CN101534608B - Manufacturing method of flexible circuit board - Google Patents
Manufacturing method of flexible circuit board Download PDFInfo
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- CN101534608B CN101534608B CN2008100077830A CN200810007783A CN101534608B CN 101534608 B CN101534608 B CN 101534608B CN 2008100077830 A CN2008100077830 A CN 2008100077830A CN 200810007783 A CN200810007783 A CN 200810007783A CN 101534608 B CN101534608 B CN 101534608B
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Abstract
The invention provides a manufacturing method of flexible circuit board, which changes the double-sided thick photosensitive layer in the prior art into the layer with a thick photosensitive layer on one side and a thin photosensitive layer on the other side. Moreover, the method of respectively forming the two sides is adopted, thereby completely preventing the linkage of the photosensitive layers in the through hole and solving the problem that the dry membrane blocks the hole during the manufacturing process of the high-density flexible printed circuit board.
Description
Technical field
The present invention relates to a kind of manufacture method of flexible circuit board.
Background technology
Flexible circuit board (Flexible Printed Circuit, be called for short FPC) is to be the printed circuit that the copper-clad plate of base material is made in order to polyimides or polyester film, has the reliability of height and excellent pliability.FPC uses more and more widely owing to have special function, is becoming a most important product of copper-clad plate.
The manufacturing process of flexible print circuit is in the prior art: the dry film that comprises photosensitive layer and carrier layer in two surface pressure of flexible double face copper; On the dry film on two surfaces, paste egative film; Then, exposed in the mode that figure is arranged in two surfaces; After removing the carrier layer of two surperficial dry films, development, etching; At last, divest with the photosensitive layer of stripper solution two surfaces.
In recent years, nearly all high-tech electronic product all adopts flexible printed circuit board in a large number.Along with the miniaturization of electronic product, various electronic devices and components also all develop towards miniaturization, miniaturization direction.The FPC that carries various electronic devices and components is no exception certainly, towards the densification development, is mainly reflected in following several respects:
1, becoming more meticulous of line pattern: realized that live width, line-spacing are the small lot batch manufacture of the FPC product of 20-25 μ m;
2, the aperture of via is also more and more littler: the FPC product that has the via aperture and be 50-100 μ m has reached the level of producing in batches;
3, the precision of size control in the windowing of coverlay, all kinds of electroplating processes process.
The development trend inevitable requirement via of above-specified high density FPC is more and more littler, and product is more and more thinner, thus make in the product hole the dry film that contains photoresists more and more difficulty divest totally, cause the surface treatment in the subsequent openings to finish.
The technical scheme that overcomes the problems referred to above that present stage adopts usually is for optimizing stripping condition (as regulating temperature, pressure and concentration etc.) and optimizing stripping flow process etc.Though these two kinds of schemes all have in various degree improvement for dry film plug-hole phenomenon, but still can't settle the matter once and for all.
Summary of the invention
The objective of the invention is to overcome the shortcoming that the dry film plug-hole takes place in the preparation process of prior art high density flexible wiring board easily, a kind of preparation method that can solve the high density flexible wiring board of dry film plug-hole problem is provided.
The present inventor is through discovering, thinner thickness, plate face jump is higher, usually occur stripping in the manufacturing process of the FPC product that through hole is less easily and be not only because: plate face jump is higher, the photosensitive layer that requirement is adopted has enough thickness (being generally the 40-50 micron) and could fill its step, and thinner thickness, when the less FPC product of through hole adopts thick photosensitive layer to produce, the photoresists UNICOM that will cause the two sides photosensitive layer, form the effect of " dowel screw ", finally cause photosensitive layer to be difficult to divest, as shown in Figure 1, wherein, 1 is flexible copper-clad plate, and 2 is through hole copper facing, and 3 is photosensitive layer
The invention provides a kind of manufacture method of flexible circuit board, wherein, this method may further comprise the steps successively: (1) with on the first surface and second surface of photosensitive layer attached to flexible copper-clad plate, wherein, the thickness of the photosensitive layer on the first surface is greater than the thickness of the photosensitive layer on the second surface; (2) on the photosensitive layer of first surface, paste egative film, then the photosensitive layer on first surface and the second surface is exposed; (3) to the exposure after first surface and second surface develops and etching, afterwards the photosensitive layer on first surface and the second surface is got rid of; (4) with on the first surface and second surface of photosensitive layer attached to flexible copper-clad plate, wherein, the thickness of the photosensitive layer on the second surface is greater than the thickness of the photosensitive layer on the first surface; (5) on the photosensitive layer of second surface, paste egative film, then the photosensitive layer on first surface and the second surface is exposed; (6) to the exposure after first surface and second surface develops and etching, afterwards the photosensitive layer on first surface and the second surface is got rid of.
