CN101461035B - Ejector unit for separating components from an essentially flat array of components - Google Patents
Ejector unit for separating components from an essentially flat array of components Download PDFInfo
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- CN101461035B CN101461035B CN2007800201742A CN200780020174A CN101461035B CN 101461035 B CN101461035 B CN 101461035B CN 2007800201742 A CN2007800201742 A CN 2007800201742A CN 200780020174 A CN200780020174 A CN 200780020174A CN 101461035 B CN101461035 B CN 101461035B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Abstract
The invention relates to a topping unit (10, 110, 610) for separating elements (70, 76, 170) from a substantially flat array of elements (72, 78, 172) by using topping elements (12, 14, 20, 112, 114, 120, 212, 312, 520, 620, 630, 640, 650, 660), wherein the number of topping elements (12, 14, 20, 112, 114, 120, 212, 312, 520, 620, 630, 640, 650, 660) in the operating position and/or the geometric arrangement of the individual or several topping elements (12, 14, 20, 112, 114, 120, 212, 312, 520, 620, 630, 640, 650, 660) of the topping unit (10, 110, 610) is variable. In this way, the adaptation of the topping unit (10, 110, 610) to elements (70, 76, 170) of different geometries and different sizes can be simplified.
Description
Technical field
The present invention relates to a kind of being used for comprises from the ejection unit of straight substantially element arrays resolution element:
Some liftout elements, these liftout element construction and layout maybe can be arranged to be used for separate one of them element from element arrays,
Wherein, described being separated on the liftout direction carried out, described liftout direction is basically perpendicular to the plane of described element arrays, and the liftout element that is used for or can be used for separating described element in the described liftout element is in a service position of described ejection unit inside.
Background technology
Known in the state of the art have this class ejection unit.For example disclosed " wafer dispenser " is used for from semiconductor wafer separating semiconductor chip among European patent specification EP 1 057 388 B1.Some material pushing needle disclosed herein are isolated chip by these material pushing needle from wafer, choose with suction pipe and get chip.
Above-mentioned the deficiencies in the prior art part is, is using under the chip size situations obviously bigger or obviously other littler wafers, and ejection unit and this new size also do not match.For example when chip size obviously more hour, the situation of contact of part material pushing needle and mobile adjacent chips can appear, this non-expectation situation can cause system to break down.When chip size was excessive, chip can be subjected to uneven mechanical load in separation process, thereby caused chip impaired in the quilt process that transports out of.Therefore, when using the different new wafer of chip size, must manually change, it is replaced with separative element with the chip coupling whole ejection unit.This point is similarly known technology in the prior art.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of being used for from the ejection unit of straight substantially element arrays resolution element, this ejection unit can improve the matching degree between ejection unit and the different elements, for example improves the matching degree between the geometric shape of ejection unit and different elements.
This purpose was reached from the ejection unit of straight substantially element arrays resolution element by a kind of being used for, and described ejection unit comprises:
Some liftout elements, these liftout element construction maybe can be arranged to be used for separating one of them element from element arrays with arranging,
Wherein, described being separated on the liftout direction carried out, and described liftout direction is basically perpendicular to the plane of described element arrays, and the liftout element that is used for or can be used for separating described element in the described liftout element is in the service position of described ejection unit inside.Described ejection unit also comprises a switching mechanism, the first liftout elements combination on the service position can be transformed into the second liftout elements combination on the service position by described switching mechanism, the described first liftout elements combination has different space layouts with the liftout element that the described second liftout elements combination is comprised.Described ejection unit rotatably supports around first of being basically parallel to described liftout direction, and installs movably along second of being basically parallel to described liftout direction.
By switching mechanism being set in ejection unit inside, can make the geometry in particular of the geometric layout that is arranged on the liftout element in the ejection unit and element to be ejected or change after geometry be complementary, and need not in this process, whole ejection unit to be changed.Therefore, can faster, more flexible and simpler mode make ejection unit and different elements by this ejection unit, for example the element with the different geometries that need separate from element arrays is complementary.
In this manual, " resolution element " this statement also comprise from straight substantially element arrays eject, separate, isolation, selection and/or cutting element.These words also can be used as the synonym of " separation " at this.
Described element can be electronic component, particularly semiconductor components and devices.For example, it can be a discrete component, as resistor, transistor or like (the less combination of these elements in other words).In addition, electronic component also can be the combination of integrated circuit (being so-called IC) or optoelectronic component (as diode or laser, particularly semiconductor laser) or said elements.Element also can be configured as so-called " element pasted on surface " (SMD:surface mounted device, surface mount device).In addition, element can also be preferably also to be micro-mechanical component or the micromechanical component made from semi-conducting material (for example silicon).Element also can comprise the plate that (for example) is made of ceramic material, and these plates are at the enterprising line operate of film, are arranged to substructure with form separated from one another subsequently.In addition, described element also can be constituted by the different elements of above-mentioned discrete component.
For example, roughly straight element arrays can be made of the loose elements combination that lies on the carrier.In addition, the element of this element arrays can be connected with each other, and its implementation is that element is sticked on the shared carrier.This carrier can be configured as film, and wherein, described adhesion can realize by adhesive.In addition, but the also direct mechanical coupling of described element wherein, can be provided with the demarcation breakaway poing between the discrete component, and these are demarcated breakaway poing and can rupture when resolution element.Described element arrays can comprise components identical, also can be made of components identical fully.In addition, described element arrays also can comprise different types of components.
Substantially straight array refers to element is positioned at same plane with conventional assembly precision or positioning accuracy array.Wherein, can have deviation fully between the height of the discrete component of this array, for example less than 10%, less than 20% or less than the deviation in 30% scope.What cause this deviation can be accidental cause, also can be system's reason, is for example bent by carrier and causes.
