CN100557783C - 电气部件的安装装置 - Google Patents
电气部件的安装装置 Download PDFInfo
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Abstract
本发明提供一种可利用粘结剂以高的可靠性安装多个电气部件的安装装置。本发明的安装装置,具备热压接头(4),所述热压接头(4)在头主体(5)中具有由既定的弹性体构成的压接部件(6),构成为使压接部件(6)以既定的压力对配置在布线基板(10)上的IC芯片(20)进行按压,设置有按照压接部件(6)的压接面(6a)的区域调整按压力的按压力调整机构。作为按压力调整机构,可以使用在头主体(5)上设置有多个按压力调整框(5a),并在这些按压力调整框(5a)的内侧配置了压接部件(6)的机构。
Description
技术领域
本发明涉及将例如半导体芯片等电气部件安装到布线基板上的技术,尤其涉及一种利用粘结剂来安装电气部件的技术。
背景技术
以往,作为将裸芯片直接安装到印刷布线板等布线基板上的方法,公知有采用在粘合剂中分散了导电粒子的各向异性导电性粘结膜的方法。
在采用了各向异性导电性粘结膜的安装方法中,在粘贴了各向异性导电性粘结膜的基板上搭载了IC芯片之后,以陶瓷或金属制等平坦的压接头对IC芯片进行加压、加热,使各向异性导电性粘结膜固化,来进行热压接安装。
在利用这样的金属等的压接头来进行加压、加热的方法的情况下,存在着当进行热压接时,对IC芯片周围的粘结剂的边缘(fillet)部加热不足,导致连接可靠性降低,而且难以安装多个IC芯片的问题。
鉴于此,近年来为了解决这些问题,提出了一种利用由硅酮橡胶等弹性体构成的热压接头,进行IC芯片的热压接的技术(例如参照专利文献1、2)。
但是,在这样的现有技术中,由于IC芯片与基板的连接部分,即凸块(bump)与图案之间的加压力不足,所以无法进行充分的连接,存在着不能充分确保初始导通电阻及老化后的连接可靠性的问题。
而且,在利用由弹性体构成的热压接头进行加压、加热的方法中,存在着压接时IC芯片会与基板错位的问题。
并且,如此一来,尤其在集中安装多个IC芯片的情况下,具有上述错位变大的倾向。
专利文献1:特开2000-79611号公报
专利文献2:特开2002-359264号公报
发明内容
本发明是为了解决上述现有技术的课题而完成的,其目的在于,提供一种能够利用粘结剂以高的可靠性安装多个电气部件的安装装置。
为了实现上述目的而作出的本发明提供一种安装装置,是电气部件的安装装置,包括:热压接头,在头主体中具有由既定的弹性体构成的压接部件;和按压力调整机构,按照前述压接部件的压接面的区域调整按压力;构成为使前述压接部件以既定的压力对配置在布线基板上的电气部件进行按压。
本发明在前述发明中,在前述头主体上设置多个框状的按压力调整部作为前述按压力调整机构,在该按压力调整部的内侧配置有前述压接部件。
本发明在前述发明中,在前述头主体上设置突起状的按压力调整部作为前述按压力调整机构。
本发明在前述发明中,构成为前述按压力调整部的高度不同。
本发明在前述发明中,构成为前述按压力调整机构埋设在前述压接部件内。
本发明在前述发明中,在前述压接部件上设置缺口部作为前述按压力调整机构。
本发明在前述发明中,前述按压力调整机构通过组合多个前述压接部件而一体构成。
本发明在前述发明中,具有支承前述布线基板的基台,在前述基台中设置有加热器。
根据本发明,如果在进行热压接之际通过由既定的弹性体构成的压接部件按压电气部件,则电气部件按压侧的区域(例如,与压接部件对置的顶部区域)以既定的压力被按压到布线基板,另外,该电气部件侧部侧的区域以比对按压侧区域的压力小的压力被按压。
结果,不仅可以对电气部件和布线基板的连接部分施加足够的压力,还能够按照不在电气部件周围的边缘部产生空隙的方式进行加压,从而,可使用例如各向异性导电性粘结膜进行高可靠性的IC芯片等的连接。
并且,在本发明中,由于设置有按照压接部件的压接面的区域调整按压力的按压力调整机构,所以,在通过各压接部集中按压多个电气部件之际,能够以最佳的力对各电气部件的按压侧及侧部侧区域分别进行按压,由此,可防止进行压接之际各电气部件与基板的错位,能够进行可靠性高的安装。
