CN101019280B - 电连接器 - Google Patents

电连接器 Download PDF

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CN101019280B
CN101019280B CN2005800306355A CN200580030635A CN101019280B CN 101019280 B CN101019280 B CN 101019280B CN 2005800306355 A CN2005800306355 A CN 2005800306355A CN 200580030635 A CN200580030635 A CN 200580030635A CN 101019280 B CN101019280 B CN 101019280B
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connector
lead frame
housing
electric
contact
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CN101019280A (zh
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史蒂文·米尼克
唐纳德·小哈珀
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FCI SA
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
    • H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
    • H01R13/6315—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only allowing relative movement between coupling parts, e.g. floating connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members

Abstract

公开了一种其中具有引线框组件和连接器壳体的电连接器。该引线框组件可以包括引线框和至少部分延伸穿过该引线框的电触点。该连接器壳体在一个或多个方向中的每一个方向上容纳该引线框组件，并还允许该引线框组件相对于该壳体在每一个方向上移动。在将连接器安装到诸如印刷电路板等基板上之后，该壳体相对于该引线框组件在至少一个方向上自由移动。该连接器可以也包括触点收容薄片，其具有至少部分限定孔的面，该孔延伸穿过该薄片。触点的端子部分可以至少部分延伸进入到该孔中。限定该孔的面在多个方向中的每一个方向上容纳该触点的端子部分，并还允许该触点的端子部分在每个方向上移动。

