CN101872100A - Electronic ink display and manufacturing method thereof - Google Patents
Electronic ink display and manufacturing method thereof Download PDFInfo
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- CN101872100A CN101872100A CN 201010208772 CN201010208772A CN101872100A CN 101872100 A CN101872100 A CN 101872100A CN 201010208772 CN201010208772 CN 201010208772 CN 201010208772 A CN201010208772 A CN 201010208772A CN 101872100 A CN101872100 A CN 101872100A
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- electronic ink
- ink layer
- protective seam
- frame glue
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Abstract
The invention relates to an electronic ink display. The electronic ink display comprises an active element array substrate, an electronic ink layer, a protective layer and a sealant, wherein the surface of the active element array substrate is provided with a contact area and a sealant coating area, the electronic ink layer is arranged in the contact area and provided with a first side wall, and an included angle between the first side wall and the surface of the active element array substrate is more than or less than 90 degrees; the protective layer is arranged on the electronic ink layer and provided with a second side wall, and an included angle between the second side wall and the surface of the active element array substrate is more than or less than 90 degrees; and the sealant is arranged in the sealant coating area of the surface of the active element array substrate and surrounds the electronic ink layer and the protective layer. Furthermore, the invention also discloses a manufacturing method of the electronic ink display.
Description
Technical field
The present invention relates to a kind of display and manufacture method thereof, and relate in particular to a kind of electronic ink display and manufacture method thereof.
Background technology
Electronic ink display is a kind of by the charged dielectric distribution kenel of electric field controls, and then changes the reflectivity of viewing area to surround lighting, to produce the display of display effect.Based on its displaying principle, electronic ink display has the characteristics of bistable state (bistability) and illuminating source that need not be extra, thereby meets modern technologies need possess high electricity-saving characteristic to display requirement.
Fig. 1 illustrates the diagrammatic cross-section into existing electronic ink display.Please refer to Fig. 1, electronic ink display 100 comprises active component array base board 110, electronic ink layer 120, waterproof membrane 130 and frame glue 140.Electronic ink layer 120 is to be configured on the active component array base board 110, and 130 of waterproof membranes are to be configured on the electronic ink layer 120, be centered around that frame glue 140 around the electronic ink layer 120 is common to intercept extraneous steam and infiltrate in the electronic ink layer 120.Yet because the water proofing property of frame glue 140 is in general poor than waterproof membrane 130, therefore, extraneous steam tends to infiltrate to electronic ink layer 120 via frame glue 140.
For improving the water preventing ability of electronic ink display, existing a kind of way is to make frame glue 140 ride up on the waterproof membrane 130 around electronic ink layer 120, shown in Fig. 2 A, to increase extraneous steam infiltrates electronic ink layer 120 via frame glue 140 possible path.Another kind is made the waterproof membrane 130 that rule is a configuration large-size on electronic ink layer 120, shown in Fig. 2 B, to prolong extraneous steam infiltrates electronic ink layer 120 via frame glue 140 possible path.
Yet, above-mentioned two kinds of methods are all easily when forming frame glue 140, residual bubble 150 between frame glue 140 and electronic ink layer 120, not only can reduce the water preventing ability of electronic ink display 200, in the process of the follow-up frame glue 140 that is heating and curing, bubble 150 more can cause frame glue 140 to break by expanded by heating, thereby makes the technology yield of electronic ink display 200 descend.As desire to avoid generating bubble 150, and then need in the process that forms frame glue 140, to reduce gluing speed, with the evacuation time of increase frame glue 140, but can make the throughput rate of electronic ink display descend thus, and then improve the technology cost.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of electronic ink display, and it has good water preventing ability.
The present invention is also providing a kind of manufacture method of electronic ink display, with water preventing ability and the technology yield that improves electronic ink display simultaneously.
The present invention proposes a kind of electronic ink display, comprises active component array base board, electronic ink layer, protective seam and frame glue.The surface of active component array base board has contact region and frame glue applying area, and electronic ink layer promptly is to be configured in the contact region.And electronic ink layer has the first side wall, and the angle on the surface of itself and active component array base board is greater than or less than 90 degree.Protective seam is to be disposed on the electronic ink layer, and has second sidewall, and the angle between the surface of this second sidewall and active component array base board is greater than or less than 90 degree.Frame glue then is disposed in the frame glue applying area on surface of active component array base board, and around electronic ink layer and protective seam.
In one embodiment of this invention; the above-mentioned the first side wall and second sidewall are for trimming in fact in same plane; and above-mentioned frame glue is on above-mentioned protective seam, extends on the above-mentioned active component array base board along second sidewall of protective seam and the first side wall of electronic ink layer.
