CN100409668C - Image pickup unit and image pickup apparatus - Google Patents
Image pickup unit and image pickup apparatus Download PDFInfo
- Publication number
- CN100409668C CN100409668C CNB2006100826619A CN200610082661A CN100409668C CN 100409668 C CN100409668 C CN 100409668C CN B2006100826619 A CNB2006100826619 A CN B2006100826619A CN 200610082661 A CN200610082661 A CN 200610082661A CN 100409668 C CN100409668 C CN 100409668C
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- China
- Prior art keywords
- imaging apparatus
- bare chip
- image unit
- camera head
- fixed part
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
An image pickup apparatus includes: an image pickup device comprising a bare chip and having an image pickup area and a mount area on the same face; an electric board having the image pickup device mounted thereon; and a support having an opening. The support is disposed on the rear face of the mount surface of the image pickup device such that the rear face of the image pickup device is opposed to and exposed through the opening. The opening is supplied with an adhesive to fix the support to the image pickup device. Thus, the image pickup apparatus to which the support can be fixed with a sufficient adhesive strength can be provided.
Description
Technical field
The present invention relates to image unit and camera head, in more detail, relate to the camera head that the imaging apparatus that will be made of bare chip is adhesively fixed on the image unit on the circuit substrate and utilizes this image unit.
Background technology
Up to now, electronic equipments such as digital camera with following structure, generally practicability is also extensively popularized, the subject picture that it will form according to the light beam from subject that incides photographic optical system, be imaged on and (for example be disposed at the imaging apparatus precalculated position, that constitute by bare chip, electronics coupled device (CCD:Charge Coupled Device) etc.) on the sensitive surface, and this subject picture can be carried out record as the view data of predetermined form etc.
As camera heads such as digital cameras, for example have and open disclosed such bare chip mounting structures (with reference to Fig. 2 of this communique) such as 2002-218293 communique by the spy.
That is, on cover glass, utilize bonding agent bonding flexible print wiring board (FPC).For this flexible print wiring board, with the face of the bonding plane opposition side that is bonded with cover glass on, connecting the imaging apparatus that constitutes by bare chip via electrode pad, projection (bump).In the case, the sensitive surface of imaging apparatus is configured to and the cover glass subtend.
And adhesive-applying on this electrode pad, projection is to cover them.Thereby flexible print wiring board and imaging apparatus simultaneously, are formed the hermetically-sealed construction of the sensitive surface (pixel region) of imaging apparatus by adhesive bond.
Like this; up to now, there is the device of following bare chip mounting structure, promptly; it is to utilize bonding agent, and structure members such as bare chip (imaging apparatus) that will be made of the plate-shaped member of hard and cover glass are adhesively fixed on as on the flexible print wiring board of the plate-shaped member of softness and form.
And the device after the blocking (image unit) like this by for example being assembled in the various electronic equipments such as digital camera, just can be undertaken the camera function of this equipment.
On the other hand, in driven disclosed camera heads such as 2002-218293 communique by above-mentioned spy, have such structure, it makes the face of the imaging apparatus side of cover glass (transparent member), be resisted against camera head main body front accept assemble on the face.Thus, just can guarantee accurately in the imaging apparatus of the optical axis direction of lens unit and the location of camera head.
, the device of aforesaid structure (image unit) also is to constitute with the form that various structure members such as imaging apparatus and cover glass is assemblied on the flexible print wiring board with flexibility basically.Thereby, in the time of in this image unit being assembled into electronic equipment such as digital camera, will producing and be difficult to carry out reliably image unit this problem points of location with respect to equipment body.
In addition, because the assembling means of image unit and the imaging apparatus that constitutes image unit is applied excessive stress etc., the flatness that also may produce the sensitive surface (being also referred to as shooting face) of this imaging apparatus problem such as degenerate.
For example, Fig. 4 is the amplification profile of the major part of the mode of expression when being fixedly installed on the image unit of existing structure as described above on the equipment body.
As shown in Figure 4, the image unit of this mode mainly is made of following part: imaging apparatus 121; Flexible print wiring board 117, it is the circuit substrate with opening 117a; And cover glass 124.