The liftout element of described ejection unit is used for isolating an element from the said elements array.For example, this can realize by the Mechanical Contact of liftout element.Wherein, this Mechanical Contact can directly or indirectly be present between liftout element and the element.For example, the indirect contact between liftout element and the element can realize by the carrier (being placed with the carrier film of element for example) that is used for load-carrying unit.The contact zone of this class liftout element can be configured as aciculiform, seal shape or analogous shape.By using this liftout element, can accurate mechanical system " release " or " extracting " described element from straight element arrays.
In addition, described liftout element also can be configured as can between be connected on the application of force on the element to be separated.This liftout element can be configured as tuyere, and tuyere can further be configured as suction pipe or blowpipe.So just can element be fixed, it is separated with ejection unit by one or more suction pipes.Blowpipe can be by air application of force on element to be separated of discharging, so that separate described element from straight array.The power that is applied on the element to be separated can be the power of magnetic property or electrical property.
The liftout element of described ejection unit can be identical liftout element, and ejection unit also can comprise the dissimilar liftout element that (for example) is as indicated above.
Described ejection unit can have two or more liftout elements, preferably has two, three, four or five liftout elements.In addition, described ejection unit can comprise that four can be arranged to (for example) rectangle or foursquare liftout element.Described ejection unit also can comprise five liftout elements, and four liftout elements wherein can be arranged to rectangle or square, and the 5th liftout element is between these four liftout elements, on the specific center that is between these four liftout elements.
" described being separated on the liftout direction carried out, and described liftout direction is basically perpendicular to the plane of described element arrays " this explanation is relevant with the described time started of separating.That is to say that separated element leaves straight element arrays along the direction that is basically perpendicular to the plane of described array.After element leaves the plane of described array, can further move along direction substantially arbitrarily.
" vertical substantially " referred to herein as, and the direction of motion of resolution element is basically perpendicular to the plane of described element arrays.The described direction of motion can have greater than 60 degree, greater than 70 degree or greater than 80 angles of spending with respect to the plane of described element arrays.
When the liftout element of described ejection unit is successfully isolated element by its direct mechanical effect from straight element arrays, just illustrate that described liftout element is in the service position.For example, described mechanism can realize by the direct mechanical contact of these liftout elements, perhaps realizes by blow out or suck air from the liftout element.Wherein, can only make a liftout element in a plurality of liftout elements that are present in the described ejection unit be in the service position.In addition, also can make a plurality of (for example two, three, four, more than five or five) liftout element be in the service position.Also can make all liftout elements of described ejection unit all be in the service position.
Need to prove that herein what " service position " this notion related to is the position of liftout element in ejection unit inside.Whether the liftout element is treated resolution element really and is produced mechanism, depends on that also ejection unit is with respect to element arrays and/or with respect to the to be separated or position of resolution element.
In these declaratives scope, the liftout elements combination refers to each liftout element on the service position that is in described ejection unit inside.As indicated above, this liftout elements combination can be made up of one of described ejection unit, a plurality of or whole liftout element.Specific can be two, three, four or five liftout elements.That is to say that the liftout elements combination is those liftout elements that really element produced mechanism in the process of resolution element in the liftout element of described ejection unit.
The first and second liftout elements combination of the declaratives indication of front can partly have identical liftout element.In addition, these two liftout elements combination can have the liftout element of equal number or the liftout element of varying number.The liftout element of the first and second liftout elements combination can be identical, and only have different space layouts.
When the position of the single liftout element of two liftout elements combination was incomplete same, two liftout elements combination had different space layouts.For example, when the liftout number of elements of two liftout elements combination not simultaneously, different space layouts will appear.When there is space displacement at least one the liftout element in the first liftout elements combination between the corresponding liftout element in respect to the second liftout elements combination, also different space layouts can appear.
Described ejection unit also can be configured as, and the liftout element of described ejection unit comprises mechanical couplings liftout element group.The mechanical couplings of this mechanical couplings liftout element group is configured as, and all liftout elements of liftout element group can enter or leave the service position in the transfer process of switching mechanism.In addition, described mechanical couplings also can be configured as, and the liftout element of liftout element group can only enter or leave the service position together.
Described ejection unit also can comprise the such mechanical couplings liftout element of many groups, for example two groups, three groups, four groups or more.A mechanical couplings liftout element group can comprise the liftout element of two or more (for example three, four or five).
In addition, described ejection unit also can comprise one or more liftout elements that are not subordinated to mechanical couplings liftout element group, promptly not with the liftout element of other liftout element mechanical couplings.
In these execution mode scopes, the mobile machine coupling that mechanical couplings refers to the rigid mechanical coupling or realizes by one or more movable joints.In the case, the mode that mechanical liftout element can be taked to relatively move and/or to rotate is installed, and perhaps is connected with each other by one or more swivel joints.Swivel joint can be configured as hinge, swivel joint, rotating shaft or ball-joint.
The advantage of this implementation is to make described ejection unit to be converted to further acceleration and simplification between the first and second liftout elements combination, thereby described ejection unit is complementary with the geometry in particular of element at faster speed.Certain criteria geometry or basic geometry can be set in mechanical couplings liftout element group, and described standard geometrical shapes or basic geometry can enter or leave the service position in the transfer process of switching mechanism.
In addition, the first and second liftout elements combination can have identical liftout element, and switching mechanism is configured as the space layout that is used to change these liftout elements.The change of space layout can be made of one of liftout element group, position change a plurality of or all liftout elements.This implementation of the present invention can improve and different elements between matching because this implementation allows only to change the corresponding spacing of liftout element under the situation that the liftout number of elements remains unchanged.
According to a kind of favourable implementation of the present invention, illustrated liftout element group also can be configured as the liftout element group that machinery links to each other simultaneously in the last paragraph.Can realize special fundamental figure in liftout element group in this way, subsequently, liftout element group can and on the spot enter or leave the service position together.Also can make the coupling between the different situations of described ejection unit and element obtain simplifying and quickening whereby.
