CN100537117C - Melting-point-changeable lead-free composite soldering material, soldering paste, thire preparation and use - Google Patents
Melting-point-changeable lead-free composite soldering material, soldering paste, thire preparation and use Download PDFInfo
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- CN100537117C CN100537117C CNB2006101036186A CN200610103618A CN100537117C CN 100537117 C CN100537117 C CN 100537117C CN B2006101036186 A CNB2006101036186 A CN B2006101036186A CN 200610103618 A CN200610103618 A CN 200610103618A CN 100537117 C CN100537117 C CN 100537117C
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Abstract
The invention discloses a lead-free composite solder and solder paste with variable melting point and their preparation and application methods. It belongs to the preparation technology field of composite lead-free solder/solder paste. The solder/solder paste is prepared by mechanical mixing of general soldering powder and flux with different melting points. It has advantages of strong sagging resistance, strong rigidity, high tenacity, long service life, bright melting point halo and simple preparation technology in the process of welding and working. Its great character is to realize low-temperature welding of middle/high temperature solder or gradient temperature welding without changing the welding process route and parameters of original lead-containing solder. It can realize the middle/high temperature application of low-temperature solder and prolong their service lives.
Description
Technical field
The present invention relates to a kind of unleaded composite solder and soldering paste and methods for making and using same thereof.This composite solder is the mechanical impurity of compatible in welding process by two kinds, that affinity is good welding powder, belongs to the manufacturing technology field of tin-base lead-free solder/cream.
Background technology
Pay attention to environmental protection, advocate the main trend that green product is the current world economy development, the unleaded of electronic product is exactly wherein major action.The patent of the current relevant lead-free solder of having applied for be we can say and covered the sky and the earth, mainly occupied by countries such as Japan, the U.S., European Union, and the unleaded Study on Technology of China's electronic product is started late, the commercialization leadless electronic product that has independent intellectual property right is very few especially, for meeting the unleaded tide of global synchronization welding, the lead-free solder patent barrier of avoiding having developed is in the world formulated the task of top priority that the lead-free solder development strategy that is fit to China's actual conditions has become China Electronics's assembly industry.
Current ternary or multi-component leadless scolder are subjected to the more of patent protection, and the binary system alloy then is not subjected to patent protection as Bi-In, Sn-Bi, Sn-Ag, Sn-Cu, Sn-Zn, Cu-P, Ag-Cu etc.Contain a kind of low-melting alloy composition in the composite solder, just fusing when welding temperature is low, and welding temperature does not reach when wherein fusing point is compared higher component fusing point, this component can serve as skeleton, the low melting point composition that has melted is penetrated into by capillarity and forms fine and close flawless solder joint in the skeleton, the so both bridgings that can avoid eutectic solder to subside in welding process and cause can improve the intensity and the electrical and thermal conductivity thereof of solder joint again; When the maximum temperature of welding meets or exceeds under the welding condition of high-melting-point component, when melting mutually, low melting point around solid phase particles, expands earlier, and the home position alloying process takes place then, and the formation original position strengthens or the plasticising phase.The characteristics of composite solder/cream maximum are in can realizing/low-temperature welding of high-temperature solder, in welding process, needn't change the process route and the parameter of original solder containing pb, as long as guarantee that in welding process the low-melting alloy component fully melts, and needn't consider high melting point component.It should be noted that, if the welding procedure window make high melting point component be semi-molten or non-molten state in preparation composite solder process the corresponding in proportion high melting point component content that reduces, can guarantee that like this skeleton is filled densification, the generation rate of unlikely increase welding point defect; Perhaps adopt the full solder joint of the method availability excellence of gradient temperature welding.