In this case, in the outer peripheral portion of imaging apparatus 121,, connecting near the inner edge of opening 117a of a face of flexible print wiring board 117 via electrode, projection.In addition, on another face (with the face of the face opposition side that imaging apparatus 121 is installed) of flexible print wiring board 117, by bonding agent 132, the outer peripheral portion of a face of the cover glass 124 that is being adhesively fixed.And, the outer peripheral portion of another face of this cover glass 124, crimping is fixed on the predetermined datum level of fixed part 140 of electronic equipment side.
Under the situation of the fixture of having used this form, for example when fixed part 140 was applied certain external force, this external force was via the bearing surface of fixed part 140 and cover glass 124, and effect has counter-force on this cover glass 124.Thereby, might produce cover glass because of crisp problem such as break.
In addition, Fig. 5 is the amplification profile of the major part of another mode of expression when being fixedly installed on the image unit of existing structure as described above on the equipment body.
As shown in Figure 5, the image unit of this another way mainly is made of following part: imaging apparatus 121; Flexible print wiring board 117, it is the circuit substrate with opening 117a; Cover glass 124; And fixed part 141, on the main composition this point, identical with the image unit (with reference to Fig. 4) of an above-mentioned mode.
In the image unit of the manner, on another face (face identical) of flexible print wiring board 117 with the face that sets cover glass 124, by bonding agent 132, the fixed part 141 of the hard that is being adhesively fixed.And the means that these fixed part 141 usefulness are predetermined are fixedly installed on the works of electronic equipment.
Under the situation of the means that fixedly install of having used this form, flexible print wiring board 117 between the centre, is located cover glass 124 and imaging apparatus 121 with respect to fixed part 141.That is, cover glass 124 and the imaging apparatus 121 by flexible print wiring board 117 supporting of flexible material becomes the aerial state that is positioned at.In such structure, if camera head integral body is applied vibration etc., because of the influence of this vibration, flexible print wiring board 117 bendings, imaging apparatus 121 can not be positioned at the position of expectation, can not obtain correct focusing result, may can make flexible print wiring board 117 for good and all crooked again sooner or later.In addition, because 121 of imaging apparatuss are connected on the flexible print wiring board 117 with monomer, therefore, thermal diffusivity is variation also, also can be written into many noises in the image that obtains.
Summary of the invention
The present invention finishes in view of the premises just.
The object of the present invention is to provide a kind of camera head, it guarantees to be in the positional precision of the imaging apparatus that is assembled into the state in the camera head with high accuracy, and has better heat radiating effect.
Benefit of the present invention from following detailed description, just can further be understood.
Description of drawings
Fig. 1 is the exploded perspective view of the camera head of an embodiment of the invention.
Fig. 2 is the amplification profile of major part of the camera head of Fig. 1.
Fig. 3 is the amplification profile of expression along the major part of the section of [III]-[III] line of Fig. 1.
Fig. 4 is the amplification profile of the major part of the mode of expression when being fixedly installed on the camera head of existing structure on the equipment body.
Fig. 5 is the amplification profile of the major part of another mode of expression when being fixedly installed on the camera head of existing structure on the equipment body.
Fig. 6 is that expression utilizes bonding agent, and is bonding by face, the amplification profile of the major part of a mode when being bonded in the camera head of bare chip mounting structure on the tabular fixed part.
Embodiment
Below, the image unit and the camera head of an embodiment of the invention described.
Fig. 1 is the exploded perspective view of the camera head of an embodiment of the invention.In addition, in Fig. 1, represent with the camera body that is assembled with image unit.Fig. 2 is the amplification sectional arrangement drawing of major part of camera head that comprises the image unit of Fig. 1.Fig. 3 is the amplification profile of expression along the major part of the section of [III]-[III] line of Fig. 1.Below, describe with reference to these accompanying drawings.
The camera that is assembled with the image unit of present embodiment is a single-lens reflex camera, and it mainly is made of following part: camera body; And constitute with respect to this camera body and can freely install and remove, and has barrel of optics (photographic lens etc.) and aperture device etc. etc.And,,, omit its diagram as general single-lens reflex camera for the diagram of camera integral body and the details and the barrel of camera body.