By following manner the coupling between described ejection unit and the different elements is further quickened, being about to described ejection unit is configured as: in the transfer process of switching mechanism, all liftout elements of the liftout element group on the service position change its relative position simultaneously.Also described ejection unit can be configured as herein, can keep under the described geometric substantially situation, in transfer process, change the relative spacing of liftout element.If the liftout arrangements of elements becomes rectangle or square, just can be under length-width ratio keep constant situation by described implementation, increase or dwindle square or rectangle by transfer process.
Described switching mechanism can comprise gear drive and/or friction gearing and/or epicyclic train, and it is used for changing relatively the position of at least one liftout element.In addition, for changing the position of at least one liftout element relatively, described switching mechanism can have and is used for the guiding device of pin being guided in groove inside.
According to another favourable implementation, the transmission to the liftout element in a mechanical couplings liftout element group can realize by the transmission mechanism of same type.Wherein, can carry out transmission to single, a plurality of or all the liftout elements in the liftout element group.This implementation has been simplified the structure and/or the preparation of described ejection unit, or has reduced the structure and/or the preparation cost of described ejection unit.
In addition, described switching mechanism also can have a locking device, is used to lock at least one liftout element at diverse location.Described locking device is specific to be configured as detachable locking device.Simply but mode makes described ejection unit have matching whereby, and has higher stability after coupling is finished.Described switching mechanism is specific to comprise the locking device of the diverse location that is used to lock at least one liftout element.Both can reliably one or more liftout elements be locked in the service position in this way, simply mode wherein, can also be locked in the liftout element such passive position by locking device away from the service position again.Described locking device can be configured as the bayonet type locking device or realize in the mode in the protuberance embedded groove.
According to a kind of favourable implementation of the present invention, described ejection unit is rotatably mounted around first of being basically parallel to the liftout direction, and installs movably along second of being basically parallel to the liftout direction.By moving of carrying out along second, can from described array, eject behind the element or after the liftout process finishes, make ejection unit be back to standby position.Wherein, described first and described second can be same axle basically.
In addition, by ejection unit around first rotation of being carried out and/or ejection unit along second moving of being carried out, can drive described switching mechanism.This can simplify the conversion of described ejection unit between different liftout element groups.Wherein, described driving can be moved by one or many rotation or one or many and be realized.In addition, described driving also can realize by rotation and the combination of moving.
Can very effectively control described switching mechanism by this implementation, because the rotating driving device of ejection unit and mobile drive deivce not only can be used for realizing truly the liftout process and the location matches of ejection unit, also can be used for switching mechanism is handled.Can save one or more discrete external driver device that are used for switching mechanism by this implementation, simplify the mechanical structure of ejection unit and reduce its cost.
In addition, described ejection unit can be configured as, when described ejection unit is in first state, by rotation around first, make the liftout element group that is used for resolution element under the invariable situation of space layout, rotate maybe and can rotate, when described ejection unit is in second state, transition components is driven maybe and can drive transition components by rotation around first.Can make the rotating driving device of ejection unit have two kinds of effects relevant in this way with the ejection unit state.Under first state, generally speaking described rotating driving device can cause the rotation of ejection unit, and under second state, described rotating driving device can make the space layout of liftout element group change.
Conversion between two states can realize by mechanical mechanism or electric mechanism.According to a kind of preferred implementation, the conversion of ejection unit between first state and second state realizes along second move by ejection unit.The advantage of this implementation is that the conversion of ejection unit between two states also is or also can realizes by the drive unit that is provided with for resolution element from straight element arrays.In the case, except the drive unit that had been provided with already for the operate as normal that realizes ejection unit, drive the switching mechanism aspect and just need not to be provided with again other external driver device.This can simplify the structure of this adjustable ejection unit, thereby reduces its cost.
Above-mentioned purpose is also reached by a kind of method of separating one or more elements by above-mentioned ejection unit from element arrays, and wherein, described method comprises the following steps:
A) described ejection unit is converted to the second liftout elements combination from the first liftout elements combination;
B), from described element arrays, separate an element by the motion of described ejection unit on the liftout direction.
Described method also can be provided with following steps after step b):
C) described ejection unit and/or described element arrays are moved on the direction on the plane that is parallel to described element arrays; Continue implementation step b subsequently).
Wherein, can implement by job step b always) and job step c) circulation formed, till the element of from described element arrays, isolating required element or required same type.Can come into effect described method from step a) once more subsequently.
Can from one or more element arrays, separate different types of components in this way, wherein, the coupling between ejection unit and the dissimilar element compared to existing technology, speed is accelerated to some extent, complexity reduces to some extent.
Described method also can further be configured as, implementation step b) time, ejection unit integral body is rotated.Can make whereby between the profile of the position of the liftout element (liftout element group) on the service position and element to be separated and the position and reach optimum Match.
In addition, above-mentioned purpose is also reached from the device of element arrays resolution element by a kind of being used for, and it comprises:
An ejection unit that carries out construction according to the declaratives of front;
A device that is used for fixing described element arrays;
One is used to device that described element arrays is moved.
For example, this device can be configured as so-called " wafer dispenser ", can be used for the wiring harness plate in automatic placement equipment or be used for the general assembly (for example assembling of " lead frame " or like) of semiconductor element.
This device also can have flip-chip assembling used " transmitting head ".Can choose by this transmission head and to get the element that is separated by ejection unit, and transfer them to other assembly heads and be for further processing the further processing in for example above-mentioned range of application.
Description of drawings
By accompanying drawing the present invention is carried out exemplary illustrated below, wherein:
Fig. 1 a, 1b, 1c are the schematic diagram of the possible configuration of exemplary ejection unit;
Fig. 2 is the embodiment with ejection unit of three liftout elements;
Fig. 3 a, 3b are the embodiment of governor motion;
Fig. 4 a, 4b are second embodiment of governor motion;
Fig. 5 a, 5b are the 3rd embodiment of governor motion;
Fig. 6 a, 6b, the embodiment of 6c for being undertaken by locking device highly regulating;
Fig. 7 is other possible configurations of liftout head shown in Figure 2;
Fig. 8 is in transition status for liftout head shown in Figure 2; And
Fig. 9 is other possibilities embodiment of ejection unit.
