CN102066038B - Decoupled, multiple stage positioning system - Google Patents

Decoupled, multiple stage positioning system Download PDF

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Publication number
CN102066038B
CN102066038B CN2008800054733A CN200880005473A CN102066038B CN 102066038 B CN102066038 B CN 102066038B CN 2008800054733 A CN2008800054733 A CN 2008800054733A CN 200880005473 A CN200880005473 A CN 200880005473A CN 102066038 B CN102066038 B CN 102066038B
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China
Prior art keywords
navigation system
platform
lens
order
air bearing
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CN2008800054733A
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CN102066038A (en
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M·T·寇摩斯基
K·布鲁兰德
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Electro Scientific Industries Inc
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Electro Scientific Industries Inc
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Priority claimed from US11/676,945 external-priority patent/US7603785B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Abstract

A split axis stage architecture is implemented as a multiple stage positioning system (10) that is capable of vibrationally and thermally stable material transport at high speed and rates of acceleration. A split axis design decouples stage motion along two perpendicular axes lying in separate, parallel planes. A dimensionally stable substrate (12) in the form of a granite, or other stone slab, or of ceramic material or cast iron, is used as the base for lower and upper stages. A rigid support structure allows for faster and more accurate positioning of axially adjustable optical components in a laser processing system. Vibrational and thermal stability is improved when an optics assembly (30) is housed in a rigid air bearing sleeve (214) that is mounted to a support structure (236, 240) above a specimen stage (26) of the multiple stage positioning system.

