CN101073184A - 包含无源电路元件的电连接器 - Google Patents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1458—Active back panels; Back panels with filtering means
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- H—ELECTRICITY
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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Abstract
公开了一种电连接器,该电连接器把第一印刷电路板和第二印刷电路板电连接,其中,优选实施例中的电连接器包括:绝缘壳体;多个信号导件,所述多个信号导件的每个的至少一部分设置于所述绝缘壳体之内;所述多个信号导件的每个具有第一接触端,第二接触端以及位于该两者之间的中间部分;以及无源电路元件,其电连接于所述多个信号导件的每个的中间部分,其中所述无源电路元件容纳在绝缘封装内并包括至少一个电容器或者电感器。
Description
技术领域
本发明主要涉及一种包含有无源电路元件的电连接器以及制造这种电连接器的方法。
背景技术
现代电子电路通常构造在印刷电路板上。然后将所述印刷电路板互连以建立电子系统,诸如用于通信网络的服务器或者路由器。通常使用电连接器来形成所述印刷电路板之间的这些互连。典型地,电连接器由两片组成,一片在一个印刷电路板上,而另一片在另一个印刷电路板上。该电连接器组件的两片搭配组合以在所述印刷电路板之间提供信号通道。
期望的电连接器通常应是具有多种特性的组合。例如,它应该提供具有合适的电特性的信号通路以使得信号在所述印刷电路板之间传送时不会过度失真。另外,所述电连接器应确保所述两片可以方便地并且可靠地组合。并且,所述电连接器应是结实的,使得在对所述印刷电路板进行处理时不会被轻易地损坏。至于其他应用而言,同样重要的是,所述电连接器具有高密度,这意味着该电连接器能够在每单位长度内运送大量电信号。
具备这些期望特性的电连接器的例子包括由本发明受让人Teradyne,Inc制造并销售的VHDM,VHDM-HSD和GbX连接器。
所述电子系统的缺点之一是经常需要把无源电路元件组装到所述互连印刷电路板的表面。这些诸如电容、电感以及电阻的无源电路元件是必需的,例如: (i)用来隔离或者至少是降低由所述互连印刷电路板上的不同电子组件间的电势差所引起的直流(“DC”)电流; (ii)用来提供期望的滤波特性;与/或(iii)用来降低数据传送损失。但是,这些无源电路元件占用了板表面的宝贵空间(进而减少了可用于信号通路的空间)。另外,在所述板表面上的这些无源电路元件连接至导电孔道的情况下,由于阻抗中断以及谐振管脚效应会导致一定频率下的非期望的信号反射。
因此需要一种电连接器以及该电连接器的制造方法,该电连接器不仅大体上具有上述现有电连接器的期望特性,而且在所述连接器内提供无源电路元件以提供由上述无源电路元件所提供的期望性能。并且,还需要该电连接器能够经济地提供无源电路元件。
发明内容
在优选实施例中,借助将第一印刷电路板和第二印刷电路板进行电连接的电连接器,实现了本发明的目标,其中,所述电连接器包括:(a)绝缘壳体; (b)多个信号导件,其中该多个信号导件中的每个的至少一部分设置于所述绝缘壳体内;(c)所述多个信号导件的每个具有第一接触端,第二接触端以及位于该两者之间的中间部分;以及(d)无源电路元件,其与所述多个信号导件中的每个的中间部分形成电连接,其中,所述无源电路元件容纳在绝缘封装内并包括至少一个电感器或者电容器。
附图说明
通过下述附图说明可以对本发明的前述特征以及该发明本身有更全面的理解,其中附图包括:
图1是显示了如美国专利6409543中的图1所示的现有技术电连接器组件的透视图,其中,该电连接器组件包括了子卡(daughtercard)连接器和底板(backplane)连接器;
图2是显示了根据本发明优选实施例的子卡连接器的薄片(wafer)的透视图;
图3是显示了图2中的薄片的透视图,其中该图去除了一部分绝缘壳体以更好地示出无源电路元件与所述薄片的信号导件之间的连接;
