CN101548287B - Wireless IC tag and method for manufacturing wireless IC tag - Google Patents
Wireless IC tag and method for manufacturing wireless IC tag Download PDFInfo
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- CN101548287B CN101548287B CN200880000835XA CN200880000835A CN101548287B CN 101548287 B CN101548287 B CN 101548287B CN 200880000835X A CN200880000835X A CN 200880000835XA CN 200880000835 A CN200880000835 A CN 200880000835A CN 101548287 B CN101548287 B CN 101548287B
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Abstract
Provided is a wireless IC tag, which has a base material having electrical insulating characteristics, an antenna circuit arranged on a surface of the base material, and an IC chip connected to the antenna circuit. In the wireless IC tag, the antenna circuit is formed of solder, and the IC chip is connected to the antenna circuit with solder. Alternatively, provided is a wireless IC tag, which has a base material having electrical insulating characteristics, an antenna circuit arranged on a surface of the base material, an IC chip connected to the antenna circuit, and a jumper line connected to the antenna circuit. The antenna circuit is formed of solder. The jumper line is coated to be insulated, with a resin composition which vaporizes, decomposes or melts at a soldering temperature or below. Furthermore, the jumper line is arranged on the side of the base material surface whereupon the antenna circuit is arranged.
Description
Technical field
The present invention relates to Wireless IC tag.More specifically, relate to and have good antenna circuit of communication characteristic and the low thin ic tag of cost.In addition, the present invention relates to be adjusted to through simple structure the Wireless IC tag of the cheapness of desired resonant frequency.And, also relate to the manufacturing approach of said Wireless IC tag.
Background technology
Wireless IC tag (comprises Wireless IC card; Below; Be designated as " IC tag " in principle) have following structure usually: on the surface of insulativity base materials such as resin film, form antenna circuit, on the base material of said formation antenna circuit, carry the IC chip, said IC chip is connected with antenna circuit.
IC tag has the IC chip, and therefore, ability information recorded amount is more much more than bar code or identification label, and can freely write new information.Especially the IC tag of plane is all very convenient owing to carrying and be installed on the article, thereby is widely used.
In order further to utilize IC tag, the IC tag that an urgent demand communication characteristic is good and more cheap.
To this, for example patent documentation 1 discloses the IC tag with the circuit pattern that is made up of metals such as copper, silver and conductive paste.
In addition, about the formation method of circuit pattern, disclose with coated wire be wound into the method for coiled type, through the conductive metal such as copper that are laminated on the base material are carried out the method that etching forms coil pattern.
But in the record of patent documentation 1, metals such as copper, silver all are high prices, are difficult to realize the reduction of fee of material.On the other hand, compare with the metallic film system coil pattern that forms through vapor deposition or plating by the circuit pattern that conductive paste constitutes, poorly conductive, the electric power that coil pattern consumed increases, and communication distance is short, and promptly communication characteristic reduces.In order to eliminate this shortcoming, live width that must the spread loop pattern, but along with the expansion of live width, not only fee of material improves, and the new problem of stray capacitance occurs producing again.
In addition, coated wire is wound into trivial operations in the method for coiled type, is difficult to realize the reduction of manufacturing cost.
Through on whole of the resin surface with insulativity, forming the copper film, further implementing in the method that etching forms coil pattern again; These trivial operations not only; And subsidiary operation such as pre-service and offal treatment also becomes numerous and diverse, and in addition, manufacturing equipment is also complicated and maximize; And spendable base material also is restricted, thereby becomes the factor that hinders cost degradation.
In addition, except that using copper, use the method for aluminium or silver in addition, comprise copper and all have melting point height, unmanageable shortcoming at these interior materials.
In addition, copper has and is prone to oxidated thereby is inappropriate for the shortcoming of heat treated; Aluminium has the low shortcoming of electric conductivity; Silver has the shortcoming that lacks ductility thereby be difficult to laminate.
Below, use Fig. 8 that existing IC tag is described.Fig. 8 is the synoptic diagram of the structure of the existing IC tag of expression, is its planimetric map (a), (b) is the part in the cross section on the A-A ' of (a).
Among Fig. 8,301 is IC tag, and 302 is the electrical insulating property base material.Antenna circuit constitutes by 303～306, and 304 and 306 is the end of antenna circuit.In addition, 307 is the IC chip, and two electrodes (not shown) of IC chip 307 connect with antenna circuit 303 and 305 respectively.Two ends 304 of the antenna circuit on the one side that is formed at base material 302 and 306 form two through holes 311,312 of the another side that runs through base material; For example in said through hole 311,312, fill after the scolding tin, fix, connect the bonding line 310 that constitutes by lead in the another side side of said base material 302.In addition, can also adopt the method for using conductor replacement scolding tin to fix, connect bonding line with riveted joint functions such as eyelets.
The resonant frequency of above-mentioned IC tag is by the intrinsic electric capacity of IC chip 307 and the inductance that length the caused decision of the antenna circuit 303～306 that links through hole 311,312.Therefore; As the method for the resonant frequency of regulating above-mentioned IC tag, proposed through method (patent documentation 2) that capacitor or resistance appends electric capacity being set in antenna circuit and being connected or cutting off the method (patent documentation 3) that a plurality of antenna circuits change antenna circuit length through suitable.
But, in the patent documentation 2, adjusting is set with capacitor or regulate structure in antenna circuit, thereby the part number increases and causes the manufacturing cost rising with resistance owing to formed.The communication distance of the IC tag that obtains in addition, possibly shorten.
In addition; In the patent documentation 3, owing to a plurality of antennas that are pre-formed electrical connection on the surface of insulating substrate, and the length of regulating antenna circuit as required through the connection of cutting off unwanted antenna circuit; Thereby the structure of antenna circuit is very complicated, thereby causes the rising of manufacturing cost.The size of the IC tag that obtains in addition, possibly increase.
Like this, existing IC tag can not be called the IC tag that communication characteristic is good and be dirt cheap, and in addition, does not also have easily and regulate at an easy rate the method for resonant frequency.
Patent documentation 1: TOHKEMY 2006-304184 communique
Patent documentation 2: TOHKEMY 2001-010264 communique
Patent documentation 3: TOHKEMY 2001-251115 communique
Summary of the invention
Problem of the present invention is to solve the problem in the above-mentioned existing IC tag.That is, first problem of the present invention is, provides a kind of communication characteristic good and more cheap IC tag and manufacturing approach thereof.
