CN100588696C - Epoxy resin base damping packaging material - Google Patents
Epoxy resin base damping packaging material Download PDFInfo
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- CN100588696C CN100588696C CN200710192619A CN200710192619A CN100588696C CN 100588696 C CN100588696 C CN 100588696C CN 200710192619 A CN200710192619 A CN 200710192619A CN 200710192619 A CN200710192619 A CN 200710192619A CN 100588696 C CN100588696 C CN 100588696C
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Abstract
The invention relates to a damping encapsulant of epoxy resin group, which consists of component A and component B, wherein the component A is composed of 0-90 parts of bisphenol A epoxy resin, 0-60 parts of polyurethane epoxy resin, 20-90 parts of flexible epoxy resin according to part by weight. The component B is composed of 25-55 parts of aliphatic amine, 10-45 parts of aliphatic cyclic amine,0-80 parts of versamid and 0-8 parts of silane coupling agent according to part by weight, the parts are mixed uniformly according to part by weight of A:B=100:15-100. The invention has the advantages that the mixture has good mobility, the solidification reaction is mild, the condensate has good mechanical property and good tensile shear strength with metals, the invention can resist high and low temperature impact, thermal aging and humidity heat aging, the condensate does not erode rigid aluminium alloy, steel, aldary and PVC plastics in sealed humidity heat condition, the solidification shrinkage ratio is low, with the damping coefficient (tan delta max>=0.5). Particularly, the invention has instantaneous high impact property and the operational temperature is from -54 DEG C to 70 DEGC.
Description
Technical field
The invention belongs to superpolymer damping material field, be specifically related to a kind of epoxy resin base damping packaging material.
Technical background
Encapsulating compound is to produce, develop and develop along with the generation of electronic devices and components, unicircuit, finally develops into current packaging industry.Under electronic technology is maked rapid progress the trend that changes, electronic devices and components, unicircuit just develop rapidly towards the direction of ultra-large, ultra-high speed, high-density, high-power, high precision, miniaturization, lightweight, precise treatment, high performance and multifunction, therefore, more and more high requirement has also been proposed in encapsulation; And the progress of encapsulation technology has promoted the raising of electronic devices and components, unicircuit level.Be a kind of interdependence, synergistic close relation in a word between them.Developed country strengthens to chip, when the electronic devices and components manufacturing drops into, and competitively encapsulation technology and investigation of materials, exploitation is injected a large amount of funds.Current, world's electronics, electrical equipment and semicon industry just progressively develop and have formed " design industry ", " coremaking industry ", " packaging industry " three is closely related and separate industry.
Encapsulation is each parts that constitute electronic devices and components, unicircuit; after carrying out layout, assembling, bonding by design code and being connected; for the erosion of steam-preventing, obnoxious flavour and dust and external impacts, vibration damage, therefore encapsulation is the effective guard method of a kind of stable electronics particular product performance parameters.Because the price comparison of epoxy damping packaging material is cheap, moulding process good, reliability is higher, and is suitable for scale production, is the maximum encapsulating compound of domestic and international application always.Especially departments such as Aeronautics and Astronautics, naval vessels and electronics in order to ensure the stable performance of product, reduce vibration, impact Effect on Performance, must carry out high-quality encapsulation to relevant electronic devices and components, each parts of unicircuit.Therefore; guaranteeing the epoxy encapsulant good fluidity, curing reaction is mild, and thermal discharge is little; have under good body mechanical property, cohesiveness, heat-resisting, cold-resistant, heat-resisting wet, high-low temperature resistant impact and the low prerequisites such as linear expansivity, damping capacity is had very strict requirement.But general epoxy encapsulation material is difficult to satisfy above condition at present.
Summary of the invention
The objective of the invention is for improving the stability and the reliability of each parts product of associated electrical components and parts, provide that a kind of to have mechanical property good, good with the cohesiveness of metal, heat-resisting, cold-resistant, heat-resisting wet, high-low temperature resistant impacts and low linear expansivity, and good fluidity, curing reaction is mild, the epoxy resin-based damping packaging material of thermal discharge circlet.