图4是显示了图3中的薄片的透视图,其中该图去除了一些无源电路元件以更好地描述与所述无源电路元件连接的信号导件部分;
图5是显示了根据本发明的另一实施例的子卡连接器的薄片的透视图;以及
图6是流程图,显示了根据本发明的连接器的优选制造工艺。
具体实施方式
图1是显示了如美国专利6409543中的图1所示的现有技术电连接器组件10的透视图。涉及GbX连接器的美国专利6409543被转让给本发明的受让人,并在此以引用的方式并入本文。所述电连接器组件10包括:子卡连接器20,其可连接于第一印刷电路板(未示出);和底板连接器50,其可连接于第二印刷电路板(未示出)。该子卡连接器20有多个模块或者薄片22,它们优选地由加固件(stiffener)24保持在一起。
每个薄片22包括多个信号导件30,屏蔽板(图1中未示出),以及电介质壳体26,该电介质壳体26在所述屏蔽板和所述多个信号导件30的每一个的至少一部分的周围形成。每个所述信号导件30具有:第一接触端32,其可连接于所述第一印刷电路板;以及第二接触端34,其可配套到所述底板连接器50。每个屏蔽板具有:第一接触端42,其可连接于所述第一印刷电路板;以及第二接触端44,其可配套到所述底板连接器50。
所述底板连接器50包括绝缘壳体52,以及由所述绝缘壳体52保持的多个信号导件54。所述多个信号导件30,54布置成差分信号对(differential signal pairs)的阵列的形式。所述底板连接器50还包括多个屏蔽板56,其置于差分信号对的各行之间。每个所述信号导件54具有:第一接触端62,其可连接于所述第二印刷电路板;以及第二接触端64,其可配套到所述子卡连接器20的相应信号导件30的第二接触端34。每个屏蔽板56具有:第一接触端72,其可连接于所述第二印刷电路板;以及第二接触端74,其可安装到所述子卡连接器20的相应屏蔽板的第二接触端44。
如本发明的背景技术部分所述,图1中的电连接器组件10不具有能够提供诸如DC电流最小化、期望滤波特性或者数据传送损失减化等期望特性的无源电路元件。
以下参考图2,其显示了根据本发明优选实施例的子卡连接器(未示出)的薄片100。该薄片100可以是由诸如图1中的加固件24的加固件保持在一起的多个这种薄片中的一个。所述薄片100包括多个信号导件110和绝缘壳体102。所述信号导件110在图3中更清楚地示出,图3描述了从图2中去除一部分绝缘壳体102后的薄片100。值得注意的是,所述信号导件110以差分信号对的方式布置,其中,差分对的信号导件之间的第一距离小于相邻差分对的信号导件之间的第二距离。但是,对于研究了本说明书的本领域技术人员而言很明显的是,本发明及其构思同样也可以应用于单端信号连接器。
每个信号导件110具有:第一接触端112,第二接触端114,以及位于该两者之间的中间部分116。所述信号导件110的中间部分116设置于所述绝缘壳体102之内。优选地,所述薄片100还包括接地导件或者具有第一接触端122和第二接触端124的屏蔽板。所述屏蔽板的构造可以类似于图1中的屏蔽板。被描述为压合型(press-fit)针眼(“eyeof the needle”)接触端的所述第一接触端112,122可连接于第一印刷电路板(未示出)。所述第二接触端114,124可连接于诸如图1中的底板连接器50的配套连接器(mating connector)(未示出)。
连接到每个信号导件110的中间部分116的是无源电路元件140。优选地,所述无源电路元件140包括至少一个电容或电感,该电容或电感容纳在绝缘封装内且是商业上可获得的现成的部件。例如,如果希望所述无源电路元件140起直流电流闭塞电路的作用,则可以使用由South Carolina,Greenville的KEMET Electronics Corporation销售的陶瓷或者钽质片式电容之一。这些陶瓷或者钽质片式电容的技术信息可从KEMET(www.kemet.com)获得,并且在此以引用的方式并入。如果希望所述无源电路元件140起高频无源均衡电路的作用,则可以使用由Califonia,Sunnyvale的Maxim Integrated Products,Inc.销售的电阻/电感/电容产品之一。这些产品的技术信息可从Maxim(www.maxim-ic.com)获得,并且在此以引用的方式并入。应该知道,虽然所述优选实施例涉及两片(子卡连接器和底板连接器)的、屏蔽的、差分对连接器组件,但本发明的构思也适用于单片连接器、无屏蔽连接器、单端连接器或者其他类型的电连接器。