United States Patent (USP) 6,360,939B1 has disclosed a kind of method of making the lead-free solder paste in the electronics industry, this soldering paste has a basic solder powder and infusible interpolation metal dust composition in welding process, add powder fusing point high more a lot of than the fusing point of basic solder powder, basic solder powder comprises the Sn of 80-90% and the Ag of 1-20%, adds powdered-metal and is selected from the metal constituent element that comprises Sn, Ni, Cu, Ag and Bi and other mixtures; The researcher of U.S. Akron university has significantly improved Joint Strength by the nano particle that adds copper or titanium oxide in the Sn-Pb scolder; Then by the composite solder that added molybdenum and tantalum preparation of nanoparticles, Chinese patent CN 1672858A discloses the tin-silver solder that contains memory alloy particle in IBM Corporation; Chinese patent CN 1672859A discloses and has contained nano zircite granule enhancement type tin-silver scolder and method for making thereof; The scolder of these announcements its enhanced particles in welding process all is a molten state not fully, its main cause be exactly in the composite solder between two kinds of base stock powder the fusing point gap excessive, in fact this high-melting-point component in welding process exists with particle shape independently, though can be certain improve strength character, but to producing the weld defect rate phenomenon of increasing is arranged, thereby influence the reliability of solder joint.And composite solder two kinds of components in welding process that U.S. Pat 2002/0040624A1 and CN 1732063A announce all are molten state, but the fusing point difference that requires two components in the composite solder that relates to is less than 15 ℃, the in fact not anti-ability of subsiding of this scolder is to reducing also not obviously effect of bridging short circuit; Also there is the extraordinary Study of Welding report of the mixed powder soldering paste of pure Sn and pure Sb powder in Canada University of Waterloo (CA) Waterloo, Ontario, N2L3GI Canada, but related only be pure simple substance powder, and its welding temperature is higher, has increased the welding procedure difficulty.
It is poor that whether different component melts the fusing point that not only depends between the different component that composite solder itself comprises in the composite solder, and compare etc. closely bound up with the process window in when welding and different component content, choose different process windows and set of dispense ratio according to the different performance requirement of postwelding and can control that high melting point component is liquid, semisolid or solid-state in the scolder, thereby realize different viscosity; Also can require to carry out the gradient temperature welding according to property.
The nontoxic scolder or the soldering paste of characteristics such as exploitation has welding temperature low (approach tradition and contain the Pb scolder) in welding and use, wetting and spreading is good, mechanical property is good, electrical and thermal conductivity is good, welding spot reliability is good always are the focuses of scolder design.The compound lead-free solder of variable fusing point can be brought into play the advantage of different component, realize having complementary advantages, the good welding quality of final formation, the low-melting component that he contains has reduced welding temperature, improved spreading property, the skeleton that its high melting point component forms has improved the mechanical property and the electrical and thermal conductivity of solder joint, has improved the anti-ability of subsiding simultaneously, reduce the bridging short circuit probability of welding, prolonged service life and anti-fatigue performance under higher temperature uses.
Summary of the invention
One of purpose of the present invention provides a kind of stronger anti-ability of subsiding that has, and effectively reduces the unleaded composite solder of variable fusing point that the rosin joint phenomenon takes place.
Another object of the present invention provides the preparation method of above-mentioned composite solder.
Another object of the present invention provides a kind of composite solder paste that comprises the unleaded composite solder of above-mentioned variable fusing point.
A further object of the present invention provides the preparation method of above-mentioned composite solder paste.
Last purpose of the present invention provides the application process of above-mentioned composite solder paste.
For achieving the above object, the present invention takes following technical scheme:
The unleaded composite solder of a kind of variable fusing point is characterized in that being made up of first solder alloy powder and second solder alloy powder, and described first solder alloy powder is the general raw material welding powder of solder or soldering paste; The fusing point of described second solder alloy powder is than the first solder alloy powder height; Wherein there is certain difference (" there is certain difference in fusing point " here is meant that fusing point differs 18-497 ℃) in the fusing point of first and second welding powders; Weight proportion scope between described first solder alloy powder and described second solder alloy powder according to difference in functionality need, different component performance and different welding process requirement, the shared percentage by weight of second solder alloy powder is 5-50wt% (not comprising 50wt%), also can be 50-90wt%.