The present invention adopts the method for twice shaping, and change the two-sided thick photosensitive layer of prior art into one side thick photosensitive layer, the thin photosensitive layer of one side, can stop the phenomenon that photosensitive layer connects fully in the hole, thereby solve the problem of dry film plug-hole in the high density flexible printed substrate manufacturing process, as shown in Figure 2, wherein, 1 is flexible copper-clad plate, and 2 is through hole copper facing, and 3 is photosensitive layer.
Description of drawings
Fig. 1 is the schematic diagram of dry film plug-hole;
The schematic diagram of dry film plug-hole phenomenon for not taking place in Fig. 2 in the inventive method manufacturing process;
Fig. 3 is the structural representation of dry film;
Fig. 4 is the structural representation of FPC product.
Embodiment
The manufacture method of flexible circuit board provided by the invention may further comprise the steps: (1) with on the first surface and second surface of photosensitive layer attached to flexible copper-clad plate, wherein, the thickness of the photosensitive layer on the first surface is greater than the thickness of the photosensitive layer on the second surface; (2) on the photosensitive layer of first surface, paste egative film, then the photosensitive layer on first surface and the second surface is exposed; (3) to the exposure after first surface and second surface develops and etching, afterwards the photosensitive layer on first surface and the second surface is got rid of; (4) with on the first surface and second surface of photosensitive layer attached to flexible copper-clad plate, wherein, the thickness of the photosensitive layer on the second surface is greater than the thickness of the photosensitive layer on the first surface; (5) on the photosensitive layer of second surface, paste egative film, then the photosensitive layer on first surface and the second surface is exposed; (6) to the exposure after first surface and second surface develops and etching, afterwards the photosensitive layer on first surface and the second surface is got rid of.
Need to prove, at this used term " first surface " and " second surface " is for the ease of distinguishing two surfaces of flexible copper-clad plate, can be with in two surfaces of flexible copper-clad plate any one as first surface, correspondingly, another surface is second surface.
In step (1) and step (4), the thickness of the photosensitive layer on the thickness of the photosensitive layer on the first surface and the second surface is different, be in order to prevent photoresists UNICOM in through hole, two surfaces are shaped at twice, the one side that needs to form pattern is used conventional thick photosensitive layer, and its thickness is generally the 40-50 micron; Wouldn't need or form the thin photosensitive layer of one side use of pattern.The thickness of thick photosensitive layer can be 1.5-5 times of thin photosensitive layer thickness, is preferably 1.5-3 doubly.
With photosensitive layer attached to the surface of flexible copper-clad plate on the time, for being played, supports and protective effect photosensitive layer, under the preferable case, can also be attached with carrier layer on the photosensitive layer in the step (1), and before the development of step (3), the carrier layer on the first surface is removed, before or after the etching of step (3), the carrier layer on the second surface is removed; Photosensitive layer in the step (4) can also be attached with carrier layer, and before the development of step (6) carrier layer on the second surface is removed, and before or after the etching of step (6) carrier layer on the first surface is removed.
Usually, described photosensitive layer comes from the dry film that is purchased.Dry film is conventionally known to one of skill in the art, and the structure of the dry film that is purchased comprises photosensitive layer 4, is positioned at lip-deep protective layer 5 of described photosensitive layer and is positioned at another lip-deep carrier layer 6 of described photosensitive layer as shown in Figure 3.Described protective layer is preferably polyethylene film, is used to prevent that photosensitive layer is contaminated, avoids inter-adhesive between photosensitive layer when the volume film, and this rete should divested before flexible copper-clad plate press dry film.Photosensitive layer is contacted with the surface of copper-clad plate.Described carrier layer is preferably polyester film, is used for supporting and the protection photosensitive layer, and this rete generally should be divested before development.Under the preferable case, press the one side of thicker dry film before development, to remove carrier layer, and press the one side of thin dry film after etching finishes, to remove carrier layer, protecting photosensitive layer better, thus the protection copper face.The material of described photosensitive layer and thickness are conventionally known to one of skill in the art, for example, and the dry film of Hitachi, Asahi Chemical Industry and E.I.Du Pont Company.