参考图6,其显示了根据本发明的连接器的优选制造工艺的流程图200。该流程图200描述了用于修改和改造诸如图1中的子卡连接器20的现有连接器以提供期望的无源电路元件的工艺步骤。对于本领域技术人员显然的是,虽然描述了所述流程图200的各种工艺步骤,但在制造根据本发明的连接器时,其中一些步骤并非必须包括于内。进而,还可以更改一些步骤的顺序。
步骤210描述了提供薄片,诸如图1中的薄片22,其中,在所述多个信号导件的周围的所述绝缘壳体的模塑期间,形成开口,经过所述开口可以接近每个所述信号导件的暴露区。优选地,开口布置在邻近所述信号导件110的中间部分116。应该注意到,所述多个信号导件优选地由引脚框架冲压形成,正如本领域所公知的。典型地,所述信号导件110由诸如铍-铜等的焊料可湿润材料形成,并且所述信号导件110的中间部分116可以涂覆镍或者其他非焊料可湿润材料。在这种情况下,所述信号导件的暴露区设置有诸如锡铅涂层的焊料可湿润材料。
步骤214描述了切割以及去除所述信号导件的暴露区的一部分,使得仅保留一部分所述暴露区。图4是图3中的薄片100在去除一部分无源电路元件140后的透视图,显示了所述信号导件110的暴露区的保留部分116a、116b。步骤216描述了在切割和去除步骤214之后对所述信号导件的清理和检查。该步骤可以手动或者自动进行,如果需要也可以将其忽略。
步骤218描述了对所述信号导件110的暴露区的保留部分116a、116b施加焊膏或者导电粘合剂。然后,步骤220描述了把无源电路元件140拾取并放置在所述信号导件110的暴露区的保留部分116a、116b之上。应该注意到,步骤210所述的绝缘壳体内的开口的尺寸应制造为能够接收所述无源电路元件140。并且,步骤222描述了传统的SMT回流,用于将所述无源电路元件140牢固地连接到所述信号导件110的暴露区的保留部分116a、116b。当步骤218的优选方法是对所述信号导件110的暴露区的保留部分116a、116b施加所述焊膏或者导电粘合剂时,对于本领域技术人员而言很明显的是,在需要时,所述焊膏/导电粘合剂可以改为施加于所述无源电路元件140,或者施加于所述信号导件110的暴露区的保留部分116a、116b以及所述无源电路元件140这两者。
步骤224和226分别描述了对所述无源电路元件140以及所述信号导件110的暴露区的保留部分116a、116b的周围的连接区域的检查和清理。步骤228和230分别描述了对跨越所述连接区域的电连续性的测试以及随需要的灌封/光学或者机械检查。最后,步骤232描述了组装多个薄片100以形成根据本发明的优选实施例的连接器。
虽然所述流程图200描述了在所述多个信号导件周围模塑所述绝缘壳体之后切除并去除所述信号导件110的暴露区的一部分(步骤214),但当然可以并且在一些情况下甚至优选的是,在所述多个信号导件周围模塑所述绝缘壳体之前,切割并且去除所述信号导件的所述部分暴露区。所述模塑的绝缘壳体将限定开口,通过该开口,可以接近所述信号导件的暴露区的保留部分。
在根据本发明的连接器的可选制造工艺(未示出)中,可以如下提供无源电路元件(优选的是电容元件):(i)提供第一引脚框架,其包括多个第一信号导件,所述多个第一信号导件中的每个具有第一接触端和中间部分;(ii)提供第二引脚框架,其包括多个第二信号导件,所述多个第二信号导件中的每个具有第二接触端和中间部分;(iii)以相互邻近的方式定位所述多个第一信号导件和所述多个第二信号导件,以使得对于每个第一信号导件都有与其相邻的相应第二信号导件;(iv)将每个第一信号导件的中间部分的至少一部分连接到相应第二信号导件的中间部分的至少一部分,且在它们之间的提供电介质材料以便提供电容元件;以及(v)在所述多个第一和第二信号导件的每个的至少一部分的周围,提供绝缘壳体。在该工艺中,所述第一信号导件和所述第二信号导件的连接的中间部分用作电容板,以提供期望的电容特性。然后可以根据需要使用图6中的其他适当步骤。