Embodiment
Fig. 1 shows an embodiment of ejection unit 10 in schematic form, and ejection unit 10 is used for ejecting semiconductor chip 70 from wafer 72, and wafer 72 is bonded on the film 74, is disassembled (being generally saw) and becomes single chip 70.Wherein, semiconductor chip 70 is " element " of the declaratives indication of front, and the wafer 72 on the film 74 is " the straight substantially element arrays " of the declaratives indication of front.What Fig. 1 a to Fig. 1 c showed is the possible configuration of ejection unit 10.
Direction illustrative examples used in the accompanying drawing description is as " level " or " vertically ", and is relevant with the diagramatic content in the respective drawings respectively.
In Fig. 1 a, needle point 12,14 is in the liftout position, and this liftout position uses the horizontal dotted line 90 that flushes with the needle point height of material pushing needle 12,14 to represent in Fig. 1.The moving both vertically of ejection unit 10 contacts material pushing needle 12,14 and film 74 and top chip 70 thereof, chip 70 is ejected wafer 72 in the process that moves both vertically that makes progress, chosen by the assembly head of grasping device, so-called transmission head or automatic assembling machine and get or can be chosen and get.After chip 70 was chosen and got, liftout head 10 came back to the position shown in Fig. 1 a, and in this process, the film 74 among the described embodiment separates with chip 70, so just chip 70 can be transported out of wafer 72.
The horizontal level of left side material pushing needle 12 in Fig. 1 a represented with vertical dotted line 82.The position of middle material pushing needle 20 represents that with lines 80 position of right side material pushing needle 14 is represented with lines 84.
What Fig. 1 b showed is other configurations of liftout head 10, and wherein, the larger sized chip 76 of liftout head and other wafers 78 is complementary.For the mechanical load of optimizing chip 76 and/or for realizing more reliable liftout, left side material pushing needle 12 is 82 positions 86 that move to the more lateral from the position, and right side material pushing needle 14 is 84 positions 88 that move to the more lateral from the position.In the case, the corner angle or the edge of the more close chip 76 of these material pushing needle.
What Fig. 1 c showed is other possible configurations of liftout head 10.Wherein, middle material pushing needle 20 moves to the service position from the passive position shown in Fig. 1 a and Fig. 1 b equally, and in Fig. 1 c, this point can be found out equally with the height of dotted line 90 flushes from the needle point of middle material pushing needle.In the case, when liftout head 10 rose, these three material pushing needle 12,14,20 all can contact with carrier film 79 and chip 76.Can further reduce the suffered mechanical load of chip 76 whereby.
When used " liftout element group " of the declaratives of annotating the front and notions such as " the liftout elements combination on the service position ", also it should be noted that, in Fig. 1, left side and right side material pushing needle 12,14 are subordinated to one group of (mechanical couplings) liftout element, and middle material pushing needle 20 is subordinated to second group of (mechanical couplings) liftout element.In addition, in Fig. 1 a and Fig. 1 b, the liftout element group that outside material pushing needle 12,14 constitutes on the service position, and in Fig. 1 c, these three material pushing needle 12,14,20 constitute the liftout element group on the service position together.
That Fig. 2 shows is convertible or the embodiment of scalable liftout head 110 (for example being used to provide the liftout head to material unit of semiconductor chip).Liftout head 110 comprises two outside liftout elements 112,114 with aciculiform protuberance 113,115, can eject chip 170 from wafer 172 by these aciculiform protuberances, and wafer 172 is positioned on the carrier film 174.Liftout head 110 herein be ejection unit a kind of of the declaratives indication of front may construction mode, chip 170 and wafer 172 element and element arrays corresponding to the declaratives indication of front.Liftout element 120 in the middle of liftout head 110 also comprises, it has aciculiform protuberance 122 and a plurality of different supporting members 124,125,126 and 128, and liftout needle point 122 was regulated different height in the middle of these supporting members were used to.In Fig. 2, outside liftout element 112 and 114 is in the service position, when liftout head 110 is upwards done vertical moving, and the needle point of outside material pushing needle 113, the 115 jack-up chip 170 that can make progress. Middle liftout element 120 and 122 of material pushing needle thereof are on the passive position of liftout head 110 inside.
Fig. 2 has also shown the external fixation device 154 with protuberance 150, and protuberance 150 stretches into the inside of liftout head 110, and has a seal shape those widened sections 152 herein.Liftout head 110 can move on vertical direction 160 with respect to this seal shape those widened sections 150 and fixture 154.Seal shape protuberance 152 can change in this motion process with respect to the relative position of (for example) middle liftout element 120 or inboard holding element 140.
For switching mechanism (hereinafter will carry out exemplary illustrated to it by Fig. 7 and Fig. 8) is handled, can reduce liftout head 110, the top side of seal shape protuberance 152 is contacted with the bottom side of middle material pushing needle 120.For by this contact by seal shape protuberance 152 in the middle of material pushing needle 120 fix the rotation of liftout head 110 remainders (for example with respect to), the bottom side of the top side of seal shape protuberance 152 and middle material pushing needle 120 can be configured as that friction is connected or claw type is coupled in the part at least.In addition, for handling switching mechanism, the liftout head 110 that also can raise makes the bottom side of seal shape protuberance 152 contact with inboard holding element 140.In the case, the contact zone of seal shape protuberance 152 and inboard holding element 140 also at least the part be configured as that friction is connected or claw type is coupled so that fix by 152 pairs of inboard holding elements 140 of seal shape protuberance.
Under the situation that adopts configuration as shown in Figure 2, vertically during 160 rising liftout heads 110, the film 174 of chip 170 below it vertically raises with respect to wafer 172 under the effect of left side material pushing needle 113 and right side material pushing needle 115, gets so that chosen by grasping device, the assembly head that transmits head or automatic assembling machine on this position.Can make liftout head 110 come back to position shown in Figure 2 subsequently, in this process, film 174 separates with chip 170.Just can be moved further chip 170 subsequently by getting material unit.
