CN101189922A - 具有安装部件用引脚的印刷线路板及使用其的电子设备 - Google Patents
具有安装部件用引脚的印刷线路板及使用其的电子设备 Download PDFInfo
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Abstract
本发明提供一种即使安装高集成化的电子部件,也可以减少发生由电子部件与印刷线路板之间的热膨胀系数之差引起的连接不良的印刷线路板及使用该印刷线路板的电子设备。本发明的电子设备(4)具有印刷线路板(1)及面安装型半导体装置(2);该印刷线路板(1)具有安装部件用引脚(18),该面安装型半导体装置(2)具有电极焊盘(3);安装部件用引脚(18)具有弹性,相对于电极焊盘(3)压接以确保电连接。
Description
技术领域
本发明涉及具有安装部件用引脚的印刷线路板及使用该印刷线路板的电子设备,更加具体来说,涉及具有用于安装面安装型部件的安装部件用引脚的印刷线路板及使用该印刷线路板的电子设备。
背景技术
为了构成电子装置,使用很多的电子部件(例如,IC、LSI等的半导体装置)。为了使这些半导体装置的电极焊盘之间彼此电连接而使用印刷线路板。被高度集成化的半导体装置必然具有很多的电极。为了将这样的半导体装置安装在限定面积的印刷线路板上,典型的是采用倒装法的方式,将半导体芯片的电极焊盘面面向印刷线路板地进行搭载,使用焊锡凸块等技术,使该半导体芯片的电极焊盘面与印刷线路板安装面的连接盘连接。
另外,在本说明书中,“印刷线路板”是指在绝缘基板上形成有布线图案的板;“印刷电路板”是指在印刷线路板上安装有IC、LSI等的电子部件等的构成品;因为印刷电路板是具有规定目的的电子部件的构成品,所以也称为“电子设备”。
专利文献1:日本特开2005-183466“多层印刷线路板”(公开日:2005年7月7日),在专利文献1的背景技术中有采用焊锡凸块等的技术进行连接的倒装法方式的记载,即“在该导通孔160及导体回路158的上层形成有阻焊层70,通过该阻焊层70的开口部71,在导通孔160及导体回路158形成有凸块76U、76D。未图示的IC芯片通过在凸块76U上进行C4(倒装法)安装而进行电连接”。
但是,没有涉及在本申请中公开的具有安装部件用引脚的印刷线路板的记载。
最近,这样的电子部件更向高集成化发展,因此,芯片的尺寸也变得巨大化。在锡焊尺寸巨大的电子部件(例如、半导体芯片)的电极焊盘与印刷线路板的连接盘的安装状态下的电子设备被暴露在周围温度的上升与下降之中时,有时会由于电子部件与印刷线路板的热膨胀系数之差引起锡焊部位损坏。
为此,一直以来期望开发这样的印刷线路板,该印刷线路板即使安装高集成化的电子部件,也可以减少发生由于半导体芯片与印刷线路板的热膨胀系数之差引起的连接不良。
发明内容
因此,本发明的目的在于提供一种印刷线路板,该印刷线路板即使安装高集成化的电子部件,也可以减少发生由电子部件与印刷线路板之间的热膨胀系数之差引起的连接不良。
另外,本发明的目的在于提供一种电子设备,该电子设备即使安装高集成化的电子部件,也可以减少发生由半导体芯片与印刷线路板之间的热膨胀系数之差引起的连接不良。
鉴于上述目的,本发明的印刷线路板是具有安装部件用引脚的印刷线路板。
另外,在上述印刷线路板中,上述安装部件用引脚也可以从上述印刷线路板的最外层导体延伸出,另一端从该印刷线路板立起。
另外,在上述印刷线路板中,上述安装部件用引脚也可以由具有弹性的材料构成。
另外,在上述印刷线路板中,上述安装部件用引脚也可以由电阻低的物质构成。
另外,在上述印刷线路板中,上述安装部件用引脚也可以是由从金属、导电性橡胶、使其一部分具有导电性的橡胶、导电性合成树脂及使其一部分具有导电性的合成树脂所组成的群中选择的任意物质构成。