Description

电连接器
技术领域
一般地，本发明涉及电连接器。更具体地，本发明涉及球栅阵列(“BGA”)连接器，它允许连接器壳体与容纳在该壳体内的引线框组件之间有相对移动，这甚至是在该连接器连接到诸如印刷电路板等基板之后。
背景技术
印刷电路板(“PCB”)通常用于安装电子元件，并且用于在那些元件与该PCB外部的元件之间提供电连接。常规PCB的一个问题是可挠性。在经历振动、组装和装卸负载时的附着电气元件的重量的影响下，PCB发生弯曲。最后，将带有附着电气元件的PCB组装在机架中，例如组装在计算机系统中。装卸和运输机架组件可以在元件重量的影响下引起PCB弯曲。
另外，电气元件正变得越来越重。附着到PCB的电气元件除了别的以外还包括附着到中央处理单元(CPU)上的散热片和风扇组件。这些组件的重量常常在1磅以上或者更重，这增大了PCB上的负担。
在致力于提高PCB上的电气元件密度的过程中，可以使用BGA工艺将电气元件附着到PCB上。例如，BGA微处理器通过该电微处理器的每个BGA连接器上的焊球和PCB表面上的电触点形成它的电连接。BGA元件需要它们可以附着到刚性基板。实质上，这些BGA元件是在没有插入触点或者导线的情况下直接被焊接到电路板上。BGA元件一般在球栅阵列封装和电路板之间包括几十或几百个焊接接头。任何明显的电路板弯曲都可能使焊接接头切变、压缩、老化并随后断裂。
本领域非常需要提供一种BGA连接器，其能够在各种负载下发生挠曲，以使施加到焊球连接上的压力最小化。
发明内容
根据本发明的电连接器可以包括引线框组件和连接器壳体。该引线框组件可以包括引线框和至少部分延伸穿过引线框的电触点。壳体在一个或多个方向上容纳该引线框组件，并且也使该引线框组件能够相对于该壳体在一个或多个方向上移动。甚至是在该连接器安装到印刷电路板之后，该壳体和引线框组件也可以相对于彼此移动。例如，根据本发明的电连接器可以用于背板应用中。
引线框组件可以包括从其中延伸的突起，壳体通过该突起容纳该引线框。该突起可以从引线框开始延伸或者从电触点开始延伸。该连接器壳体可以包括突起插座，该突起插座限定突起延伸所进入的开口。为了使突起能够在开口内移动，开口可以大于突起的横截面积。该突起插座可以是有弹性的，以便于将引线框组件插入到壳体中。
连接器也可以包括触点收容薄片(wafer)，该薄片具有在其中延伸的孔。触点的端子部分至少部分延伸进入该孔中。该孔使触点的端子部分能够在一个或多个方向上移动，并且也在每个方向上容纳该端子部分。
焊球可以连接到触点的端子部分。该焊球的直径可以大于该孔的宽度。因此，可以将薄片容纳在焊球和引线框之间，并且可以限制触点进入到该孔中的运动。
根据本发明的另一个方面，提供一种电连接器，包括：
连接器壳体，其限定出内腔；以及
引线框组件，其位于由该连接器壳体所限定的该内腔中，该引线框组件包括至少部分地延伸穿过包覆成型引线框壳体的电触点，
设置在所述包覆成型引线框壳体的每一端上的相应突起；
布置在所述连接器壳体的相对侧上的相应一对突起插座，每一个突起插座限定了用于收容一个相应突起的开口；
其中该引线框组件相对于所述连接器壳体沿着两个垂直方向自由移动。
附图说明
图1A和1B示出了根据本发明的连接器的示例性实施例；
图2示出了根据本发明的插入模制引线框组件的示例性实施例；
图3提供了根据本发明的球栅阵列连接器的示例性实施例的局部视图，其不具有薄片或者焊球；
图4提供了根据本发明的球栅阵列连接器的示例性实施例的局部视图，其不具有焊球。
图5提供了形成在多个电触点上的球栅阵列的局部视图，其不具有薄片；
图6提供了根据本发明的连接器的底部透视图，其具有附着到壳体上的焊柱。
具体实施方式
图1A和1B示出了根据本发明的球栅阵列(“BGA”)连接器100的示例性实施例，该BGA连接器100具有球栅侧100A(图1A清楚示出)和插座侧100B(图1B清楚示出)。虽然将此处所述的连接器描述为球栅阵列连接器，但是应该理解：除了BGA外，也可以使用贯通管脚安装或者表面安装。如图所示，BGA连接器100可以包括由诸如塑料等电绝缘材料制成的壳体101，其限定出内部腔。壳体101可以容纳一个或多个插入模制引线框组件(“IMLA”)115。虽然可以认为壳体101可以容纳任意数量的IMLA 115，但是在示例性实施例中，壳体101容纳十个IMLA 115。
图2示出了IMLA 115的示例性实施例。如图所示，IMLA 115可以包括一组或多组导电触点211，这些导电触点211延伸穿过包覆成型壳体215。包覆成型壳体215可以由诸如塑料等电绝缘材料制成。形成差分信号对的相邻触点211在延伸穿过包覆成型壳体215时朝向彼此或者远离彼此缓慢前进，以便在形成该差分信号对的触点之间维持基本恒定的差分阻抗分布。为了布置成列，触点211可以沿包覆成型壳体215的长度设置(例如，沿如图2所示的“Y”方向)。
例如，触点211可以是双梁式插座触点。这种双梁式插座触点可以适于在与电气设备配合期间收容互补梁式触点。如图2所示，每个触点211可以具有双梁式插座部分217和端子部分216。如下文所述，端子部分216适于收容焊球120。
IMLA 115还可以包括一个或多个容纳突起204。在示例性实施例中，各个突起204可以设置在IMLA 115的每个端部上。例如，在IMLA 115的端部的触点211可以具有延伸超过包覆成型壳体215的表面的突起204。在该实施例中，突起204可以由与触点211相同的材料(例如导电材料)制成。可选地，突起204可以从包覆成型壳体215开始延伸，并且可以附着到包覆成型壳体215上或者与包覆成型壳体215一体形成。在这种实施例中，突起204可以由与包覆成型壳体215相同的材料(例如电绝缘材料)制成。