具体而言,在本发明中,设置了多个框状的按压力调整部作为按压力调整机构,当在这些按压力调整框部的内侧配置压接部件时,能够对对应的电气部件可靠地执行下述关系,即按照侧部侧区域压力小于按压侧区域的方式进行按压。另外,由于从材质、硬度等观点出发可对按压力调整框部内的压接部件进行微调整,所以,能够在集中安装多个电气部件时可靠地防止错位。
而且,在本发明中,如果在该头主体上设置突起状的按压力调整部作为按压力调整机构,或构成为按压力调整部的高度不同,则可以使压接部件的压接面的各区域中的按压力最佳,不仅可进一步可靠地防止多个电气部件的位置错位,同时能够对多个电气部件进行热压接。
并且,在本发明中,如果构成为按压力调整机构埋设在压接部件内,则即使当电气部件位于按压力调整机构的正下方,也可进行压接,因此,能够在压接面的各区域进行顺畅的压接,结果,不需要准备与电气部件的数量、配置、大小等对应的热压接头,可防止各种电气部件位置错位,同时能够对多个电气部件进行热压接。
进而,在本发明中,当在压接部件上设置了缺口部作为按压力调整机构时,不会隔着缺口部向邻接部位传播按压力,可以仅使与电气部件对应的部分压缩,因此,能够以简易的机构防止电气部件的位置错位而不需要设置框部。
此外,在本发明中,当按压力调整机构通过组合多个压接部件而一体构成时,由于可形成与在压接部件上设置上述缺口部的情况相同的间隙,所以,能够以简易的机构防止电气部件的位置错位而不需要设置框部。
根据本发明,可利用粘结剂以高的可靠性安装多个电气部件。
附图说明
图1(a)是表示本实施方式的安装装置的主要部分的概略构成图,图1(b)是表示该安装装置的热压接头与IC芯片的位置关系的说明图。
图2(a)、图2(b)是表示利用了本实施方式的安装装置的安装方法的一个例子的工序图。
图3是表示本发明其他实施方式的概略构成图。
图4是表示本发明其他实施方式的概略构成图。
图5是表示本发明其他实施方式的概略构成图。
图6是表示本发明其他实施方式的概略构成图。
图7(a)是表示本发明其他实施方式的头主体的俯视图,图7(b)是图7(a)的A-A线剖视图。
附图标记说明
1安装装置,2基台,3加热器,4热压接头,5头主体,5a按压力调整框(框状的按压力调整部、按压力调整机构),6压接部件,6a压接面,7各向异性导电性粘结膜,7c边缘部,10布线基板,20IC芯片(电气部件),20a顶部。
具体实施方式
下面,参照附图对本发明所涉及的电气部件的安装装置的实施方式进行详细说明。
图1(a)是表示本实施方式的安装装置的主要部分的概略构成图,图1(b)是表示该安装装置的热压接头与IC芯片的位置关系的说明图。
如图1(a)、图1(b)所示,本实施方式的安装装置1包括:对形成有布线图案10a的布线基板10进行载置的基台2、和对设置有凸块20b的IC芯片(电气部件)20进行加压及加热的热压接头4。
这里,基台2由既定的金属构成,在其内部设置有加热用的加热器3。
另一方面,热压接头4具有由既定的金属构成的头主体5,在其内部设置有未图示的加热用加热器。
而且,在头主体5的与基台2对置的部分,按照与多个IC芯片20对应的方式设置有多个按压力调整框(按压力调整机构)5a,从而设置了被分割为多个区域的凹部5b。
在本发明中,由板状的弹性体构成的压接部件6被安装成与各凹部5b的内壁紧密接触。
本实施方式的压接部件6被配置成平面状的压接面6a处于水平状态。而且,为了压接部件6的压接面6a对IC芯片20的顶部20a施加均匀的力,其被构成为比顶部20a的面积大。
并且,从以最佳的压力对IC芯片20的顶部20a和后述侧部的边缘部7c加压的观点出发,优选将压接部件6的厚度设定成与IC芯片20的厚度相同或更厚。
另一方面,在本发明的情况下,压接部件6的弹性体的种类没有特别限定,但从提高连接可靠性的观点出发,优选使用橡胶硬度为40以上80以下的弹性体。
橡胶硬度小于40的弹性体对IC芯片20的压力不充分,存在着初始电阻及连接可靠性差的不良情况,橡胶硬度大于80的弹性体对边缘部分的压力不充分,会在粘结剂的粘接树脂中产生空隙(void),存在着连接可靠性差的不良情况。