另外,在上述印刷线路板中,上述安装部件用引脚也可以由n(n≥2)层的膜构成,设与上述印刷线路板相对的膜的层数为n=1时,第一层的膜相对于第n层的膜容易延伸。
另外,在上述印刷线路板中,也可以是第n-1层的应力相对于第n层的应力为拉伸应力或与其相等,第一层的应力相对于第n层的应力为拉伸应力。
另外,在上述印刷线路板中,也可以是第n-1层的热膨胀系数与第n层的热膨胀系数相等或比其大,第1层的热膨胀系数比第n层的热膨胀系数大。
另外,在上述印刷线路板中,上述安装部件用引脚也可以形成有导电性的保护被膜。
另外,在上述印刷线路板中,上述安装部件用引脚也可以在前端部具有焊锡凸块。
另外,本发明的电子设备具有印刷线路板与面安装型部件,该印刷线路板具有安装部件用引脚,该面安装型部件具有电极焊盘;上述安装部件用引脚电连接于上述电极焊盘。
另外,在上述电子设备中,上述安装部件用引脚也可以具有弹性,相对于上述电极焊盘压接。
另外,在上述电子设备中,上述安装部件用引脚也可以长度较短。
另外,在上述电子设备中,上述安装部件用引脚也可以从上述印刷线路板的最外层导体延伸出立起,电连接于上述电极焊盘,该立起部分的周围由空气包围。
另外,本发明的电子设备具有印刷线路板与面安装型部件,该印刷线路板具有安装部件用引脚,该面装型部件具有电极焊盘;上述安装部件用引脚在其前端部具有焊锡凸块,锡焊在上述电极焊盘。
根据本发明,可以提供一种印刷线路板,该印刷线路板即使安装高集成化的电子部件,也可以减少发生由电子部件与印刷线路板之间的热膨胀系数之差引起的连接不良。
另外,由本发明,可以提供一种电子设备,该电子设备即使安装高集成化的电子部件,也可以减少发生由电子部件与印刷线路板之间的热膨胀系数之差引起的连接不良。
附图说明
图1是表示具有安装部件用引脚的印刷线路板的结构的一部分的图。
图2是表示使用具有安装部件用引脚的印刷线路板的电子设备的一部分的图。
图3是表示通过锡焊印刷线路板的安装部件用引脚与电子部件来确保电连接的电子设备的一部分的图。
图4A是表示在具有安装部件用引脚的印刷线路板的制造方法中准备基材的工序的图。
图4B是表示形成阻焊层的工序的图。
图4C是表示层压阻镀层、进行曝光、显影处理的工序的图。
图4D是表示形成镀锡的工序的图。
图4E是表示形成第1电镀层的工序的图。
图4F是表示形成第二电镀层的工序的图。
图4G是表示层压阻镀层的工序的图。
图4H是表示对阻镀层进行曝光、显影处理的工序的图。
图4I是表示第1及第2电镀层的蚀刻处理工序的图。
图4J是表示镀锡的蚀刻处理工序的图。
图4K是表示使安装部件用引脚立起的工序的图。
图4L是表示形成保护膜工序的图。
附图标记说明:
1:印刷线路板;2:半导体装置(IC、LSI等);3:电极焊盘;4:电子设备;5:填充通路孔;10:绝缘层;11:最外层导体、导体连接盘;12:阻焊层;12a:开口;13:干膜;13a:开口;14:锡层;16:第1电镀层;17:第2电镀层;18:安装部件用引脚;20:抗蚀层。
具体实施方式
以下,参照附图对本实施方式的印刷线路板及使用该印刷线路板的电子设备作详细说明。另外,对附图中的相同要素标注相同的附图标记,省略重复说明。
(具有安装部件用引脚的印刷线路板及使用该印刷线路板的电子设备的结构)
(具有安装部件用引脚的印刷线路板)
图1是表示具有安装部件用引脚的印刷线路板的结构的一部分的图,本发明的印刷线路板1例如具有用于连接如IC、LSI等的半导体装置之类的电子部件(图中未示。)的安装部件用引脚18。