The unleaded composite solder of preferred variable fusing point of the present invention is characterized in that: above-mentioned first solder alloy powder is a kind of general eutectic or nearly eutectic alloy solder powder; There is a constituent element identical or of the same clan in periodic table in above-mentioned second solder alloy powder and the first solder alloy powder composition.
The unleaded composite solder of preferred variable fusing point of the present invention is characterized in that: described first solder alloy powder is Sn base or Bi base eutectic or the nearly general welding powder of eutectic; Described second solder alloy powder is a kind of in Sn base, Cu base, the Ag base welding powder.
The unleaded composite solder of preferred variable fusing point of the present invention is characterized in that: described first solder alloy powder is a Sn-Bi eutectic welding powder; Described second solder alloy powder is a Sn-Cu eutectic welding powder.
The unleaded composite solder of preferred variable fusing point of the present invention is characterized in that: described first solder alloy powder is a Sn-Bi eutectic welding powder; Described second solder alloy powder is a Sn-Ag eutectic welding powder.
The unleaded composite solder of preferred variable fusing point of the present invention is characterized in that: described first solder alloy powder is a Sn-Bi eutectic welding powder; Described second solder alloy powder is the Sn-Ag-Cu welding powder.
The unleaded composite solder of preferred variable fusing point of the present invention is characterized in that: described Sn-Cu eutectic welding powder proportion by weight is 40-90%, this moment mean described Sn-Bi eutectic welding powder by weight proportion be 60-10%.
The unleaded composite solder of preferred variable fusing point of the present invention is characterized in that: described Sn-Ag eutectic welding powder proportion by weight is 5-70%, this moment mean described Sn-Bi eutectic welding powder by weight proportion be 95-30%.
The unleaded composite solder of preferred variable fusing point of the present invention is characterized in that: Sn-Ag-Cu welding powder proportion by weight is 10-50%; This moment mean described Sn-Bi eutectic welding powder by weight proportion be 90-50%.
The preparation method of the unleaded composite solder of the variable fusing point of the present invention, this method comprises: first solder alloy powder, it is the general raw material welding powder of solder or soldering paste; Second solder alloy powder, its fusing point is than the first solder alloy powder height (can be 18-497 ℃ on request); Two kinds of powder can be granularity powder of the same race according to different welding requirements, also can be granularity powder not of the same race; The weight proportion scope is according to difference in functionality needs, different component performance and different welding process requirement, and the second solder alloy powder content can account for 5-50wt% (not comprising 50wt%), also can account for 50-90wt%.Pass through conventional method then or (vacuum or Ar or N under protective condition
2) mix, promptly get the unleaded composite solder of variable fusing point.
A kind of variable fusing point lead-free composite solder paste comprises: scaling powder/weld-aiding cream of unleaded composite solder powder of resulting according to the method described above variable fusing point and 10-25 weight % (comprise traditional abietyl, water-washing type, exempt from cleaning-type etc.).
Further be that this soldering paste comprises: first solder alloy powder that the unleaded composite solder of described variable fusing point comprises is a Sn-Bi eutectic welding powder, second solder alloy powder is a Sn-Cu eutectic welding powder, and wherein said Sn-Cu eutectic welding powder shared part by weight in the unleaded composite solder of described variable fusing point is 40-90%.
Further be that this soldering paste comprises: first solder alloy powder that the unleaded composite solder of described variable fusing point comprises is a Sn-Bi eutectic welding powder, second solder alloy powder is a Sn-Ag eutectic welding powder, and wherein said Sn-Ag eutectic welding powder is shared part by weight 5-70% in the unleaded composite solder of described variable fusing point.
Further be that this soldering paste comprises: first solder alloy powder that the unleaded composite solder of described variable fusing point comprises is a Sn-Bi eutectic welding powder, second solder alloy powder is the Sn-Ag-Cu welding powder, and wherein said Sn-Ag-Cu welding powder is shared part by weight 10-50% in the unleaded composite solder of described variable fusing point.