In addition, second problem is, thus provide a kind of do not append again capacitor etc., simple in structure, can be easily be the IC tag and the manufacturing approach thereof of the cheapness of the random length resonant frequency that obtains stipulating with the length adjustment of antenna circuit.
The present invention is that purpose is accomplished to solve above problem.Below, each invention of the present invention is described.
First invention of the present invention is a kind of Wireless IC tag; Have: the electrical insulating property base material, be arranged on antenna circuit on the said substrate surface, and the IC chip that is connected with said antenna circuit; It is characterized in that; Said antenna circuit is formed by scolding tin, and said IC chip is connected with said antenna circuit through scolding tin.
First invention according to the present invention can realize said first problem.That is, in first invention of the present invention, the antenna circuit of IC tag is formed by the scolding tin than aluminium, copper, silver cheapness, therefore, cheap IC tag can be provided.
In addition, because therefore the electric conductivity of scolding tin, can provide the live width and the good IC tag of communication characteristic that extremely do not enlarge antenna circuit than the excellent conductivity of existing conductive paste.
And, because low, the excellent processability of scolding tin fusing point, therefore; Degree of freedom in the manufacturing process is high, need not use complicated manufacturing equipment or large-scale manufacturing equipment, and the selection degree of freedom of base material is also big; Can not cause the rising of manufacturing cost, IC tag can easily be provided.
Be used to form not special qualification of scolding tin of antenna circuit,, can also adopt Sn-Ag-Cu system to wait other scolding tin such as Pb-free solder, silver soldering tin for example except that common lead and the scolding tin of ashbury metal (about 183 ℃ of melting point).
In addition; In first invention of the present invention; The IC chip is connected through scolding tin with antenna circuit; Therefore, need be as not in the past, the method (TOHKEMY 2006-304184 communique) of the anisotropic conductive cream (ACP) through using high valency or the method for ultrasound wave fusing connect IC chip and antenna circuit.Therefore, more cheap IC tag can be provided.
Being connected of said antenna circuit and IC chip (electrode); Can make the melts soldering tin that constitutes antenna circuit and directly connect, also can joint be set with scolding tin, come easily to connect in the part of wanting bonding electrodes through under the state of butt electrode, making the scolding tin heat fused.
Said joint does not limit with scolding tin is special, and in order not damage antenna circuit, in various scolding tin, especially preferably using the low Bi-Sn of melting point is the scolding tin that melting point such as scolding tin is no more than the melting point that forms the used scolding tin of antenna circuit.
In first invention of the present invention, as long as can carry out the processing of electrical connection of formation, the antenna circuit of antenna circuit, then the material of base material can be any material.Because antenna circuit forms by the low scolding tin of melting point, so can use thermotolerance can not be called the base material of made of paper fully, synthetic resin system, glass etc.Wherein, when using glass, utilize methods such as special solder flux or ultrasonic brazing method directly to form antenna circuit at substrate surface as said base material.
In addition, of the present invention first the invention in, also can directly on base material, not form antenna circuit, and will on other substrate, form antenna circuit move on on the base material.
Second invention of the present invention is characterized in that for the described IC tag of the present invention's first invention said base material is made of paper.
In second invention of the present invention,, therefore, can further reduce material cost owing to use cheap paper as base material.
In addition, because paper is the thin material that obtains easily, so can easily obtain thinner IC tag.
In addition, base material made of paper is different from plastic base material, in the formation of circuit pattern; When the pattern material of printing paste, even do not implement the roughening treatment on surface especially, pattern material can not flow out towards periphery yet; Therefore, can easily form correct pattern, excellent processability.In addition, the paste pattern material of coating infiltrates the inside of paper, thereby cohesive is good.
And, compare with resin, usually the excellent heat resistance of paper.Therefore, if base material is made of paper, the operation when then using fusing scolding tin to form antenna circuit is easier.
In addition, not limiting in that this said " made of paper " is special, not only can be pure paper (cellulose, resin slurry), also can impregnating resin or the surface implemented certain processing etc.
In addition, in material made of paper, use the viscose paper (waxed paper) can be correctly and easily form the antenna circuit of scolding tin system, thus preferred.
In addition, also comprise the smooth heat-resisting paper of the surface of viscose paper having been implemented the silicon processing at this said viscose paper.
The 3rd invention of the present invention is characterized in that for the present invention first or the described Wireless IC tag of second invention said IC chip is arranged at the antenna circuit face side of said base material.
In the 3rd invention of the present invention,, thereby can process the thinner IC tag of thickness because the IC chip is arranged at the antenna circuit face side of base material.
The 4th invention of the present invention is characterized in that for the described Wireless IC tag of arbitrary invention in the present invention's first to the 3rd invention, posts the sheet that is made up of the high-dielectric constant material on the said base material.
In the 4th invention of the present invention, can guarantee the thinness of IC tag, even and the also good IC tag of communication characteristic can process on being installed to metal object the time through attaching the so simple structure of sheet that constitutes by the high-dielectric constant material.
The 5th invention of the present invention is characterized in that the base material of said base material for being made up of the high-dielectric constant material for the described Wireless IC tag of arbitrary invention in the present invention's first to the 3rd invention.
In the 5th invention of the present invention, replace on said base material, attaching the sheet that constitutes by the high-dielectric constant material, and adopt the base material that constitutes by the high-dielectric constant material, therefore, can process the good thinner IC tag of communication characteristic as base material itself.
The 6th invention of the present invention provides a kind of method of making Wireless IC tag; It is characterized in that; The material that use has wetting state for the scolding tin that melts; After forming the pattern identical on the surface of electrical insulating property base material, use the scolding tin of fusing on said pattern, to form said antenna circuit with antenna circuit.
In the 6th invention of the present invention; The material that use has wetting state for the scolding tin that melts forms the pattern identical with antenna circuit, therefore in advance on the surface of base material; Can make scolding tin be attached to substrate surface, thereby can easily form antenna circuit according to pattern.