本发明的具有安装部件用引脚的印刷线路板1的特征在于,形成有电连接在最外层导体11上的安装部件用引脚18。因此,关于印刷线路板1的其他结构为任意。本实施方式因为其特征在于最外层导体,为了便于说明,所以将一块印刷线路板1分为形成有最外层导体11的绝缘层10、其上层的阻焊层12与位于绝缘层10下层的其他层9来进行说明。
例如,印刷线路板1具有形成有开口12a的阻焊层12、基板9与基板10。基板10是阻焊层的下层的绝缘层,基板9由规定的导体层及绝缘层构成。在绝缘层10形成有填充通路孔5,其上部成为最外层导体11。
安装部件用引脚18的一端电连接在最外层导体11上,另一端从印刷线路板1立起。根据期望,在安装部件用引脚18上形成有导电性的保护被膜19。印刷线路板1利用该安装部件用引脚18与半导体装置(图中未示。)连接。
安装部件用引脚18具有挠性、弹性、弯曲性等,优选由电阻低的物质构成。例如,该弹性体可以是从金属、导电性橡胶、使其一部分具有导电性的橡胶、导电性合成树脂及使其一部分具有导电性的合成树脂所组成的群中选择的任意物质。
安装部件用引脚18也可以由n层膜(n≥2。在此,第1层作为与印刷线路板1相对的一侧)构成,如果第n层膜相对于第1层膜容易收缩,则第n层膜没有必要相对于第n-1层膜收缩。作为制作这样的膜的方法,有使第n层膜相对于第1层膜为压缩应力,使第n层膜的热膨胀系数比第1层膜的热膨胀系数小的方法等。
因此,第n-1层既可以相对于第n层为拉伸应力,也可以不是拉伸应力或压缩应力中的任何一种。另外,第n-1层的热膨胀系数既可以比第n层的热膨胀系数大,也可以与其相等。也可以使各层的热膨胀系数从第1层到第n层逐渐减小,使得第2层相对于第1层为压缩应力、第3层相对于第2层为压缩应力、......、第n相对于第n-1层为压缩应力。
(使用具有安装部件用引脚的印刷线路板的电子设备的安装方法)
图2是表示使用具有安装部件用引脚18的印刷线路板1的电子设备4的一部分的图,使安装结构清楚明了。印刷线路板1的安装部件用引脚18例如相对于形成在如IC、LSI等的半导体装置之类的电子部件2上的电极焊盘3机械接触,确保电连接。
可由任意的方法进行印刷线路板1与半导体装置2相互之间的固定。虽然图中未示,例如,也可以相对于电子设备的壳体固定两者。或者,也可以用树脂等粘接剂固定两者。
该电子设备4的特征在于,将连接电子部件2与印刷线路板1之间的连接物由以往的焊锡凸块(图中未示。)变更为安装部件用引脚18。
因为安装部件用引脚18具有挠性、弹性、弯曲性等,被压靠在电极焊盘3上,形成可靠的电连接。另外,安装部件用引脚18成为通过弹性或变形可以吸收施加于半导体装置2及印刷线路板1中的一方或者双方上的力(机械能)的机械要素。因此,可以减少发生由半导体装置2与印刷线路板1的热膨胀系数之差引起的连接不良。
在此没有限制印刷线路板1的尺寸,例如为30~70mm的方材。搭载半导体装置2的尺寸例如为10~30mm见方。1个半导体装置2例如具有3000~20000点的电极焊盘。特别是在本实施方式中,优选是安装具有10000~20000点的电极焊盘的电子备件。虽然通常在1块印刷线路板1上搭载一个半导体装置2,但即使在MCM(多芯片模式)化、搭载2~3个半导体装置时,也可以通过利用安装部件用引脚18,减少发生由热膨胀系数之差引起的连接不良。
另外,由于安装部件用引脚18的长度非常短,例如在匹配特性阻抗Z0、电信号的传送速度的高速化方面可以得到良好的电特性。同样,在安装部件用引脚18由电阻低的物质形成时,可以避免不必要的电压下降。例如,是做成由Cu、Au、Ag或它们的任意的合金制成的安装部件用引脚,有时是用这些金属表面处理后的安装部件用引脚。
另外,由于安装部件用引脚18为立起的形状,周围被空气所包围,可以实现信号传送的高速化。
另外,在利用安装部件用引脚18的反弹力进行机械接触时,可以确保半导体装置2与印刷线路板1的良好的电连接。