That the present invention further comprises is the preparation method of variable fusing point lead-free composite solder paste, this method comprises: scaling powder or the weld-aiding cream of unleaded composite solder powder of the variable fusing point that said method obtains and 10-25 weight %, wherein in scaling powder/weld-aiding cream, (0-30 ℃) stirs, mixes under the uniform temperature condition, make the unleaded composite solder powder of variable fusing point evenly be suspended in the flux vehicle, and compatible with it, promptly obtain stable paste fluid, form variable fusing point lead-free composite solder paste.
That the present invention further comprises is the improvement preparation method of variable fusing point lead-free composite solder paste, this method comprises: utilize electronic balance or other weight meters, the compatible well general soldering paste of (it is identical or of the same clan to refer to that a constituent element is arranged in two kinds of soldering paste) (referring to the soldering paste of the monomer alloy powder preparation of above-mentioned composite solder) by two kinds of different melting points of required proportioning weighing (referring to that the fusing point difference is in 18-497 ℃ of scope), to divide the part by weight of shared composite solder paste be 10-25% to the assembly of scaling powder or weld-aiding cream in two kinds of soldering paste, under 0-30 ℃ of temperature conditions, stir, mix, two kinds of soldering paste are mixed, form homogeneous, stable paste fluid forms variable fusing point lead-free composite solder paste.
The present invention further comprises a kind of electronic component is welded to method on the substrate, its step comprises variable fusing point lead-free composite solder paste is brushed on the substrate, electronic devices and components are placed on the variable fusing point lead-free composite solder paste, integral body is heated to the melting temperature that is higher than low-melting component in the soldering paste (first solder alloy powder) at least then, or gradient-heated makes firm being welded on the substrate of electronic component to the melting temperature of high-melting-point component (second solder alloy powder).
Beneficial effect: composite solder of the present invention has the stronger anti-ability of subsiding, thereby can reduce short circuit; In addition, experiment shows that variable fusing point lead-free composite solder paste of the present invention has two DSC endothermic peaks, and than the universal solder fusing point of one of its component skew is arranged, and the difference along with the variation of component content, this mainly is because scolder is subjected to the influence of second component in fusion process.This explanation is in the SMT process, can make this scolder before the reflux temperature curve peak temperature with regard to partial melting, purpose is to reduce peak value wetting time (being the temperature peak height), thereby reduces the high temperature secondary effect that refluxes to components and parts, has also reduced the generation of rosin joint phenomenon.
The present invention is described in detail below by drawings and Examples.It should be understood that described embodiment only relates to the preferred embodiments of the invention, do not breaking away under the spirit and scope of the present invention situation that the changes and improvements of various compositions and content all are possible.
Description of drawings
Fig. 1 is the preparation technology and the applicating flow chart of preparation unleaded composite solder of variable fusing point of the present invention and soldering paste;
Fig. 2 a and 2b are that the solder joint of the unleaded composite solder of variable fusing point of the present invention and SnPb37 and SnBi58 scolder is sprawled comparison diagram;
Fig. 3 a is the DSC differential thermal analysis curve figure of the variable fusing point lead-free composite solder paste of SnBi58-SnCu0.7 system in the embodiment of the invention;
Fig. 3 b is the DSC differential thermal analysis curve figure of the variable fusing point lead-free composite solder paste of SnBi58-SnAg3.5 system in the embodiment of the invention;
Fig. 3 c is the DSC differential thermal analysis curve figure of the variable fusing point lead-free composite solder paste of SnBi58-SnAg3.0Cu0.5 system in the embodiment of the invention;
Fig. 3 d is the DSC differential thermal analysis curve figure of the variable fusing point lead-free composite solder paste of 6# in the embodiment of the invention (SnBi58-50SnAg3.5) temperature recurrence;
Fig. 4 is the curve map of the fusing point of the unleaded compound material of variable fusing point of the present invention with the low-melting component content.