如图3清楚示出，连接器壳体101可以包括一个或多个突起插座302。在示例性实施例中，各对突起插座302设置在壳体101的两侧，从而在第一方向(例如图3所示的Y方向)上容纳相关的IMLA 115。每个突起插座302可以具有开口322，以收容各自的突起204。每个这种开口可以由形成在突起插座内部的多个面332限定。突起插座302可以是有弹性的，使得它们可以进行充分的位移以将相关的IMLA 115插入到壳体101中。随着IMLA 115插入到壳体101中，突起插座204会迅速恢复，并由此可以将突起204设置在突起插座302中的开口322内。根据本发明的一个方面，突起插座302可以在所有方向上将IMLA容纳在壳体内，并还允许IMLA 115在壳体内沿所有方向移动。
为了使IMLA 115能够在Y方向上移动，引线框215不需要一直延伸到突起插座302的内表面305。当包覆成型壳体215的端部接触到相关突起插座302的内表面305时，突起插座302阻止包覆成型壳体215沿Y方向进一步移动。IMLA 115在Y方向上相对于壳体101移动的距离可以通过调整包覆成型壳体215的端部与壳体101的内表面305之间的距离来调节。因此，突起插座302可以在Y方向上将IMLA 115容纳在壳体101内，同时允许IMLA在Y方向上移动。
为了使IMLA 115能够在X和Z方向上相对于壳体101移动，可以使插座开口322略大于突起204(适于由该开口322收容的)的横截面(在X-Z平面)。当突起204接触到其中一个面332时，该面332阻止突起204(并由此，包覆成型壳体215)在IMLA 115移动的任一方向(例如X或Z方向)上进一步移动。插座开口322和突起204的横截面之间尺寸的相对差确定了IMLA 115可以相对于壳体101在X和Z方向上的移动量。因此，突起插座302可以在X和Z方向上容纳IMLA 115，同时允许IMLA在X-Z平面上移动。
在本发明的示例性实施例中，突起204在X方向上的尺寸大约为0.20mm，而在Z方向上的尺寸大约为1.30mm。插座开口322在X方向上的尺寸大约为0.23mm，而在Z方向上的尺寸大约为1.45mm。包覆成型壳体215的每个端部与壳体101的各个内表面305之间的距离可以大约为0.3mm。
如图1所示，根据本发明的连接器100可以包括球栅阵列148。通过在每个电触点211的末端216上形成各个焊球120来形成所述球栅阵列148。这样，球栅阵列连接器100可以设置在诸如印刷电路板等基板上，其中该基板具有与球栅阵列148互补的焊盘阵列。
根据本发明的一个方面，连接器100可以包括触点收容基板或者薄片107，其容纳触点的末端，同时允许该末端移动。薄片107可以由诸如塑料等电绝缘材料制成。
如图4清楚示出，薄片107可以包括孔456的阵列。每个孔456可以收容各个触点211的各个端子部分216。每个孔456由各组面478限定，各组面478在X和Y方向上容纳该端子。为了允许端子在X和Y方向上移动，孔456可以略大于该孔456适于收容的端子216的横截面(在X-Y平面上)。如图所示，面478可以如此限定孔456，使得其中至少一个面的长度大于触点的宽度。因此，触点的端子部分可以自由设置或“浮动”在孔456之内。即，触点的端子部分不必与限定出孔456的任何一个面接触。孔456与端子216之间尺寸的相对差确定了该端子可以在X和Y方向上移动的量。因此，薄片107可以在X和Z方向上容纳触点211的端子部分，同时允许该端子部分216在X-Y平面中移动。
如图所示，孔456一般为正方形，尽管应当理解，可以将孔456限定为任何所需的形状。在本发明的示例性实施例中，触点211的端子部分216的尺寸可以是大约0.2mm乘以大约0.3mm。孔456的尺寸可以是大约0.6mm乘以大约0.6mm。
为了制造连接器100，可以将IMLA 115按照上述插入并锁入壳体101中。然后，将薄片107设置在包覆成型壳体215的球侧表面229上，其中触点211的端子部分216延伸到孔456中。然后，使用公知技术在触点211的端子部分216上形成各个焊球120。图5示出了形成在各个触点的端子部分408上的多个焊球120，该触点的端子部分408延伸穿过包覆成型壳体215。应该注意，虽然期望在形成焊球120之前将薄片设置到引线框上，但是图5示出了具有焊球而没有薄片的连接器。
为了在触点的末端上形成焊球，可以将焊膏沉积到孔456中，其中触点的末端延伸进入孔456中。可以将焊球压入焊膏中以抵靠着薄片107的表面。为了防止通过孔将触点拉入到壳体中，焊球的直径应大于孔的宽度。可以将连接器组件(其至少包括与壳体和薄片结合的触点)加热到高于焊料的熔融温度的温度。这引起焊料回流，在触点尾部形成大致球形的焊料块，并将焊球冶金结合到触点上。
优选地，孔456的宽度小于焊球的直径，使得焊球防止触点可能被拉入壳体中。类似地，焊球的直径大于孔的宽度，这能够使薄片107被容纳在焊球120和引线框组件的包覆成型壳体之间。
如图6所示，连接器壳体115也可以包括一个或多个焊柱160。焊柱160适于收容在PCB板所限定出的孔中，该焊柱160可以容纳焊料或可焊表面。
如上所述，在焊球回流之前，IMLA可以相对于壳体115自由移动。这种移动或者浮动允许IMLA在焊球回流期间自对准。例如，当焊球在回流期间熔化时，液体焊料中的表面张力产生了自对准效应。本发明使IMLA能够受益于液体焊球的自对准特性。一旦回流完成，则触点、壳体和焊柱都相对于PCB固定。经固定的焊柱有助于防止作用在壳体上沿平行于PCB的方向传递到焊球。
应当理解，已经提供的前述示例性实施例仅仅用于解释目的，而并非被解释作为对本发明的限制。在此所使用的词是用于说明和解释的词，而不是用于限制的词。此外，虽然此处参考特定结构、材料和/或实施例介绍了本发明，但是并不是要将本发明限制到此处所公开的特例。相反，本发明扩展到所有功能上等效的结构、方法和使用，例如在所附权利要求的范围内。本领域普通技术人员在具有本说明书的教导之后，可以对此做出各种改型，并且在没有偏离本发明的在这方面的范围和精神的情况下可以做出各种改变。