In one embodiment of this invention, the viscosity of above-mentioned frame glue between 20000 centipoises (cp) between 60000 centipoises (cp).
In one embodiment of this invention, above-mentioned electronic ink layer has first surface, and protective seam has second surface, and wherein the area of second surface is greater than the area of first surface, and first surface is contacted with the bottom surface of part.
In one embodiment of this invention, the viscosity of above-mentioned frame glue is between between the 10000cp to 70000cp.
The present invention proposes a kind of manufacture method of electronic ink display in addition, and it is that an active component array base board is provided earlier, and the surface of this active component array base board has contact region and frame glue applying area.Then, electronic ink layer and protective seam are cut, so that electronic ink layer has the first side wall, and protective seam has second sidewall.Come again, electronic ink layer be disposed in the contact region on surface of active component array base board so that its first side wall therewith the angle between the surface be greater than or less than 90 degree.Then, protective seam is disposed on the electronic ink layer, so that the angle between the surface of its second sidewall and active component array base board is greater than or less than 90 degree.Continue, in the frame glue applying area on the surface of active component array base board, form frame glue, so that this frame glue is around electronic ink layer and protective seam.
In one embodiment of this invention, the step of above-mentioned cutting electronic ink layer and protective seam comprises laser cutting method.
In one embodiment of this invention; above-mentioned electronic ink layer is in finishing cutting with in the cutting technique with protective seam; and the step that forms above-mentioned frame glue comprises that first self-insurance sheath top splashes into sticky material, so that sticky material self-insurance sheath upper edge second sidewall and the first side wall flow on the active component array base board.And then solidify this sticky material, with the frame glue of the frame glue applying area of the protective seam, the first side wall, second sidewall and the part that form the cover part.
In one embodiment of this invention, above-mentioned electronic ink layer has first surface, and protective seam has second surface, and electronic ink layer is to finish cutting in different cutting techniques with protective seam, and makes the area of the area of second surface greater than first surface.And, in the step that protective seam is disposed on the electronic ink layer, comprise the second surface of first surface with part contacted.
The present invention proposes a kind of electronic ink display again, comprises active component array base board, electronic ink layer, protective seam and frame glue.The surface of active component array base board has contact region and frame glue applying area, and electronic ink layer promptly is to be configured in the contact region.And electronic ink layer has the first side wall and first surface, and wherein the angle on the surface of the first side wall and active component array base board is greater than or less than 90 degree.Protective seam is to be disposed on the electronic ink layer, and has second surface, and the area at the end is greater than the area of first surface, and first surface contacts with the second surface of part.Frame glue then is disposed in the frame glue applying area on surface of active component array base board, and around electronic ink layer and protective seam.
In one embodiment of this invention, the viscosity of above-mentioned frame glue is between between the 10000cp to 70000cp.
The present invention more proposes a kind of manufacture method of electronic ink display, and it provides an active component array base board earlier, and the surface of this active component array base board has contact region and frame glue applying area.Then, electronic ink layer is cut, so that electronic ink layer has the first side wall.Come again, electronic ink layer be disposed in the contact region on surface of active component array base board so that its first side wall therewith the angle between the surface be greater than or less than 90 degree.Then, protective seam is disposed on the first surface of electronic ink layer, wherein protective seam has second surface, while the area of second surface is greater than the area of first surface.That is to say that first surface is to contact with the second surface of part.Continue, in the frame glue applying area on the surface of active component array base board, form frame glue, so that this frame glue is around electronic ink layer and protective seam.
In one embodiment of this invention, the step of above-mentioned cutting electronic ink layer and protective seam comprises laser cutting method.
Electronic ink display of the present invention adopts surface with relative active component array base board and the electric ink of angled side walls; with in the process of follow-up formation frame glue; make the liquid mucilage materials that drips from the protective seam top to flow to along the sidewall of electronic ink layer on the active component array base board; and then avoid between frame glue and electronic ink layer, producing bubble, to improve the technology yield and the product reliability of electronic ink display.