The specific embodiment
As shown in Figure 1, for preparing preparation technology's flow chart of unleaded composite solder of variable fusing point of the present invention and weldering.The 1st step: the percetage by weight of pressing earlier raw material alloy powder is calculated and weighing; The 2nd step: again raw material alloy powder is evenly mixed; Or directly carried out for the 3rd step: two kinds of general soldering paste of weighing by weight percentage; The 4th step: carry out the preparation of composite solder cream; The 5th step: on substrate, carry out the brushing of solder cream; The 6th step: stick components and parts integral body and add thermal weld.
The preparation of embodiment 1 40 (SnZn9)-60 (SnAg4.0Cu0.5) soldering paste:
Take by weighing 2.3# (38-63 μ m) the welding powder 10g of SnZn9 (199 ℃ of fusing points); take by weighing 3# (25-45 μ m) the welding powder 15g of SnAg4.0Cu0.5 (217 ℃ of fusing points); put into the planetary type ball-milling jar and fully mix 20min; add the general scaling powder of 12 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion; (room temperature) nitrogen protection state stirs, mixes under the uniform temperature condition; pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 2 95 (SnAg3.5)-5 (CuP8.3) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 23.75g of SnAg3.5 (221 ℃ of fusing points), take by weighing fine powder (the 25 μ m) 1.25g of CuP8.3 (714 ℃ of fusing points), put into the planetary type ball-milling jar and fully mix 20min, add the general scaling powder of 12 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion, (in 0 ℃ the freezer) stirs, mixes under the uniform temperature condition, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 3 80 (SnAg4.0Cu0.5)-20 (CuP8.3) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 20g of SnAg4.0Cu0.5, take by weighing the fine powder (25 of CuP8.3
μ m) 5g, put into the planetary type ball-milling jar and fully mix 20min, add the general scaling powder of 12 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion, (room temperature) stirs, mixes under the uniform temperature condition, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 4 10 (SnBi58)-90 (SnCu0.7) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 2.5g of SnBi58 (138 ℃ of fusing points), take by weighing 3# (25-45 μ m) the welding powder 22.5g of SnCu0.7 (227 ℃ of fusing points), put into the planetary type ball-milling jar and fully mix 20min, add the general scaling powder of 12 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion, (room temperature) stirs, mixes under the uniform temperature condition, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 5 30 (SnBi58)-70 (SnCu0.7) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 7.5g of SnBi58, take by weighing 3# (25-45 μ m) the welding powder 17.5g of SnCu0.7, put into the planetary type ball-milling jar and fully mix 20min, add the general scaling powder of 12 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion, (0 ℃ freezer environment) stirs, mixes under the uniform temperature condition, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 6 50 (SnBi58)-50 (SnCu0.7) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 12.5g of SnBi58, take by weighing 3# (25-45 μ m) the welding powder 12.5g of SnCu0.7, put into the planetary type ball-milling jar and fully mix 20min, add 12 weight % water-washing types (chanting the water-soluble type scaling powder of writing brush 622H) then in proportion, (room temperature) stirs, mixes under the uniform temperature condition, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 7 60 (SnBi58)-40 (SnCu0.7) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 15g of SnBi58; take by weighing 3# (25-45 μ m) the welding powder 10g of SnCu0.7; put into the planetary type ball-milling jar and fully mix 20min; add 12 weight % routines then in proportion and exempt from cleaning-type (" friendly nation " board FY-N99 exempts from scaling powder clearly); under the certain condition (30 ℃; the nitrogen protection environment) stirs, mixes, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 8 30 (SnBi58)-70 (SnAg3.5) soldering paste:
Take by weighing 3# (25-45um) the welding powder 7.5g of SnBi58, take by weighing 3# (25-45 μ m) the welding powder 17.5g of SnAg3.5, put into the planetary type ball-milling jar and fully mix 20min, add the general scaling powder of 12 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion, (room temperature) stirs, mixes under the uniform temperature condition, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 9 50 (SnBi58)-50 (SnAg3.5) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 12.5g of SnBi58, take by weighing 3# (25-45 μ m) the welding powder 12.5g of SnAg3.5, put into the planetary type ball-milling jar and fully mix 20min, add the general scaling powder of 12 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion, (0 ℃ freezer environment) stirs, mixes under the uniform temperature condition, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 10 75 (SnBi58)-25 (SnAg3.5) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 18.75g of SnBi58, take by weighing 3# (25-45 μ m) the welding powder 6.25g of SnAg3.5, put into the planetary type ball-milling jar and fully mix 20min, add the general scaling powder of 12 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion, (room temperature) stirs, mixes under the uniform temperature condition, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 11 95 (SnBi58)-5 (SnAg3.5) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 23.75g of SnBi58, take by weighing 3# (25-45 μ m) the welding powder 1.25g of SnAg3.5, put into the planetary type ball-milling jar and fully mix 20min, add the general scaling powder of 12 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion, (room temperature) stirs, mixes under the uniform temperature condition, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 12 50 (SnBi58)-50 (SnAg3.0Cu0.5) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 12.5g of SnBi58; take by weighing 3# (25-45 μ m) the welding powder 12.5g of SnAg3.0Cu0.5 (217 ℃ of fusing points); put into the planetary type ball-milling jar and fully mix 20min; add the general scaling powder of 25 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion; under the certain condition (30 ℃; the argon shield environment) stirs, mixes, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 13 70 (SnBi58)-30 (SnAg3.0Cu0.5) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 17.5g of SnBi58, take by weighing 3# (25-45 μ m) the welding powder 7.5g of SnAg3.0Cu0.5, put into the planetary type ball-milling jar and fully mix 20min, add the general scaling powder of 12 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion, (room temperature, vacuum) stirs, mixes under the uniform temperature condition, pour in the solder paste cartridge, put into refrigerator and be in store for.
The preparation of embodiment 14 90 (SnBi58)-10 (SnAg3.0Cu0.5) soldering paste:
Take by weighing 3# (25-45 μ m) the welding powder 22.5g of SnBi58, take by weighing 3# (25-45 μ m) the welding powder 2.5g of SnAg3.0Cu0.5, put into the planetary type ball-milling jar and fully mix 20min, add the general scaling powder of 10 weight % (be sure oing the synthetic colophony type scaling powder of CR22LU type of Ai Fa company) then in proportion, (room temperature) stirs, mixes under the uniform temperature condition, pour in the solder paste cartridge, put into refrigerator and be in store for.
The improvement preparation of embodiment 15 90 (SnBi58)-10 (SnAg3.0Cu0.5) composite solder paste:
Take by weighing 3# (the welding powder granularity is at 25-45 μ m) the soldering paste 24.75g of SnBi58, take by weighing 3# (the welding powder granularity is at 25-45 μ m) the soldering paste 2.75g of SnAg3.0Cu0.5, (two kinds of soldering paste are the two firmly high-tech development centre preparations in Beijing), then in certain condition (room temperature, argon filling) puts into solder paste stirrer under and fully stir 20min, pour in the solder paste cartridge, put into refrigerator and be in store for.
Embodiment 16
2024 components and parts are inserted on the prefabricated substrate, then with above-mentioned variable fusing point lead-free composite solder paste, promptly (50 (SnBi58)-50 (SnAg3.0Cu0.5) soldering paste are brushed to the junction of components and parts and substrate, again whole base plate is put into reflow soldering together with components and parts, take out according to the whole preheating-insulation of SnPb37 standard circumfluence welding procedure curve-Jia thermal weld-cooling, give over to observation.
Table 1 is the component of the used unleaded composite solder of variable fusing point of the variable fusing point lead-free composite solder paste of embodiment of the invention 1-14 preparation.