Supporting member 146, the 148 coefficient protuberances 124,125,126 and 128 of liftout element 120 and middle holding unit 140 in the middle of first switching mechanism comprises.When the top of middle liftout element 120 protuberance 124,125 was resisted against on the protuberance 146,148, middle liftout element 120 was in passive position, and 113,115 of outside liftout element 112,114 and material pushing needle thereof are in the service position.Be resisted against on the supporting member 146 and work as (for example middle liftout element 120 carries out composite type and promotes-rotatablely move the back) protuberance 126, when not making illustrated protuberance among a Fig. 2 and being resisted against on the supporting member 148, the needle point of outside material pushing needle 113,115 and the needle point of middle material pushing needle 120 all are in sustained height.In the case, outside liftout element 112,114 and middle liftout element 120 all are in the service position, thereby constitute the liftout elements combination on the service position.
When middle liftout element 120 (for example mode that promotes-rotatablely move with composite type) further raises, make protuberance 128 be resisted against on the supporting member 146, when not making illustrated protuberance among a Fig. 2 and being resisted against on the supporting member 148, the needle point of the material pushing needle 122 of middle liftout element 120 will be given prominence on the material pushing needle 113,115 of outside liftout element 112,114.In the case, have only middle liftout element 120 to be in the service position, 112,114 of outside liftout elements are in passive position.
Hereinafter also will get in touch Fig. 7 and Fig. 6 describes the working method of this first switching mechanism and other construction modes.
Second switching mechanism of ejection unit 110 can cause the change in location of outside liftout element 112,114.This switching mechanism comprises inboard holding element 140 and adopts groove 116, the 117 coefficient pins 142,144 of the outside liftout element 112,114 of rotatable mounting means.
Hereinafter will get in touch Fig. 3 and Fig. 8 is elaborated to the principle and the working method of this second switching mechanism.
In the embodiment shown in Figure 2, outside liftout element 112,114 constitutes a mechanical couplings liftout element group by outside holding element 130 mechanical couplings.Middle liftout element 120 constitutes other irrelevant therewith liftout element groups.
That ensuing three accompanying drawings show is the embodiment of switching mechanism, and these switching mechanisms are used to change the space layout of corresponding liftout element.
What Fig. 3 b showed is the residing state after the space layout that makes liftout element 212 by transfer process changes of the switching mechanism 200 shown in Fig. 3 a.In the present embodiment, the transfer process of being implemented is equivalent to the rotation that lateral branch carrier ring 230 carries out with respect to medial branch carrier ring 240.Because pin 244 is inserted in the groove 216 of liftout element 212, the material pushing needle 213 of liftout element 212 is outwards moved, and this can increase the relative spacing of material pushing needle.In the present embodiment, only can change relative spacing between all material pushing needle 213 by converting motion, wherein, the basic square layout of material pushing needle 213 remains unchanged.Whereby can open-and-shut mode make the layout of material pushing needle 213 and different size, be foursquare element substantially and be complementary.
What Fig. 4 a showed is another possibility of switching mechanism 300.Identical with previous embodiment, embodiment shown here also comprises four liftout elements 312 that have material pushing needle 313, wherein, for clarity sake, only is liftout element 312 and reference symbol of corresponding details mark in the accompanying drawing.
What Fig. 4 b showed is the residing state after implementing transfer process of the switching mechanism 300 shown in Fig. 4 a, and this transfer process makes outside ring gear 330 rotate counterclockwise with respect to support ring 340 exactly.In this process, the material pushing needle 313 of liftout element 312 still outwards moves, and wherein, the basic square layout of material pushing needle 313 remains unchanged.Whereby equally can be simply and utmost point effective and efficient manner make liftout element 312 and different size, be foursquare element substantially and be complementary.
Those liftout elements 212 shown in Figure 3 and those liftout elements 312 shown in Figure 4 all can constitute the component groups of a mechanical couplings.
That Fig. 5 shows is another embodiment of switching mechanism 400, wherein, for clarity sake, truly liftout element is not illustrated herein.Four mechanisms with same function of same existence for clarity sake, have equally also only marked reference symbol for one of them mechanism in the accompanying drawing among this embodiment.
What Fig. 5 a showed is the exploded view of switching mechanism 400.Switching mechanism 400 is made of the preceding slotted disk 440 that has four microscler curved grooves 442.In addition, this mechanism also is made of second slotted disk 450 that has four microscler curved grooves 452, the back of slotted disk before second slotted disk is positioned at.Wherein, the groove 442 of preceding slotted disk 440 is corresponding one by one each other with the groove 452 of back slotted disk 450.The bending direction of the groove 442,452 that corresponds to each other is opposite.
What Fig. 5 b showed is the front view of having assembled the switching mechanism that finishes, and wherein, back slotted disk 450 is covered by preceding slotted disk 440.The groove 442 and 452 of preceding slotted disk 440 and back slotted disk 450 takes to form the arrangement of circular open 410, and the material pushing needle of liftout element can be passed from these openings, projects upwards the outside in switching mechanism.By relatively rotating slotted disk 440,450, circular open 410 is outwards moved, it is same outwards mobile that this can make Fig. 5 b not make material pushing needle illustrated, that pass from these openings.But same in this way a kind of simple switching mechanism of construction can make the liftout element be foursquare layout substantially and waits that the specification that ejects element is complementary by this switching mechanism.
What Fig. 6 showed is another possibility that is used for the switching mechanism 500 of liftout element 520.Fig. 3, Fig. 4 and embodiment shown in Figure 5 are used to change the horizontal arrangement of liftout element, and 500 of switching mechanisms shown in Figure 6 are mainly used in the upright position that changes the liftout element.
