CN100533158C - 为源极串联终接的串行链路发射器提供阻抗校准的方法和器件 - Google Patents
为源极串联终接的串行链路发射器提供阻抗校准的方法和器件 Download PDFInfo
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- CN100533158C CN100533158C CN200610137114.6A CN200610137114A CN100533158C CN 100533158 C CN100533158 C CN 100533158C CN 200610137114 A CN200610137114 A CN 200610137114A CN 100533158 C CN100533158 C CN 100533158C
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- 238000000034 method Methods 0.000 title claims description 27
- 238000012360 testing method Methods 0.000 claims abstract description 64
- 230000007246 mechanism Effects 0.000 claims description 28
- 230000011218 segmentation Effects 0.000 claims description 14
- 230000008859 change Effects 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims 2
- 230000008676 import Effects 0.000 claims 1
- 238000013459 approach Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 108010022579 ATP dependent 26S protease Proteins 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
- G01R35/007—Standards or reference devices, e.g. voltage or resistance standards, "golden references"
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
Abstract
Description
CMPL | CMPH | CTL变化 |
0 | 0 | N/A;断开 |
0 | 1 | 增加Vtst |
1 | 0 | 降低Vtst |
1 | 1 | 已校准 |
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/262,101 US7368902B2 (en) | 2005-10-28 | 2005-10-28 | Impedance calibration for source series terminated serial link transmitter |
US11/262,101 | 2005-10-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1955748A CN1955748A (zh) | 2007-05-02 |
CN100533158C true CN100533158C (zh) | 2009-08-26 |
Family
ID=37995425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610137114.6A Active CN100533158C (zh) | 2005-10-28 | 2006-10-20 | 为源极串联终接的串行链路发射器提供阻抗校准的方法和器件 |
Country Status (3)
Country | Link |
---|---|
US (3) | US7368902B2 (zh) |
JP (1) | JP5165877B2 (zh) |
CN (1) | CN100533158C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI656733B (zh) * | 2016-10-17 | 2019-04-11 | 美商格羅方德半導體公司 | 傳輸驅動器阻抗校正電路 |
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KR100862993B1 (ko) * | 2006-10-12 | 2008-10-13 | 주식회사 하이닉스반도체 | 반도체 집적 회로의 전원 공급 장치 |
WO2010111619A2 (en) | 2009-03-27 | 2010-09-30 | Rambus, Inc. | Voltage mode transmitter equalizer |
WO2011032178A2 (en) | 2009-09-14 | 2011-03-17 | Rambus Inc. | High resolution output driver |
US8547140B1 (en) | 2010-11-03 | 2013-10-01 | Pmc-Sierra, Inc. | Apparatus and method for generating a bias voltage |
TW201225529A (en) * | 2010-12-03 | 2012-06-16 | Fortune Semiconductor Corp | Test mode controller and electronic apparatus with self-testing thereof |
US8653844B2 (en) * | 2011-03-07 | 2014-02-18 | Xilinx, Inc. | Calibrating device performance within an integrated circuit |
US8941974B2 (en) | 2011-09-09 | 2015-01-27 | Xilinx, Inc. | Interdigitated capacitor having digits of varying width |
KR101912123B1 (ko) * | 2012-02-17 | 2018-10-26 | 삼성전자주식회사 | 임피던스 조정 회로 및 이를 포함하는 집적 회로 |
US8618833B1 (en) | 2012-06-19 | 2013-12-31 | International Business Machines Corporation | Source series terminated driver circuit with programmable output resistance, amplitude reduction, and equalization |
US8742799B2 (en) * | 2012-08-30 | 2014-06-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for de-emphasis level calibration in voltage mode drivers |