另外,由于本发明的具有安装部件用引脚18的印刷线路板1的特征在于电连接在最外层导体11上的安装部件用引脚18,关于印刷线路板1的其他部分为任意,也可以适用于大尺寸的印刷线路板或容易发生翘曲的无芯基板等。
另外,由于将半导体装置2与印刷线路板1之间的连接不锡焊而变更为采用安装部件用引脚18的机械接触,具有不会残留回流焊工艺等的受热过程的优点。
图3是表示通过锡焊印刷线路板1的安装部件用引脚18与半导体装置2来确保电连接的电子设备5的一部分的图,使安装构造清楚明了。根据期望,在印刷线路板1的安装部件用引脚18的前端设置焊锡凸块4,如图2所示,通过在与半导体装置2机械接触的状态下进行回流焊处理,用焊锡连接安装部件用引脚18与半导体的电极焊盘3。另外,根据期望,也可以用上述方法进行印刷线路板1与半导体装置2的相互固定。
(具有安装部件用引脚的印刷线路板的制造方法)
参照图4A~图4M,由利用电镀的方法(电镀法)说明具有安装部件用引脚的印刷线路板的制造方法的典型例。
另外,由于该制造方法的特征在于与利用最外层导体11的安装电子部件的面相关的部分,对最外层导体以外的部分(参照图1~3的附图标记9、10)作为已经形成部分来说明。
另外,本申请中,仅仅对具有安装部件用引脚18的印刷线路板的制造方法的典型例进行简单说明。关于具有安装部件用引脚18的印刷线路板的制造方法的详细说明,请参照同日提出的专利申请(申请人整理编号PB030-JP00)。
最外层以外的部分9、10由众所周知的积层制造法形成。关于这样的印刷线路板的制造方法,例如,请参照日本专利特开2004-40138“积层多层印刷线路板”(公开日2004年2月5日)、日本专利特开2004-311919“通孔填充方法”(公开日2004年11月4日)。关于积层制造法请参照高木清“积层多层印刷线路板技术”日刊工业新闻社、2000年6月20日。
希望由以上知道在以下的制造方法说明中省略最外层导体以外的部分。
图4A是表示准备基板(最外层导体以外的部分)9、基板10的工序的图。该基板9、基板10如上述由形成了最外层以外的部分的印刷线路板构成。由众所周知的半加成法、全加成法、减除法形成最外层导体11。作为该最外层导体11例如形成为厚度20μm、直径(导体连接盘直径)150μm、最小间距(相邻的导体连接盘之间的距离)200μm的半导体装置连接用连接盘。导体连接盘11的配置是中心部为格子状配置、外周部为任意配置。导体连接盘的个数为50×40个。这样的导体连接盘群形成在印刷线路板的最外层的150平方毫米的区域内。
图4B是表示形成阻焊层的工序的图。例如通过丝网印刷涂布阻焊层12,形成开口12a。或者,也可以贴附半固化状态的绝缘膜,在热固化后利用激光光线等形成开口12a。
图4C是表示层压干膜、进行曝光、显影处理的工序的图。例如层压干膜13,通过曝光、显影处理在干膜13上形成开口部13a。干膜13的开口部13a位于与阻焊层12的开口12a在厚度方向上不重合的位置。
图4D是表示形成锡层的工序的图。例如,通过溅镀而在干膜13及开口部13a的底部的阻焊层12的上面形成锡层。其后,剥离干膜13。其结果,只残留开口部13a底部的阻焊层12上面的锡层14。该锡层14因在后工序(图4K)中将被部分去除,所以也被称为“牺牲层”。
其后,付予无电解电镀用催化核。作为无电解电镀用催化核典型的是使用贵金属离子、贵金属胶体(例如:氯化钯、钯胶体)(图中未示。)。
图4E是表示形成第1电镀层的工序的图。作为第1电镀层16典型的是使用无电解镀铜。优选是,因为在析出的第1电镀层16容易产生拉伸应力,所以该无电解电镀液中采用酒石酸作为配位剂,还可以包含从由镍离子、铁离子、钴离子等所组成的群中所选的至少一种金属离子作为添加剂。因为进入电镀膜的氢含量变少,可以推测为拉伸应力。
