CN101454910B - 含三维支架用于物理空间照明的半导体光源 - Google Patents

含三维支架用于物理空间照明的半导体光源 Download PDF

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CN101454910B
CN101454910B CN2007800196354A CN200780019635A CN101454910B CN 101454910 B CN101454910 B CN 101454910B CN 2007800196354 A CN2007800196354 A CN 2007800196354A CN 200780019635 A CN200780019635 A CN 200780019635A CN 101454910 B CN101454910 B CN 101454910B
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曹殿生
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Epistar Corp
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Abstract

本发明涉及用于物理空间照明的半导体光源,包括具有多个表面的支架。每个表面可以具有一个或更多个位于其上的半导体发光器件,如发光二极管。该光源可配置为容纳传统的灯插座几何体和其它的照明几何体,诸如条形灯和表面表面安装灯等。

Description

含三维支架用于物理空间照明的半导体光源
对相关申请的交叉引用
本申请是2006年4月4日提交的、序列号为11/397,323的在先提交的美国实用新型专利申请的部分延续申请。该专利申请是2004年2月5日提交的、序列号为10/773,123的美国实用新型专利申请(现在_____)的部分延续,该美国实用新型专利申请是2001年8月24日提交的、申请序列号为09/938,875的美国专利申请(现在是美国专利No.6,746,885)的延续。将上述各项专利申请通过引用的方式并入。
技术领域
本发明涉及电气照明和照明设备领域,具体涉及利用三维支架上的发光二极管(LEDs)来提供照明的光源。
背景技术
本公开涉及用于物理空间照明的光源,例如灯泡。尤其是讨论利用发光二极管(LED)光源来产生足够的光线以照明物理空间的难题。以往,由于无法输出足够的光线,对LED灯的利用常常局限于背景性的照明。有几种方法可提高LED输出。一种是增加芯片的尺寸.另一种是在光源中使用更多的芯片。
增加芯片尺寸会引发几个问题。首先,由于随着芯片尺寸增加,生产流程更加精确,结果会导致成本上升。其次,由于发热的原因,芯片的发光效率会下降。当LED芯片变大,热量也会成比例的增加。大量的热量难以从芯片中排出,结果导致芯片的整体温度上升,且发光效率下降。
现有技术中,将多个LED芯片集成在二维平台上以提高功率。在二维阵列内集成多个芯片还有下列缺陷:占用面积大,生产流程复杂。
本公开涉及利用三维多面支架创建LED光源,以便创建紧凑、高效的光源的结构及流程。
发明内容
三维多表面支架用于创建紧凑、高效的光源。为了达到该目的和其他目的,本发明包括:配有轴和电气连接结构(例如标准螺纹或者电气面板连接)的三维支架。借助该螺纹结构,该光源可以被拧入传统的灯插座,以取代现有的白炽灯泡。支架上设有多个表面,支架本身又作为安装于其上的发光二极管的阴极。阳极盖配有延伸的管脚,并通过绝缘层与阴极隔离。在支架的所选的表面上放置一个或多个LED芯片,以产生可达360度的发光弧。用导线将芯片的阳极连接到支架的阳极,另用导线将芯片的阴极连接到支架的主体。多个芯片可以阵列或者组件的形式进行排列,每个芯片各自与基座单元相连,基座单元与支架相连(在此处及所附权利要求所用术语“阵列”包含阵列和组件)。支架和芯片用封装构件覆盖,封装构件由环氧树脂、硅、塑料或者类似材料制成,该封装构件对芯片所发射的光线起光学透镜作用。该构件也对芯片和支架起保护层的作用,并能有效的对光源起防水作用。光源的整体设计达到以下特征:电弧中所发射的光达到360度(含360度);光源易于更换并完全密封和防水。
值得注意的是,申请人认识到,各种形式从技术上讲在体积方面都是三维的;应当认为,这也包括了在板上安装LEDs的二维阵列的情形。然而,就本次申请的目的而言,“三维支架”可以解释为指:除安装阳极的表面外,在实施本发明时,支架上其他各个平表面均可用于LED安装,从而提供可使用表面的三个维度。所包括的形状几乎是任何圆柱形(圆形或者多边型),半球形,球状,或者圆顶的形状。尽管从技术上而言,板也是三维的,但由于板只能为LED提供二维的安装表面,所以不将其包括在内(即使两面都使用,也只是两个平行的表面)。