The image unit of present embodiment is received the predetermined position of the camera body inside that is configured in this camera.This camera head comprises: agent structure body 4, and it is fixedly supported upon on one's body the camera, and has the 4a of central opening portion (with reference to Fig. 1) along optical axis O; Fuselage lens mount 13, as the photographic lens support unit, detachable thereon barrel (not shown); Principal reflection mirror 5, shutter (diagram) especially, image unit 8 etc., they are to be configured in structure member among the 4a of central opening portion of agent structure body 4 along optical axis O; And focus(s)ing glass (not shown), pentaprism 40, eyepiece 41 etc., they are fixedly supported upon the upper side of agent structure body 4, constitute viewfinder.
In addition, at the rear of fixed part 15, be equipped with the circuit substrate 36 that is used for mounting interface circuit element and image processing circuit element etc.
Fixed part 15 is formed by aluminium sheet or corrosion resistant plate.This fixed part 15 keeps imaging apparatus 21 via insulating trip 34, simultaneously, also has the heat sinking function of imaging apparatus 21.Fixed part 15 is fixedly installed on the image unit support 4c (with reference to Fig. 1) of back side portion of agent structure body 4 as described later.
Flexible print wiring board 17 partly is provided with opening 17a in substantial middle.In addition, flexible print wiring board 17 is provided with in two end portions and connects the plug-in unit 17b of portion.And,, near the periphery of opening 17a, be equipped with to connect and use figure 17c in the rear side of flexible print wiring board 17.
The rear side of imaging apparatus 21 surface 21c is with the state across insulating trip 34, with the front face side of fixed part 15 against state under be adhesively fixed.
In more detail, with bonding agent 32 fixed part 15 and insulating trip 34 are glued together.In addition, bonding agent 32 is glued together imaging apparatus 21 and insulating trip 34 usefulness bonding agents 32 by aforesaid adhesive applicating hole 34a.
In addition, the front face side surface 21a of imaging apparatus 21 is under the state that the opening 17a from flexible print wiring board 17 exposes, the connection of imaging apparatus 21 sides is contacted with being connected with figure 17c of flexible print wiring board 17 sides with protruding 21b, and under this state, both are adhesively fixed.Under this stationary state, the shooting face of imaging apparatus 21 just becomes and state as the back subtend of the barrel (not shown) of optics.
On the rear side of rubber frame 33, spread all over full week, be formed with frame shape teat 33a (with reference to Fig. 2).This frame shape teat 33a promptly is fixed under the state of front face side of fixed part 15 at the holding member 35 that rubber frame 33 has been installed under above-mentioned state, is connected to the outer peripheral portion of the front of cover glass 24 with closed state.Thereby in view of the above, the front face side surface of the cover glass 24 of the front face side surface 21a of protection imaging apparatus 21 just becomes the state from outside seal, can prevent that dust from invading from the outside.
By imaging apparatus 21, flexible print wiring board 17, cover glass 24, optics LPF 26 and the image unit 8 that the fixed part 15 of holding member 35 constitutes is installed; the predetermined position of the front face side by making fixed part 15; be connected on the image unit support 4c of 3 positions rear side that is set at agent structure body 4, that form prominent shape, just be positioned and install.
In more detail, on the image unit support 4c of agent structure body 4, alignment pin (not illustrating especially) is set.The location hole 15b that makes fixed part 15 embeds facing to this alignment pin, and fixed part 15 just is oriented to be in the position with optical axis O quadrature.And, in the Screw through hole 15a of fixed part 15, insert Screw 37, this Screw 37 is screwed (being screwed into) in the screwed hole 4b of image unit support 4c.Thereby fixed part 15 is fixed with respect to the direction along optical axis O.In addition, the predetermined Plug Division (not illustrating especially) with the connection plug-in unit 17b of portion of flexible print wiring board 17 inserts circuit substrate 36 is electrically connected both.
As mentioned above, fixedly mounted in the back side of agent structure body 4 one under the state of image unit 8, fixed part 15 is under the state that is positioned to the direction of optical axis O quadrature, with respect to the direction along optical axis O, be resisted against on the image unit support 4c, be fixed with very high positional precision.The imaging apparatus 21 of naked core chip is via insulating trip 34, with against state be bonded on the fixed part 15.Thereby, the precision of the distance (being called the location intercept) of the shooting face (photoelectric conversion surface) of the imaging apparatus 21 on from the front of the fuselage lens mount 13 of the front face side that is fixed on fixed part 15 to fixed part 15, adding imaging apparatus 21 is bare chips, just can guarantee high precision.