The invention provides epoxy resin base damping packaging material and be made up of A, B two components, the A component mainly is made up of the mass fraction of 40～90 parts of bisphenol A epoxide resins, 0～60 part of polyurethane-epoxy resin, 20～90 parts of flexible-epoxies; The B component is that the mass fraction of 2～8 parts of 650 and 651 0～80 parts, silane coupling agent is formed by 25～55 parts of aliphatic amides, 10～45 parts of aliphatic cyclic amines, Versamid mainly, during use by mass fraction A: B=100: 15～100 mix.
The condition of cure of said mixture is: 20～25 ℃ are 48h down; Or behind 20～25 ℃ of following primary solidification 2h, 60 ℃ of following 4h that solidify get final product again.
Described bisphenol A epoxide resin is E-56D, E-54, E-53D, E-51, E-44, E-39D, CYD-115, CYD-127, CYD-128 and CYD-128E; Polyurethane-epoxy resin is a polyether(poly)urethane Resins, epoxy; Flexible-epoxy is the Racemic glycidol ether type epoxy, wherein any two kinds or any two or more resin, the mixing of carrying out with any proportioning.
Described aliphatic amide is the condenses of reactant, diethylenetriamine and the epoxy propane butyl ether of diethylenetriamine, triethylene tetramine, diethylenetriamine and vinyl cyanide; Aliphatic cyclic amine is isophorone diamine, modification isophorone diamine, 5618 modification aliphatic cyclic amine affixtures and 5701 modification aliphatic cyclic amines; Wherein any two kinds or any two or more amine curing agent, the mixing of carrying out with any proportioning.
Described silane coupling agent is γ-An Bingjisanjiayangjiguiwan, γ-An Bingjisanyiyangjiguiwan, γ-(glycidoxy) propyl trimethoxy silicane, γ-mercaptopropyl trimethoxysilane and gamma-mercaptopropyltriethoxysilane, wherein any one or any two or more coupling agent, the mixing of carrying out with any proportioning.
Epoxy resin base damping packaging material provided by the present invention, its advantage are A, B two component mixture good fluidities, and curing reaction is mild, and thermal discharge is little.Cured article has good mechanical property, glueds joint the tensile shear strength 〉=10MPa of aluminium alloy; High-low temperature resistant (54 ℃ * 4h～71 ℃ * 4h, through three circulations) impacts not crackle; Moisture-proof heat (50 ± 2 ℃, RH＞98%, 7 day) is aging; Cured article damp and hot (71 ℃, following 7 days of airtight condition RH100%) does not produce corrosion to 7A09T6B level duralumin, 30CrMnSiA steel, H62 copper alloy and PVC plastics; Cure shrinkage＜1.5%, ratio of damping (tan δ max 〉=0.5); Working temperature-54～70 ℃.
Epoxy resin base damping packaging material provided by the invention is to adopt direct blend.A, B two components in mass portion are counted A during use: B=100: 15～100 mix and get final product.Have that packaging process is simple, container cleans easily, be suitable for plurality of advantages such as suitability for industrialized production.
Principle of design of the present invention is: adopt modern techniquies such as blend, the structure and the prescription of Resins, epoxy and solidifying agent is optimized design, adjust material composition, structure and proportioning.Under specified temp and frequency, make it to obtain as much as possible high dissipation factor tan δ max, the temperature width Delta T 0.7 of wide limited proportionality in addition, as outstanding damping packaging material, also should have an appropriate storage modulus G ' value simultaneously.
Embodiment
Umber in following examples all according to the mass fraction.
Embodiment 1
A kind of Resins, epoxy damping packaging material is made up of A, B two components.The A component is 45 parts of E-54 Resins, epoxy, 50 parts of glycidyl ether type flexible-epoxies, 5 parts of compositions of polyurethane-epoxy resin.The B component is mixed for 2 parts by 8 parts of diethylenetriamines, 25 parts of diethylenetriamine epoxy propane butyl ethers and γ-An Bingjisanyiyangjiguiwan to be formed.