下文及所附权利要求部分将详细展示本发明的各项特征及其优点。这些特征和优点可以通过所附权利要求所示的装置及其组合得以实现。而且,通过实施本发明的方式可以理解到本发明的特征和优点,并且下文所作描述也可使这些特征和优点显而易见。
本发明的许多目的会出现在以下的描述和所附的权利要求中,对附图的引用构成本说明书的一部分,其中相同的参考字符指示一些视图中的相应部分。
在详细解释本发明之前,应该理解本发明并不局限于申请中所述的或者附图中例示的结构和部件的细节。本发明能够具有其它实施方案,且能够以各种方式进行实践和实施。也可以理解,此处所使用的的措词和技术是以描述本发明为目的,而非作为限制。
同样,本领域的技术人员可以理解,本公开所基于的概念可以被容易地用来作为为了实施本发明的一些目的而设计的其它结构、方法和系统的基础。因此,重要的是权利要求应被看作包括这种等同的构造的范围,只要其不偏离本发明的精神和范围。
附图说明
图1描绘使用三维多面支架进行物理空间照明的光源的立体图;
图2描绘图1所示设备的截面图;
图3描绘不同形状支架的几个实例;
图4描绘使用三维多面支架的可替代光源的立体图;
图5描绘图4所示设备的截面图;
图6描绘使用三维多面支架的另一可替代光源的立体图;
图7描绘使用三维多面支架的又一可替代光源的立体图;
图8描绘图7所示设备的截面图。
具体实施方式
下面参考附图描述本申请器具的优选实施方案。应当注意到,本说明书中所使用的冠词“一(a)”、“一(an)”或“该”包括复数个所指对象,除非该内容清楚地指示了其它意思。在本说明书中所引用的各种材料仅仅是例示性质,在实施本发明时,就已有技术而言,该等材料均有类似功能的可替代品。因此,下面所作描述内容应当被看作例示性而不应当作为限定。
图1描绘了具有带多个表面或面的三维支架的光源100,该表面或面用于安置多个LED芯片。三维支架101配有轴102及标准螺纹103。借助螺纹结构,该光源可以拧入传统灯插座,从而可以取代现有的白炽灯泡。支架101上配有面或表面104。支架101自身作为发光二极管100的阴极。阳极的盖105配有延伸的管脚106。阴极和阳极由绝缘层107隔离。LED芯片108放置于支架101的各个表面上。每个表面可以使用一个或多个芯片。导线109将芯片的阳极108连接到支架的阳极105,另用导线将芯片的阴极连接到支架的主体。将具有芯片的支架用环氧树脂盖120加以覆盖。环氧树脂盖120既可以对芯片中发射的光线起光学透镜的作用,同时也可以对芯片和支架起保护层的作用。整个设计可以实现光源的下列特征:发射的光线的电弧达360度(含360度);光源便于更换;且光源被完全密封并可防水。
图2描绘了图1所示光源的截面200。支架201以截面图形式显示。基座202为LED的阴极,阴极的轴203与螺线配件204相连。在本实施例中,阴极的表面部分205几乎与基座202相垂直。基于设计要求,该表面与基座可以相垂直也可以不相垂直。支架的阳极的盖206配有延伸到支架的阴极的管脚207。阳极和阴极通过绝缘材料208隔离。该绝缘材料可以是环氧树脂、ATO、或其他具有绝缘性质的材料。绝缘层可以使阳极和阴极电绝缘。芯片如芯片209,附着于支架的表面。芯片209通过导线210a与阳极206相连,并通过金或铝制的导线210b与阴极201相连。光线转换层211覆盖在芯片209顶部,可用于在需要转换时将芯片所发光线转换成不同的颜色,当无需转换时,无需该转换层。支架、阳极、阴极,和芯片被环氧树脂盖212覆盖。环氧树脂盖212既起光学透镜的作用,也起支架和芯片的保护层的作用。尽管各个附图均未加以描绘,但应当理解:LED芯片和支架的连接可以是串联或并联方式的电气连接,且LED芯片可以以所例示的阵列结构装配,也可以是将芯片预先装配成组件后再将该组件附着到支架的阳极和阴极。所有这些变换形式均属于对本发明的实施方案。
图3a-3f描绘支架的外形的实施例。支架的主要形状由阴极的形状所限定。阳极与阴极形状相同,阴极和阳极均可以根据具体需要采用各种形状。
图4描绘了具有表面安装型包装400的多表面光源。基座401起导热体的功能。它是电绝缘材料制成,如陶瓷、塑料等。在基座401上,电极402和403位于该基座的一侧,电极404和405位于该基座的另一侧。阳极402和404与阴极403和405形成回路。各电极可利用在陶瓷基座顶部上覆盖诸如铝、金或其他合金的金属层的方法制成。在401基座的顶部设置有支架406的阴极407。支架406的阴极407与基座401连接。多个垂直表面408与基座407相连。阳极盖409经绝缘层410相隔后放置在阴极支架的顶部。如图所例示,芯片阵列411放置在其中一个表面上。芯片阵列411通过导线412和413与阴极和阳极相连。环氧树脂层414覆盖于支架和各芯片之上,既用作盖也用作光学透镜。应当指出,在本申请中“表面安装”指将光源安装于表面之上的各种构造。表面表面安装构造有多种形式,包括但不限于:将光源放置于印刷电路板上或安装于电气面板上。所有将光源安装于表面之上的构造均属于表面该术语的范围。同时有必要指出,在本例示性实施方案中,使用了芯片阵列411。应当理解为对多个芯片和阵列的单独使用。