Description

Decoupling zero, multistage navigation system
Technical field
Content of the present invention relates to the sample system of processing, and particularly about in order to control processing unit (plant) with respect to the level platform structure (stage architecture) of the two dimension of target sample or three-dimensional localization.
Background technology
Be constructed to be used in wafer that use handles in the processing of semiconductor wafer grade and transport system and generally comprise the one-level platform, this grade platform has a fastening wafer so that the chuck of processing.Sometimes, this grade platform is static, and sometimes it is movably.Some application scenarios need make grade platform one dimension, two dimension or three-dimensional coordinate neutral line ground in the cartesian corrdinate system under the situation that rotation is arranged or do not have to rotate mobile.If the very most of the time of total process time is to expend aiming at and transporting wafer, then the speed of level platform motion may be arranged the output of entire wafer processing platform.
For the application that comprises that optics processing is handled, a portable optical module can be installed on the wafer surface top, thus required wafer is transported distance and be reduced to minimum level.The main direction that moves of level platform is called as " main shaft ", then is called " minor axis " perpendicular to the level platform direction of motion of this main direction.Fixing want the chuck of processed wafer or sample can be mounted to for along the major axis stage of main axle moving, be used for the minor axis level platform that moves along minor axis or among the resting position below main shaft and the minor axis.Major axis stage can short supporting axle level platform, and perhaps they can be independent of one another.
Along with the size decreases of electronic circuit, the level platform design of this kind optical system becomes more crucial.Considering of a level platform design is because wafer chuck and the vibration of optical module and the impact of the caused processing quality of heat endurance.Laser beam is subjected in the continuously adjustable situation therein, and the existing structure that supports laser module is too flexible, and can't keep required measure of precision.And along with diminishing of circuit size, it is more important that the pollution of particulate also becomes.
Summary of the invention
A kind of " split axle level platform (split axis stage) " structure is implemented to a kind of multi-stag navigation system.In preferred embodiments, this navigation system is in order to support laser optic assemblies and workpiece, and this workpiece has for laser beam surface of carrying out Laser Processing incident thereon.This multi-stag navigation system can transported material with vibration and thermally-stabilised mode at a high speed with under the high acceleration.The design of " split axle " is moved along the level platform that is arranged in separately, two vertical axis decoupling zeros (decouple) of parallel plane drive.In preferred embodiments, motion in a horizontal plane relative to each other orthogonally between a mobile specimen stage (main shaft or lower stage) and the scanning optical component level platform (minor axis or upper stage) quilt separated.
Have granite or other slabstone or ceramic material, cast iron or Anocast for example TMThe dimensionally stable base material of condensate composite plate form can be used as the pedestal of lower stage and upper stage.Plate is preferably by the material with similar thermal coefficient of expansion with the level platform and makes, and can play favourable reaction to variations in temperature with coordinated mode to cause system.Base material is made that by accurately cutting (" polish ") its higher level's platform surface and some positions on subordinate platform surface are smooth and parallel to each other.In preferred embodiments, the below guide assembly of guiding the lower stage that carries sample fixing chuck is coupled to the surface below of base material.The top guide assembly of guiding the upper stage of carrying the laser beam focal region RACS is connected to the surface, a top of base material.Moving of the linear motor control upper stage of locating along the adjacent rail bar of guide assembly and lower stage.
Abundant and base material that structure is hard is isolated and the motion of stabilized lasers optical module and sample, absorb vibration and make that acceleration and deceleration are more smooth-going, and this is because this supporting construction is just very hard originally.The narrow interval of the stiffness of base material and level platform axis of movement can cause higher frequency resonance, and is having less error along moving of all three axis.Base material is also by providing heat endurance as acting on as heat sink.And because system is designed to very small and exquisite structure, it is to be made of less material, and therefore is not easy to expand when being subjected to heating.The centre oval slot cut portion branch of base material is exposed under the laser beam sample of below, and allows laser optic assemblies to move both vertically to pass through base material.Otherwise, except the regional area that is subjected to Laser Processing, sample is subjected to the protection of base material, makes it avoid touching the influence of the particulate that pinnacled motion produces.
The laser beam focal region RACS is supported on the lower stage top, and comprises the optical module that can vertically adjust that is positioned on the rigid air bearing sleeve, and the supported structure of this air bearing sleeve is installed on upper stage.The rigidity of supporting construction can allow to move both vertically along the quicker and more accurate of beam axis.The inner surface of sleeve is as outer shroud, and therefore the outer surface of lens forms the air bearing of the vertical movement of the focus area of guiding laser beam then as interior ring.By one at the lens injector of sleeve top end and initial moving both vertically, this lens injector provides priming power to optical module, adjust optical module thus with respect to the height of the workpiece on the lower chuck, and when so carrying out, this injector is adjusted laser with respect to the focus area of working surface.One is hard and is that submissive isolation bending device relaxes the excessive movement from the lens injector of optical module in a horizontal plane along beam axis.
The design of split axle level platform can be applied to comprise that stripping and slicing, part are pruned, fusion processing, inking, by on employed many platforms in printed wiring board (PWB), wiring, inspection and the metological semiconductor machining of boring.The advantage that produces by such designing institute also is very useful for whole mechanical cutting tool.
From the detailed description of following preferred embodiments of carrying out with accompanying drawing, can know other viewpoint of the present invention and advantage more.
Description of drawings
Fig. 1 is the isometric drawing of decoupling zero, multistage navigation system.
Fig. 2 is that the part of Fig. 1 navigation system is decomposed isometric drawing, and it shows that top and lower stage are installed in for example base material of the dimensionally stable of slabstone when this set of systems gets togather.
Fig. 3 is the isometric drawing of Fig. 1 navigation system, and upper stage and higher level's platform driving element of scanning lens supported in its demonstration.
Fig. 4 is the isometric drawing of Fig. 1 navigation system, and lower stage and the lower stage driving element of sample fixing chuck supported in its demonstration.
Fig. 5 A, Fig. 5 B and Fig. 5 C show substituting guide assembly structure, be used for the upper stage of navigation system of mobile Fig. 1 to Fig. 4 and lower stage wherein one or the two.
