CN101546796A - Led导线支架 - Google Patents
Led导线支架 Download PDFInfo
- Publication number
- CN101546796A CN101546796A CN200810027088A CN200810027088A CN101546796A CN 101546796 A CN101546796 A CN 101546796A CN 200810027088 A CN200810027088 A CN 200810027088A CN 200810027088 A CN200810027088 A CN 200810027088A CN 101546796 A CN101546796 A CN 101546796A
- Authority
- CN
- China
- Prior art keywords
- support
- material section
- punching
- pair
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Abstract
Description
Claims (9)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100270880A CN101546796B (zh) | 2008-03-25 | 2008-03-25 | Led导线支架 |
US12/230,194 US7688599B2 (en) | 2008-03-25 | 2008-08-26 | Lead frame module for manufacturing light emitting diodes |
JP2008006731U JP3146899U (ja) | 2008-03-25 | 2008-09-24 | 発光ダイオード製造用リードフレームモジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100270880A CN101546796B (zh) | 2008-03-25 | 2008-03-25 | Led导线支架 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101546796A true CN101546796A (zh) | 2009-09-30 |
CN101546796B CN101546796B (zh) | 2012-01-11 |
Family
ID=41116901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100270880A Active CN101546796B (zh) | 2008-03-25 | 2008-03-25 | Led导线支架 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7688599B2 (zh) |
JP (1) | JP3146899U (zh) |
CN (1) | CN101546796B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101146506B1 (ko) * | 2009-07-24 | 2012-05-25 | 브라이트 엘이디 엘렉트로닉 코퍼레이션 | 발광 다이오드 모듈 및 그의 제조 방법 |
JP5875848B2 (ja) * | 2011-12-16 | 2016-03-02 | 株式会社東芝 | フォトカプラの製造方法及びフォトカプラ用リードフレームシート |
CN102683554B (zh) * | 2012-05-29 | 2016-07-06 | 新疆紫晶光电技术有限公司 | 基于kgd设计的led光源模组及其芯片可测性封装方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4129682A (en) * | 1977-11-16 | 1978-12-12 | Monsanto Company | High density led lead frame |
US5150194A (en) * | 1991-04-24 | 1992-09-22 | Micron Technology, Inc. | Anti-bow zip lead frame design |
JP3096824B2 (ja) * | 1992-04-17 | 2000-10-10 | ローム株式会社 | Led製造用フレームおよびこれを用いたledの製造方法 |
WO1997002578A2 (en) * | 1995-06-30 | 1997-01-23 | Philips Electronics N.V. | Surface-mountable electrical component |
US6268643B1 (en) * | 1997-12-22 | 2001-07-31 | Texas Instruments Incorporated | Lead frame device for delivering electrical power to a semiconductor die |
SG75958A1 (en) * | 1998-06-01 | 2000-10-24 | Hitachi Ulsi Sys Co Ltd | Semiconductor device and a method of producing semiconductor device |
US7132734B2 (en) * | 2003-01-06 | 2006-11-07 | Micron Technology, Inc. | Microelectronic component assemblies and microelectronic component lead frame structures |
US7183485B2 (en) * | 2003-03-11 | 2007-02-27 | Micron Technology, Inc. | Microelectronic component assemblies having lead frames adapted to reduce package bow |
-
2008
- 2008-03-25 CN CN2008100270880A patent/CN101546796B/zh active Active
- 2008-08-26 US US12/230,194 patent/US7688599B2/en active Active
- 2008-09-24 JP JP2008006731U patent/JP3146899U/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20090244875A1 (en) | 2009-10-01 |
JP3146899U (ja) | 2008-12-04 |
CN101546796B (zh) | 2012-01-11 |
US7688599B2 (en) | 2010-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101546796B (zh) | Led导线支架 | |
CN203085520U (zh) | 一种具隔离沟槽的引线框架 | |
CN203277171U (zh) | 键盘led灯的装贴结构 | |
CN2483160Y (zh) | 一种竹木复合重组模块料 | |
CN203456453U (zh) | 一种可以全面发光的led | |
CN101286677B (zh) | 一种电机单双层混合线圈下线工艺 | |
CN204230297U (zh) | 球泡灯丝支架 | |
CN204558206U (zh) | 一种电子零件组装盒 | |
CN203553141U (zh) | 交互式引线框架单元和交互式引线框架 | |
CN2821801Y (zh) | 扬声器音圈引接线 | |
CN201051451Y (zh) | 铝电解电容器的引出线 | |
CN111146173A (zh) | 一种新型双排式全包封ito-220f引线框架 | |
CN2823171Y (zh) | 一种集装箱底板 | |
CN203453892U (zh) | 一种led幻彩灯条 | |
CN201134437Y (zh) | 一种光电元件 | |
CN202603022U (zh) | 基于系统级封装的荧光灯镇流器芯片 | |
CN204375149U (zh) | 一种便携式抄表器 | |
CN205752241U (zh) | Led支架 | |
CN202816475U (zh) | 十七点五千伏全浇注中压母线 | |
CN203398113U (zh) | 一种散热陶瓷封装的led光源 | |
CN201758140U (zh) | 新型led光源模块封装结构 | |
CN202042367U (zh) | 复合式cbb65电容器接口 | |
CN201256055Y (zh) | 干式变压器用低压线圈 | |
CN201623155U (zh) | 贴片式sma二极管 | |
CN201314012Y (zh) | 一种新型高强度瓦楞原纸 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. GUANGBAO SC Free format text: FORMER OWNER: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131111 Owner name: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Free format text: FORMER OWNER: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. Effective date: 20131111 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 510663 GUANGZHOU, GUANGDONG PROVINCE TO: 213166 CHANGZHOU, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20131111 Address after: 213166 Wujin high tech Industrial Development Zone, Jiangsu Province, Yang Lake Road, No. 88 Patentee after: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee after: Lite-On Technology Corporation Address before: 510663 Guangzhou science and Technology Development Zone, Guangzhou City, Guangdong Province Science City West Road, No. 25 Patentee before: Xuli Electronics (Guangzhou) Co., Ltd. Patentee before: Lite-On Technology Corporation |