What Fig. 6 a showed is the liftout element 520 with aciculiform protuberance 522, can vertically eject discrete component by this aciculiform protuberance from element arrays.Liftout element 520 comprises steady pin 524, and this steady pin is resisted against in the following groove 546 of retaining ring 540.For locking the position of liftout element 520, there is spring 550 between the base plate 526 of the lower edge of retaining ring 540 and liftout element.
What Fig. 6 b showed is that the residing state in the first conversion substep back was being implemented in the switching mechanism shown in Fig. 6 a, and this first conversion substep is exactly to overcome the elastic force effect of spring 550 with respect to the mobile vertically upward conversion element of support ring 540.The current amplitude that moves has reached the degree of the steady pin 524 of liftout element 520 being shifted onto the upper limb top of retaining ring 540.
What Fig. 6 c showed is that two other residing states in conversion substep back were being implemented in the switching mechanism shown in Fig. 6 b.The first conversion substep wherein is liftout element 520 to be revolved turn 90 degrees, thereby makes the steady pin 524 of liftout element 520 arrive the top of the last groove 547 of retaining rings.Another conversion substep is to reduce liftout element 520 with respect to support ring, is resisted against in the top holddown groove 547 until steady pin 524.So far, the liftout element is locked on this upright position by the top holddown groove.This locking wherein, by the acting in conjunction of groove 547 and spring 550, can realize especially effectively locking on the one hand by groove 547, realize by spring 550 on the other hand.
Causing the conversion of switching mechanism 500 from the state-transition shown in Fig. 6 a to the state shown in Fig. 6 c to divide step sequence is the example of " transfer process " of the declaratives indication of front.
What Fig. 7 showed is that liftout element 110 shown in Figure 2 was carrying out handling the residing state in back to first switching mechanism, and the upright position of liftout element 120 had above been got in touch Fig. 2 it was carried out explanation in the middle of first switching mechanism was used to change.Different with Fig. 2 is, does not treat to eject chip and affiliated wafer illustrates herein.
From liftout head 110 state as shown in Figure 2, can realize state shown in Figure 7 by following switch process:
-reduce liftout head 110, touch up to the seal shape protuberance 152 that is fixed on component external 150 till the bottom side of middle liftout element 120.Liftout element 120 obtains fixing with respect to lateral branch fixed bearing element 130,140 in the middle of making whereby.
-by further reduction liftout head 110 and supporting member 130,140 is rotated simultaneously jointly, can realize state shown in Figure 7, promptly the protuberance 126,127 of liftout element 120 is resisted against on the supporting member 146,148 of medial branch carrier ring 140.
-liftout head 110 subsequently once more can move up, in the case, on the position shown in the new upright position of middle liftout element 120 is locked in, on this position, the middle liftout element 120 still needle point 113,115,122 of outside liftout element 112,114 all is positioned at same plane, that is middle liftout element 120 and outside liftout element 112,114 all are in the service position, thereby constitute the liftout elements combination on the service position.
Except that Fig. 2, Fig. 7 and execution mode shown in Figure 8, also can use as shown in Figure 6 groove and/or the situation of spring mechanism under by the locking device locking in the middle of the upright position of liftout element 120.Specific said mechanism can being combined, lock to be similar to mode shown in Figure 6.
By continuing to implement above-mentioned transfer process with corresponding manner, can further reach Fig. 7 and not make illustrated state, promptly the protuberance 128 of middle liftout element 120 is resisted against on the supporting member 146 of inboard holding element 140.In the case, the needle point 122 of middle liftout element 120 is positioned at the top of the needle point 113,115 of outside liftout element 112,114, is on the service position.The needle point 113,115 of outside liftout element 112,114 is in passive position, does not participate in the liftout process under this state of liftout head 110.In the case, the liftout elements combination of having only middle liftout element 120 to constitute on the service position.
The liftout head 110 shown in Figure 2 residing state when second switching mechanism is handled that is still that Fig. 8 shows has above been got in touch Fig. 2 explanation had been carried out in this second switching mechanism.Wherein, mobile vertically upward liftout head 110 is till the seal shape protuberance 152 that is fixed on component external 150 touches the upper limb of medial branch carrier ring 140.Make medial branch carrier ring 140 obtain fixing whereby with respect to lateral branch carrier ring 130.By rotating lateral branch carrier ring 130, make the motion of rotating shaft 132,134 generations of lateral branch carrier ring 130 with respect to the pin 142,144 of medial branch carrier ring 140.This makes outside liftout element 112,114 that axle 132,134 rotations of being carried out around the lateral branch carrier ring take place under the guiding of the groove on the outside liftout element 112,114 116,117.This mechanism and shown in Figure 3 being used to are regulated and are also had comparativity between the governor motion of liftout position of components.Outside liftout element 112,114 in this way and the athletic meeting that produces changes the spacing of its material pushing needle 113,115, thereby the profile after liftout head 110 and element to be ejected change is complementary.
Fig. 9 shows is another embodiment of ejection unit 610 of the declaratives indication of front.Ejection unit 610 comprises five concentric support rings 620,630,640,650,660, wherein, four lateral branch carrier rings 620,630,640,650 respectively have four liftout needle points 622,632,642,652, for clarity sake, only marked reference symbol among Fig. 9 for one in these four liftout needle points.Innermost support ring 660 has a liftout needle point 662.Support ring 620,630,640,650,660 can carry out telescopic moving independently of one another.Under state shown in Figure 9, lateral branch carrier ring 620 and innermost support ring 660 are in the service position, and wherein, the needle point 622,662 of these support rings is in the same plane, will wait to eject the element top from element arrays in the liftout process.By support ring 620,630,640,650 is relatively moved accordingly, can make one, two or more liftout elements that are configured as band needle point support ring be in the service position.
The present invention has illustrated a kind of by using the ejection unit of liftout element resolution element from roughly straight element arrays, wherein, the geometric layout that is in the single or multiple liftout elements of the quantity of liftout element of service position and/or described ejection unit is variable.Can simplify the coupling between the element of described ejection unit and different geometric shapes and different size in this way.