Table 2 is the unleaded composite solder DSC of the variable fusing point fusing point test result of embodiment of the invention 1-10 preparation.
Fig. 2 a-2b is that the solder joint of the unleaded composite solder of variable fusing point of the present invention and SnPb37 and SnBi58 scolder is sprawled comparison diagram.Fig. 2 a and Fig. 2 b all are followed successively by SnPb37,6#, 10#, SnBi58 from left to right.According to Japanese JIS standard the 0.2+0.001g scolder being placed on purity is on 99.9% the copper plate, is incubated 90s on 250 ℃ of thermostatic electrothermal plates, takes with digital camera behind the air cooling.Before the experiment, copper coin sand paper fine grinding, clean with acetone again and remove greasy dirt and in 10%HCl, dip 5s removal surface film oxide, fully wash with deionized water, soldering paste is formulated by the synthetic colophony type scaling powder of unleaded composite solder of variable fusing point of the present invention and the CR22LU type of be sure oing Ai Fa company among this test a figure again; Soldering paste is exempted from by the unleaded composite solder of variable fusing point of the present invention and " friendly nation " board FY-N99 that scaling powder is formulated clearly among the b figure.As can be seen from Figure 2: compound lead-free solder of the present invention at present SnPb37 has suitable spreading area, and than the surperficial rounding of SnBi58 scolder, full.This explanation the present invention compound lead-free solder has spreading property preferably, the stronger anti-ability of subsiding, thereby makes scolder of the present invention have good solderability, and can reduce the generation of solder shorts.
Fig. 3 a is the DSC differential thermal analysis curve figure of the variable fusing point lead-free composite solder paste of SnBi58-SnCu0.7 system in the embodiment of the invention; Fig. 3 b is the DSC differential thermal analysis curve figure of the variable fusing point lead-free composite solder paste of SnBi58-SnAg3.5 system in the embodiment of the invention; Fig. 3 c is the DSC differential thermal analysis curve figure of the variable fusing point lead-free composite solder paste of SnBi58-SnAg3.0Cu0.5 system in the embodiment of the invention; Fig. 3 d is the DSC differential thermal analysis curve figure of the variable fusing point lead-free composite solder paste of 6# in the embodiment of the invention (SnBi58-50SnAg3.5) temperature recurrence.This experiment uses DSC2910 difference formula scanning calorimeter (TAInstru-ment) to measure the fusing point of alloy, carries out the fusion temperature analysis, and technological parameter is according to Japanese JIS-Z3198 standard test.Therefrom as can be seen: variable fusing point lead-free composite solder paste of the present invention has two DSC endothermic peaks, and the universal solder fusing point than one of its component has skew, and the difference along with the variation of component content, this mainly is because scolder is subjected to the influence of second component in fusion process.This explanation is in the SMT process, can make this scolder before the reflux temperature curve peak temperature with regard to partial melting, purpose is to reduce peak value wetting time (being the temperature peak height), thereby reduces the high temperature secondary effect that refluxes to components and parts, has also reduced the generation of rosin joint phenomenon.
Fig. 4 is the curve map of the fusing point of the unleaded compound material of variable fusing point of the present invention with the low-melting component content.As can be seen: compound lead-free solder of the present invention, increase by first solidus and second solidus temperature with Bi content under other, the certain content range condition of system of the same race change not obvious, but first liquidus curve increases afterwards earlier and subtracts, and second liquidus curve reduces with the increase of Bi.This explanation can be complied with different welding process requirement by the content that changes different component within the specific limits.
Claims (5)
1, the unleaded composite solder of a kind of variable fusing point is characterized in that being made up of first solder alloy powder and second solder alloy powder, and described first solder alloy powder is Sn base or Bi base eutectic or the nearly general welding powder of eutectic; Described second solder alloy powder is a Cu-P eutectic welding powder; The shared percentage by weight of described second solder alloy powder is 5-90 weight %.