With not special qualification of material that the scolding tin of said fusing has wetting state, can use for example various metallicss.Wherein, surface coated the wetting state of silver-colored nickel particles or copper particle and fusing scolding tin good, thereby preferred.
When using this metallics, form the not special qualification of the method for patterning identical with antenna circuit with metallics.For example can adopt methods such as vapor deposition, preferred adopt form binder resin system and film through screen painting after, sprinkle said metallics, with not being attached to that metallics on the binder resin is shaken off and the method for removing unnecessary metallics.According to this method, can reduce the consumption of metallics as far as possible, and can easily form thin pattern.
For the method that on the pattern that constitutes by said metallics, forms scolding tin system antenna circuit; For example under the situation of the common base material made of paper that uses no water tolerance; Preferred following method: through printing the scolding tin of paste is coated on whole of base material; Heating makes its fusing and infiltration diffuse to the surface of conductivity substrate then, and the paste scolding tin reflow soldering method that dispels with the nitrogen fusing scolding tin that becoming of other position is spherical.In addition, if having the paper of water tolerance, then also can be employed in the infusion process of flooding in the melting molten tin bath.
The 7th invention of the present invention is characterized in that for the method for the described manufacturing Wireless IC tag of the present invention's the 6th invention said scolding tin for fusing has the resin of material for carrying out soldering of wetting state.
The resin that can carry out soldering can be printed on through screen painting etc. and easily form pattern on the base material.Therefore, in the 7th invention of the present invention, can easily form scolding tin system antenna circuit with predetermined pattern.
In addition, owing to the adaptation of resin that can carry out soldering and base material is good, therefore, can antenna circuit be fixed on the base material more firmly.
The resin of the soldering carried out of using among the present invention does not have special qualification, can enumerate to contain resin that metal powder, resin binder and unsaturated fatty acid form etc. in the organic solvent.As metal powder; Can enumerate silver powder, copper powders may, nickel by powder, aluminium powder, silver-coated copper powder end, silver-colored nickel coat powder, yellow gold powder etc.; Consider the mixed-powder of preferred silver-colored nickel coat powder, silver-coated copper powder end or these powder and silver powder from the braze ability aspect.
In addition, said resin binder can adopt heat-curing resins such as epoxy resin, melamine resin, phenol resin, polyimide resin, considers preferred epoxy, phenol resin from the coating characteristic aspect.Wherein, with regard to heat-curing resin, consider preferred low temperature (below 200 ℃) gel-type resin from the aspect that influences that can suppress as much as possible to heat to base material.
Can also be dissolved with unsaturated fatty acids such as oleic acid, linoleic acid, leukotrienes in the said resin that carries out soldering.Wherein, consider preferred oleic acid from the aspect that helps to prevent the oxidation on metal powder surface and destroy the oxide scale film that produces.
Process the organic solvent of the paste that is fit to printing as the resin that is used for to carry out soldering; So long as can make heat-curing resin be evenly dispersed in the solvent in this cream; Then not special the qualification can be enumerated for example organic solvents such as BC, methyl carbitol, ソ Le ベ Star ソ 150.
In addition, the mixing ratio that can carry out metal powder described in the resin of soldering and resin is as long as suitably determine there is not special qualification according to the mode that can engage with scolding tin.In addition, as the electroconductive resin of the soldering carried out that contains said metal powder, also can use commercially available article.
The 8th invention of the present invention provides a kind of method of making Wireless IC tag, it is characterized in that having: the operation that the antenna circuit that is formed by the material that has wetting state for the scolding tin that melts is set on the electrical insulating property base material; The operation of IC chip is set on said antenna circuit through the solder paste that contains scolding tin and cohesive heat reactive resin; Make the operation of said solder paste heat fused under the temperature more than the melting point of scolding tin composition; Through under the temperature below the melting point of said scolding tin composition, make the cohesive heat reactive resin generation heat curing of said solder paste said IC chip is connected in the operation of said antenna circuit.
In the 8th invention of the present invention; When on the antenna circuit that the material that is had wetting state by the scolding tin for fusing forms, the IC chip being set; Contain the solder(ing) paste of scolding tin and resin of binding property in coating after; Make solder(ing) paste heat fused under the temperature more than the fusing point of scolding tin composition, under the temperature below the fusing point of scolding tin composition, make the cohesive heat reactive resin heat curing of solder(ing) paste then, just can the IC chip be bonded on antenna circuit and the substrate securely through this extremely simple method.
The inventor has accomplished the 8th invention of the present invention according to following discovery: for the solder(ing) paste of heat fused under the temperature more than the melting point of scolding tin composition; During the contained cohesive heat reactive resin composition of solder(ing) paste is still uncured; The scolding tin composition that has melted concentrates on the electrode part of IC chip; Thereby form scolding tin and become the part of separating/enriching and the part of cohesive heat reactive resin enrichment; At this moment, the IC chip is installed in the position at the junction surface of antenna circuit well even without precision, also can move to the appropriate location voluntarily through this phenomenon.That is, the effect that scolding tin becomes the part performance of separating/enriching that the IC chip is engaged with antenna circuit, the part performance of cohesive heat reactive resin enrichment makes the IC chip be firmly fixed on the base material and makes the IC chip move to the effect of appropriate location voluntarily at this moment.
In addition, in the 8th invention of the present invention, the cohesive heat reactive resin does not have special qualification, can adopt heat reactive resins such as for example said epoxy resin, melamine resin, phenol resin, polyimide resin.In addition, use the low temperature curing type resin can not damage antenna circuit and base material and easily solidify, thus preferred.
In addition; The scolding tin of said scolding tin composition is not special yet to be limited, and in order antenna circuit not to be caused damage, preference such as In-Sn are that scolding tin (118 ℃ of melting points) or Bi-Sn are scolding tin low melting point scolding tin such as (132 ℃ of melting points); Wherein Bi-Sn is that scolding tin is cheap, thereby preferred especially.
As stated; As the method that the IC chip is fixed in antenna circuit; Adopt to use method, and the method for ultrasound wave fusing of the anisotropic conductive cream (ACP) of high valency in the past; In addition, because the electrode and the electrode separation of IC chip is very small, so need very high-precision location when the IC chip is installed.To this, in the 8th invention of the present invention, owing to can use fixedly IC chip of cheap material and method, thereby more cheap IC chip can be provided.