Claims (17)
1. an ejection unit (10,110,610) is used for separating those elements (70,76,170) from straight substantially element arrays (72,78,172), and described ejection unit comprises:
Some liftout elements (12,14,20,112,114,120,212,312,520,620,630,640,650,660), construction of described liftout element and layout maybe can be arranged to be used for separate one of them element (70,76,170) from described element arrays (72,78,172)
Wherein, described being separated on the liftout direction carried out, and described liftout direction is basically perpendicular to the plane of described element arrays (72,78,172), and
The liftout element that is used to separate described element (70,76,170) in the described liftout element (12,14,20,112,114,120,212,312,520,620,630,640,650,660) is on the inner service position of described ejection unit (10,110,610),
It is characterized in that,
Described ejection unit (10,110,610) also comprises a switching mechanism (200,300,400,500), can be by described switching mechanism with the first liftout elements combination (12,14,20,112,114 on the described service position, 120,212,312,520,620,630,640,650,660) be transformed into the second liftout elements combination (12,14 on the described service position, 20,112,114,120,212,312,520,620,630,640,650,660), the wherein said first liftout elements combination and described second is expected elements combination (12,14,20,112,114,120,212,312,520,620,630,640,650,660) those liftout elements (12,14,20,112,114 that comprised, 120,212,312,520,620,630,640,650,660) has different space layouts
Described ejection unit (10,110,610) rotatably supports around first of being basically parallel to described liftout direction, and installs movably along second (160) that are basically parallel to described liftout direction.
2. ejection unit according to claim 1 is characterized in that,
Described some liftout elements (12,14,20,112,114,120,212,312,520,620,630,640,650,660) comprise one group of liftout element (12,14,20,112,114,120,212,312,520,620,630,640,650,660), described liftout element group mechanical couplings, and the mode of its mechanical couplings makes whole liftout element group (12,14,20,112,114,120,212,312,520,620,630,640,650,660) can in the transfer process of described switching mechanism (200,300,400,500), enter and/or leave described service position.
3. ejection unit according to claim 1 and 2 is characterized in that,
Described first liftout elements combination and the described second liftout elements combination (12,14,20,112,114,120,212,312,520,620,630,640,650,660) has identical liftout element (12,14,20,112,114,120,212,312,520,620,630,640,650,660), described switching mechanism (200,300,400,500) be configured as and be used to change described those liftout elements (12,14,20,112,114,120,212,312,520,620,630,640,650,660) space layout.
4. ejection unit according to claim 3 is characterized in that,
Described liftout element group (12,14,20,112,114,120,212,312,520,620,630,640,650,660) constitutes the liftout element group (12,14,20,112,114,120,212,312,520,620,630,640,650,660) that a machinery links to each other each other.
5. ejection unit according to claim 3 is characterized in that,
In the transfer process of described switching mechanism (200,300,400,500), described liftout elements combination (12,14,20,112,114,120,212,312,520,620,630,640,650,660) all liftout elements (12,14,20,112,114,120,212,312,520,620,630,640,650,660) change its relative position simultaneously.
6. according to the described ejection unit of each claim in claim 1 or 2, it is characterized in that,
Described switching mechanism (200,300,400,500) comprises gear drive and/or friction gearing (330,346) and/or epicyclic train, it is used for changing relatively at least one liftout element (12,14,20,112,114,120,212,312,520,620,630,640,650,660) position.
7. according to the described ejection unit of each claim in claim 1 or 2, it is characterized in that,
Described switching mechanism (200,300,400,500) comprises and being used at groove (116,117,216) the inner guiding device that a pin (142,144,244) is guided, described guiding device is used for changing relatively at least one liftout element (12,14,20,112,114,120,212,312,520,620,630,640,650,660) position.
8. according to the described ejection unit of each claim in the claim 1 to 2, it is characterized in that,
Described switching mechanism (200,300,400,500) comprises a locking device, be used to lock at least one liftout element (12,14,20,112,114,120,212,312,520,620,630,640,650,660) on different positions, described locking device is used in particular for the locking of the diverse location on described liftout direction.
9. ejection unit according to claim 1 is characterized in that,
Described first is same axle with described second (160).
10. pre-material unit according to claim 1 is characterized in that,
The motion of being done along described second (160) by described ejection unit (10,110,610) separates described element (70,76,170) from described element arrays (72,78,172).
11. ejection unit according to claim 1 is characterized in that,
By described ejection unit (10,110,610) around described first rotation of being carried out and/or described ejection unit (10,110,610) along moving that described second (160) are carried out, described switching mechanism (200,300,400,500) is driven.
12. ejection unit according to claim 1 is characterized in that,
When described ejection unit (10,110,610) when being in first state, by drive the liftout element group (12 that is used for or can be used for separating described element (70,76,170) around described first rotation, 14,20,112,114,120,212,312,520,620,630,640,650,660) under the invariable situation of space layout, rotate maybe and can rotate, when described ejection unit (10,110,610) when being in second state, by around described first rotation to described switching mechanism (200,300,400,500) drive.
13. ejection unit according to claim 12 is characterized in that,
The motion of being done along described second (160) by described ejection unit (10,110,610) is implemented in the conversion between second state of first state of described ejection unit (10,110,610) and described ejection unit (10,110,610).
14. a method of separating one or more elements (70,76,170) by the described ejection unit of one of claim 1 to 13 (10,110,610) from straight substantially element arrays (72,78,172), described method comprises the following steps:
A) with described ejection unit (10,110,610) from the described first liftout elements combination (12,14,20,112,114,120,212,312,520,620,630,640,650,660) be converted into the described second liftout elements combination (12,14,20,112,114,120,212,312,520,620,630,640,650,660);
B), from described element arrays (72,78,172), separate an element (70,76,170) by the motion of described ejection unit (10,110,610) on described liftout direction; And
C) described ejection unit (10,110,610) and/or described element arrays (72,78,172) are moved on the direction on the plane that is parallel to described element arrays; Continue implementation step b subsequently).
