CN100561179C - Nano mechanical pick-up unit based on AFM - Google Patents

Nano mechanical pick-up unit based on AFM Download PDF

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Publication number
CN100561179C
CN100561179C CNB2006101512356A CN200610151235A CN100561179C CN 100561179 C CN100561179 C CN 100561179C CN B2006101512356 A CNB2006101512356 A CN B2006101512356A CN 200610151235 A CN200610151235 A CN 200610151235A CN 100561179 C CN100561179 C CN 100561179C
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connects
chip microcomputer
change
input bus
analog signal
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CN101000295A (en
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闫永达
孙涛
胡振江
史立秋
董申
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Harbin Institute of Technology
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Harbin Institute of Technology
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Abstract

Based on the nano mechanical pick-up unit of AFM, what it related to is the technical field that nano mechanical detects.It is to exist its checkout equipment to cost an arm and a leg for solving existing measuring method, and existing AFM system can not directly provide the impression conditional curve of the surperficial mechanical property of reflection and the problem of the friction force signal of the delineation process that loads by given pace of energy measurement not.Main control computer (1) connects two-dimentional work bench controller (13), two-dimentional work bench (14) and AFM system (15) respectively by serial communication circuit (2), first single-chip microcomputer (4), photoelectricity isolation electric current loop serial line interface passage (8), the 3rd single-chip microcomputer (11), three road D/A change-over circuits (12) and second singlechip (9), two-way A/D change-over circuit (10).It also has the manufacturing cost low price, can directly provide the impression conditional curve of the surperficial mechanical property of reflection and the friction force signal of the delineation process that can load by given pace.The maximum magnitude of dot matrix impression is 100 μ m * 100 μ m, and delineation length is 100nm~100 μ m.