接下来参考图5,其显示了根据本发明的另一实施例的子卡连接器(未示出)的薄片150的透视图。该薄片150可以是由诸如图1中的加固件24的加固件保持在一起的多个这种薄片之一。图5的薄片150类似于图2的薄片100,主要差别在于沿着所述信号导件110的中间部分116具有附加的无源电路元件140。应该注意到,在图5中的薄片150内,除了长度最短的两个信号导件,所有的信号导件各设置了两个无源电路元件140。在一些仿真中已经显示,具备了附加的无源电路元件140则可以提供更优的期望性能,诸如高频无源均衡。应该认识到,对于每个信号导件,无源电路元件140的期望数量不限制为一个或者两个,而是取决于各种其他因素,包括所述连接器的结构和电特性。
已经对本发明的优选实施例进行了描述,对于本领域技术人员而言很明显的是,也可以采用包含了这些构思在内的其它实施例。
应该认为,这些实施例并非限制于所公开的实施例,而是应该限制于所附的权利要求的精神和范围内。
所有在此引用的出版物和参考文件的全部内容在此以引用的方式明确地并入。
Claims (20)
1.一种电连接器,用于将第一印刷电路板和第二印刷电路板进行电连接,该电连接器包括:
绝缘壳体;
多个信号导件,所述多个信号导件的每个的至少一部分设置于所述绝缘壳体之内;
所述多个信号导件的每个包括第一接触端,第二接触端以及位于该两者之间的中间部分;以及
无源电路元件,其电连接于所述多个信号导件的每个的中间部分,所述无源电路元件容纳在绝缘封装内并包括至少一个电容器或者电感器。
2.根据权利要求1所述的电连接器,其中,容纳所述无源电路元件的所述绝缘封装由陶瓷材料制成。
3.根据权利要求1所述的电连接器,其中,容纳所述无源电路元件的所述绝缘封装由钽制成。
4.根据权利要求1所述的电连接器,其中,所述无源电路元件还包括电阻器。
5.根据权利要求1所述的电连接器,其中,所述无源电路元件通过焊接被电连接于相应信号导件的中间部分。
6.根据权利要求1所述的电连接器,其中,所述无源电路元件是商业上可获得的现成的部件。
7.根据权利要求1所述的电连接器,其中,所述多个信号导件作为信号导件差分对被设置于所述绝缘壳体之内,差分对的信号导件之间的第一距离小于相邻差分对的信号导件之间的第二距离。
8.一种电连接器,包括:
多个薄片,所述多个薄片的每个包括:
绝缘壳体;
多个信号导件,所述多个信号导件的每个的至少一部分设置于所述绝缘壳体之内;
所述多个信号导件的每个包括第一接触端,第二接触端以及位于该两者之间的中间部分;
无源电路元件,其电连接于所述多个信号导件的每个的中间部分,所述无源电路元件容纳在绝缘封装内并包括至少一个电容器或者电感器;
接地导件,其至少一部分设置于所述绝缘壳体之内;以及
加固件,用于以彼此平行的方式保持所述多个薄片。
9.根据权利要求8所述的电连接器,其中,容纳所述无源电路元件的所述绝缘封装由陶瓷材料制成。
10.根据权利要求8所述的电连接器,其中,容纳所述无源电路元件的所述绝缘封装由钽制成。
11.根据权利要求8所述的电连接器,其中,所述无源电路元件还包括电阻器。
12.根据权利要求8所述的电连接器,其中,所述无源电路元件通过焊接被电连接于相应信号导件的中间部分。
13.根据权利要求8所述的电连接器,其中,所述无源电路元件是商业上可获得的现成的部件。
14.根据权利要求8所述的电连接器,其中,对于所述多个薄片的每个,所述多个信号导件作为信号导件差分对被设置于所述绝缘壳体之内,差分对的信号导件之间的第一距离小于相邻差分对的信号导件之间的第二距离。
15.一种电连接器组件,包括可连接到第一印刷电路板的第一电连接器和可连接到第二印刷电路板的第二电连接器,所述电连接器组件包含:
所述第一电连接器,它包括:
第一绝缘壳体;
多个第一信号导件,所述多个第一信号导件的每个的至少一部分设置于所述第一绝缘壳体之内;
所述多个第一信号导件的每个包括可连接到所述第一印刷电路板的第一接触端,第二接触端以及位于该两者之间的中间部分;
无源电路元件,其电连接于所述多个第一信号导件的每个的中间部分,所述无源电路元件包括至少一个电容器或者电感器;
所述第二电连接器包括:
第二绝缘壳体;
多个第二信号导件,所述多个第二信号导件的每个的至少一部分设置于所述第二绝缘壳体之内;
所述多个第二信号导件的每个包括第一接触端,第二接触端以及位于该两者之间的中间部分,该第一接触端可连接到所述第二印刷电路板,该第二接触端可匹配到相应的第一信号导件的第二接触端。
16.根据权利要求15所述的电连接器组件,其中,所述无源电路元件容纳在绝缘封装内。
17.根据权利要求16所述的电连接器组件,其中,容纳所述无源电路元件的所述绝缘封装由陶瓷材料制成。