US9893693B2 (en) * | 2012-12-07 | 2018-02-13 | Futurewei Technologies, Inc. | Gain control method for a broadband inductorless low noise amplifier |
US8989254B2 (en) | 2012-12-21 | 2015-03-24 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Single serdes transmitter driver design for both ethernet and peripheral component interconnect express applications |
US9270247B2 (en) | 2013-11-27 | 2016-02-23 | Xilinx, Inc. | High quality factor inductive and capacitive circuit structure |
US9231631B1 (en) * | 2014-06-20 | 2016-01-05 | Altera Corporation | Circuits and methods for adjusting the voltage swing of a signal |
US9524964B2 (en) | 2014-08-14 | 2016-12-20 | Xilinx, Inc. | Capacitor structure in an integrated circuit |
US9455713B1 (en) * | 2015-06-02 | 2016-09-27 | Avago Tcehnologies General IP (Singapore) Pte. Ltd. | Split resistor source-series terminated driver |
JP6515776B2 (ja) | 2015-10-13 | 2019-05-22 | 富士通株式会社 | 終端抵抗調整回路および終端抵抗調整回路を有する装置 |
CN105652056B (zh) * | 2015-12-30 | 2018-10-02 | 宁波三星医疗电气股份有限公司 | 单相电能表电压改变影响量的自适应补偿方法 |
TWI585422B (zh) * | 2016-01-05 | 2017-06-01 | 明泰科技股份有限公司 | 電路傳輸線的特性阻抗擷取方法 |
JP6807642B2 (ja) | 2016-01-08 | 2021-01-06 | ザインエレクトロニクス株式会社 | 送信装置 |
CN106526517A (zh) * | 2016-10-26 | 2017-03-22 | 黑龙江省电力科学研究院 | 一种基于adpss仿真系统的有功功率变送器暂态特性检测方法 |
CN106526519B (zh) * | 2016-10-28 | 2019-12-24 | 黑龙江省电力科学研究院 | 一种基于adpss仿真系统的有功功率变送器暂态特性指标评价方法 |
US9942028B1 (en) | 2017-02-02 | 2018-04-10 | International Business Machines Corporation | Serial transmitter with feed forward equalizer and timing calibration |
US9942030B1 (en) | 2017-02-02 | 2018-04-10 | International Business Machines Corporation | Serial transmitter with feed forward equalizer |
US10587794B2 (en) | 2018-04-25 | 2020-03-10 | Semiconductor Components Industries, Llc | Methods and apparatus for actuator control |
US10615893B1 (en) | 2018-09-27 | 2020-04-07 | Intel Corporation | Transmitter with feedback control |
CN110208687A (zh) * | 2019-05-27 | 2019-09-06 | 宁波芯路通讯科技有限公司 | 一种模拟电路参数校准的调试系统及方法 |
US11366193B2 (en) * | 2019-09-19 | 2022-06-21 | Rohde & Schwarz Gmbh & Co. Kg | Method of setting a measurement instrument and system for setting a measurement instrument |
US11566950B2 (en) * | 2020-04-06 | 2023-01-31 | Realtek Semiconductor Corp. | Process and temperature tracking reference load and method thereof |
CN111880135B (zh) * | 2020-07-02 | 2023-02-17 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | 传导骚扰能力验证样品和方法 |
TWI763174B (zh) * | 2020-12-14 | 2022-05-01 | 瑞昱半導體股份有限公司 | 參數校正方法與半導體裝置 |
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JPH1127132A (ja) * | 1997-07-01 | 1999-01-29 | Hitachi Ltd | インピーダンスマッチング回路および半導体記憶装置 |
US6064224A (en) * | 1998-07-31 | 2000-05-16 | Hewlett--Packard Company | Calibration sharing for CMOS output driver |
JP2001024497A (ja) | 1999-07-06 | 2001-01-26 | Hitachi Ltd | 自己整合式ディジタルドライバ回路 |
US6359465B1 (en) * | 2000-05-30 | 2002-03-19 | International Business Machines Corporation | CMOS small signal switchable adjustable impedence terminator network |
US6420897B1 (en) * | 2000-05-30 | 2002-07-16 | International Business Machines Corporation | SOI small signal terminator and network |
US6400178B1 (en) * | 2000-05-30 | 2002-06-04 | International Business Machines Corporation | CMOS small signal terminated receiver |
US6359464B1 (en) * | 2000-05-30 | 2002-03-19 | International Business Machines Corporation | Method of use with a terminator and network |