For purpose of the present invention, feature and advantage can be become apparent, embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 is the diagrammatic cross-section of existing a kind of electronic ink layer display;
Fig. 2 A and Fig. 2 B are the diagrammatic cross-section of existing another kind of electronic ink layer display;
Fig. 3 A to Fig. 3 D is the diagrammatic cross-section of electronic ink display in technology in one embodiment of the invention;
Fig. 4 is the diagrammatic cross-section of electronic ink display in the another embodiment of the present invention;
Fig. 5 is the diagrammatic cross-section of electronic ink display in the another embodiment of the present invention;
Fig. 6 is the diagrammatic cross-section of electronic ink display in the another embodiment of the present invention;
Fig. 7 is the diagrammatic cross-section of electronic ink display in the another embodiment of the present invention;
Fig. 8 is the diagrammatic cross-section of electronic ink display in the another embodiment of the present invention;
Fig. 9 is the diagrammatic cross-section of electronic ink display in the another embodiment of the present invention;
Figure 10 is the diagrammatic cross-section of electronic ink display in the another embodiment of the present invention.
Wherein, Reference numeral:
100,200,300,500: electronic ink display
110,310: active component array base board
120,320: electronic ink layer
130: waterproof membrane
140,340,540: frame glue
150: bubble
311: the contact region
312: the surface
313: frame glue applying area
322: the first side wall
324: first surface
330,530: protective seam
332,534: the second sidewalls
532: second surface
Embodiment
Fig. 3 A to Fig. 3 D is the diagrammatic cross-section of electronic ink display in technology in one embodiment of the invention.Please refer to Fig. 3 A, active component array base board 310 at first is provided, its surface 312 has contact region 311 and frame glue applying area 313.In the present embodiment, active component array base board 310 for example is thin film transistor (TFT) (thin film transistor, a TFT) array base palte, but the present invention is not as limit.
Then, shown in Fig. 3 B, cutting electronic ink layer 320 and protective seam 330, so that electronic ink layer has the first side wall 322 of inclination, and protective seam 330 has second sidewall 332 of inclination.Specifically, present embodiment for example is to finish the cutting process of electronic ink layer 320 and protective seam 330 with laser cutting method, but the invention is not restricted to this.And present embodiment is simultaneously electronic ink layer 320 and protective seam 330 to be cut in technology, so that the first side wall 322 of electronic ink layer 320 and second sidewall 332 of protective seam roughly trim in same plane.In addition, the electronic ink layer 320 of present embodiment can be electrophoretic layer (electro-phoretic layer), electric wettable layer (electro-wetting layer) or electronics powder fluid layer (quick response liquid powder layer), but the present invention is not as limit.
Come again, shown in Fig. 3 C, electronic ink layer 320 is disposed in the contact region 311 on surface 312 of active component array base board 310, and protective seam 330 is disposed on the electronic ink layer 320.What deserves to be mentioned is that because the electronic ink layer 320 of present embodiment is to carry out cutting process in same technology with protective seam 330, therefore, the first side wall 322 of electronic ink layer 320 can roughly trim in same plane with second sidewall 332 of protective seam 330.And the angle theta 1 between the frame glue applying area 313 on the first side wall 322 of present embodiment and surface 312 is greater than 90 degree, and the angle theta 2 between the frame glue applying area 313 on second sidewall 332 and surface 312 is also greater than 90 degree, but the present invention is not as limit.
Please more then with reference to Fig. 3 D, in the frame glue applying area 313 on the surface 312 of active component array base board 310, form frame glue 340 around protective seam 330 and electronic ink layer 320, this promptly roughly finishes electronic ink display 300.In the present embodiment, frame glue 340 for example be on the self-insurance sheath 330 in regular turn along second sidewall 332 and the first side wall 322 and extend on the active component array base board 310, and its viscosity for example is between 60000 centipoises (cp) between 20000 centipoises (cp).
What deserves to be mentioned is that the method that forms frame glue 340 for example is the liquid mucilage materials that drips from protective seam 330 tops, after solidify this mucilage materials again and make it become frame glue 340.At this; owing to the first side wall 322 of electronic ink layer 320 tilts with the surface 312 of all relative active cell array 310 of second sidewall 332 of protective seam 330; therefore, the liquid mucilage materials that drips from protective seam 330 tops can flow on the active component array base board 310 along the first side wall 322 and second sidewall 332.Thus, can avoid in the process that forms frame glue 340, between frame glue 340 and the first side wall 322 or second sidewall 332, producing bubble, and then can improving the technology yield and the product reliability of electronic ink display 300.
In other embodiments of the invention, as shown in Figure 4, also can cut electronic ink layer 320 and protective seam 330, and angle theta 1 and angle theta 2 are spent less than 90 simultaneously with another angle.When angle theta 1 is spent less than 90, the electronic ink layer 120 of electronic ink layer 320 and Fig. 1 in comparison, itself and extraneous apart from each other, therefore, extraneous steam is difficult to infiltrate to electronic ink layer 320 via frame glue 340.