另外,在本说明书中,设橡胶硬度采用了遵照JIS S 6050的标准(温度条件为室温5~35℃)。
这里,作为橡胶硬度的测定方法在JIS S 6050中记载如下。
即,使用压针形状为直径5.08±0.02mm的半球状的弹簧硬度试验机,对水平地保持的试验片的表面,按照试验机的压针成为铅垂的方式与加压面接触,并以正数立即读取刻度。
其中,试验片的测定位置是将表面整体三等分、并将各自的中央部分作为一个位置进行测定,设其中央值为试验片的硬度。
备注1:压针的高度在刻度为0时是2.54±0.02mm,在刻度为100时为0mm。
备注2:对于刻度与弹簧力(N)的关系而言,在刻度为0时是0.54,在刻度为10时为1.32,在刻度为20时为2.11,在刻度为25时为2.50,在刻度为30时为2.89,在刻度为40时为3.68,在刻度为50时为4.46,在刻度为60时为5.25,在刻度为70时为6.03,在刻度为75时为6.42,在刻度为80时为6.82,在刻度为90时为7.60,在刻度为100时为8.39。
另外,根据本发明者们的实验可以确认,在将压接部件6从室温加热到240℃时,其弹性体的橡胶硬度几乎不变化(±2左右)。
作为这样的弹性体,可以使用天然橡胶、合成橡胶的任意一种,但从耐热性、耐压性的观点出发,优选使用硅酮橡胶。
图2(a)、图2(b)是表示采用了本实施方式的安装装置的安装方法的一个例子的工序图。
在本实施方式中,为了进行IC芯片20的安装,如图2(a)所示,将布线基板10配置到基台2上,并将各向异性导电性粘结膜7载置到该布线基板10上。该各向异性导电性粘结膜7在粘结树脂7a中分散了导电粒子7b。
另外,如果粘结树脂7a中分散的导电粒子7b的量为少量,则本发明所使用的粘结剂的熔融粘度,不会因有无分散导电粒子7b而受到影响。
并且,在这种各向异性导电性粘结膜7上载置IC芯片20,经由未图示的保护膜将热压接头4的压接面6a按压到IC芯片20的顶部20a,在既定的条件下进行预压接,进而在以下的条件下进行正式压接。
本发明从对IC芯片20周围的边缘部7c充分加热来可靠地防止产生空隙的观点出发,优选在正式压接时以既定温度加热IC芯片20侧,并以高于上述既定温度的温度加热布线基板10侧。
具体而言,对热压接头4的加热器进行控制,以使压接部件6的温度成为100℃左右,并对基台2的加热器3进行控制,以使各向异性导电性粘结膜7的粘结树脂7a的温度成为200℃左右。
由此,在进行该热压接之际,将粘结剂各向异性导电性粘结膜7加热成熔融粘度为1.0×102mPa·s以上1.0×105mPa·s以下。
这里,在热压接时的各向异性导电性粘结膜7的熔融粘度小于1.0×102mPa·s时,热压接时的粘结树脂7a的流动性大,存在着会产生空隙,导致初始电阻及连接可靠性差的不良情况;在熔融粘度大于1.0×105mPa·s的情况下,热压接时在连接部分无法将粘结树脂7a完全排除,存在着会产生空隙,导致初始电阻及连接可靠性差的不良情况。
另外,对于IC芯片20而言,正式压接时的压力为每个以100N左右作用15秒左右。
如图2(b)所示,在本实施方式中,通过利用上述的由弹性体构成的压接部件6进行加压,可以将IC芯片20的顶部20a以既定的压力向布线基板10按压,另一方面,能够以比对顶部20a的压力小的压力按压IC芯片20侧部的边缘部7c,由此,不仅可以对IC芯片20与布线基板10的连接部分施加足够的压力,而且,对IC芯片20周围的边缘部7c也可按照不产生空隙的方式加压。
结果,根据本实施方式,可利用各向异性导电性粘结膜7进行高可靠性的IC芯片20等的连接。
并且,在本实施方式中,由于通过按压力调整框5a对各压接部件6的按压力进行调整,所以,在利用各压接部件6集中按压多个IC芯片20时,能够以最佳的力(特别是对IC芯片20的侧部以均匀的力)分别对各IC芯片的顶部20a及侧部侧进行按压,由此,在压接之际可防止各IC芯片20与基板10的错位,从而进行可靠性高的安装。
图3~图6是表示本发明其他实施方式的概略构成图,下面对与上述实施方式对应的部分赋予相同附图标记,并省略其详细说明。