18.根据权利要求16所述的电连接器组件,其中,容纳所述无源电路元件的所述绝缘封装由钽制成。
19.根据权利要求15所述的电连接器组件,其中,所述无源电路元件还包括电阻器。
20.根据权利要求15所述的电连接器组件,其中,所述无源电路元件是商业上可获得的现成的部件。
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2005
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- 2005-06-23 DE DE602005016814T patent/DE602005016814D1/de active Active
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2007
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2009
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2011
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US11336060B2 (en) | 2010-05-21 | 2022-05-17 | Amphenol Corporation | Electrical connector having thick film layers |
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US9722366B2 (en) | 2010-05-21 | 2017-08-01 | Amphenol Corporation | Electrical connector incorporating circuit elements |
CN103124010A (zh) * | 2011-11-17 | 2013-05-29 | 安费诺公司 | 具有阻抗匹配的中间连接点的电连接器 |
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CN103579865A (zh) * | 2013-10-24 | 2014-02-12 | 安费诺(常州)高端连接器有限公司 | 背板连接器 |
CN111630726A (zh) * | 2018-01-09 | 2020-09-04 | 莫列斯有限公司 | 高密度插座 |
US11509100B2 (en) | 2018-01-09 | 2022-11-22 | Molex, Llc | High density receptacle |
US11831105B2 (en) | 2018-01-09 | 2023-11-28 | Molex, Llc | High density receptacle |
Also Published As
Publication number | Publication date |
---|---|
EP1779472A1 (en) | 2007-05-02 |
US20090298308A1 (en) | 2009-12-03 |
US7285018B2 (en) | 2007-10-23 |
US7887371B2 (en) | 2011-02-15 |
EP1779472B1 (en) | 2009-09-23 |
US20110256741A1 (en) | 2011-10-20 |
US20050287869A1 (en) | 2005-12-29 |
DE602005016814D1 (de) | 2009-11-05 |
ATE443932T1 (de) | 2009-10-15 |
US8123563B2 (en) | 2012-02-28 |
US20080020646A1 (en) | 2008-01-24 |
US7540781B2 (en) | 2009-06-02 |
WO2006002356A1 (en) | 2006-01-05 |
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