Described method and the condition that press dry film is conventionally known to one of skill in the art, for example, the temperature of press mold can be 100-120 ℃, and the pressure of press mold can be the 3-5 Kilograms Per Square Meter, the speed of press mold can for 0.5-3.0 rice/minute, its detailed process repeats no more herein.
Described egative film can be any egative film that is used for the printed circuit board (PCB) preparation process, those skilled in the art can select suitable egative film according to the pattern of the flexible circuit board that will form, its material and conditions of exposure are conventionally known to one of skill in the art, for example, the silver salt sheet that the printed circuit board (PCB) that egative film can be commercially available is commonly used, recommendation exposure intensity according to supplier exposes, and exposure energy can be 20-80 milli Jiao/square centimeter.
Developer solution that described developing process is used and development conditions are conventionally known to one of skill in the art, for example, used developer solution be 0.005-0.15 rub/liter alkaline solution, be preferably Na
2CO
3, K
2CO
3, NaHCO
3And KHCO
3The aqueous solution in one or more; The condition of developing comprises that temperature can be 25-38 ℃, is preferably 28-32 ℃, and developing time can be 20-100 second, is preferably 30-90 second.
Described etching process can use various etching solution system known in those skilled in the art and etching condition, for example, can use CuCl
2System, CuSO
4System or FeCl
3System etc.
Under the preferable case, used etching solution is CuCl
2System promptly contains CuCl
2, H
2O
2With the aqueous solution of HCl, wherein, CuCl
2Concentration be 0.015-0.05 rub/liter, the concentration of HCl can rub for 2-6/liter, be benchmark with the total weight of etching solution, H
2O
2Content can be 0.2-1.5 weight %, etched temperature can be 45-55 ℃, is preferably 48-52 ℃, the etched time can be 0.5-3 minute, is preferably 1-2 minute.
Described method of removing photosensitive layer is preferably 3-5 minute for the copper-clad plate after the etching is contacted 2-10 minute with stripper solution, and the temperature of stripper solution can be 45-55 ℃, is preferably 48-52 ℃.
The described mode that copper-clad plate is contacted with stripper solution can be in soaking, scrubbing and spray one or more.Be preferably spray quinoline mode, the pressure of spray can be 0.5-1.8 kilogram/square centimeter, is preferably 0.8-1.2 kilogram/square centimeter.
Used stripper solution is OH independently of one another
-Concentration be 0.5-1.5 rub/liter strong alkali solution.For example, used stripper solution be 0.5-1.5 rub/liter NaOH and/or KOH solution.
The structure of described copper-clad plate as shown in Figure 4, wherein, 7 is prepreg, L1 and L2 are flexible copper foil base material (FCCL).
Under the preferable case, concrete implementation step of the present invention comprises:
1, press the dry film that comprises photosensitive layer and polyester film at L1 face and L2 face, and the thickness of L1 film that face press dry is greater than the L2 face;
2, paste egative film at the L1 face that is pressed with thick dry film;
3, the L1 face is exposed in the mode that figure is arranged, the L2 face directly exposes;
4, the polyester film with the L1 face removes;
5, L1 face and L2 face are developed and etching;
6, remove the photosensitive layer of L1 face and L2 face with stripper solution;
7, press the dry film that comprises photosensitive layer and polyester film at L2 face and L1 face, and the thickness of L2 film that face press dry is greater than the L1 face;
8, paste egative film at the L2 face that is pressed with thick dry film;
9, the L2 face is exposed in the mode that figure is arranged, the L1 face directly exposes;
10, the polyester film with the L2 face removes;
11, L2 face and L1 face are developed and etching;
12, remove the photosensitive layer of L2 face and L1 face with stripper solution.
Below, will be described in more detail the present invention by embodiment.
Present embodiment is used to illustrate the preparation method of flexible circuit board of the present invention.
