0.08mm in, this depends primarily on the sharpness of mold notch.Step D when opening negative pressure device, must guarantee the smooth of sticking paper.The positional precision in sticking paper array hole is guaranteed, and the positioning accuracy of potsherd pit just obtains also guaranteeing that after the positioning accuracy and the bonding precision between the potsherd that guarantee pit, the qualification rate that cuts into junior unit piezoelectric vibration chamber is very high.Get rid of the influence of other factors, 100% qualification rate is possible.
Claims (2)
1. the preparation method of the vibration cavity of chip pottery frequency device is characterized in that concrete steps are as follows:
A. the planar dimension according to the chamber requires to make a m * n array high accuracy towards the paper matrix tool, m=1,2,3 ..., n=1,2,3,
B. utilize this mould and punch press to go out m * n array hole on commercially available sticking paper, the size in this hole is exactly the planar dimension of vibration cavity;
C. prepare two two parallel ceramic wafers, the ceramic wafer planar dimension is identical with sticking paper;
The sticking paper that D. will have the array hole is placed on the paster workbench, sticking paper down, substrate up, and two limits that will glue paper are close to three alignment pins on the paster workbench, open the negative pressure device of workbench, will glue paper and suck, tweezer lightly then substrate is removed, the both sides of potsherd are close to three alignment pins again and are put into subsides jail on the sticking paper, close negative pressure device, this moment, sticking paper transferred the mask of ceramic wafer to;
The ceramic wafer that E. will have mask is placed on and carries out sandblast on the sand-blasting machine, forms the pit array the same with sticking paper precision at last on ceramic wafer, and the degree of depth of pit is decided as required;
F. remove mask paper, the piezoelectric vibrator sheet is clipped between two ceramic wafers with identical pit array, make pit relative, be placed on the paster workbench coated with adhesive between them, and three alignment pins on the paster workbench are close on two limits that make them, pressurization makes three to be bonded into one, and cuts into junior unit then, constitutes piezoelectric ceramic vibration chamber, when this step, do not need to open the negative pressure device of workbench.
2. according to the used paster workbench of preparation method of the vibration cavity of a kind of chip pottery frequency device of claim 1, comprise platform (6), it is characterized in that: there is a chain-wales with many apertures (7) (8) that protrudes the centre of platform (6), on two orthogonal limits of chain-wales (8), three alignment pins (9) are arranged, wherein be close to long limit for two, be close to minor face for one, under chain-wales (8), have one to provide the air extractor (10) of negative pressure for chain-wales.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100165890A CN100392978C (en) | 2004-02-26 | 2004-02-26 | Preparation method of vibration cavity of plate ceramic frequency device and special platform for adhering it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100165890A CN100392978C (en) | 2004-02-26 | 2004-02-26 | Preparation method of vibration cavity of plate ceramic frequency device and special platform for adhering it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1560995A CN1560995A (en) | 2005-01-05 |
| CN100392978C true CN100392978C (en) | 2008-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100165890A Expired - Fee Related CN100392978C (en) | 2004-02-26 | 2004-02-26 | Preparation method of vibration cavity of plate ceramic frequency device and special platform for adhering it |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1233884A (en) * | 1998-02-12 | 1999-11-03 | 株式会社村田制作所 | Piezoelectric resonator, method of mfg. piezoelectric resonator and method of adjusting resonance frequency of piezoelectric resonator |
| US6300708B1 (en) * | 1998-11-18 | 2001-10-09 | Murata Manufacturing Co., Ltd. | Piezoelectric resonator and a method of manufacturing the same |
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2004
- 2004-02-26 CN CNB2004100165890A patent/CN100392978C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1233884A (en) * | 1998-02-12 | 1999-11-03 | 株式会社村田制作所 | Piezoelectric resonator, method of mfg. piezoelectric resonator and method of adjusting resonance frequency of piezoelectric resonator |
| US6300708B1 (en) * | 1998-11-18 | 2001-10-09 | Murata Manufacturing Co., Ltd. | Piezoelectric resonator and a method of manufacturing the same |
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| Publication number | Publication date |
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| CN1560995A (en) | 2005-01-05 |
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Granted publication date: 20080604 |