CN101288205B - 金属化弹性体电学接触 - Google Patents
金属化弹性体电学接触 Download PDFInfo
- Publication number
- CN101288205B CN101288205B CN200580043425XA CN200580043425A CN101288205B CN 101288205 B CN101288205 B CN 101288205B CN 200580043425X A CN200580043425X A CN 200580043425XA CN 200580043425 A CN200580043425 A CN 200580043425A CN 101288205 B CN101288205 B CN 101288205B
- Authority
- CN
- China
- Prior art keywords
- elastomeric material
- carrier
- conductive layer
- plane
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Abstract
Description
Claims (33)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63666604P | 2004-12-16 | 2004-12-16 | |
US60/636,666 | 2004-12-16 | ||
PCT/US2005/035324 WO2007001391A2 (en) | 2004-12-16 | 2005-09-30 | Metalized elastomeric electrical contacts |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101288205A CN101288205A (zh) | 2008-10-15 |
CN101288205B true CN101288205B (zh) | 2011-09-21 |
Family
ID=37570885
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800434245A Expired - Fee Related CN101218515B (zh) | 2004-12-16 | 2005-09-30 | 金属化弹性探针结构 |
CN200580043425XA Expired - Fee Related CN101288205B (zh) | 2004-12-16 | 2005-09-30 | 金属化弹性体电学接触 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005800434245A Expired - Fee Related CN101218515B (zh) | 2004-12-16 | 2005-09-30 | 金属化弹性探针结构 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8054095B2 (zh) |
EP (1) | EP1834379B1 (zh) |
JP (2) | JP4709850B2 (zh) |
KR (2) | KR100968184B1 (zh) |
CN (2) | CN101218515B (zh) |
WO (2) | WO2006137896A2 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7771208B2 (en) | 2004-12-16 | 2010-08-10 | International Business Machines Corporation | Metalized elastomeric electrical contacts |
CN101218515B (zh) | 2004-12-16 | 2011-08-24 | 国际商业机器公司 | 金属化弹性探针结构 |
TWI275187B (en) * | 2005-11-30 | 2007-03-01 | Advanced Semiconductor Eng | Flip chip package and manufacturing method of the same |
US7585173B2 (en) * | 2007-03-30 | 2009-09-08 | Tyco Electronics Corporation | Elastomeric electrical contact |
US8832936B2 (en) | 2007-04-30 | 2014-09-16 | International Business Machines Corporation | Method of forming metallized elastomeric electrical contacts |
US8673416B2 (en) * | 2009-10-28 | 2014-03-18 | Xerox Corporation | Multilayer electrical component, coating composition, and method of making electrical component |
US8263879B2 (en) | 2009-11-06 | 2012-09-11 | International Business Machines Corporation | Axiocentric scrubbing land grid array contacts and methods for fabrication |
US8959764B2 (en) | 2009-11-06 | 2015-02-24 | International Business Machines Corporation | Metallurgical clamshell methods for micro land grid array fabrication |
WO2012075356A1 (en) * | 2010-12-03 | 2012-06-07 | Ardent Concepts, Inc. | Compliant electrical contact and assembly |
US8917106B2 (en) * | 2011-11-09 | 2014-12-23 | Advantest America, Inc. | Fine pitch microelectronic contact array and method of making same |
US8641428B2 (en) * | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
FR3009445B1 (fr) * | 2013-07-31 | 2017-03-31 | Hypertac Sa | Organe de contact entre un support et un dispositif et connecteur electrique comprenant un tel organe de contact |
US9835653B2 (en) | 2014-05-13 | 2017-12-05 | International Business Machines Corporation | Solder bump array probe tip structure for laser cleaning |
IT201700100522A1 (it) | 2017-09-07 | 2019-03-07 | Technoprobe Spa | Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione |
JP7308660B2 (ja) | 2019-05-27 | 2023-07-14 | 東京エレクトロン株式会社 | 中間接続部材及び検査装置 |
Family Cites Families (52)
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US5917707A (en) * | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US5476211A (en) * | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
JPS63208237A (ja) * | 1987-02-25 | 1988-08-29 | Hitachi Ltd | 半導体装置の測定装置 |
US5071359A (en) | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
JPH0826231B2 (ja) * | 1991-08-16 | 1996-03-13 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 導電性ポリマー材料及びその使用 |
US5244143A (en) * | 1992-04-16 | 1993-09-14 | International Business Machines Corporation | Apparatus and method for injection molding solder and applications thereof |
US6295729B1 (en) * | 1992-10-19 | 2001-10-02 | International Business Machines Corporation | Angled flying lead wire bonding process |
US5371654A (en) | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US6528984B2 (en) * | 1996-09-13 | 2003-03-04 | Ibm Corporation | Integrated compliant probe for wafer level test and burn-in |
US6054651A (en) | 1996-06-21 | 2000-04-25 | International Business Machines Corporation | Foamed elastomers for wafer probing applications and interposer connectors |
US5810607A (en) | 1995-09-13 | 1998-09-22 | International Business Machines Corporation | Interconnector with contact pads having enhanced durability |
US6329827B1 (en) * | 1997-10-07 | 2001-12-11 | International Business Machines Corporation | High density cantilevered probe for electronic devices |
JPH0737633A (ja) * | 1993-07-14 | 1995-02-07 | Whitaker Corp:The | エラストマコネクタ |