US6373276B1 (en) * | 2000-05-31 | 2002-04-16 | International Business Machines Corporation | CMOS small signal switchable impedence and voltage adjustable terminator with hysteresis receiver network |
US6577114B1 (en) * | 2000-07-31 | 2003-06-10 | Marvell International, Ltd. | Calibration circuit |
DE60110128T2 (de) * | 2000-10-31 | 2005-09-29 | Acuid Corp. (Guernsey) Ltd., St. Peter Port | Sender mit aktivem differenzabschluss |
US6472934B1 (en) * | 2000-12-29 | 2002-10-29 | Ericsson Inc. | Triple class E Doherty amplifier topology for high efficiency signal transmitters |
JP2002270773A (ja) * | 2001-03-12 | 2002-09-20 | Nec Corp | 半導体集積回路およびその製造方法 |
US6670828B2 (en) * | 2002-01-31 | 2003-12-30 | Texas Instruments Incorporated | Programmable termination for CML I/O |
US6807650B2 (en) * | 2002-06-03 | 2004-10-19 | International Business Machines Corporation | DDR-II driver impedance adjustment control algorithm and interface circuits |
DE10245536B4 (de) * | 2002-09-30 | 2005-02-03 | Infineon Technologies Ag | Kalibrieren von Halbleitereinrichtungen mittels einer gemeinsamen Kalibrierreferenz |
US6940303B2 (en) * | 2002-11-29 | 2005-09-06 | Roy L. Vargas | System and method to establish an adjustable on-chip impedance |
US6924660B2 (en) * | 2003-09-08 | 2005-08-02 | Rambus Inc. | Calibration methods and circuits for optimized on-die termination |
US7106104B2 (en) * | 2003-10-30 | 2006-09-12 | International Business Machines Corporation | Integrated line driver |
US7447273B2 (en) * | 2004-02-18 | 2008-11-04 | International Business Machines Corporation | Redundancy structure and method for high-speed serial link |
US7386410B2 (en) * | 2005-09-27 | 2008-06-10 | Ati Technologies Inc. | Closed loop controlled reference voltage calibration circuit and method |
-
2005
- 2005-10-28 US US11/262,101 patent/US7368902B2/en active Active
-
2006
- 2006-10-18 JP JP2006284420A patent/JP5165877B2/ja not_active Expired - Fee Related
- 2006-10-20 CN CN200610137114.6A patent/CN100533158C/zh active Active
-
2008
- 2008-02-08 US US12/028,451 patent/US7570071B2/en not_active Expired - Fee Related
- 2008-02-08 US US12/028,439 patent/US7698802B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI656733B (zh) * | 2016-10-17 | 2019-04-11 | 美商格羅方德半導體公司 | 傳輸驅動器阻抗校正電路 |
Also Published As
Publication number | Publication date |
---|---|
CN1955748A (zh) | 2007-05-02 |
US20080120838A1 (en) | 2008-05-29 |
JP2007121288A (ja) | 2007-05-17 |
US20080122452A1 (en) | 2008-05-29 |
US7368902B2 (en) | 2008-05-06 |
US7570071B2 (en) | 2009-08-04 |
US20070096720A1 (en) | 2007-05-03 |
US7698802B2 (en) | 2010-04-20 |
JP5165877B2 (ja) | 2013-03-21 |
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C06 | Publication | ||
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Effective date of registration: 20171114 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171114 Address after: American New York Patentee after: Core USA second LLC Address before: New York grams of Armand Patentee before: International Business Machines Corp. |
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Effective date of registration: 20171120 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171120 Address after: American New York Patentee after: Core USA second LLC Address before: New York grams of Armand Patentee before: International Business Machines Corp. |
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