The 9th invention of the present invention provides a kind of Wireless IC tag; Have: electrical insulating property base material, the bonding line that is arranged on the antenna circuit on the said substrate surface, the IC chip that is connected with said antenna circuit and is connected with said antenna circuit; It is characterized in that; Said antenna circuit is formed by scolding tin, and said bonding line is coated by the resin combination insulation of evaporation under the temperature below the brazing temperature, decomposition or fusing; And said bonding line is arranged on the substrate surface side that is provided with said antenna circuit.
According to the 9th invention of the present invention, can realize second problem of the present invention.That is, in the 9th invention of the present invention,, thereby can easily connect bonding line in the optional position on antenna circuit because bonding line is arranged on the substrate surface side that is provided with antenna circuit.And, coat because bonding line is insulated by resin combination, thereby can not make the antenna circuit short circuit at the pars intermedia of bonding line.Consequently, can freely regulate the length of antenna circuit with simple structure, thus can be easily and the IC tag with regulation resonant frequency is provided at an easy rate.
In addition, according to the 9th invention of the present invention,, thereby can easily carry out and being connected of the conductor of bonding line because antenna circuit forms by scolding tin.
In addition, because scolding tin is all more cheap than aluminium, copper, silver, thereby cheap IC tag can be provided.And the melting point of scolding tin is low, excellent processability; Therefore, the degree of freedom in the manufacturing process is high, need not use complicated manufacturing equipment or large-scale manufacturing equipment; The selection degree of freedom of base material is also big, can not cause the rising of manufacturing cost, thereby more cheap IC tag can be provided.
And, according to the 9th invention of the present invention, when resin combination is the resin combination of evaporation under the temperature below the temperature under brazing temperature, when promptly carrying out soldering, decomposition; Only the predetermined connecting portion with bonding line and antenna circuit is heated to brazing temperature; The insulation that can eliminate bonding line coats, and exposes not oxidized conductor metal, simultaneously; The melts soldering tin of antenna circuit, thus can the conductor that expose directly be connected with scolding tin.
In addition; When resin combination was the resin combination that melts under the temperature below brazing temperature, only the predetermined connecting portion with bonding line and antenna circuit was heated to brazing temperature, and the insulation that can eliminate bonding line coats; Expose not oxidized conductor metal; Simultaneously, the melts soldering tin of antenna circuit, thus can the conductor that expose directly be connected with scolding tin.In addition, because the resin combination of fusing easily attached on the conductor metal, therefore, if in heating, apply ultrasound wave, then can more successfully be removed the insulation coating of bonding line.
Like this, can need not to expose the conductor of bonding line in advance and bonding line directly is connected with antenna circuit, therefore, can more effectively operate, thereby cheap IC tag can be provided.
Like this; According to the 9th invention of the present invention; Because the antenna circuit that is formed by scolding tin is set on the identical substrate surface with the bonding line that is coated by the resin combination insulation in evaporation under the temperature below the brazing temperature, decomposition or fusing; Thereby can be easily the length adjustment of antenna circuit be length arbitrarily, thereby the IC tag that can obtain the regulation resonant frequency is provided at an easy rate.
In the 9th invention of the present invention, as the electrical insulating property base material, as long as can carry out the processing of electrical connection of formation, the antenna circuit of antenna circuit, then the material of base material can be any material.In first invention of the present invention,, therefore, can adopt thermotolerance can not be called the base material of made of paper fully, synthetic resin system, glass etc. because employing compares the low-down scolding tin of melting point and form antenna circuit with aluminium, copper, silver.Wherein, when using glass, utilize methods such as special solder flux or ultrasonic brazing method directly to form antenna circuit at substrate surface as said base material.
Be used to form not special qualification of scolding tin of antenna circuit,, can also use Sn-Ag-Cu system to wait Pb-free solder, silver soldering tin etc. for example except that common lead and the scolding tin of ashbury metal (about 183 ℃ of melting point).
Use scolding tin to form not special qualification of method of antenna circuit; Except the scolding tin that uses fusing is directly forming the antenna circuit on the base material, the material that can also adopt the scolding tin that for example uses for fusing to have wetting state forms the pattern identical with antenna circuit on substrate surface, then with its surperficial method of scolding tin covering that melts etc.
In addition, also can directly on base material, not form antenna circuit, and the antenna circuit that will on other substrate, form moves on on the base material.
The material of the conductor in the bonding line can be used the various metals that use in the common insulated line, does not have special qualification, considers from the aspect of flexibility, excellent conductivity and suitable soldering, more preferably copper.
As the resin combination of coating conductor, the resin combination that use evaporation under the temperature that forms below the used brazing temperature of antenna circuit, decomposes or melt.Particularly, for example can enumerate thermoplastic resins such as polyolefin resin such as tygon or urethane resin.
Insulation coats that thickness is not special to be limited, and considers that from the wall thickness of guaranteeing IC tag and the flexibility aspect of covering thread preferred thickness is thin.
The tenth invention of the present invention is characterized in that for the described Wireless IC tag of the present invention's the 9th invention said base material is made of paper.
In the tenth invention of the present invention, owing to use cheap paper as base material, thereby can further reduce material cost.In addition, because paper is the thin material that obtains easily, therefore, can easily make thinner IC tag.
In addition, base material made of paper is different from plastic base material, in the formation of circuit pattern; When the pattern material of printing paste, even do not implement the roughening treatment on surface especially, pattern material can not flow out towards periphery yet; Therefore, form correct pattern easily, excellent processability.In addition, the paste pattern material of coating infiltrates the inside of paper, thereby cohesive is also good.
And paper is than resin excellent heat resistance usually.Therefore, if base material is made of paper, the operation when then using fusing scolding tin to form antenna circuit is easier.
In addition, not limiting in that this said " made of paper " is special, not only can be pure paper (cellulose, resin slurry), also can impregnating resin or the surface implemented certain processing etc.
In addition, in material made of paper, consider, use the viscose paper (waxed paper) can be correctly and easily form the antenna circuit of scolding tin system from the viewpoint of thermotolerance and slickness, thus preferred.
In addition, also comprise the smooth heat-resisting paper of the surface of viscose paper having been implemented the silicon processing at this said viscose paper.