The structure of the copper-clad plate of selecting for use as shown in Figure 4, wherein, the material of L1 and L2 face is the SL-12-12-EP of LG company, the material of prepreg is the BH-10 of platform rainbow company.
Press YQ-40SD dry film (thickness is 40 microns) at the L1 surface layer, the L2 surface layer is pressed AQ-20FA dry film (thickness is 20 microns); Pasting egative films (the silver salt egative film of Shenzhen U.S.A section) at the L1 face that is pressed with thick dry film also exposes in the mode that figure is arranged with 5 kilowatts high-pressure mercury-vapor lamp, the L2 face directly exposes, and the exposure energy of L1 face is 50 milli Jiao/square centimeters, and the exposure energy of L2 face is 30 milli Jiao/square centimeters; The L1 face tears off polyester film; Under 30 ℃, with the Na of 1.0 weight %
2CO
3Solution develops to L1 face and L2 face; Under 48 ℃, use CuCl
2/ H
2O
2/ HCl the aqueous solution (wherein, CuCl
2Concentration be 0.3 rub/liter, HCl concentration be 4 rub/liter, H
2O
2Content be 1 weight %) L1 face and L2 face are carried out etching; With stripper solution (concentration be 1 rub/liter the NaOH aqueous solution) remove the photosensitive layer of L1 face and L2 face; Then, press the YQ-40SD dry film at the L2 surface layer, the L1 surface layer is pressed the AQ-20FA dry film; The L2 face pastes egative film and exposes in the mode that figure is arranged with 5 kilowatts high-pressure mercury-vapor lamp, and the L1 face directly exposes; (exposure energy of L1 face is 50 milli Jiao/square centimeters, and the exposure energy of L2 face is 30 milli Jiao/square centimeters); Before developing the L2 face is torn off polyester film, keeps the polyester film of L1 face; Under 30 ℃, with the Na of 1.0 weight %
2CO
3Solution develops to L2 face and L1 face; Polyester film with the LI face after the development tears off; Under 48 ℃, use CuCl
2/ H
2O
2/ HCl the aqueous solution (wherein, CuCl
2Concentration be 0.3 rub/liter, HCl concentration be 4 rub/liter, H
2O
2Content be 1 weight %) L2 face and L1 face are carried out etching; At last, with stripper solution (concentration be 1 rub/liter the NaOH aqueous solution) remove the photosensitive layer of L2 face and L1 face.The stripping condition is: spray pressure is 1.0 kilograms/square centimeter, and temperature is 50 ℃, and spray time is 1.5 minutes.
With 400 same flexible circuit board of method for preparing, the product note is made A1.
Present embodiment is used to illustrate the preparation method of flexible circuit board of the present invention.
According to the method identical with embodiment 1, different is that the thickness of used dry film is respectively: thick dry film is 40 microns (YQ-40SD), and thin dry film is 15 microns (SPG-152).
With 400 same flexible circuit board of method for preparing, the product note is made A2.
Present embodiment is used to illustrate the preparation method of flexible circuit board of the present invention.
According to the method identical with embodiment 1, different is that the thickness of used dry film is respectively: thick dry film is 50 microns (YQ-50SD), and thin dry film is 20 microns (AQ-20FA).
With 400 same flexible circuit board of method for preparing, the product note is made A3.
Comparative Examples 1
This Comparative Examples is used to illustrate the preparation method of prior art flexible circuit board.
The structure of the copper-clad plate of selecting for use as shown in Figure 4, wherein, the material of L1 face and L2 face is the SL-12-12-EP of LG company, the material of prepreg is the BH-10 of platform rainbow company.
Press YQ-40SD dry film (thickness is 40 microns) and paste egative film (Shenzhen U.S. section silver salt sheet) at L1 face and L2 surface layer respectively at L1 face that is pressed with dry film and L2 face; L1 face and L2 face are exposed in the mode that figure is arranged with 5 kilowatts high-pressure mercury-vapor lamp simultaneously, and exposure energy is 50 milli Jiao/square centimeters, with the Na of 1.0 weight %
2CO
3Solution develops to L1 face and L2 face; Under 48 ℃, use CuCl
2/ H
2O
2/ HCl the aqueous solution (wherein, CuCl
2Concentration be 0.3 rub/liter, HCl concentration be 4 rub/liter, H
2O
2Content be 1 weight %) L1 face and L2 face are carried out etching; At last, at normal pressure, under 48 ℃, with stripper solution (concentration be 1 rub/liter the NaOH aqueous solution) remove the dry film of L1 face and L2 face.The stripping condition is with embodiment 1.