Claims (11)

1.一种电连接器，包括：
连接器壳体，其限定出内腔；以及
引线框组件，其位于由该连接器壳体所限定的该内腔中，该引线框组件包括至少部分地延伸穿过包覆成型引线框壳体的电触点，
设置在所述包覆成型引线框壳体的每一端上的相应突起；
布置在所述连接器壳体的相对侧上的相应一对突起插座，每一个突起插座限定了用于收容一个相应突起的开口；
其中所述开口的尺寸大于所述引线框壳体上的所述突起的尺寸，使得该引线框组件相对于所述连接器壳体沿着两个彼此垂直的方向自由移动。
2.如权利要求1所述的电连接器，其中该连接器壳体在该电触点连接到基板之后能够相对于该引线框组件移动。
3.如权利要求1所述的电连接器，还包括薄片，其限定出至少一个电触点收容孔，其中该电触点收容孔收容该电触点，并且该电触点收容孔至少部分由宽度大于该电触点宽度的面限定。
4.如权利要求3所述的电连接器，其中该薄片附着到该连接器壳体，并且其中该薄片和该引线框组件相对于彼此移动。
5.如权利要求3所述的电连接器，其中该薄片附着到该连接器壳体上，并且其中该连接器壳体和该薄片作为一个整体在该电触点附着到基板之后相对于该引线框组件移动。
6.如权利要求1所述的电连接器，其中该引线框组件相对于该壳体在第三方向上移动，其中该第三方向与所述两个垂直方向中的第一方向、第二方向垂直。
7.如权利要求1所述的电连接器，其中该引线框壳体由电绝缘材料制成。
8.如权利要求1所述的电连接器，其中该相应突起从该电触点开始延伸。
9.如权利要求1所述的电连接器，其中该开口大于该突起的横截面积。
10.如权利要求1所述的电连接器，其中该突起插座是弹性的。
11.如权利要求1所述的电连接器，还包括连接到至少部分地延伸穿过所述包覆成型引线框壳体的该电触点的端子部分的焊球。
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US20060057897A1 (en) 2006-03-16

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