The 11 invention of the present invention is the present invention the 9th or the described Wireless IC tag of the tenth invention; It is characterized in that; One end of said bonding line is connected in an end of said antenna circuit, and the other end is connected in the position that can access the regulation resonant frequency of said antenna circuit.
In the 11 invention of the present invention; Because for following structure: an end, the other end that an end of bonding line is connected in antenna circuit is connected in the position that can access the regulation resonant frequency of antenna circuit; Therefore; The resonant frequency that can in the resonant frequency scope of broadness, obtain stipulating through simple method, thus can be easily and IC tag is provided at an easy rate.
The 12 invention of the present invention is characterized in that for the described Wireless IC tag of arbitrary invention in the present invention the 9th to the 11 invention, and it is the coating of insulating of the insulating varnish of main body that said bonding line adheres to the urethane resin through baking on conductor.
In the 12 invention of the present invention, it is the bonding line that the insulating varnish of main body forms that the regulation bonding line adheres to the urethane resin for baking on conductor.This is because usually, and it is that bonding line that the insulating varnish of main body forms has all the time the actual achievement of using as magnetic wire or UEW that baking is adhered to the urethane resin, and obtains easily.
The 13 invention of the present invention is characterized in that for the described Wireless IC tag of arbitrary invention in the present invention's the 9th to the 12 invention, is formed with the layer that is made up of high-permeability material on the said base material.
In the 13 invention of the present invention, can guarantee the thinness of IC tag, even and the also good IC tag of communication characteristic can process on being installed to metal object the time through on base material, forming the so simple structure of layer that constitutes by high-permeability material.
As the method that forms the layer that constitutes by high-permeability material, for example can enumerate: the high magnetic conductivity ferrite sheet is attached to the method for the method on the base material, the method for printing the cream (printing ink) that constitutes by high-permeability material, plating coating high-permeability material etc.
In addition,,, revise the link position of bonding line and antenna circuit as required, also can resonant frequency be set at desired value even after layer formation when the layer that is made up of high-permeability material is formed at when forming on the relative face of face with antenna circuit.
The 14 invention of the present invention is characterized in that the base material of said base material for being made up of high-permeability material for the described Wireless IC tag of arbitrary invention in the present invention's the 9th to the 12 invention.
In the 14 invention of the present invention, replace on said base material, forming the layer that constitutes by high-permeability material, and adopt the base material that constitutes by high-permeability material, therefore, can process the good thinner IC tag of communication characteristic as base material itself.
The 15 invention of the present invention provides a kind of method of making Wireless IC tag, it is characterized in that having: use scolding tin on the electrical insulating property base material, to form the operation of antenna circuit; To be overlying on the operation that the bonding line that forms around the conductor is arranged at the substrate surface side that is formed with said antenna circuit by the resin combination insulating bag of evaporation under the temperature below the brazing temperature, decomposition or fusing; Said conductor is connected in the operation of the assigned position of said antenna circuit through said bonding line is heated.
The 15 invention of the present invention is to the 9th invention of the present invention, from the invention of manufacturing approach angle proposition.
The invention effect
According to the present invention, can provide communication characteristic good and more cheap IC tag and manufacturing approach thereof.
In addition, according to the present invention, thereby a kind of IC tag and manufacturing approach thereof of not appending the cheapness of capacitor etc., simple in structure, the resonant frequency that can be easily the length adjustment of antenna circuit obtained stipulating for length arbitrarily again can be provided.
Description of drawings
Fig. 1 is the synoptic diagram of the IC tag of first embodiment of the invention;
Fig. 2 is the figure of pattern of the antenna circuit of expression first embodiment of the invention;
The figure of the state when Fig. 3 is the IC tag lift-launch that schematically shows among the present invention;
Fig. 4 is the figure of pattern of the antenna circuit of expression second embodiment of the invention;
Fig. 5 is the figure of pattern of the antenna circuit of expression third embodiment of the invention;
Fig. 6 is the synoptic diagram of the IC tag of four embodiment of the invention;
Fig. 7 is the synoptic diagram after the bonding line position adjustments of IC tag of four embodiment of the invention;
Fig. 8 is a synoptic diagram of representing the structure of IC tag in the past.
Label declaration
1,301 IC tags
2,302 base materials
3,5,303,305 antenna circuits
4, the end of 6,304,306 antenna circuits
7,307 IC chips
8,310 bonding lines
11 solder(ing) pastes
12,13 electrodes
The part of 14 scolding tin enrichments
15 cohesive heat reactive resins become the part of separating/enriching
311,312 through holes
Embodiment
Below, the present invention will be described based on best mode for carrying out the invention.In addition, the present invention is not limited to following embodiment.Can in the scope identical and impartial, carry out various changes to following embodiment with the present invention.
(first embodiment)
(structure of IC tag)
Below, based on accompanying drawing this embodiment is described.Fig. 1 is the synoptic diagram of the IC tag of this embodiment.
Among Fig. 1,1 is IC tag, and 2 is base material (Lintec corporate system, viscose paper).Antenna circuit constitutes by 3～6, and 4 and 6 is two terminal parts of antenna circuit.In addition, 7 is IC chip (PHILIPS corporate system, I-CODE SLI), and two electrodes (not shown) of IC chip 7 are connected to antenna circuit 3 and 5.The end 4 of antenna circuit and 6 is connected by bonding line (the polyurethane covering thread of diameter 0.05mm, by more than the film thickness 5 μ m, reason is ground the electric wire corporate system) 8.
At last, use commercially available laminater (being set at 110 ℃), lamination is carried out on the surface of IC tag shown in Figure 1, accomplish IC tag thus as product with PET film (commercially available article: not shown).
Below, use Fig. 2～3 to describe in more detail.
(formation of antenna circuit)
Fig. 2 is the figure of the pattern of the antenna circuit in the expression IC tag shown in Figure 1.
Utilize static that viscose paper (viscose paper F133kg) is fixing and as base material.Use in the above resin (A-5050, Nippon Paint Co., Ltd.'s system) screen painting can carry out soldering (printing condition: ST325 net+emulsion thickness 10 μ m) behind the pattern shown in Figure 2,160 ℃ down heating made resin solidification in 30 minutes.In addition, pattern is that the mode that 0.75mm, line are spaced apart 0.25mm is regulated according to live width.