US6624648B2 (en) * | 1993-11-16 | 2003-09-23 | Formfactor, Inc. | Probe card assembly |
US6336269B1 (en) * | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
US6835898B2 (en) * | 1993-11-16 | 2004-12-28 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US5632631A (en) * | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
US5590460A (en) * | 1994-07-19 | 1997-01-07 | Tessera, Inc. | Method of making multilayer circuit |
US5599193A (en) * | 1994-08-23 | 1997-02-04 | Augat Inc. | Resilient electrical interconnect |
US5700398A (en) | 1994-12-14 | 1997-12-23 | International Business Machines Corporation | Composition containing a polymer and conductive filler and use thereof |
DE19605661A1 (de) | 1995-02-24 | 1996-08-29 | Whitaker Corp | Elektrisches Verbinderbauteil zur Herstellung einer elektrischen Verbindung zwischen leitfähigen Flächen |
JPH08287983A (ja) * | 1995-04-14 | 1996-11-01 | Whitaker Corp:The | エラストマコネクタ |
US5785538A (en) * | 1995-11-27 | 1998-07-28 | International Business Machines Corporation | High density test probe with rigid surface structure |
US5632626A (en) * | 1996-01-05 | 1997-05-27 | The Whitaker Corporation | Retention of elastomeric connector in a housing |
EP0925509B1 (en) * | 1996-09-13 | 2005-09-07 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips |
JP3206922B2 (ja) | 1996-09-13 | 2001-09-10 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | ウエハ・スケール高密度プローブ・アセンブリ、その使用装置、および製造方法 |
US6104201A (en) | 1996-11-08 | 2000-08-15 | International Business Machines Corporation | Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage |
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US6264476B1 (en) * | 1999-12-09 | 2001-07-24 | High Connection Density, Inc. | Wire segment based interposer for high frequency electrical connection |
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JP3921163B2 (ja) * | 2000-09-26 | 2007-05-30 | 株式会社アドバンストシステムズジャパン | スパイラルコンタクタ及びその製造方法、並びにそれを用いた半導体検査装置、及び電子部品 |
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US6425518B1 (en) * | 2001-07-25 | 2002-07-30 | International Business Machines Corporation | Method and apparatus for applying solder to an element on a substrate |
JP2003142537A (ja) * | 2001-11-01 | 2003-05-16 | Hitachi Ltd | 半導体装置の検査装置 |
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US6948940B2 (en) * | 2003-04-10 | 2005-09-27 | Formfactor, Inc. | Helical microelectronic contact and method for fabricating same |
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US7172431B2 (en) | 2004-08-27 | 2007-02-06 | International Business Machines Corporation | Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof |
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CN101218515B (zh) | 2004-12-16 | 2011-08-24 | 国际商业机器公司 | 金属化弹性探针结构 |
-
2005
- 2005-09-30 CN CN2005800434245A patent/CN101218515B/zh not_active Expired - Fee Related
- 2005-09-30 KR KR1020077013680A patent/KR100968184B1/ko not_active IP Right Cessation
- 2005-09-30 US US11/718,283 patent/US8054095B2/en not_active Expired - Fee Related
- 2005-09-30 US US11/718,279 patent/US7452212B2/en not_active Expired - Fee Related
- 2005-09-30 EP EP05858193A patent/EP1834379B1/en not_active Not-in-force
- 2005-09-30 CN CN200580043425XA patent/CN101288205B/zh not_active Expired - Fee Related
- 2005-09-30 JP JP2007546648A patent/JP4709850B2/ja not_active Expired - Fee Related
- 2005-09-30 KR KR1020077013681A patent/KR100968183B1/ko not_active IP Right Cessation
- 2005-09-30 WO PCT/US2005/035322 patent/WO2006137896A2/en active Search and Examination
- 2005-09-30 WO PCT/US2005/035324 patent/WO2007001391A2/en active Search and Examination
- 2005-09-30 JP JP2007546647A patent/JP5220417B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1834379B1 (en) | 2012-07-11 |
US20080094085A1 (en) | 2008-04-24 |
US8054095B2 (en) | 2011-11-08 |
KR100968183B1 (ko) | 2010-07-05 |
JP4709850B2 (ja) | 2011-06-29 |
EP1834379A4 (en) | 2010-02-24 |
WO2006137896A2 (en) | 2006-12-28 |
JP2008524583A (ja) | 2008-07-10 |
KR100968184B1 (ko) | 2010-07-05 |
KR20070090927A (ko) | 2007-09-06 |
WO2007001391A3 (en) | 2007-12-13 |
JP2008524799A (ja) | 2008-07-10 |
KR20070112107A (ko) | 2007-11-22 |
CN101218515B (zh) | 2011-08-24 |
JP5220417B2 (ja) | 2013-06-26 |
CN101288205A (zh) | 2008-10-15 |
US20070298626A1 (en) | 2007-12-27 |
CN101218515A (zh) | 2008-07-09 |
EP1834379A2 (en) | 2007-09-19 |
WO2007001391A2 (en) | 2007-01-04 |
US7452212B2 (en) | 2008-11-18 |
WO2006137896A3 (en) | 2008-01-24 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171211 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171211 Address after: American New York Patentee after: Core USA second LLC Address before: New York grams of Armand Patentee before: International Business Machines Corp. |
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TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110921 Termination date: 20190930 |
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CF01 | Termination of patent right due to non-payment of annual fee |