Certainly, in other embodiments, electronic ink layer 320 also can be to finish cutting in different process with protective seam 330.In other words, angle theta 1 can be not equal to angle theta 2, and those skilled in the art can decide according to actual demand voluntarily, and the present invention does not impose any restrictions at this.
In addition, the present invention can also use the protective seam of different size and electronic ink layer to arrange in pairs or groups mutually, to improve the sealing of frame glue.Below will for embodiment cooperate graphic explanation it.Fig. 5 is the diagrammatic cross-section of electronic ink display in one embodiment of the invention.Please refer to Fig. 5; electronic ink display 500 comprises active component array base board 310, electronic ink layer 320, protective seam 530 and frame glue 540; the identical person of label wherein with previous embodiment; the element of its representative is also same or similar with previous embodiment, repeats no more the detailed structure of these elements herein.
Described as previous embodiment, the formation method of frame glue 540 also is the liquid mucilage materials that drips from active component array base board 310 tops, afterwards, solidify this mucilage materials again and make it become frame glue 540, and its viscosity for example is between 70000 centipoises (cp) between 10000 centipoises (cp).Wherein, the process of the liquid mucilage materials that drips above active component array base board 310, this liquid mucilage materials can flow to the first side wall 322 of electronic ink layer 320 because of the principle of capillarity along second sidewall 534 of protective seam 530.At this moment, because the angle theta 1 between the frame glue applying area 313 on the first side wall 322 and surface 312 is spent greater than 90, therefore, liquid mucilage materials carries over the first side wall 322 and flow on the active component array base board 310, and is cured as frame glue 540.Thus, can avoid between electronic ink layer 320 and glue frame 540, producing bubble.And, because the area of second surface 532 is greater than the area of first surface 324, thereby, can form the thicker frame glue 540 of thickness, and then prolong extraneous steam infiltrates electronic ink layer 320 via frame glue 540 possible path.
From the above, as long as the first side wall 322 is not orthogonal to the surface 312 of active component array base board 310, all can makes liquid mucilage materials carry over the first side wall 322 and flow on the active component array base board 310, to avoid producing bubble.Therefore, in another embodiment of the present invention, as shown in Figure 6, the angle theta 1 between the frame glue applying area 313 on the first side wall 322 and surface 312 also can be less than 90 degree.
Specifically; in the embodiment that Fig. 5 and Fig. 6 illustrated; adopt the protective seam 530 of size greater than electronic ink layer; so that increase the thickness of follow-up formed frame glue 540, but the present invention not this second sidewall 534 that limits protective seam 530 whether relatively active component array base board 310 surface 312 and tilt.In Fig. 5 and Fig. 6; second sidewall 534 of protective seam 530 is perpendicular to surface 312; but in other embodiments; angle theta 2 between the frame glue applying area 313 on second sidewall 534 of protective seam 530 and surface 312 can be spent (as shown in Figure 7) greater than 90 simultaneously with angle theta 1, also can spend (as shown in Figure 8) less than 90 simultaneously with angle theta 1.Certainly, angle theta 1 and angle theta 2 also can be respectively less than or greater than 90 degree, as Fig. 9 and shown in Figure 10.
In sum; electronic ink display of the present invention is to adopt surface with relative active component array base board and the electric ink of angled side walls; with in the process of follow-up formation frame glue; make the liquid mucilage materials that drips from the protective seam top to flow on the active component array base board, and then avoid between frame glue and electronic ink layer, producing bubble along the sidewall of electronic ink layer.And the present invention also adopts protective seam or the larger-size protective seam that has sloped sidewall equally, prolongs extraneous steam with the thickness that increases frame glue and infiltrates possible path to electronic ink layer, and then improve the water preventing ability of electronic ink display.Hence one can see that, and the present invention can improve the technology yield and the product reliability of electronic ink display.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (13)
1. an electronic ink display is characterized in that, comprising:
One active component array base board has a surface, and this surface has a contact region and a frame glue applying area;
One electronic ink layer is disposed in this contact region on this surface, and this electronic ink layer has a first side wall, and the angle between this first side wall and this surface is greater than or less than 90 degree;
One protective seam is disposed on this electronic ink layer, and this protective seam has one second sidewall, and the angle between this second sidewall and this surface is greater than or less than 90 degree; And
One frame glue is disposed in this frame glue applying area on this surface, and around this electronic ink layer and this protective seam.
2. electronic ink display according to claim 1; it is characterized in that; this the first side wall and this second sidewall are for trimming in fact in same plane, and this frame glue extends on this active component array base board along this second sidewall and this first side wall on this protective seam.