Description

Nano mechanical pick-up unit based on AFM
Technical field
What the present invention relates to is the technical field that nano mechanical detects.
Background technology
The nano level mechanical property of surface measurements mainly adopts the nanometer mechanics pick-up unit at present, as Switzerland CSM TMThe Nano Indenter XP type nano hardness instrument of producing with American MTS company of nano hardness tester etc., the power that these devices apply from the teeth outwards is usually in milli ox magnitude.Be difficult to satisfy measurement requirement in the nano-machine characteristic of several nanometers to the tens nanometer scope, therefore be applied to lip-deep power in order to reduce pressure head, realize the mechanical property measurement of nanoscale, usually people take following two kinds of means: (1) installs the gauge head of the responsive power of high precision on AFM, as the nanometer in-situ measurement system of U.S. Hysitron company production.Need be on the AFM integrated extra cover device for measuring force of this cover system or buy the independent equipment of a cover in addition, so price comparison costliness.(2) adopt AFM itself to measure nano level mechanical property as the means of nanometer test.Yet impression that current AFM provides itself and delineation software package can not directly provide the impression conditional curve of the surperficial mechanical property of reflection and the friction force signal of the delineation process that loads by given pace.
Summary of the invention
The present invention exists its checkout equipment to cost an arm and a leg for solving existing measuring method, existing AFM system can not directly provide the impression conditional curve of the surperficial mechanical property of reflection and the problem of the friction force signal of the delineation process that loads by given pace of energy measurement not, and a kind of nano mechanical pick-up unit based on AFM is provided.
The present invention is made up of main control computer 1, serial communication circuit 2, static RAM (SRAM) 3, first single-chip microcomputer 4, the 4th single-chip microcomputer 5, display circuit 6, keyboard circuit 7, photoelectricity isolation electric current loop serial line interface passage 8, second singlechip 9, two-way A/D change-over circuit 10, the 3rd single-chip microcomputer 11, three road D/A change-over circuits 12, two-dimentional work bench controller 13, two-dimentional work bench 14, AFM system 15;
The serial communication end of main control computer 1 connects the serial communication end of serial communication circuit 2, the serial communication level shifter interface of serial communication circuit 2 connects the communication port of first single-chip microcomputer 4, the data address control output input bus end of first single-chip microcomputer 4 connects the data address control output input bus of static RAM (SRAM) 3, the address date communication output input bus end of first single-chip microcomputer 4 connects first interface end that photoelectricity is isolated electric current loop serial line interface passage 8, the video data output terminal of the 4th single-chip microcomputer 5 connects the input end of display circuit 6, the Keyboard Control input end of the 4th single-chip microcomputer 5 connects the output terminal of keyboard circuit 7, the address date communication output input bus end of the 4th single-chip microcomputer 5 connects the 4th interface end that photoelectricity is isolated electric current loop serial line interface passage 8, the address date communication output input bus end of second singlechip 9 connects second interface end that photoelectricity is isolated electric current loop serial line interface passage 8, the Data Control output input bus end of second singlechip 9 connects the Data Control output input bus end of two-way A/D change-over circuit 10, two input end of analog signal of two-way A/D change-over circuit 10 connect the LVZ analog signal output of AFM system 15 respectively, the AuxA analog signal output, the address date communication output input bus end of the 3rd single-chip microcomputer 11 connects the 3rd interface end that photoelectricity is isolated electric current loop serial line interface passage 8, the Data Control output input bus end of the 3rd single-chip microcomputer 11 connects the Data Control output input bus end of three road D/A change-over circuits 12, first analog signal output of three road D/A change-over circuits 12 connects the Setpoint input end of analog signal of AFM system 15, second analog signal output of three road D/A change-over circuits 12, the 3rd analog signal output connects two input end of analog signal of two-dimentional work bench controller 13 respectively, and the control I/O of two-dimentional work bench controller 13 connects the control I/O of two-dimentional work bench 14.
The present invention can directly provide the impression conditional curve of the surperficial mechanical property of reflection and the friction force signal of the delineation process that can load by given pace, and has advantage cheap for manufacturing cost.
The function that it can be realized is as follows:
1, nano impress function,
A, directly obtain the dark curve of the load of impression process-press;
Obtain in real time load-press dark curve, imposed load scope: 0-150 μ N,
B, can carry out the dot matrix indentation test,
The maximum magnitude of dot matrix impression is 100 μ m * 100 μ m; Minimum spacing in the dot matrix between two impression points is 500nm.
2, nanometer delineation function,
A, the delineation process that loads by given pace,
The loading speed scope 10 μ N/s of load are to 150 μ N/s,
The delineation mode of b, realization array.
Maximum delineation length 100 μ m, minimum delineation length is 100nm; The delineation velocity range is 0 μ m/s-200 μ m/s.The maximum magnitude of cut array is 100 μ m * 100 μ m; Minimum spacing in the cut array between two cuts is 500nm.
Description of drawings
Fig. 1 is an integrated circuit structural representation of the present invention, and Fig. 2 is impression process depth of cup measuring principle figure, and Fig. 3 is delineation Principle of Process figure.
Embodiment
Embodiment one: in conjunction with Fig. 1 present embodiment is described, embodiment is made up of main control computer 1, serial communication circuit 2, static RAM (SRAM) 3, first single-chip microcomputer 4, the 4th single-chip microcomputer 5, display circuit 6, keyboard circuit 7, photoelectricity isolation electric current loop serial line interface passage 8, second singlechip 9, two-way A/D change-over circuit 10, the 3rd single-chip microcomputer 11, three road D/A change-over circuits 12, two-dimentional work bench controller 13, two-dimentional work bench 14, AFM system 15;