2, the unleaded composite solder of variable fusing point according to claim 1 is characterized in that: described first solder alloy powder is a Sn-Ag eutectic welding powder.
3, the unleaded composite solder of variable fusing point according to claim 1 is characterized in that: described first solder alloy powder is a Sn-Ag4.0-Cu0.5 eutectic welding powder.
4, the method for preparing variable fusing point lead-free composite solder paste according to the unleaded composite solder of each described variable fusing point among the claim 1-3, the material that this method is used comprises described first solder alloy powder and second solder alloy powder; It is characterized in that, also comprise conventional scaling powder or the weld-aiding cream of 10-25 weight %; Conventional scaling powder or weld-aiding cream are traditional rosin fundamental mode; Under 0-30 ℃ of temperature conditions, stir, mix, the unleaded composite solder powder of variable fusing point evenly is suspended in the flux vehicle, and compatible with it, promptly obtain stable paste fluid, form variable fusing point lead-free composite solder paste.
5, a kind of application process of variable fusing point lead-free composite solder paste, its step comprises the variable fusing point lead-free composite solder paste of claim 4 gained is brushed on the substrate, electronic devices and components are placed on the variable fusing point lead-free composite solder paste, the whole then melting temperature that is higher than first solder alloy powder at least that is heated to, or the melting temperature of gradient-heated to the second solder alloy powder, make firm being welded on the substrate of electronic component.
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| CNB2006101036186A CN100537117C (en) | 2006-05-10 | 2006-07-25 | Melting-point-changeable lead-free composite soldering material, soldering paste, thire preparation and use |
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| CNB2006101036186A CN100537117C (en) | 2006-05-10 | 2006-07-25 | Melting-point-changeable lead-free composite soldering material, soldering paste, thire preparation and use |
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| JP5643972B2 (en) * | 2009-02-25 | 2014-12-24 | 株式会社弘輝 | Metal filler, low-temperature connection lead-free solder, and connection structure |
| CN102528315B (en) * | 2012-01-11 | 2015-03-11 | 深圳市唯特偶新材料股份有限公司 | Lead-free and cleaning-free solder paste capable of realizing few-cavity welding layers and preparation method of lead-free cleaning-free solder paste |
| CN104985350B (en) * | 2015-07-03 | 2017-03-29 | 北京康普锡威科技有限公司 | A kind of unleaded composite solder material of Sn Bi/Cu |
| CN105033496B (en) * | 2015-07-03 | 2018-01-09 | 北京康普锡威科技有限公司 | A kind of compound lead-free high-temperature solder of high-strength highly-conductive and preparation method thereof |
| CN105127611A (en) * | 2015-09-28 | 2015-12-09 | 苏州龙腾万里化工科技有限公司 | Low-temperature solder paste |
| JP6619387B2 (en) * | 2017-06-08 | 2019-12-11 | 株式会社タムラ製作所 | Lead-free solder alloy |
| CN108015373B (en) * | 2017-12-21 | 2020-04-14 | 哈尔滨工业大学 | Preparation method of combined alloy soft soldering structure for expanding service working temperature range |
| CN108857135A (en) * | 2018-03-12 | 2018-11-23 | 深圳市鑫富锦新材料有限公司 | A kind of hybrid alloys solder cream |
| CN108337821B (en) * | 2018-04-20 | 2019-08-16 | 汉通（沧州）电子有限公司 | A kind of welding method of circuit board |
| JP2022506217A (en) * | 2018-10-31 | 2022-01-17 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Mixed alloy solder paste, its manufacturing method, and soldering method |
| CN111462648A (en) * | 2020-04-23 | 2020-07-28 | 厦门乾照半导体科技有限公司 | Micro-L ED display device, display panel and manufacturing method thereof |
| US20230241725A1 (en) * | 2022-01-19 | 2023-08-03 | Ning-Cheng Lee | Solder pastes and methods of using the same |
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