Proportioning during use: by mass fraction A: B=100: 30～45 mix.
Condition of cure: be 48h down at 20～25 ℃; Or behind 20～25 ℃ of primary solidification 2h, 60 ℃ of following 4h that solidify get final product again.
Embodiment 2
A kind of Resins, epoxy damping packaging material is made up of A, B two components.The A component is 40 parts of CYD-127 Resins, epoxy, 50 parts of glycidyl ether type flexible-epoxies, 10 parts of compositions of polyurethane-epoxy resin.The B component is by 8 parts of triethylene tetramines, and 40 parts of 651 Versamids and γ-An Bingjisanyiyangjiguiwan mix composition for 2 parts.
Proportioning during use: by mass fraction A: B=100: 45～65 mix and get final product.
Condition of cure: be 48h down at 20～25 ℃; Or behind 20～25 ℃ of primary solidification 2h, 60 ℃ of following 4h that solidify get final product again.
Embodiment 3
A kind of Resins, epoxy damping packaging material is made up of A, B two components.The A component is 40 parts of E-51 Resins, epoxy, 60 parts of compositions of glycidyl ether type flexible-epoxy.The B component is mixed for 2 parts by 100 parts of 650 Versamids, 15 parts of diethylenetriamine epoxy propane butyl ethers and γ-An Bingjisanyiyangjiguiwan to be formed, during use by mass fraction A: B=100: 100 mix and get final product.
Condition of cure: be 48h down at 20～25 ℃; Or behind 20～25 ℃ of primary solidification 2h, 60 ℃ of following 4h that solidify get final product again.
Embodiment 4
A kind of Resins, epoxy damping packaging material is made up of A, B two components.The A component is 25 parts of CYD128 Resins, epoxy, 60 parts of glycidyl ether type flexible-epoxies and 5 parts of compositions of polyurethane-epoxy resin.The B component is mixed for 2 parts and is formed by diethylenetriamine and 15 parts of epoxy propane butyl ethers, 20 parts of modification isophorone diamines, 5 parts of 650 Versamids, 2 parts of γ-An Bingjisanyiyangjiguiwans, γ-(glycidoxy) propyl trimethoxy silicane.
Proportioning during use: by mass fraction A: B=100: 25～35 mix and get final product.
Condition of cure: be 48h down at 20～25 ℃; Or behind 20～25 ℃ of primary solidification 2h, 60 ℃ of following 4h that solidify get final product again.
Claims (5)
1, a kind of epoxy resin base damping packaging material is made up of A, B component, it is characterized in that: the A component is made up of the mass fraction of 40～90 parts of bisphenol A epoxide resins, 0～60 part of polyurethane-epoxy resin, 20～90 parts of flexible-epoxies; The B component is that the mass fraction of 2～8 parts of 650 and 6510～80 parts, silane coupling agent is formed by 25～55 parts of aliphatic amides, 10～45 parts of aliphatic cyclic amines, Versamid, during use by mass fraction A: B=100: 15～100 mix.
2 epoxy resin base damping packaging materials according to claim 1 is characterized in that: the condition of cure of said mixture is: be 48h down at 20～25 ℃; Or behind 20～25 ℃ of primary solidification 2h, 60 ℃ of following 4h that solidify get final product again.
3. epoxy resin base damping packaging material according to claim 1, it is characterized in that: described bisphenol A epoxide resin is E-56D, E-54, E-53D, E-51, E-44, E-39D, CYD-115, CYD-127, CYD-128 and CYD-128E, polyurethane-epoxy resin is a polyether(poly)urethane Resins, epoxy, flexible-epoxy is the Racemic glycidol ether type epoxy, wherein any two kinds or any two or more resin, the mixing of carrying out with any proportioning.