图5描绘了光源500的截面图,该光源500如图4中所示光源。支架阴极501配有基座502。盖504配有阳极管脚505。在阴极和阳极之间设有绝缘层506。LED芯片阵列507位于支架表面之一上面,如503。可选择的磷光体涂层508可用于光线颜色的转换。导线509和510将芯片与阳极和阴极相连。环氧树脂盖511覆盖整个支架。LED的基座形状如512所示。用于基座512的材料具有导热和电绝缘的性质。使用金属涂层的电极513和514分别作为阴极和阳极。支架的阴极503通过线路515与基座上的阴极513相连,支架的阳极505通过线路516与基座上的阳极514相连。
图6描绘了光线仅向一个方向发射的另一种包装方式,即发光弧的度数小于360度的情形。注意,支架上的表面数较少。LED600分别配有基座601及电极602、603、604和605。支架606具有仅在一个方向的多个表面,且在这些表面上放置有芯片。在本构造中,仅有一个表面面向非照射方向,该表面不作使用。然而,取决于支架的形状,可以选择数量不等的表面在其上不安装芯片,以便使发光弧的度数小于360度。环氧树脂盖607用于保护支架及LED芯片。光线将向同一方向发射。此类光线可用于各种需使用背景灯光的场合。
图7描绘了用两个多表面支架相连,以形成柱形或条形光源的情形。光源700有2个多表面阴极支架701和702。一阳极703与阴极701并排放置,中间用绝缘层704隔开。芯片705安装在一个表面上,通过导线与阳极和阴极相连。另一个阳极706夹于两个绝缘层708和709之间,并安装于支架701和702之间。LED芯片709位于702的一个表面之上。环氧树脂盖711做成覆盖整个支架及各构件的形状。电极712和713分别作为阳极和阴极的引线。
图8描绘了图7所例示的LED的截面图。该视图展示了阳极和阴极之间的排列。在阳极中有接触片801。通过杆804将平台802和803相连。在平台802和803上分别有两个压合表面805和806。两阴极807和808通过连接杆809与多表面相连。绝缘层810和811用于填充阳极和阴极之间的空隙。用于阴极的接触片为812。芯片813安装于支架的一个表面上。可选择的磷光体涂层814可用于波长转换。导线815和816将芯片与阳极和阴极相连。应当指出,通过将三个、四个、五个或更多个支架通过前述结构和组装方式整合在一起,可以制成更长的条形光源。同样,多个支架可以采用本说明书中前述的单方向。
通过将带有一个或多个LED芯片的多表面支架的各个表面上的光源,可以用于将多个芯片集成占用空间小的包装中。取决于具体需求,支架上的表面数量可以从1个到无数多个。支架的三维结构可以按具体需要调整多表面的方向。通过绝缘材料将支架上的阴极和阳极隔离。每个表面上可以安装一个或多个LED芯片。通过覆盖在LED芯片上的光线转换层将芯片所发光线转换成不同颜色。由环氧树脂或类似材料制成的盖,在覆盖支架后,既可以作保护层又可作光学透镜。支架既可采用在基座上带有螺纹的二极管的方式,也可采用在基座上带有电极的表面安装的方式。多表面支架可以通过一个单元或多单元组合的方式来形成条形光源。通过在蓝光芯片顶部涂布磷光体,可制造带有多表面支架的白光源。支架由导热材料制成,有利于散发芯片热量,避免热效应引起的流明输出损耗。
尽管通过一定数量的具体实施方案和应用对本发明进行了描述和例示,但在本发明所例示、描述和权利要求保护的原理范围内,熟悉本发明所涉技术领域的人员可能会做出各种变动或修改。在本发明实质内容和基本特征的范围内,本发明可能会作其他形式的使用或实施。无论如何,所描述的本发明具体实施的各情形仅仅是为例示的方便,不应当看成是对本发明内容的任何限制性描述。在本发明权利保护范围内或等价范围内所作修改均属于本发明权利保护的范畴。申请人在此对本发明的各种具体应用所作披露,既不代表申请人对本发明的内容及权利要求作限定性质的意思表示,也不应当从该等披露中推断出该意思表示。
工业实用性
本发明通过利用固态技术和改进的几何设计,提供了紧凑和高效的光源。除多表面支架用于支持发光二极管这一技术外,本发明所使用的其他制造技术与现今用于制造类似光源的技术内容类似。因此,与现有技术的设备相比,本发明可以在更小的空间安装更多的发光二极管,从而增加照明亮度。