图4F是表示形成第2电镀层的工序的图。作为第2电镀层17典型的是使用无电解镀铜。优选是,因为在析出的第2电镀层17容易产生压缩应力,所以该无电解电镀液中采用EDTA(乙二胺四甲醋酸)作为配位剂。使第2电镀层17含有较多的氢。
其结果,形成了容易产生拉伸应力的第1电镀层16与容易产生压缩应力的第2电镀层17的两层构造。这两层构造经过其后的工序成为安装部件用引脚18。
图4G是表示层压抗蚀层的工序的图。例如,层压干膜13。
图4H是表示对抗蚀层进行曝光、显影处理的工序的图。由此,形成对下一工序的蚀刻处理的抗蚀层20。
图4I是表示第1及第2电镀层的蚀刻处理工序的图。利用抗蚀层20,蚀刻都是无电解电镀层的第1电镀层16及第2电镀层17,形成导体连接盘(图案)。其后,剥离抗蚀层20。
图4J是表示锡层14的蚀刻处理工序的图。利用锡剥离剂,部分蚀刻位于第1电镀层16下方的锡层14。
图4K是表示形成安装部件用引脚的工序的图。通过去除位于第1电镀层16下方的锡层14,安装部件用引脚18立起。由于该安装部件用引脚18是由容易产生拉伸应力的第1电镀层16与容易产生压缩应力的第2电镀层17的两层构造形成,所以通过第1电镀层16拉伸、第2电镀层17收缩,该安装部件用引脚18向上方立起。
图4L是表示形成保护膜(涂布)工序的图。根据期望,在安装部件用引脚18上形成导电性的保护膜。作为该涂布,例如,利用电镀形成从Ni、Au、Cu、Pd/Sn等中选择的一层或多层的皮膜。
(本实施方式的效果)
根据上述实施方式,有如下效果。
(1)减少发生由半导体芯片与印刷线路板的热膨胀系数的差引起的连接不良。
因为由具有挠性、弹性、弯曲性等的安装部件用引脚连接(利用安装部件用引脚的反弹力的机械接合)半导体芯片与印刷线路板,所以可以吸收由被曝露的温度产生的膨胀差所产生的剪切应力(机械能)。由于可以吸收半导体芯片与印刷线路板的膨胀差,不会在焊锡连接部产生过大的应力集中,从而可以减少连接部分的损坏。
该安装部件用引脚可以吸收360度方向的应力。其结果,可以提供一种印刷线路板,该印刷线路板可以减少发生由半导体芯片与印刷线路板的热膨胀系数之差引起的连接不良。
(2)良好的电特性
因为由利用了印刷线路板的图案的安装部件用引脚连接半导体芯片与印刷线路板,必然缩短了连接长度,从而得到良好的电特性。例如,在一块印刷板中,在搭载了多个半导体裸芯片的电子设备(多芯片模式)中,对于将特性阻抗Z0设计成恒定值的印刷线路板的微带线,通过在长度的极端形成短的安装部件用引脚来与半导体芯片连接,可以减少由于特性阻抗Z0不匹配引起的电气不良。
(3)电子设备的高速化
因为由尺寸较短的安装部件用引脚连接半导体芯片与印刷线路板,可以实现电子设备的高速化。
(4)对电子设备的各回路要素的良好的电源供给
因为由电阻低的安装部件用引脚连接半导体芯片与印刷线路板,所以可以防止对电子设备的各回路要素供给电源时不必要的电压下降。作为电阻低的安装部件用引脚,例如可以使用Cu、Au、Ag或他们的任意合金制成的安装部件用引脚、用这些金属作过表面处理的安装部件用引脚。
(5)信号的高速传送
因为由在空气中立起的安装部件用引脚连接半导体芯片与印刷线路板,可以实现信号的高速传送。即,相对于在玻璃环氧基板等介电常数εr大于1的基板中流动的电信号的速度为v=c/(εr)1/2(m/s),在在空气中立起的安装部件用引脚中可认为是接近在真空中的速度v=c/(m/s),速度更快。
(6)半导体芯片与印刷线路板的良好的电连接
在具有用图2说明的安装部件用引脚压接安装构造的电子设备4中,因为由利用安装部件用引脚的反弹力状态机械连接半导体芯片与印刷线路板,可以得到接触电阻相对较低状态的电连接。
