CN101014446B - 制造化学机械平面化(cmp)垫中的原位凹槽的方法以及新颖的cmp垫设计 - Google Patents
制造化学机械平面化(cmp)垫中的原位凹槽的方法以及新颖的cmp垫设计 Download PDFInfo
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- CN101014446B CN101014446B CN2005800241276A CN200580024127A CN101014446B CN 101014446 B CN101014446 B CN 101014446B CN 2005800241276 A CN2005800241276 A CN 2005800241276A CN 200580024127 A CN200580024127 A CN 200580024127A CN 101014446 B CN101014446 B CN 101014446B
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- cmp
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- cmp pad
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D15/00—Hand tools or other devices for non-rotary grinding, polishing, or stropping
- B24D15/04—Hand tools or other devices for non-rotary grinding, polishing, or stropping resilient; with resiliently-mounted operative surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/565—Consisting of shell-like structures supported by backing material
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/40—Plastics, e.g. foam or rubber
- B29C33/405—Elastomers, e.g. rubber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/897,192 US7377840B2 (en) | 2004-07-21 | 2004-07-21 | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
US10/897,192 | 2004-07-21 | ||
PCT/US2005/025330 WO2006020153A2 (en) | 2004-07-21 | 2005-07-15 | Methods for producing in-situ grooves in chemical mechanical planarization (cmp) pads, and novel cmp pad designs |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101014446A CN101014446A (zh) | 2007-08-08 |
CN101014446B true CN101014446B (zh) | 2013-04-03 |
Family
ID=35276212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800241276A Active CN101014446B (zh) | 2004-07-21 | 2005-07-15 | 制造化学机械平面化(cmp)垫中的原位凹槽的方法以及新颖的cmp垫设计 |
Country Status (6)
Country | Link |
---|---|
US (4) | US7377840B2 (zh) |
EP (1) | EP1778439B1 (zh) |
JP (1) | JP4977604B2 (zh) |
KR (2) | KR101200312B1 (zh) |
CN (1) | CN101014446B (zh) |
WO (1) | WO2006020153A2 (zh) |
Families Citing this family (78)
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US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US7377840B2 (en) | 2004-07-21 | 2008-05-27 | Neopad Technologies Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
SG153668A1 (en) | 2003-03-25 | 2009-07-29 | Neopad Technologies Corp | Customized polish pads for chemical mechanical planarization |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
JP2007081322A (ja) * | 2005-09-16 | 2007-03-29 | Jsr Corp | 化学機械研磨パッドの製造方法 |
US7329174B2 (en) * | 2004-05-20 | 2008-02-12 | Jsr Corporation | Method of manufacturing chemical mechanical polishing pad |
US20070224925A1 (en) * | 2006-03-21 | 2007-09-27 | Rajeev Bajaj | Chemical Mechanical Polishing Pad |
US7131895B2 (en) * | 2005-01-13 | 2006-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having a radially alternating groove segment configuration |
TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
KR100721196B1 (ko) * | 2005-05-24 | 2007-05-23 | 주식회사 하이닉스반도체 | 연마패드 및 이를 이용한 화학적기계적연마장치 |
GB2447021B (en) * | 2007-02-27 | 2010-03-17 | Rolls Royce Plc | A mould lining |
JP4971028B2 (ja) * | 2007-05-16 | 2012-07-11 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
US8383003B2 (en) * | 2008-06-20 | 2013-02-26 | Nexplanar Corporation | Polishing systems |
BR112012011210A2 (pt) * | 2009-11-12 | 2016-07-05 | 3M Innovative Properties Co | blocos giratórios de alisamento |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
KR20110100080A (ko) * | 2010-03-03 | 2011-09-09 | 삼성전자주식회사 | 화학적 기계적 연마 공정용 연마 패드 및 이를 포함하는 화학적 기계적 연마 설비 |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
WO2012036444A2 (ko) | 2010-09-15 | 2012-03-22 | 주식회사 엘지화학 | Cmp용 연마 패드 |
US8758659B2 (en) * | 2010-09-29 | 2014-06-24 | Fns Tech Co., Ltd. | Method of grooving a chemical-mechanical planarization pad |
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US9017060B2 (en) * | 2011-12-28 | 2015-04-28 | Huang-Nan Huang | Arc blade-shaped processing surface structure of pad conditioner and manufacturing mold structure thereof |
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US20140024299A1 (en) * | 2012-07-19 | 2014-01-23 | Wen-Chiang Tu | Polishing Pad and Multi-Head Polishing System |
US9421669B2 (en) * | 2012-07-30 | 2016-08-23 | Globalfoundries Singapore Pte. Ltd. | Single grooved polishing pad |
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JP5892389B2 (ja) * | 2013-03-29 | 2016-03-23 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨方法 |
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US9308620B2 (en) | 2013-09-18 | 2016-04-12 | Texas Instruments Incorporated | Permeated grooving in CMP polishing pads |
TWI599447B (zh) | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | 具有偏移同心溝槽圖樣之邊緣排除區的cmp拋光墊 |
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- 2005-07-15 KR KR1020077000129A patent/KR101200312B1/ko active IP Right Grant
- 2005-07-15 JP JP2007522606A patent/JP4977604B2/ja active Active
- 2005-07-15 EP EP05772600.2A patent/EP1778439B1/en active Active
- 2005-07-15 KR KR1020127011484A patent/KR101234168B1/ko active IP Right Grant
- 2005-07-15 WO PCT/US2005/025330 patent/WO2006020153A2/en active Application Filing
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- 2007-11-28 US US11/998,212 patent/US8287793B2/en active Active
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- 2012-09-12 US US13/612,135 patent/US8932116B2/en active Active
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Also Published As
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US20150093977A1 (en) | 2015-04-02 |
CN101014446A (zh) | 2007-08-08 |
KR20120066059A (ko) | 2012-06-21 |
WO2006020153A2 (en) | 2006-02-23 |
WO2006020153A3 (en) | 2006-04-27 |
US8287793B2 (en) | 2012-10-16 |
EP1778439B1 (en) | 2017-11-15 |
US20080211141A1 (en) | 2008-09-04 |
US20130059509A1 (en) | 2013-03-07 |
JP2008507417A (ja) | 2008-03-13 |
KR20070034043A (ko) | 2007-03-27 |
JP4977604B2 (ja) | 2012-07-18 |
US8932116B2 (en) | 2015-01-13 |
KR101200312B1 (ko) | 2012-11-12 |
US20060019587A1 (en) | 2006-01-26 |
KR101234168B1 (ko) | 2013-02-18 |
EP1778439A2 (en) | 2007-05-02 |
US7377840B2 (en) | 2008-05-27 |
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