With 400 same flexible circuit board of method for preparing, the product note is made C1.
Comparative Examples 2
This Comparative Examples is used to illustrate the preparation method of prior art flexible circuit board.
According to preparing flexible circuit board with the same method of Comparative Examples 1, different is that the condition of stripper solution is: spray pressure is 2.0 kilograms/square centimeter, and temperature is 55 ℃, and spray time is 4 minutes.
With 400 same flexible circuit board of method for preparing, the product note is made C2.
Comparative Examples 3
This Comparative Examples is used to illustrate the preparation method of prior art flexible circuit board.
According to preparing flexible circuit board with the same method of Comparative Examples 1, different is, earlier with 3 rub/liter NaOH solution immersion 5 minutes, use stripper solution (1 rub/liter NaOH solution) spray again, spray pressure is 2.0 kilograms/square centimeter, and temperature is 55 ℃, and spray time is 4 minutes.
With 400 same flexible circuit board of method for preparing, the product note is made C3.
Product test
Observe the method for stripping fraction defective: product is placed on the light table (that is: has a desk of light source down, this light source is that ordinary incandescent lamp gets final product) upward visual, observe the printing opacity situation of aperture, the situation of fully saturating white light is OK, dry film does not divest fully in the situation explanation hole of saturating blue light, and residual dry film hinders light.The quantity of the flexible circuit board that does not divest fully with dry film can obtain the stripping fraction defective divided by the total quantity (400) of wiring board.The results are shown in table 1.
Table 1
| Numbering | A1 | A2 | A3 | C1 | C2 | C3 |
| Stripping fraction defective/% | 0 | 0 | 0 | 100 | 70 | 40 |
From the data of table 1 as can be seen, having only the stripping fraction defective with the flexible circuit board of the inventive method preparation is 0, and method promptly of the present invention can solve the dry film plug-hole problem of high density double-faced flexible wiring board fully.
Claims (10)
1. the manufacture method of a flexible circuit board is characterized in that, this method may further comprise the steps successively:
(1) with on the first surface and second surface of photosensitive layer attached to flexible double face copper, wherein, the thickness of the photosensitive layer on the first surface is greater than the thickness of the photosensitive layer on the second surface;
(2) on the photosensitive layer of first surface, paste egative film, then the photosensitive layer on first surface and the second surface is exposed;
(3) to the exposure after first surface and second surface develops and etching, afterwards the photosensitive layer on first surface and the second surface is got rid of;
(4) with on the first surface and second surface of photosensitive layer attached to flexible double face copper, wherein, the thickness of the photosensitive layer on the second surface is greater than the thickness of the photosensitive layer on the first surface;
(5) on the photosensitive layer of second surface, paste egative film, then the photosensitive layer on first surface and the second surface is exposed;
(6) to the exposure after first surface and second surface develops and etching, afterwards the photosensitive layer on first surface and the second surface is got rid of.
2. method according to claim 1, wherein, in step (1), the thickness of the photosensitive layer on the first surface be the photosensitive layer on the second surface thickness 1.5-5 doubly.
3. method according to claim 1, wherein, in step (4), the thickness of the photosensitive layer on the second surface be the photosensitive layer on the first surface thickness 1.5-5 doubly.
4. method according to claim 1, wherein, also be attached with carrier layer on the photosensitive layer in the step (1), and before the development of step (3), the carrier layer on the first surface removed, before or after the etching of step (3), the carrier layer on the second surface is removed.
5. method according to claim 1, wherein, photosensitive layer in the step (4) also is attached with carrier layer, and before the development of step (6) carrier layer on the second surface is removed, and before or after the etching of step (6) carrier layer on the first surface is removed.
6. according to claim 4 or 5 described methods, wherein, described carrier layer is a polyester film.
7. method according to claim 1, wherein, the conditions of exposure in step (2) and the step (5) comprises that respectively exposure energy is a 20-80 milli Jiao/square centimeter.