(7)即使较大的印刷线路板也可以适用
在具有用图2说明的安装部件用引脚压接安装构造的电子设备中,通过相对于半导体芯片推压印刷线路板,可以确保两者之间的电连接。因此,即使对于如不存在芯基板的无芯基板或芯基板的厚度较薄的基板那样的发生翘曲比较大的印刷线路板,也可以实现具有该安装部件用引脚压接安装构造的电子设备。
(8)变更作业、修补作业容易
在具有用图2说明的安装部件用引脚压接安装构造的电子设备中,因为半导体芯片与印刷线路板不是用焊锡连接,所以在变更作业、修补(修理)作业等时,可以容易地将半导体芯片与印刷线路板分离。
(9)在印刷线路板上没有由于热产生的损伤
在具有用图2说明的安装部件用引脚压接安装构造的电子设备中,因为半导体芯片与印刷线路板不是用焊锡连接,在印刷线路板不会残留回流焊工序等的受热过程。即,在印刷线路板上不会产生由热所造成的损伤。
(10)可以使印刷线路板的图案高密度化
在具有用图2说明的安装部件用引脚压接安装构造的电子设备中,不会残留回流焊工序等的受热过程。因为没有由热所造成的损伤,可以使印刷线路板的图案高密度化(优化)。
即,回流焊温度是使印刷线路板在被曝露的温度中的最高温度,为了可应对在回流焊时印刷线路板所受到的应力,回流焊温度受到设计上的各种制约。例如,在积层印刷线路板中将导通孔的底径设为规定值以上(例如,60μm以上),为了确保绝缘层与导体层之间的紧密结合而需要对导体层进行规定值以上(例如,2μm以上)的导体粗糙化处理。但是,由于不需要回流焊工序,就没有这样的制约,从而可以进一步减少导通孔直径,而且可以进一步减少导体粗糙化,从而可以使印刷线路板的图案高密度化。或者,也可以消除导体粗糙化(导体表面平滑)。
(其他)
由以上,虽然对具有安装部件用引脚的印刷线路板及使用该印刷线路板的电子设备的实施方式进行了说明,这些都只是例示,本发明不局限于此。本领域技术人员容易做到的添加、削除、变换、改进等包含在本发明的范围中。
本发明的保护范围由添附的权利要求书的记载确定。
Claims (15)
1.一种印刷线路板,具有安装部件用引脚。
2.根据权利要求1所述的印刷线路板,上述安装部件用引脚从上述印刷线路板的最外层导体延伸出,另一端从该印刷线路板立起。
3.根据权利要求1所述的印刷线路板,上述安装部件用引脚由具有弹性的材料构成。
4.根据权利要求1所述的印刷线路板,上述安装部件用引脚由电阻低的物质构成。
5.根据权利要求1所述的印刷线路板,上述安装部件用引脚由从金属、导电性橡胶、使其一部分具有导电性的橡胶、导电性合成树脂及使其一部分具有导电性的合成树脂所组成的群中选择的任意物质构成。
6.根据权利要求1所述的印刷线路板,上述安装部件用引脚由n(n≥2)层的膜构成,设与上述印刷线路板相对的膜的层数为n=1时,第一层膜相对于第n层膜容易延伸。
7.根据权利要求6所述的印刷线路板,其特征在于,第n-1层的应力相对于第n层的应力为拉伸应力或相等,第一层的应力相对于第n层的应力为拉伸应力。
8.根据权利要求6所述的印刷线路板,其特征在于,第n-1层的热膨胀系数与第n层的热膨胀系数相等或比其大,第1层的热膨胀系数比第n层的热膨胀系数大。
9.根据权利要求1所述的印刷线路板,上述安装部件用引脚形成有导电性的保护被膜。
10.根据权利要求1所述的印刷线路板,上述安装部件用引脚在前端部具有焊锡凸块。
11.一种电子设备,该电子设备具有印刷线路板与面安装型部件;该印刷线路板具有安装部件用引脚,该面安装型部件具有电极焊盘;上述安装部件用引脚电连接在上述电极焊盘上。
12.根据权利要求11所述的电子设备,上述安装部件用引脚具有弹性,相对于上述电极焊盘压接。