4. epoxy resin base damping packaging material according to claim 1 is characterized in that: described aliphatic amide is the condenses of reactant, diethylenetriamine and the epoxy propane butyl ether of diethylenetriamine, triethylene tetramine, diethylenetriamine and vinyl cyanide; Aliphatic cyclic amine is isophorone diamine, modification isophorone diamine, 5618 modification aliphatic cyclic amine affixtures and 5701 modification aliphatic cyclic amines; Wherein any two kinds or any two or more amine curing agent, the mixing of carrying out with any proportioning.
5. epoxy resin base damping packaging material according to claim 1 is characterized in that:
Described silane coupling agent is γ-An Bingjisanjiayangjiguiwan, γ-An Bingjisanyiyangjiguiwan, γ-(glycidoxy) propyl trimethoxy silicane, γ-mercaptopropyl trimethoxysilane and gamma-mercaptopropyltriethoxysilane, wherein any one or any two or more coupling agent, the mixing of carrying out with any proportioning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710192619A CN100588696C (en) | 2007-12-12 | 2007-12-12 | Epoxy resin base damping packaging material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710192619A CN100588696C (en) | 2007-12-12 | 2007-12-12 | Epoxy resin base damping packaging material |
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| Publication Number | Publication Date |
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| CN101186803A CN101186803A (en) | 2008-05-28 |
| CN100588696C true CN100588696C (en) | 2010-02-10 |
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| CN200710192619A Expired - Fee Related CN100588696C (en) | 2007-12-12 | 2007-12-12 | Epoxy resin base damping packaging material |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101805442A (en) * | 2010-04-22 | 2010-08-18 | 宏昌电子材料股份有限公司 | Epoxy resin composition for large wind blades and preparation method thereof |
| CN102040805A (en) * | 2010-12-23 | 2011-05-04 | 东方电气集团东方汽轮机有限公司 | Epoxy resin system for manufacturing blade mould of wind-driven generator and preparation method thereof |
| CN102634261B (en) * | 2012-04-20 | 2014-03-26 | 中国海洋石油总公司 | High solid constituent epoxy coating composition |
| CN102816499B (en) * | 2012-08-21 | 2014-10-08 | 中山蓝海洋水性涂料有限公司 | Quick-drying type environmental protection water epoxy floor paint and preparation method thereof |
| CN102936394B (en) * | 2012-09-05 | 2014-07-09 | 太仓市联安新型绝缘材料制造厂 | Dry outdoor type electric power complete equipment insulation casting material and preparation method thereof |
| CN103788735B (en) * | 2012-10-29 | 2017-09-05 | 中冶建筑研究总院有限公司 | A kind of solvent-free flexible corrosion protection epoxy coating and preparation method thereof and application method |
| CN103320073A (en) * | 2013-06-26 | 2013-09-25 | 株洲世林聚合物有限公司 | Pouring type epoxy resin-based high-damping encapsulation material |
| CN103740059B (en) * | 2013-12-31 | 2016-04-06 | 苏州巨峰电气绝缘系统股份有限公司 | A kind of low temperature resistant insulated impregnating resin and preparation method thereof |
| CN106189187A (en) * | 2016-07-29 | 2016-12-07 | 华蓥伟创立电子科技有限公司 | A kind of earphone encapsulated plastic material |
| WO2018218596A1 (en) * | 2017-06-01 | 2018-12-06 | 苏州佳亿达电器有限公司 | Led packaging material having high hardness and preparation method therefor |
| CN110003621A (en) * | 2019-04-23 | 2019-07-12 | 江苏金苏泽工程技术有限公司 | A kind of toughening cracking resistance colour epoxy resin composite materials and preparation method thereof |
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2007
- 2007-12-12 CN CN200710192619A patent/CN100588696C/en not_active Expired - Fee Related
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| 建筑用环氧树脂如何选择固化剂. 邹汝洁.化学建材，第6期. 1992 |
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| CN101186803A (en) | 2008-05-28 |
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| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhuzhou Shilin Polymer Co., Ltd. Assignor: Zhang Xiangyu Contract record no.: 2011430000266 Denomination of invention: Epoxy resin base damping packaging material Granted publication date: 20100210 License type: Exclusive License Open date: 20080528 Record date: 20111027 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100210 Termination date: 20121212 |