8. method according to claim 1, wherein, the used developer solution of developing process in step (3) and the step (6) be 0.005-0.15 rub/liter alkaline aqueous solution; The condition of developing comprises that temperature is 28-32 ℃, and developing time is 30-90 second.
9. method according to claim 1, wherein, the used etching solution of etching process in step (3) and the step (6) is independently of one another for containing CuCl
2, H
2O
2With the aqueous solution of HCl, wherein, CuCl
2Concentration be 0.015-0.05 rub/liter, the concentration of HCl be 2-6 rub/liter, be benchmark with the total weight of etching solution, H
2O
2Content be 0.2-1.5 weight %, etched condition comprises that temperature is 48-52 ℃, the time is 1-2 minute.
10. method according to claim 1, wherein, the method for getting rid of photosensitive layer in step (3) and the step (6) is for contacting 3-5 minute with the flexible double face copper after the etching with 48-52 ℃ stripper solution; Used stripper solution is OH independently of one another
-Concentration be 0.5-1.5 rub/liter strong alkali solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100077830A CN101534608B (en) | 2008-03-12 | 2008-03-12 | Manufacturing method of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100077830A CN101534608B (en) | 2008-03-12 | 2008-03-12 | Manufacturing method of flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101534608A CN101534608A (en) | 2009-09-16 |
| CN101534608B true CN101534608B (en) | 2011-01-26 |
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ID=41104929
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100077830A Expired - Fee Related CN101534608B (en) | 2008-03-12 | 2008-03-12 | Manufacturing method of flexible circuit board |
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| Country | Link |
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| CN (1) | CN101534608B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110247193A (en) * | 2019-05-13 | 2019-09-17 | 华中科技大学 | A kind of flexible gradual change resistive film, preparation method and application |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103458630B (en) * | 2013-08-09 | 2016-12-28 | 高德（无锡）电子有限公司 | A kind of method overcoming printed circuit board (PCB) copper-clad base plate thin plate operation to limit |
| CN103687321A (en) * | 2013-12-06 | 2014-03-26 | 中国航空工业集团公司第六三一研究所 | Machining method for hollow metal graph |
| CN105530769B (en) * | 2014-09-30 | 2019-02-05 | 深南电路有限公司 | A kind of processing method and printed circuit board of printed circuit board |
| CN109246928A (en) * | 2018-09-27 | 2019-01-18 | 常州市武进三维电子有限公司 | The production technology of the flexible wires wiring board of new-energy automobile |
| CN111088494B (en) * | 2019-12-04 | 2022-03-25 | 中色奥博特铜铝业有限公司 | Processing method of copper alloy foil for heating new energy automobile battery module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4327167A (en) * | 1980-03-14 | 1982-04-27 | Dainippon Screen Manufacturing Co., Ltd. | Method of producing printed circuit boards |
| CN1826035A (en) * | 2006-01-12 | 2006-08-30 | 珠海元盛电子科技有限公司 | Method for making single-face hollowed-out board |
-
2008
- 2008-03-12 CN CN2008100077830A patent/CN101534608B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4327167A (en) * | 1980-03-14 | 1982-04-27 | Dainippon Screen Manufacturing Co., Ltd. | Method of producing printed circuit boards |
| CN1826035A (en) * | 2006-01-12 | 2006-08-30 | 珠海元盛电子科技有限公司 | Method for making single-face hollowed-out board |
Non-Patent Citations (2)
| Title |
|---|
| JP特开平8-288644A 1996.11.01 |
| JP特开平8-46327A 1996.02.16 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110247193A (en) * | 2019-05-13 | 2019-09-17 | 华中科技大学 | A kind of flexible gradual change resistive film, preparation method and application |
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|---|---|
| CN101534608A (en) | 2009-09-16 |
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Effective date of registration: 20201123 Address after: Room 501, Jianshe building, No.20, Zhongshi Road, Huangdai Town, Xiangcheng District, Suzhou City, Jiangsu Province Patentee after: Suzhou Xiangcheng Daichen science and Technology Industrial Park Operation Management Co.,Ltd. Address before: 518119, Ping Ping Road, Pingshan Town, Longgang District, Guangdong, Shenzhen 3001 Patentee before: BYD Co.,Ltd. |
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