The serial communication end of main control computer 1 connects the serial communication end of serial communication circuit 2, the serial communication level shifter interface of serial communication circuit 2 connects the communication port of first single-chip microcomputer 4, the data address control output input bus end of first single-chip microcomputer 4 connects the data address control output input bus of static RAM (SRAM) 3, the address date communication output input bus end of first single-chip microcomputer 4 connects first interface end that photoelectricity is isolated electric current loop serial line interface passage 8, the video data output terminal of the 4th single-chip microcomputer 5 connects the input end of display circuit 6, the Keyboard Control input end of the 4th single-chip microcomputer 5 connects the output terminal of keyboard circuit 7, the address date communication output input bus end of the 4th single-chip microcomputer 5 connects the 4th interface end that photoelectricity is isolated electric current loop serial line interface passage 8, the address date communication output input bus end of second singlechip 9 connects second interface end that photoelectricity is isolated electric current loop serial line interface passage 8, the Data Control output input bus end of second singlechip 9 connects the Data Control output input bus end of two-way A/D change-over circuit 10, two input end of analog signal of two-way A/D change-over circuit 10 connect the LVZ analog signal output of AFM system 15 respectively, the AuxA analog signal output, the address date communication output input bus end of the 3rd single-chip microcomputer 11 connects the 3rd interface end that photoelectricity is isolated electric current loop serial line interface passage 8, the Data Control output input bus end of the 3rd single-chip microcomputer 11 connects the Data Control output input bus end of three road D/A change-over circuits 12, first analog signal output of three road D/A change-over circuits 12 connects the Setpoint input end of analog signal of AFM system 15, second analog signal output of three road D/A change-over circuits 12, the 3rd analog signal output connects two input end of analog signal of two-dimentional work bench controller 13 respectively, and the control I/O of two-dimentional work bench controller 13 connects the control I/O of two-dimentional work bench 14.The base of two-dimentional work bench 14 is connected on the table top of AFM system 15 worktable.
The model that serial communication circuit 2 is selected for use is MAX232, the model that static RAM (SRAM) 3 is selected for use is HM628512-CLP, first single-chip microcomputer 4, second singlechip 9, the 3rd single-chip microcomputer 11, the model that the 4th single-chip microcomputer 5 is selected for use all is the 77LE58 single-chip microcomputer of MCS_51, two-way A/D change-over circuit 10 selects for use two models to form for parallel 16 high precision moulds/number (AD) switching device AD976, three road D/A change-over circuits 12 select for use three models to form for parallel 16 high-precision high-speed D/As (DA) switching device DAC715, the model that two-dimentional work bench controller 13 is selected for use is E503.00, the model that two-dimentional work bench 14 is selected for use is P517.3, and the model that AFM system 15 selects for use is Dimension3100.
Principle of work:
(1) nano impress detects:
Device: main control computer 1 is realized applying and unloading of vertical load by Setpoint port in the Signal interface module of the first via D/A passage connection AFM system 15 of serial communication circuit 2, first single-chip microcomputer 4, photoelectricity isolation electric current loop serial line interface passage 8, the 3rd single-chip microcomputer 11, three road D/A change-over circuits 12; The X-axis port and the Y-axis port of second, third two-way D/A passage control two-dimentional work bench 14 are realized the control of two-dimentional work bench 14.And road A/D passage in the two-way A/D change-over circuit 10, LVZ port in the Signal interface module of collection AFM system 15 is realized the collection of scanning earthen-ware pipe change in displacement.
Realize single-point impression process, collect the dark curve of the load of impression process-press.Realize dot matrix impression function.
Measuring principle as shown in Figure 2.Expression sample 01 produces plastic yield, scanning earthen-ware pipe Z to total displacement amount Δ Z PztEqual the degree of depth Z that probe is pressed into sample 01 DepthWith micro-cantilever 02 deflection D sum:
ΔZ pzt=Z depth+D(1)
, can calculate probe 03 and be applied to lip-deep power F to elastic constant by the Z of the deflection D of micro-cantilever 02 and micro-cantilever 02:
F=D*K N(2)
In addition can be at the compression distance Z under the F effect by formula 1 Depth:
Z depth=ΔZ pzt-D(3)
Micro-cantilever 02 deflection D is the parameter setting point voltage (Setpoint by AFM system 15, V) (force curve that is obtained by calibration process obtains with the sensitivity of AFM system 15, (nm/V)) product obtains, main control computer 1 in the native system is provided with parameter setting point voltage (Setpoint, V) realization dynamic load by the first via D/A passage of three road D/A change-over circuits 12.Scanning earthen-ware pipe Z to total displacement amount Δ Z PztRealizing gathering in real time the LVZ signal by main control computer 1 by one road A/D passage of two-way A/D change-over circuit 10 obtains.Therefore, through type (2) and (3) can obtain load and correspondingly press dark relation curve: the dark curve of the load of impression process-press, can calculate the consistency and elasticity modulus equivalence of this point with these data, and realize single-point impression process.
In conjunction with two-dimentional precision stage system, repeat above-mentioned single-point impression process, can be implemented in and carry out dot matrix impression function in the surface.Specific implementation is that main control computer 1 is done the stepping feeding by second, third two-way D/A passage control two-dimentional work bench 14 of three road D/A change-over circuits 12 in X-Y plane, shown in the coordinate of Fig. 2 lower right corner, calls single-point impression program then.
(2) the nanometer delineation detects:
Device: main control computer 1 is realized applying of vertical load by Setpoint port in the Signal interface module of the first via D/A passage connection AFM system 15 of serial communication circuit 2, first single-chip microcomputer 4, photoelectricity isolation electric current loop serial line interface passage 8, the 3rd single-chip microcomputer 11, three road D/A change-over circuits 12; The X-axis port and the Y-axis port of second, third two-way D/A passage control two-dimentional work bench 14 are realized the control of two-dimentional work bench 14.One road A/D passage of two-way A/D change-over circuit 10, Aux A port in the Signal interface module of collection AFM system is realized the collection of micro-cantilever 02 torsional signals of Representation Level friction force size.
The realization of the delineation process that loads by given pace comprises two parts: the dynamic load of vertical load in (1) delineation process: utilize formula (2) to realize, wherein micro-cantilever 02 deflection D is the parameter setting point voltage (Setpoint by AFM system 15, V) (force curve that is obtained by calibration process obtains with the sensitivity of AFM system 15, (nm/V)) product obtains, (Setpoint V) realizes dynamic load by the first via D/A passage of main control computer 1 by three road D/A change-over circuits 12 the parameter setting point voltage to be set in the native system.(2) measurement of the torsional signals (the horizontal voltage of the PSD of AFM system 15) of sign friction force size: realize that by one road A/D passage of two-way A/D change-over circuit 10 the AuxA signal of gathering AFM system 15 in real time obtains (as Fig. 3) dotted line for after reversing by main control computer 1, solid line is the reflected light of incident laser 04 before reversing.
In conjunction with two-dimentional work bench 14, repeat above-mentioned single-point delineation process, can be implemented in and carry out dot matrix delineation function in the surface.Specific implementation is that main control computer 1 is done the stepping feeding by second, third two-way D/A passage control two-dimentional work bench 14 of three road D/A change-over circuits 12 in X-Y plane, calls single-point delineation program then.