图3所示的安装装置1A,与上述实施方式的头主体5同样,在设置于头主体5的凹部5b中设置有多个按压力调整框5a,但在本实施方式的情况下,这些按压力调整框5a构成为埋设在被配置于凹部5b内的一体的压接部件6内。
并且,这里在按压力调整框5a之间设置有高度低于按压力调整框5a的不同高度的按压力调整框50。
而且,在本实施方式中,通过变更按压力调整框5a、50的位置、高度,可以按照压接部件6的压接面6a的区域调整按压力。
根据具有这种构成的本实施方式,由于即使在IC芯片20及布线基板10位于按压力调整框5a的正下方时,也可以进行压接,所以,在压接面6a的各区域中可进行顺畅的按压,结果,不必准备与IC芯片20的个数、配置、大小等对应的热压接头4,可以在防止位置错位的同时对多个IC芯片20进行热压接。
由于其他的构成及作用效果与上述实施方式相同,所以省略其详细说明。
图4所示的安装装置1B,在头主体5的凹部5b内安装的压接部件6的压接面6a上,设置有缺口部6b作为按压力调整机构。
该情况下,隔着既定的间隔设置有多个缺口部6b。并且,通过变更缺口部6b的个数、方向、深度,可按照压接部件6的压接面6a的区域调整按压力。
根据具有这种构成的本实施方式,例如在以缺口部6b以外的部分按压了IC芯片20时,按压力不会隔着缺口部6b传播到邻接部位,可以仅压缩该按压部分,结果,能够不设置框部地以简单的机构防止IC芯片20的位置错位。
另外,由于本实施方式的缺口部6b的间隙小,所以,即使在IC芯片20位于缺口部6b的正下方时,也不会在热压接之际产生IC芯片20的位置错位,可以在压接面6a的各区域中进行顺畅的按压。
并且,通过具有该构成的本实施方式,也不需要准备与IC芯片20的个数、配置、大小等对应的热压接头4,在可以防止位置错位的同时,可对多个IC芯片20进行热压接。
由于其他的构成及作用效果与上述实施方式相同,所以省略其详细的说明。
图5所示的安装装置1C将图3所示的实施方式与图4所示的实施方式进行了组合。
即,在本实施方式中,构成为按压力调整框5a、50埋设于头主体5的凹部5b的压接部件6内,并且,在该压接部件6的压接面6a上设置有缺口部6b。
而且,根据这样的本实施方式,也不需要准备与IC芯片20的数量、配置、大小等对应的热压接头4,在防止位置错位的同时可对多个IC芯片20进行热压接。
尤其是在本实施方式中,由于作为按压力调整机构采用了将头主体5的按压力调整框5a、50与压接部件6的缺口部6b并用的构成,所以,在压接部件6的压接面6a的各区域能够微调整按压力。
其他的构成及作用效果与上述实施方式相同,因此省略其详细的说明。
图6所示的安装装置1D构成为按压力调整框5a埋设在上述头主体5的凹部5b的压接部件6内,并且,组合了多个(本实施方式的情况下为两种)压接部件61、62一体构成。
如图6所示,在本实施方式中,构成为在头主体5的凹部5b的第一压接部件61中设置长方体形状的凹部,并将与该凹部相同形状的第二压接部件62嵌合于其中,由此,可形成平面式的压接面6a。
该情况下,头主体5的按压力调整框5a贯通第二压接部件62并对其加以支承,例如采用粘结剂将第二压接部件62固定在第一压接部件61的头主体5的凹部5a侧的界面61a上。
由此,在第二压接部件62的侧部侧的面与第一压接部件61的壁面之间形成间隙60。
根据具有这样构成的本实施方式,由于在第一及第二压接部件61、62之间形成有与上述实施方式的缺口部6b相同的间隙60,所以,能够以简易的机构防止IC芯片20的位置错位,而不必设置框部。
该情况下,与上述实施方式的情况相同,由于该间隙60微小,所以,即使IC芯片20位于其正下方,当进行热压接时也不会产生IC芯片20的位置错位。
另外,从可靠地发挥本发明的效果、提高连接可靠性的观点出发,使用橡胶硬度小于第一压接部件61的部件作为第二压接部件62是有效的。
而且,根据这样的本实施方式,也不需要准备与IC芯片20的数量、配置、大小等对应的热压接头4,在防止位置错位的同时可对多个IC芯片20进行热压接。
由于其他的构成及作用效果与上述实施方式相同,所以省略其详细的说明。
另外,本发明不限定于上述的实施方式,还可进行各种变更。