3. electronic ink display according to claim 2 is characterized in that, the viscosity of this frame glue is between 20000 centipoise to 60000 centipoises.
4. electronic ink display according to claim 1; it is characterized in that this electronic ink layer has a first surface, this protective seam has a second surface; and the area of this second surface is greater than the area of this first surface, and this first surface contacts with this second surface of part.
5. electronic ink display according to claim 4 is characterized in that the viscosity of this frame glue is between between the 10000cp to 70000cp.
6. the manufacture method of an electronic ink display is characterized in that, comprising:
One active component array base board is provided, and this active component array base board has a surface, and this surface has a contact region and a frame glue applying area;
Cut an electronic ink layer and a protective seam, this electronic ink layer has a first side wall, and this protective seam has one second sidewall;
This electronic ink layer is disposed in this contact region on this surface, so that the angle between this first side wall and this surface is greater than or less than 90 degree;
This protective seam is disposed on this electronic ink layer, so that the angle between this second sidewall and this surface is greater than or less than 90 degree; And
In this frame glue applying area on this surface, form a frame glue, so that this frame glue is around this electronic ink layer and this protective seam.
7. the manufacture method of electronic ink display according to claim 6 is characterized in that, the step of cutting this electronic ink layer and this protective seam comprises laser cutting method.
8. the manufacture method of electronic ink display according to claim 6 is characterized in that, this electronic ink layer is finished cutting with this protective seam in same cutting technique, and in the step that forms this frame glue, comprising:
Splash into a sticky material from this protective seam top, so that this sticky material flow on this active component array base board from this second sidewall of this protective seam upper edge and this first side wall; And
Solidify this sticky material, with this frame glue of this frame glue applying area on this surface of this protective seam, this first side wall, this second sidewall and the part that form the cover part.
9. the manufacture method of electronic ink display according to claim 6; it is characterized in that; this electronic ink layer has a first surface; this protective seam has a second surface; and this electronic ink layer is finished cutting with this protective seam in different cutting techniques; and make the area of the area of this second surface greater than this first surface, in the step that this protective seam is disposed on this electronic ink layer, comprise that this second surface with part contacts with this first surface.
10. an electronic ink display is characterized in that, comprising:
One active component array base board has a surface, and this surface has a contact region and a frame glue applying area;
One electronic ink layer is disposed in this contact region on this surface, and this electronic ink layer has a first side wall and a first surface, and the angle between this first side wall and this surface is greater than or less than 90 degree;
One protective seam is disposed on this first surface of this electronic ink layer, and this protective seam has a second surface, and the area of this second surface is greater than the area of this first surface, and this second surface of part is contacted with this first surface; And
One frame glue is disposed in this frame glue applying area on this surface, and around this electronic ink layer and this protective seam.
11. electronic ink display according to claim 10 is characterized in that, the viscosity of this frame glue is between between the 10000cp to 70000cp.
12. the manufacture method of an electronic ink display is characterized in that, comprising:
One active component array base board is provided, and this active component array base board has a surface, and this surface has a contact region and a frame glue applying area;
Cut an electronic ink layer, so that this electronic ink layer has a first side wall;
This electronic ink layer is disposed in this contact region on this surface, so that the angle between this first side wall and this surface is greater than or less than 90 degree;
One protective seam is disposed on the first surface of this electronic ink layer, this protective seam has a second surface, and the area of this second surface is greater than the area of this first surface, and this first surface is contacted with this second surface of part; And
In this frame glue applying area on this surface, form a frame glue, so that this frame glue is around this electronic ink layer and this protective seam.
13. the manufacture method of electronic ink display according to claim 12 is characterized in that, the step of cutting this electronic ink layer comprises laser cutting method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102087726A CN101872100B (en) | 2010-06-18 | 2010-06-18 | Electronic ink display and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102087726A CN101872100B (en) | 2010-06-18 | 2010-06-18 | Electronic ink display and manufacturing method thereof |
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| CN101872100A true CN101872100A (en) | 2010-10-27 |
| CN101872100B CN101872100B (en) | 2011-12-14 |
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| CN2010102087726A Active CN101872100B (en) | 2010-06-18 | 2010-06-18 | Electronic ink display and manufacturing method thereof |
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| CN (1) | CN101872100B (en) |
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| CN108241226A (en) * | 2016-12-23 | 2018-07-03 | 群创光电股份有限公司 | Show equipment |
| CN109445222A (en) * | 2019-01-02 | 2019-03-08 | 重庆京东方智慧电子系统有限公司 | A kind of display panel and display device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN101872100B (en) | 2011-12-14 |
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