In addition, imaging apparatus 21 is not packaged type but naked core chip, and, because imaging apparatus 21 is via thin insulating trip 34, on the fixed part 15 of the metallic plate system of being adhesively fixed on, therefore, the caloric value of imaging apparatus 21 is dispelled the heat as fin with fixed part 15.Thereby the temperature that can suppress imaging apparatus 21 rises.In addition, because imaging apparatus 21 is bare chips, therefore also very favourable on cost.
In the present invention, in very wide scope, different execution modes only otherwise break away from the thought and the scope of invention certainly constitutes according to the present invention.The present invention is except that claim limited, not restricted by specific execution mode by additional.
Claims (12)
1. camera head is characterized in that having:
Imaging apparatus, it is made of bare chip, and this bare chip has and the electrical connection section of shooting face on same one side;
Fixed part, the back side subtend of the shooting face of itself and described bare chip supports described bare chip, is formed by metal material; And
Circuit substrate, it avoids described shooting face, is electrically connected with described electrical connection section, so that described bare chip can be accepted the shooting light beam from described photographic lens.
2. camera head as claimed in claim 1 is characterized in that,
Between described imaging apparatus and described fixed part, be provided with thermal component.
3. camera head as claimed in claim 2 is characterized in that,
On described thermal component, be provided with opening.
4. camera head as claimed in claim 1 is characterized in that,
Described circuit substrate is a flexible print wiring board.
5. camera head as claimed in claim 1 is characterized in that,
Above the described shooting face of described bare chip, the back side at the face that imaging apparatus is installed of described circuit substrate is bonded with the transparent member that is used to protect described shooting face.
6. as each described camera head of claim 1～3, it is characterized in that,
Described camera head is a single-lens reflex camera.
7. image unit is characterized in that having:
Imaging apparatus, it is made of bare chip, and this bare chip has and the electrical connection section of shooting face on same one side;
Fixed part, the back side subtend of the shooting face of itself and described bare chip supports described bare chip, is formed by metal material; And
Circuit substrate, it avoids described shooting face, is electrically connected with described electrical connection section, so that described bare chip can be accepted the shooting light beam from described photographic lens.
8. image unit as claimed in claim 7 is characterized in that,
Between described imaging apparatus and described fixed part, be provided with thermal component.
9. image unit as claimed in claim 8 is characterized in that,
On described thermal component, be provided with opening.
10. image unit as claimed in claim 7 is characterized in that,
Described circuit substrate is a flexible print wiring board.
11. image unit as claimed in claim 7 is characterized in that,
Above the described shooting face of described bare chip, the back side at the face that imaging apparatus is installed of described circuit substrate is bonded with the transparent member that is used to protect described shooting face.
12. as each described image unit of claim 7～11, it is characterized in that,
Described image unit is to use the image unit in single-lens reflex camera.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005151335A JP4555732B2 (en) | 2005-05-24 | 2005-05-24 | Imaging device |
| JP2005151335 | 2005-05-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1870725A CN1870725A (en) | 2006-11-29 |
| CN100409668C true CN100409668C (en) | 2008-08-06 |
Family
ID=37444267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100826619A Expired - Fee Related CN100409668C (en) | 2005-05-24 | 2006-05-24 | Image pickup unit and image pickup apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4555732B2 (en) |