That uses that flatiron smears φ 0.6mm on the pattern that obtains contains solder flux class scolding tin (Sn-Ag-Cu system) (design temperature: 325 ℃).After removing the scolding tin on the position beyond the pattern, the two ends of bonding line are brazed in respectively on the end 4 and 6 of antenna circuit 3 and 5.
Then, clean solder flux and carry out drying, thereby form antenna circuit 3 and 5.
(lift-launch of IC chip)
Then, carry IC chip 7.Fig. 3 schematically shows the figure that IC chip 7 is equipped on the state in 2 last times of base material, is carried out successively to (c) by (a).Shown in Fig. 3 (a), use spreader between antenna circuit 3 and 5, to be coated with the solder(ing) paste that contains scolding tin and cohesive heat reactive resin (TYCAP-5401-11, TAMURA changes into corporate system, Sn-Bi is a solder(ing) paste) 11 of ormal weight.Then, shown in Fig. 3 (b), with two electrodes 12,13 of IC chip 7 to be equipped on the substrate with the mode of antenna circuit 3 and 5 butts respectively temporarily.
Heated for 10 seconds down at 160 ℃, make the contained scolding tin of solder(ing) paste become fractional melting.Then, reduce the temperature to 130 ℃ and keep 30 minutes, so that the heat curing of cohesive heat reactive resin.
At this moment, during cohesive heat reactive resin composition was uncured, the scolding tin composition of fusing concentrated on the good electrode 12,13 of scolding tin composition wetting state is reached the near surface of the antenna circuit 3,5 that is made up of soldering-tin layer, thereby forms scolding tin enriching section 14.On the other hand, at middle the form cohesive heat reactive resin composition enriching section 15 of electrode 12 with electrode 13.
At this moment; Because the interim lift-launch of IC chip is put with hand and is carried out; Thereby be in the state that is not installed in the good position of for assigned position precision; But can confirm: generate the equilibrium of forces that scolding tin enriching section 14 and cohesive heat reactive resin composition enriching section 15 are produced, make the IC chip move to suitable position voluntarily.
Under this state, solder(ing) paste 11 solidifies, and electrode 12,13 and antenna circuit 3,5 engage through scolding tin enriching section 14.At this moment, antenna circuit 3 can not be short-circuited with antenna circuit 5, and in addition, the main body of IC chip 7 is bonding securely through cohesive heat reactive resin composition enriching section 15 and substrate 2.
(test of IC tag)
Then, the IC tag of processing is tested.Particularly; Except measuring impedance, (ウ エ Le キ ヤ Star ト society system EFG-310-01) has been measured communication distance also to use read write line; (research institute's corporate system that three fields are wireless DMC-230S2) has been measured resonant frequency before and after the surface laminated to use grid-dipmeter.
(test result)
The test result of the IC tag of first embodiment is following.
(A) impedance: 13～15 Ω
(B) resonant frequency (before the lamination): 14.20～14.30MHz
Resonant frequency (behind the lamination): 13.90～14.10MHz
(C) communication distance (behind the lamination, aerial): 60～65mm
(second embodiment)
(structure of IC tag)
Base material adopts viscose paper (viscose paper W87.5kg), uses in the digraph case shown in Figure 4 one as the antenna circuit pattern, in addition, likewise operates with first embodiment and to make IC tag, and test.
(test result)
The test result of the IC tag of second embodiment is following.
(A) impedance: 12～17 Ω
(B) resonant frequency (before the lamination): 13.80～13.90MHz
Resonant frequency (behind the lamination): 13.40～13.60MHz
(C) communication distance (behind the lamination, aerial): 40～45mm
(the 3rd embodiment)
Adopt pattern shown in Figure 5 as the antenna circuit pattern, in addition, likewise operate with first embodiment and to make IC tag, and test.
(test result)
The test result of the IC tag of the 3rd embodiment is following.
(A) impedance: 14～16 Ω
(B) resonant frequency (before the lamination): 14.50～14.60MHz
Resonant frequency (behind the lamination): 14.10～14.30MHz
(C) communication distance (behind the lamination, aerial): 35～40mm
Can be known by above-mentioned test result: in the IC tag of first embodiment～the 3rd embodiment, the formation of antenna circuit and IC chip are all good with being connected of antenna circuit, have realized enough little impedance, and the communication distance aspect has obtained good characteristic.Can confirm that in addition the IC chip is firmly fixed on the base material.
Post the making of the IC tag of high-dielectric constant material piece)
But, the IC tag that is known that first embodiment～the 3rd embodiment on being installed on metal object the time communication be extremely difficult.So; (form the relative face of face) at the back side of IC tag and paste the sheet (ferrite sheet of thickness 150 μ m, initial permeability 30) of high-dielectric constant material system and test with antenna circuit; Consequently, can be formed in the IC tag that also can work when being installed on the metal object.
(the 4th embodiment)
(structure of IC tag)
Fig. 6 is the synoptic diagram of the IC tag of this embodiment.
Among Fig. 6,1 is IC tag, and 2 is base material (Lintec corporate system, viscose paper).Antenna circuit constitutes by 3,5, and 4 and 6 is two ends of antenna circuit.In addition, 7 is IC chip (PHILIPS corporate system, I-CODE SLI), and two electrodes (not shown) of IC chip 7 are connected to antenna circuit 3 and 5.The end 4 of antenna circuit and 6 is connected by bonding line (diameter is the polyurethane covering thread of 0.05mm, by more than the film thickness 5 μ m, reason is ground the electric wire corporate system) 8.
(formation of antenna circuit)
Utilize static that viscose paper (viscose paper F133kg) is fixing and as base material.Use in the above resin (A-5050, Nippon Paint Co., Ltd.'s system) screen painting can carry out soldering (printing condition: ST325 net+emulsion thickness 10 μ m) behind the pattern (vertical 34.0mm, horizontal 41.0mm) shown in Figure 6,160 ℃ down heating made resin solidification in 30 minutes.In addition, pattern is that the mode that 0.75mm, line are spaced apart 0.25mm is regulated according to live width.