Claims (1)

1,, it is characterized in that it is isolated electric current loop serial line interface passage (8), second singlechip (9), two-way A/D change-over circuit (10), the 3rd single-chip microcomputer (11), three road D/A change-over circuits (12), two-dimentional work bench controller (13), two-dimentional work bench (14), AFM system (15) by main control computer (1), serial communication circuit (2), static RAM (SRAM) (3), first single-chip microcomputer (4), the 4th single-chip microcomputer (5), display circuit (6), keyboard circuit (7), photoelectricity and forms based on the nano mechanical pick-up unit of AFM; The model of AFM system (15) is Dimension3100;
The serial communication end of main control computer (1) connects the serial communication end of serial communication circuit (2), the serial communication level shifter interface of serial communication circuit (2) connects the communication port of first single-chip microcomputer (4), the data address control output input bus end of first single-chip microcomputer (4) connects the data address control output input bus of static RAM (SRAM) (3), the address date communication output input bus end of first single-chip microcomputer (4) connects first interface end that photoelectricity is isolated electric current loop serial line interface passage (8), the video data output terminal of the 4th single-chip microcomputer (5) connects the input end of display circuit (6), the Keyboard Control input end of the 4th single-chip microcomputer (5) connects the output terminal of keyboard circuit (7), the address date communication output input bus end of the 4th single-chip microcomputer (5) connects the 4th interface end that photoelectricity is isolated electric current loop serial line interface passage (8), the address date communication output input bus end of second singlechip (9) connects second interface end that photoelectricity is isolated electric current loop serial line interface passage (8), the Data Control output input bus end of second singlechip (9) connects the Data Control output input bus end of two-way A/D change-over circuit (10), two input end of analog signal of two-way A/D change-over circuit (10) connect the LVZ analog signal output of AFM system (15) respectively, the AuxA analog signal output, the address date communication output input bus end of the 3rd single-chip microcomputer (11) connects the 3rd interface end that photoelectricity is isolated electric current loop serial line interface passage (8), the Data Control output input bus end of the 3rd single-chip microcomputer (11) connects the Data Control output input bus end of three road D/A change-over circuits (12), first analog signal output of three road D/A change-over circuits (12) connects the Setpoint input end of analog signal of AFM system (15), second analog signal output of three road D/A change-over circuits (12), the 3rd analog signal output connects two input end of analog signal of two-dimentional work bench controller (13) respectively, and the control I/O of two-dimentional work bench controller (13) connects the control I/O of two-dimentional work bench (14).
CNB2006101512356A 2006-12-31 2006-12-31 Nano mechanical pick-up unit based on AFM Expired - Fee Related CN100561179C (en)

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CN108469374B (en) * 2018-02-07 2024-03-26 中国建材检验认证集团股份有限公司 Method and device for dynamically analyzing loading rate of material testing machine
CN108534683B (en) * 2018-03-06 2019-08-27 山东大学 The micro-nano platform movement measurement system and method for view-based access control model image procossing
CN110375899B (en) * 2019-07-29 2021-01-12 清华大学 Friction force measuring device and working method thereof

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Nanohardness Test Using AFM-Based Measurement System. 史立秋等.纳米技术与精密工程,第4卷第2期. 2006
Nanohardness Test Using AFM-Based Measurement System. 史立秋等.纳米技术与精密工程,第4卷第2期. 2006 *
基于AFM的微结构加工实验研究. 闫永达等.电子显微学报,第22卷第3期. 2003
基于AFM的微结构加工实验研究. 闫永达等.电子显微学报,第22卷第3期. 2003 *

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