13.根据权利要求11所述的电子设备,上述安装部件用引脚的长度较短。
14.根据权利要求11所述的电子设备,上述安装部件用引脚从上述印刷线路板的最外层导体延伸出立起,电连接于上述电极焊盘,该立起部分的周围由空气包围。
15.一种电子设备,该电子设备具有印刷线路板与面安装型部件,该印刷线路板具有安装部件用引脚,该面装型部件具有电极焊盘;上述安装部件用引脚在其前端部具有焊锡凸块,锡焊在上述电极焊盘上。
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JP2005356049A JP4848752B2 (ja) | 2005-12-09 | 2005-12-09 | 部品実装用ピンを有するプリント配線板及びこれを使用した電子機器 |
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US (1) | US7773388B2 (zh) |
EP (1) | EP1895821A4 (zh) |
JP (1) | JP4848752B2 (zh) |
KR (1) | KR20070100386A (zh) |
CN (1) | CN101189922A (zh) |
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-
2005
- 2005-12-09 JP JP2005356049A patent/JP4848752B2/ja not_active Expired - Fee Related
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2006
- 2006-11-30 CN CNA2006800091042A patent/CN101189922A/zh active Pending
- 2006-11-30 WO PCT/JP2006/323913 patent/WO2007066563A1/ja active Application Filing
- 2006-11-30 KR KR1020077019656A patent/KR20070100386A/ko not_active Application Discontinuation
- 2006-11-30 EP EP06833716A patent/EP1895821A4/en not_active Ceased
- 2006-12-05 US US11/566,912 patent/US7773388B2/en not_active Expired - Fee Related
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EP1895821A4 (en) | 2010-11-17 |
JP4848752B2 (ja) | 2011-12-28 |
TWI341153B (en) | 2011-04-21 |
US7773388B2 (en) | 2010-08-10 |
JP2007165373A (ja) | 2007-06-28 |
WO2007066563A1 (ja) | 2007-06-14 |
TW200806133A (en) | 2008-01-16 |
EP1895821A1 (en) | 2008-03-05 |
KR20070100386A (ko) | 2007-10-10 |
US20070187140A1 (en) | 2007-08-16 |
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