That uses that flatiron smears φ 0.6mm on the pattern that obtains contains solder flux class scolding tin (Sn-Ag-Cu system) (design temperature: 325 ℃).After removing the scolding tin on the position beyond the pattern, with said flatiron with the two ends of bonding line 8 respectively hand be brazed on the end 4 and 6 of antenna circuit 3 and 5 and carry out crimping.
Then, clean solder flux and carry out drying, thereby form antenna circuit 3 and 5.
(lift-launch of IC chip)
Then, carry IC chip 7.Its order is described below.
Use spreader between antenna circuit 3 and 5, to be coated with the solder(ing) paste that contains scolding tin and cohesive heat reactive resin (TYCAP-5401-11, TAMURA changes into corporate system, Sn-Bi is a solder(ing) paste) of ormal weight.Then, with two electrodes of IC chip 7 to be equipped on the substrate with the mode of antenna circuit 3 and 5 butts respectively temporarily.
Heated for 10 seconds down at 160 ℃, make the contained scolding tin of solder(ing) paste become fractional melting.Then, reduce the temperature to 130 ℃ and keep 30 minutes, so that the heat curing of cohesive heat reactive resin.
At this moment; During the cohesive heat reactive resin is uncured; The scolding tin composition of fusing concentrates on the near surface to the antenna circuit 3,5 of two electrodes of the good IC chip 7 of scolding tin composition wetting state and scolding tin system; Thereby form the part of scolding tin enrichment, on the other hand, in the middle of two electrodes of IC chip 7, form the part that the cohesive heat reactive resin becomes separating/enriching.After the cohesive heat reactive resin solidified, the electrode of IC chip 7 and antenna circuit 3,5 were connected by scolding tin, and IC chip 7 is bonded on the base material 2 through the cohesive heat reactive resin.
(test of IC tag)
Then, the IC tag of processing is tested.Particularly, except measuring impedance, (ウ エ Le キ ヤ Star ト corporate system EFG-310-01) has been measured communication distance, and (research institute's corporate system that three fields are wireless DMC-230S2) has been measured aerial resonant frequency to use grid-dipmeter also to use read write line.
(test result)
Measured the impedance of the IC tag that obtains, aerial resonant frequency and placed when aerial IC tag and communication distance when being installed in the metal and being on the object of matrix (below be designated as " on the metal ").
The test result of the IC tag that obtains is following.
(A) impedance: 14～16 Ω
(B) aerial resonant frequency: 14.5MHz
(C) communication distance: aerial: 30mm
On the metal: 0mm
As stated, aerial resonant frequency is higher than desirable 13.56MHz, thereby can guarantee the excellent communications distance aloft.But, when be installed in common communication can become the difficulty metal on the time, can't obtain the appropriate communication distance.
(the 5th embodiment)
(posting the making of the IC tag of high-permeability material sheet)
Shown in above-mentioned result, the IC tag that obtains in the 4th embodiment can't obtain the appropriate communication distance on metal.And, lay on the metal with after the identical paper of ferrite sheet thickness stated, more on it, can not increase communication distance with the IC tag setting.
So the back side of the IC tag that in the 4th embodiment, obtains (forming the relative face of face with antenna circuit) goes up the sheet (ferrite sheet of thickness 150 μ m, initial permeability 100) of the high-permeability material system of stickup, and tests.
(test result)
Test result is following.
(A) aerial resonant frequency: 12.8MHz
(B) communication distance: aerial: 20mm
On the metal: 10mm
Results verification is through enclosing this simple structure of ferrite sheet, even the IC tag that also can communicate by letter when having processed on being installed on metal overleaf.But owing to pasted ferrite sheet, aerial resonant frequency is lower than desirable 13.56MHz, thereby aerial communication distance is shorter than the 30mm of the 4th embodiment.
(the 6th embodiment)
This embodiment is the improvement to the 5th embodiment.
(having regulated the making of the IC tag of bridge position)
In the 5th embodiment; In order to make the aerial resonant frequency of pasting under the ferrite sheet state near desired 13.56MHz; As shown in Figure 7, the mode that is arranged at the inboard of enclosing outer Monday according to the periphery connecting portion with bonding line and antenna circuit is carried out hand soldering and crimping.Then, paste ferrite sheet, and test.
(test result)
Test result is following.
(A) aerial resonant frequency (before pasting ferrite sheet): 15.4MHz
Aerial resonant frequency (after pasting ferrite sheet): 13.7MHz
(B) communication distance: aerial: 35mm
On the metal: 20mm
Shown in above-mentioned result, in the 6th embodiment, can make the resonant frequency of pasting behind the ferrite sheet near desired value.Therefore, as stated, can make the air communication range recovery that is reduced to 20mm in second embodiment to 35mm.In addition, can make the communication distance on the metal increase to 20mm, be the twice of the 5th embodiment.Can confirm in this embodiment, so, can change the pattern of antenna circuit, from the beginning make once more and easily regulate resonant frequency, thereby can increase communication distance.
In addition; It in the example shown in Figure 7 the front end of a side (outside) of excision bonding line 8; And the periphery connecting portion of bonding line 8 and antenna circuit 3 moved to the inboard of enclosing outer Monday; But do not excise bonding line 8 a side front end and through with flatiron by be pressed in bonding line outer Monday circle the inboard come to connect again bonding line 8 and antenna circuit 3, also can access the result of same adjusting resonant frequency.
Can confirm that by the above IC tag of the present invention has simple structure, can be easily and regulate resonant frequency at an easy rate.
Claims (18)
1. Wireless IC tag; Have: electrical insulating property base material, antenna circuit, and the IC chip that is connected with said antenna circuit; Said antenna circuit is to use the material that has wetting state for the scolding tin that melts, and after forming the pattern identical with said antenna circuit on the surface of said electrical insulating property base material, uses the scolding tin of fusing to be formed on the said pattern; Said Wireless IC tag is characterised in that; Said antenna circuit is formed by scolding tin, and said IC chip is connected with said antenna circuit through scolding tin.
2. Wireless IC tag as claimed in claim 1 is characterized in that, said base material is made of paper.
3. according to claim 1 or claim 2 Wireless IC tag is characterized in that said IC chip is arranged on the antenna circuit face side of said base material.
4. according to claim 1 or claim 2 Wireless IC tag is characterized in that, posts the sheet that is made up of the high-dielectric constant material on the said base material.