| CN (1) | CN100409668C (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007004724A1 (en) | 2007-01-22 | 2008-07-24 | Pilz Gmbh & Co. Kg | Camera unit for monitoring a room area, in particular as part of a running protective device on a moving machine part |
| US7928358B2 (en) | 2007-02-08 | 2011-04-19 | Olympus Imaging Corp. | Imaging device module and portable electronic apparatus utilizing the same |
| JP4935441B2 (en) * | 2007-03-14 | 2012-05-23 | 株式会社ニコン | Imaging device |
| JP5291892B2 (en) | 2007-05-01 | 2013-09-18 | オリンパスイメージング株式会社 | Imaging device module, lens unit using imaging device module, and portable electronic device |
| JP4543339B2 (en) | 2007-12-14 | 2010-09-15 | ソニー株式会社 | Imaging device |
| JP5376865B2 (en) * | 2008-08-19 | 2013-12-25 | キヤノン株式会社 | Solid-state imaging device and electronic imaging device |
| JP5324935B2 (en) * | 2009-01-20 | 2013-10-23 | 株式会社ザクティ | Solid-state imaging device |
| JP5484148B2 (en) * | 2010-03-26 | 2014-05-07 | キヤノン株式会社 | Photoelectric conversion element unit and imaging apparatus |
| JP5479972B2 (en) * | 2010-03-29 | 2014-04-23 | オリンパス株式会社 | Imaging device |
| JP5601081B2 (en) * | 2010-08-11 | 2014-10-08 | 株式会社ニコン | Imaging element unit and imaging apparatus |
| EP2641391B1 (en) * | 2010-11-18 | 2017-10-18 | LG Innotek Co., Ltd. | Camera module and method for manufacturing the same |
| JP5769995B2 (en) * | 2011-03-25 | 2015-08-26 | 株式会社シグマ | Imaging apparatus and imaging system |
| JP5864890B2 (en) | 2011-04-26 | 2016-02-17 | キヤノン株式会社 | Imaging device |
| JP5147978B2 (en) * | 2011-08-22 | 2013-02-20 | キヤノン株式会社 | Imaging device |
| JP5511928B2 (en) * | 2012-10-19 | 2014-06-04 | キヤノン株式会社 | Imaging device |
| JP6172993B2 (en) * | 2013-03-28 | 2017-08-02 | オリンパス株式会社 | Imaging device |
| JP6163828B2 (en) * | 2013-03-29 | 2017-07-19 | 株式会社ニコン | Imaging unit and imaging apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6414299B1 (en) * | 1999-02-17 | 2002-07-02 | Canon Kabushiki Kaisha | Method of mounting optical sensor package |
| JP2002218293A (en) * | 2001-01-17 | 2002-08-02 | Canon Inc | Image pickup device |
| CN1605922A (en) * | 2003-10-06 | 2005-04-13 | 株式会社腾龙 | Image pickup apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068755U (en) * | 1983-10-17 | 1985-05-15 | 株式会社ニコン | Solid-state image sensor mounting adjustment device |
| JP2001285697A (en) * | 2000-03-30 | 2001-10-12 | Minolta Co Ltd | Digital imaging apparatus, lens unit and mount method for imaging section |
| JP4405062B2 (en) * | 2000-06-16 | 2010-01-27 | 株式会社ルネサステクノロジ | Solid-state imaging device |
| JP4034031B2 (en) * | 2000-08-01 | 2008-01-16 | 三菱電機株式会社 | Imaging device |
| JP4083521B2 (en) * | 2001-10-29 | 2008-04-30 | オリンパス株式会社 | Imaging device |
| JP2005072736A (en) * | 2003-08-20 | 2005-03-17 | Canon Inc | Image pickup unit and image pickup apparatus |
-
2005
- 2005-05-24 JP JP2005151335A patent/JP4555732B2/en not_active Expired - Fee Related
-
2006
- 2006-05-24 CN CNB2006100826619A patent/CN100409668C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6414299B1 (en) * | 1999-02-17 | 2002-07-02 | Canon Kabushiki Kaisha | Method of mounting optical sensor package |
| JP2002218293A (en) * | 2001-01-17 | 2002-08-02 | Canon Inc | Image pickup device |
| CN1605922A (en) * | 2003-10-06 | 2005-04-13 | 株式会社腾龙 | Image pickup apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4555732B2 (en) | 2010-10-06 |
| JP2006332894A (en) | 2006-12-07 |
| CN1870725A (en) | 2006-11-29 |
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Effective date of registration: 20151119 Address after: Tokyo, Japan, Japan Patentee after: Olympus Corporation Address before: Tokyo, Japan Patentee before: Olympus Imaging Corp. Effective date of registration: 20151119 Address after: Tokyo, Japan, Japan Patentee after: Olympus Corporation Address before: Tokyo, Japan Patentee before: Olympus Imaging Corp. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080806 Termination date: 20190524 |