例如,在上述的实施方式中,在头主体上设置了框状的压力调整部作为按压力调整机构,但本发明不限定于此,也能够设置下述的突起状按压力调整部。
例如,在图7(a)、图7(b)所示的实施方式中,构成为在上述的头主体5的按压力调整框5a内侧的凹部5b中设置有多个突起状的按压力调整部51。
这里,按压力调整框51被设置成高度比周围的按压力调整框5a低,由此,使得按压力调整框51埋设在上述按压部件6内。
并且,根据这样的本实施方式,也不需要准备与IC芯片20的数量、配置、大小等对应的热压接头4,在防止位置错位的同时可对多个IC芯片20进行热压接。
而且,在上述的实施方式中,举例说明了采用各向异性导电性粘结膜安装IC芯片的情况,但本发明不限定于此,也可以采用不含有导电粒子的粘结剂。
并且,在上述的实施方式中,举例说明了对具有凸块电极的IC芯片进行安装的情况,但也能够适用于不具有凸块电极的IC芯片。
Claims (8)
1、一种安装装置,是电气部件的安装装置,其特征在于,包括:
热压接头,在头主体中具有由既定的弹性体构成的压接部件;和
按压力调整机构,按照前述压接部件的压接面的区域调整按压力;
作为前述按压力调整机构、在前述头主体的与基台对置的部分,设置有凹部,并且,在该凹部设置有多个框状的按压力调整部,从而该凹部被分割为多个区域,进而,在该按压力调整部的内侧,以与该按压力调整部的内壁紧密接触的方式配置前述压接部件,
构成为使前述压接部件以既定的压力对配置在布线基板上的电气部件进行按压。
2、根据权利要求1所述的安装装置,其特征在于,
构成为前述框状的按压力调整部的高度不同。
3、根据权利要求1所述的安装装置,其特征在于,
构成为前述按压力调整机构埋设在前述压接部件内。
4、根据权利要求1所述的安装装置,其特征在于,
在前述压接部件的压接面上设置有缺口部作为前述按压力调整机构。
5、根据权利要求1所述的安装装置,其特征在于,
前述按压力调整机构通过组合两个前述压接部件而一体构成。
6、根据权利要求1所述的安装装置,其特征在于,
具有支承前述布线基板的基台,在前述基台中设置有加热器。
7、一种安装装置,是电气部件的安装装置,其特征在于,包括:
热压接头,在头主体中具有由既定的弹性体构成的压接部件;和
按压力调整机构,按照前述压接部件的压接面的区域调整按压力;
作为前述按压力调整机构、在前述头主体的与基台对置的部分,设置有凹部,并且,在该凹部设置有多个突起状的按压力调整部,进而,在该凹部内,以与该凹部的内壁紧密接触的方式配置前述压接部件,
构成为使前述压接部件以既定的压力对配置在布线基板上的电气部件进行按压。
8、根据权利要求7所述的安装装置,其特征在于,
构成为前述突起状的按压力调整部的高度不同。
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JP (1) | JP4841431B2 (zh) |
KR (1) | KR101253794B1 (zh) |
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HK1116920A1 (en) | 2009-01-02 |
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JPWO2006082744A1 (ja) | 2008-06-26 |
EP1845556A1 (en) | 2007-10-17 |
WO2006082744A1 (ja) | 2006-08-10 |
US7857028B2 (en) | 2010-12-28 |
EP1845556A4 (en) | 2010-02-10 |
EP2264748A2 (en) | 2010-12-22 |
CN101111932A (zh) | 2008-01-23 |
KR101253794B1 (ko) | 2013-04-12 |
JP4841431B2 (ja) | 2011-12-21 |
KR20070099679A (ko) | 2007-10-09 |
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