5. Wireless IC tag as claimed in claim 3 is characterized in that, posts the sheet that is made up of the high-dielectric constant material on the said base material.
6. according to claim 1 or claim 2 Wireless IC tag is characterized in that, the base material of said base material for being made up of the high-dielectric constant material.
7. Wireless IC tag as claimed in claim 3 is characterized in that, the base material of said base material for being made up of the high-dielectric constant material.
8. method of making Wireless IC tag; It is characterized in that; The material that use has wetting state for the scolding tin that melts after forming the pattern identical with antenna circuit on the surface of electrical insulating property base material, uses the scolding tin of fusing on said pattern, to form said antenna circuit.
9. the method for manufacturing Wireless IC tag as claimed in claim 8 is characterized in that, said scolding tin for fusing has the resin of material for carrying out soldering of wetting state.
10. method of making Wireless IC tag is characterized in that having:
The material that use has wetting state for the scolding tin that melts after forming the pattern identical with antenna circuit on the surface of electrical insulating property base material, uses the scolding tin that melts on said pattern, to form the operation of said antenna circuit;
The operation of IC chip is set on said antenna circuit through the solder paste that contains scolding tin and cohesive heat reactive resin;
Make the operation of said solder paste heat fused under the temperature more than the melting point of scolding tin composition;
Through under the temperature below the melting point of said scolding tin composition, make the cohesive heat reactive resin generation heat curing of said solder paste said IC chip is connected in the operation of said antenna circuit.
11. a Wireless IC tag has: electrical insulating property base material, the bonding line that is arranged on the antenna circuit on the said substrate surface, the IC chip that is connected with said antenna circuit and is connected with said antenna circuit, it is characterized in that,
Said antenna circuit is to use the material of scolding tin with wetting state for fusing, after forming the pattern identical on the surface of said electrical insulating property base material, uses the scolding tin that melts to be formed on to form on the said pattern with said antenna circuit,
And said bonding line is coated by the resin combination insulation of evaporation under the temperature below the brazing temperature, decomposition or fusing,
And said bonding line is arranged on the substrate surface side that is provided with said antenna circuit with the mode that can be connected to the optional position on the said antenna circuit,
And then an end of said bonding line is connected in an end of said antenna circuit, and the other end is connected in the position that can access the regulation resonant frequency of said antenna circuit.
12. Wireless IC tag as claimed in claim 11 is characterized in that, said base material is made of paper.
13., it is characterized in that it is the coating of insulating of the insulating varnish of main body that said bonding line adheres to the urethane resin through baking on conductor like claim 11 or 12 described Wireless IC tags.
14. like claim 11 or 12 described Wireless IC tags, it is characterized in that, be formed with the layer that constitutes by high-permeability material on the said base material.
15. Wireless IC tag as claimed in claim 13 is characterized in that, is formed with the layer that is made up of high-permeability material on the said base material.
16., it is characterized in that the base material of said base material like claim 11 or 12 described Wireless IC tags for constituting by high-permeability material.
17. Wireless IC tag as claimed in claim 13 is characterized in that, the base material of said base material for being made up of high-permeability material.
18. a method of making Wireless IC tag is characterized in that having:
The material that use has wetting state for the scolding tin that melts after forming the pattern identical with antenna circuit on the surface of electrical insulating property base material, uses the scolding tin that melts on said pattern, to form the operation of said antenna circuit;
To be overlying on the operation that the bonding line that forms around the conductor is arranged at the substrate surface side that is formed with said antenna circuit by the resin combination insulating bag of evaporation under the temperature below the brazing temperature, decomposition or fusing;
Said conductor is connected in the operation of the assigned position of said antenna circuit through said bonding line is heated.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007127986A JP4674710B2 (en) | 2007-05-14 | 2007-05-14 | Manufacturing method of wireless IC tag |
| JP127986/2007 | 2007-05-14 | ||
| JP2007151880A JP4618690B2 (en) | 2007-06-07 | 2007-06-07 | Wireless IC tag and method of manufacturing wireless IC tag |
| JP151880/2007 | 2007-06-07 | ||
| PCT/JP2008/058697 WO2008143043A1 (en) | 2007-05-14 | 2008-05-12 | Wireless ic tag and method for manufacturing wireless ic tag |
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| Publication Number | Publication Date |
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| CN101548287A CN101548287A (en) | 2009-09-30 |
| CN101548287B true CN101548287B (en) | 2012-07-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200880000835XA Active CN101548287B (en) | 2007-05-14 | 2008-05-12 | Wireless IC tag and method for manufacturing wireless IC tag |
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| JP (1) | JP4674710B2 (en) |
| CN (1) | CN101548287B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9053402B2 (en) | 2007-05-14 | 2015-06-09 | Tateyama Kagaku Industry Co., Ltd. | Wireless IC tag and method for manufacturing wireless IC tag |
| JP5501114B2 (en) | 2010-06-25 | 2014-05-21 | 東洋アルミニウム株式会社 | Antenna circuit assembly for IC card / tag and manufacturing method thereof |
| EP2492847A1 (en) * | 2011-02-25 | 2012-08-29 | NagraID S.A. | Card comprising a transponder |
| KR101483553B1 (en) * | 2013-09-06 | 2015-01-21 | 주식회사 바른전자 | Semiconductor package comprising ferrite antenna for near filed communication and manufacturing method thereof |
| CN103761562B (en) * | 2014-01-06 | 2016-03-16 | 深圳市源明杰科技有限公司 | Double-interface IC card automatic producing device |
| WO2016158123A1 (en) * | 2015-03-31 | 2016-10-06 | ソニー株式会社 | Electronic circuit and communication device |
| SE541653C2 (en) * | 2017-11-03 | 2019-11-19 | Stora Enso Oyj | Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna |
| CN108336473A (en) * | 2018-02-06 | 2018-07-27 | 北京宏诚创新科技有限公司 | Copper-aluminium nanometer junction normal-temperature processing method |
| CN111191762B (en) * | 2019-12-30 | 2023-03-10 | 神思电子技术股份有限公司 | Method for improving performance of dinner plate RFID electronic tag |
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| CN101548287A (en) | 2009-09-30 |
| JP2008282320A (en) | 2008-11-20 |
| JP4674710B2 (en) | 2011-04-20 |
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