15. method according to claim 14 is characterized in that,
Implementation step b) time, described ejection unit (10,110,610) is rotated at the described element of separation (70,76,170).
16. be used for the device of resolution element (70,76,170) from element arrays (72,78,172), described device comprises:
One according to the described ejection unit of one of claim 1 to 13;
A device that is used for fixing described element arrays (72,78,172);
A device that is used to make described element arrays (72,78,172) to move.
17. device according to claim 16 is characterized in that,
Described device also comprises the transmission head, and described transmission head is configured as and is used to choose the element of getting by described ejection unit (10,110,610) separation (70,76,170).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006025361A DE102006025361A1 (en) | 2006-05-31 | 2006-05-31 | Ejection unit for separating components from a substantially planar arrangement of components |
| DE102006025361.2 | 2006-05-31 | ||
| PCT/EP2007/052297 WO2007137888A1 (en) | 2006-05-31 | 2007-03-12 | Ejection unit for removing components from an essentially planar arrangement of components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101461035A CN101461035A (en) | 2009-06-17 |
| CN101461035B true CN101461035B (en) | 2011-08-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800201742A Expired - Fee Related CN101461035B (en) | 2006-05-31 | 2007-03-12 | Ejector unit for separating components from an essentially flat array of components |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101332236B1 (en) |
| CN (1) | CN101461035B (en) |
| DE (1) | DE102006025361A1 (en) |
| WO (1) | WO2007137888A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009035099B4 (en) | 2009-07-29 | 2017-09-28 | Asm Assembly Systems Gmbh & Co. Kg | Device and method for lifting components from a carrier |
| DE102011017218B4 (en) * | 2011-04-15 | 2018-10-31 | Mühlbauer Gmbh & Co. Kg | Apparatus and method for transferring electronic components from a first carrier to a second carrier |
| DE102013200347A1 (en) * | 2013-01-11 | 2014-07-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | transmission device |
| DE102018006760A1 (en) | 2018-08-27 | 2020-02-27 | Mühlbauer Gmbh & Co. Kg | Inspection when transferring electronic components from a first to a second carrier |
| DE102018006771B4 (en) | 2018-08-27 | 2022-09-08 | Mühlbauer Gmbh & Co. Kg | Device and method for transferring electronic components from a first to a second carrier |
| DE102018125682B4 (en) * | 2018-10-16 | 2023-01-19 | Asm Assembly Systems Gmbh & Co. Kg | Ejector device and method for assisting detachment of an electrical component arranged on a holding film |
| CN113130372A (en) * | 2020-01-14 | 2021-07-16 | 江苏长电科技股份有限公司 | Thimble device |
| DE102020001439B3 (en) | 2020-02-21 | 2021-06-10 | Mühlbauer Gmbh & Co. Kg | Apparatus and method for transferring electronic components from a first to a second carrier |
| DE102020005484A1 (en) | 2020-09-07 | 2022-03-10 | Mühlbauer Gmbh & Co. Kg | Devices and methods for operating at least two tools |
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| US4907790A (en) * | 1987-12-15 | 1990-03-13 | Kabushiki Kaisha Shinkawa | Pellet-lifting apparatus |
| US6386815B1 (en) * | 1999-01-20 | 2002-05-14 | Nec Corporation | Pick-up apparatus for semiconductor chips |
| CN1663024A (en) * | 2002-06-26 | 2005-08-31 | 西门子公司 | Device for picking ICs from a wafer |
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| JP3313121B2 (en) * | 1991-03-20 | 2002-08-12 | 松下電器産業株式会社 | Slender chip feeder |
| DE59204509D1 (en) * | 1992-04-13 | 1996-01-11 | Tresky Dr Ing Miroslav | Ejection device for separating a chip from an adhesive carrier. |
| JPH10189690A (en) * | 1996-12-26 | 1998-07-21 | Hitachi Ltd | Pick-up device and method of semiconductor chip |
| KR200151979Y1 (en) | 1997-02-04 | 1999-07-15 | 구본준 | Chip ejecting apparatus of chip bonder |
| DE10046899A1 (en) * | 2000-09-21 | 2002-04-18 | Siemens Ag | Chip feeder and method for feeding semiconductor chips |
| JP4021614B2 (en) * | 2000-12-11 | 2007-12-12 | 株式会社東芝 | Semiconductor element pickup jig, semiconductor element pickup device, semiconductor element pickup method, semiconductor device manufacturing method, and semiconductor device manufacturing apparatus |
| DE10349847B3 (en) * | 2003-10-25 | 2005-05-25 | Mühlbauer Ag | Positioning device and method for the transmission of electronic components |
| US20050274457A1 (en) * | 2004-05-28 | 2005-12-15 | Asm Assembly Automation Ltd. | Peeling device for chip detachment |
-
2006
- 2006-05-31 DE DE102006025361A patent/DE102006025361A1/en not_active Ceased
-
2007
- 2007-03-12 CN CN2007800201742A patent/CN101461035B/en not_active Expired - Fee Related
- 2007-03-12 WO PCT/EP2007/052297 patent/WO2007137888A1/en active Application Filing
- 2007-03-12 KR KR1020087032164A patent/KR101332236B1/en active IP Right Grant
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4907790A (en) * | 1987-12-15 | 1990-03-13 | Kabushiki Kaisha Shinkawa | Pellet-lifting apparatus |
| US6386815B1 (en) * | 1999-01-20 | 2002-05-14 | Nec Corporation | Pick-up apparatus for semiconductor chips |
| CN1663024A (en) * | 2002-06-26 | 2005-08-31 | 西门子公司 | Device for picking ICs from a wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102006025361A1 (en) | 2007-12-06 |
| KR101332236B1 (en) | 2013-11-25 |
| WO2007137888A1 (en) | 2007-12-06 |
| CN101461035A (en) | 2009-06-17 |
| KR20090018682A (en) | 2009-02-20 |
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