Claims (21)

1.一种用于物理空间照明的半导体光源,包括:
a.三维支架,包括底部的基座和顶部的盖,其中所述基座用作为阴极,所述盖用作为阳极;
b.所述三维支架由热传导材料制成,以便将热量从安装到其上的半导体芯片导出,
c.位于所述三维支架上的多个表面,所述表面被配置在不同方向,并容纳其上发光半导体芯片的安装,以及
d.安装于所述表面上的多个发光半导体芯片。
2.如权利要求1所述的半导体光源,还包括一个阳极和阴极之间的绝缘层。
3.如权利要求2所述的半导体光源,还包括连接所述芯片与阳极和阴极的导线。
4.如权利要求1所述的半导体光源,还包括一个覆盖所述三维支架和芯片的外包体。
5.如权利要求4所述的半导体光源,其中,所述外包体对所述芯片发出的光起光学透镜的作用。
6.如权利要求5所述的半导体光源,所述外包体由选自硅、环氧树脂和塑料组成的材料列表中的至少一种材料组成。
7.如权利要求1所述的半导体光源,还包括用于将芯片发出的光转换为白光的光转换层。
8.如权利要求7所述的半导体光源,其中,所述光转换层为磷光体层。
9.如权利要求1所述的半导体光源,其中,所述三维支架的每一表面上至少安装一个发光二极管芯片。
10.如权利要求1所述的半导体光源,操作上与所述三维支架连接的半导体芯片阵列中排列有至少两个半导体芯片。
11.如权利要求1所述的半导体光源,其中,所述光源发出跨360度弧度的光。
12.如权利要求1所述的半导体光源,其中,所述光源发出跨小于360度的弧度的光。
13.如权利要求12所述的半导体光源,所述弧度是限定的以使所述光源在一个方向发射光。
14.如权利要求1所述的半导体光源,还包括用于连接电源的构件。
15.如权利要求14所述的半导体光源,用于连接电源的所述构件为具有附着于灯插座的机械装置的基座。
16.如权利要求14所述的半导体光源,用于连接电源的所述构件为将所述半导体光源安装到表面的构件。
17.一种用于物理空间照明的半导体光源,包括:
a.第一个三维支架,
b.附着于所述第一个三维支架的第二个三维支架,
c.所述三维支架由热传导材料制成,以便将热量从安装到其上的半导体芯片散出,
d.位于所述三维支架上的多个表面,所述表面被设置以接受其上发光半导体芯片的安装,以及
e.安装在位于所述三维支架的所述多个表面的每一个之上的至少一个发光半导体芯片;
其中,所述三维支架还包括底部的基座和顶部的盖,其中所述基座用作为阴极,所述盖用作为阳极。
18.如权利要求17所述的半导体光源,其中,所述三维支架彼此相关地配置以形成条形灯。
19.如权利要求18所述的半导体光源,还包括所述条形灯上的一个外包体。
20.如权利要求17所述的半导体光源,还包括可操作地连接到外包体的具有多个面、且具有至少一个在至少一个面上的LED芯片的至少另一个三维支架。
21.如权利要求17所述的半导体光源,附着于三维支架的半导体芯片阵列中排列有至少两个半导体芯片。
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