CN101138091A - 用于生长平坦半极性氮化镓的技术 - Google Patents
用于生长平坦半极性氮化镓的技术 Download PDFInfo
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- CN101138091A CN101138091A CNA2006800076945A CN200680007694A CN101138091A CN 101138091 A CN101138091 A CN 101138091A CN A2006800076945 A CNA2006800076945 A CN A2006800076945A CN 200680007694 A CN200680007694 A CN 200680007694A CN 101138091 A CN101138091 A CN 101138091A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/938—Lattice strain control or utilization
Abstract
Description
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US66028305P | 2005-03-10 | 2005-03-10 | |
US60/660,283 | 2005-03-10 | ||
PCT/US2006/008595 WO2006099138A2 (en) | 2005-03-10 | 2006-03-10 | Technique for the growth of planar semi-polar gallium nitride |
Related Child Applications (1)
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CN201010111379A Division CN101845670A (zh) | 2005-03-10 | 2006-03-10 | 用于生长平坦半极性氮化镓的技术 |
Publications (2)
Publication Number | Publication Date |
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CN101138091A true CN101138091A (zh) | 2008-03-05 |
CN101138091B CN101138091B (zh) | 2010-05-19 |
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Application Number | Title | Priority Date | Filing Date |
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CN201010111379A Pending CN101845670A (zh) | 2005-03-10 | 2006-03-10 | 用于生长平坦半极性氮化镓的技术 |
CN2006800076945A Active CN101138091B (zh) | 2005-03-10 | 2006-03-10 | 用于生长平坦半极性氮化镓的技术 |
Family Applications Before (1)
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CN201010111379A Pending CN101845670A (zh) | 2005-03-10 | 2006-03-10 | 用于生长平坦半极性氮化镓的技术 |
Country Status (8)
Country | Link |
---|---|
US (4) | US7220324B2 (zh) |
EP (2) | EP1869707B1 (zh) |
JP (2) | JP5706601B2 (zh) |
KR (2) | KR101145753B1 (zh) |
CN (2) | CN101845670A (zh) |
HK (1) | HK1112109A1 (zh) |
TW (2) | TWI453813B (zh) |
WO (1) | WO2006099138A2 (zh) |
Cited By (11)
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CN102119243A (zh) * | 2008-07-16 | 2011-07-06 | 奥斯坦多科技公司 | 利用氢化物气相外延(HVPE)生长平面非极性的{1-100}m面和半极性的{11-22}氮化镓 |
CN102422391A (zh) * | 2009-11-12 | 2012-04-18 | 松下电器产业株式会社 | 氮化物半导体元件的制造方法 |
CN102449737A (zh) * | 2009-03-02 | 2012-05-09 | 加利福尼亚大学董事会 | 生长于非极性或半极性(Ga,Al,In,B)N衬底上的装置 |
CN102549778A (zh) * | 2009-08-27 | 2012-07-04 | 首尔Opto仪器股份有限公司 | 倾斜基底上的高质量非极性/半极性半导体器件及其制造方法 |
US8629065B2 (en) | 2009-11-06 | 2014-01-14 | Ostendo Technologies, Inc. | Growth of planar non-polar {10-10} M-plane gallium nitride with hydride vapor phase epitaxy (HVPE) |
US8759814B2 (en) | 2012-08-10 | 2014-06-24 | National Taiwan University | Semiconductor light-emitting device and manufacturing method thereof |
CN105702562A (zh) * | 2010-11-08 | 2016-06-22 | 韩国光技术院 | 使用化学剥离方法的iii族氮化物基板的制备方法 |
CN105824179A (zh) * | 2009-05-29 | 2016-08-03 | 天空激光二极管有限公司 | 一种投影系统 |
CN104112803B (zh) * | 2014-04-14 | 2016-08-17 | 中国科学院半导体研究所 | 半极性面氮化镓基发光二极管及其制备方法 |
US11594862B2 (en) | 2018-12-21 | 2023-02-28 | Kyocera Sld Laser, Inc. | Fiber delivered laser induced white light system |
US11788699B2 (en) | 2018-12-21 | 2023-10-17 | Kyocera Sld Laser, Inc. | Fiber-delivered laser-induced dynamic light system |
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US7504274B2 (en) | 2004-05-10 | 2009-03-17 | The Regents Of The University Of California | Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition |
US9011598B2 (en) * | 2004-06-03 | 2015-04-21 | Soitec | Method for making a composite substrate and composite substrate according to the method |
US9130119B2 (en) * | 2006-12-11 | 2015-09-08 | The Regents Of The University Of California | Non-polar and semi-polar light emitting devices |
TWI453813B (zh) * | 2005-03-10 | 2014-09-21 | Univ California | 用於生長平坦半極性的氮化鎵之技術 |
JP5743127B2 (ja) | 2005-06-01 | 2015-07-01 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 半極性(Ga,Al,In,B)N薄膜、ヘテロ構造およびデバイスの成長と作製のための方法及び装置 |
US8148713B2 (en) * | 2008-04-04 | 2012-04-03 | The Regents Of The University Of California | Method for fabrication of semipolar (Al, In, Ga, B)N based light emitting diodes |
WO2007009035A2 (en) * | 2005-07-13 | 2007-01-18 | The Regents Of The University Of California | Lateral growth method for defect reduction of semipolar nitride films |
TWI404122B (zh) * | 2005-09-09 | 2013-08-01 | Univ California | 增進半-極性(Al,In,Ga,B)N藉由金屬有機化學氣相沈積生長之方法 |
KR20080098039A (ko) * | 2006-01-20 | 2008-11-06 | 더 리전츠 오브 더 유니버시티 오브 캘리포니아 | 금속유기 화학 기상 증착을 통한 준극성 (Al,In,Ga,B)N의 성장을 향상시키기 위한 방법 |
US7691658B2 (en) | 2006-01-20 | 2010-04-06 | The Regents Of The University Of California | Method for improved growth of semipolar (Al,In,Ga,B)N |
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CN104112803B (zh) * | 2014-04-14 | 2016-08-17 | 中国科学院半导体研究所 | 半极性面氮化镓基发光二极管及其制备方法 |
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JP2014222780A (ja) | 2014-11-27 |
US20070111531A1 (en) | 2007-05-17 |
HK1112109A1 (en) | 2008-08-22 |
US20100133663A1 (en) | 2010-06-03 |
TW200735203A (en) | 2007-09-16 |
KR101145753B1 (ko) | 2012-05-16 |
KR20070120982A (ko) | 2007-12-26 |
CN101138091B (zh) | 2010-05-19 |
US8128756B2 (en) | 2012-03-06 |
TW201443990A (zh) | 2014-11-16 |
WO2006099138A2 (en) | 2006-09-21 |
EP1869707B1 (en) | 2012-06-13 |
US20060205199A1 (en) | 2006-09-14 |
US20120119222A1 (en) | 2012-05-17 |
KR101145755B1 (ko) | 2012-05-16 |
TWI453813B (zh) | 2014-09-21 |
EP2315253A1 (en) | 2011-04-27 |
JP2008533723A (ja) | 2008-08-21 |
US7704331B2 (en) | 2010-04-27 |
US7220324B2 (en) | 2007-05-22 |
JP5706601B2 (ja) | 2015-04-22 |
CN101845670A (zh) | 2010-09-29 |
KR20110044332A (ko) | 2011-04-28 |
EP1869707A4 (en) | 2009-02-25 |
EP1869707A2 (en) | 2007-12-26 |
WO2006099138A3 (en) | 2006-11-23 |
US8524012B2 (en) | 2013-09-03 |
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