Fig. 6 is the exploded view of the preferred embodiments of laser beam focal region RACS, and it comprises an air bearing sleeve assembly, and this assembly covers the one scan lens and guides its vertical (Z axle) motion.
The specific embodiment
Fig. 1 and Fig. 2 show a decoupling zero, multistage navigation system 10, and in preferred embodiments, this navigation system is supporting the part of a laser-processing system, and this laser beam is propagated and is incident on the target sample by this laser-processing system.Navigation system 10 comprises the base material 12 of a dimensionally stable, and this base material is to be made by slabstone, preferably by granite or ceramic material, cast iron or Anocast for example TMThe polymer composites plate formed.Base material 12 has first or the main surface 14 of upper flat and the main surface 16 of second or lower flat with a stepped recess 18. Main surface 14 and 16 comprises surperficial position, and these surperficial positions are planes parallel to each other and are adjusted to present flatness in about ten microns margins of tolerance with parallel.
Surperficial position and first guide assembly 20 on main surface 14, top couple, in order to the motion along a first axle laser optic assemblies level platform of guiding (stage) 22.Surperficial position and second guide assembly 24 on main surface 16, below couple, in order to transversely in the motion of the specimen stage 26 of second axis guiding of first axle.Optical module level platform 22 supports a laser beam focal region RACS 28, and this subsystem comprises the scanning lens 30 that main surperficial 16 belows, a below in base material 12 hang downwards.Specimen stage 26 supports a sample fixing chuck 32. Level platform 22 and 26 guiding movement can make scanning lens 30 move with respect to the sample (not shown) lip-deep laser light light beam Working position of 32 fixings of chuck.
In preferred embodiments, base material 12 is placed on the appropriate location, make main surface 14 and 16 define the horizontal plane that separates, and guide assembly 20 and 24 is positioned such that first axle is perpendicular to one another with second axis, defines separately Y-axis and X-axis thus.But this minute axle construction decoupling zero (decouple) is moved along X-axis and Y-axis, the positioning control of passing through to allow than lower-mobility simplification laser beam and chuck 32.
Fig. 3 is display optical component level platform 22 at length, and it is with first guide assembly, 20 operations shown in Figure 2.First guide assembly 20 comprises two guide rail that separate 40 that are fixed in the support portions on main surface 14, top, and the U-shaped guiding block 42 on two lower surface 44 that are supported on optical module level platform 22.Each guiding block 42 is assemblied on corresponding wherein rail bar 40, and reacts on the motive force that applies and slide along this rail bar.A motor driver that is used for optical module level platform 22 comprises a linear motor 46, and this linear motor 46 is installed on the main surface 14, top and along the total length of each guide rail 40 and installs.Linear motor 46 applies motive force and promotes its corresponding guiding block 42, is used for producing slip along its corresponding guide rail 40.Each linear motor 46 comprises a U channel magnet tracks 48, a plurality of magnet 50 of separated linear array that fixing disposes along the total length of guide rail 40.An injector coil block 52 that is positioned between the magnet 50 of this linear array is connected to the lower surface 44 of optical module level platform 22, and constitutes the mobile member in order to the linear motor 46 of moving optical assembly level platform 22.The linear motor 46 that is fit to is that the model that can obtain from Pittsburgh, Binzhou aeronautical technology registered company is the linear motor of MTH480.
Every pair of guide rail 40-guiding block 42 of first guide assembly 20 shown in Figure 2 is rolling element bearing assemblies.The replacement scheme that is used for guide assembly 20 comprises flat air bearing or vacuum preload air bearing.The surperficial position that use any air bearing all must be able to remove each guide rail 40, to expose top surface 14 is to form guidance surface and to replace each dress to be attached to the guiding block 42 of the lower surface 44 of laser optic assemblies level platform 22 with guidance surface or the bearing surface of bearing.Vacuum preload air bearing with a pressure port and a vacuum port will remain on itself them the below simultaneously and their itself be lifted from guidance surface.Use vacuum preload air bearing only to need a flat guidance surface, otherwise use bearing preload in opposite directions then to need two flat parallel guidance surfaces.Can obtain suitable air bearing from Binzhou Aston city knob prestige machine parts registered company.Therefore, according to the type of employed guide assembly, the surperficial position on main surface 14, top can represent guide rail contact surface or bearing surface noncontact guidance surface are installed.
Be fixed to the lower surface 44 of optical module level platform 22 and be oriented to and comprise a plurality of position sensors in abutting connection with a pair of encoder heads 60 of different guiding blocks 42, the yaw angle (yaw angle) of its measurement optics component level platform 22 and the distance of advancing.Be placed on position sensor near guide rail 40, guiding block 42 and drive at different levels 22 and 26 linear motor 46 places, can guarantee to have effective loop formula FEEDBACK CONTROL of minimum resonance effect.A pair of block member 62 reacts on limit switch and limits the travel distance of guiding block 42, and limit switch is included within the encoder heads 60 and is started by the magnet (not shown) that is affixed to base material 12.A pair of damper (dashpot) 64 suppresses and stops the motion of optical module level platform 22, breaks away from guide rail 40 to prevent it from excessively moving.
Provide an opening between guide rail 40 and along the oval slit 66 that is formed in the base material 12 of its total length, when optical module level platform 22 moved along guide rail 40, scanning lens 30 can be advanced in this opening.Be formed on a pair of through hole 68 in stepped recess 18 zones in the base material 12 can provide operating personnel from surface, top 14 to encoder heads 60 maintenance entrance, keep its alignment situation thus.
Fig. 4 shows the specimen stage 26 of being combined with mode of operation with second guide assembly 24 of Fig. 2 in detail.Second guide assembly 24 comprises guide rail, U-shaped guiding block, linear motor, U channel magnet tracks, magnet, injector coil block and encoder, these elements all corresponding to and by above at first guide assembly, 20 employed similar elements symbols.The element that the element of linear motor 46 and second guide assembly 24 and second guide assembly 24 support is installed on the surface 70 of a specimen stage bed 72.
Level platform 22,26 and the mechanical arrangements of motor 46 cause the pitching of grade platform 22 and 26 and rolling to reduce, and the accuracy of enhancement high-speed motion.Motor 46 symmetries are placed on the control that to promote deviation angle on the two opposite sides of grade platform 22 and 26.Place motor 46 along the side of level platform 22 and 26 and the heat of critical elements and position sensor can be done the degree that disorderly be reduced to minimum, this point with motor is placed on grade platform under opposite.
Second guide assembly 24 is assembled with the specimen stage 26 that is supporting chuck 32 and is fixed among the stepped recess 18.The surface 70 of specimen stage bed 72 is fixed to the surperficial position 74 that nestles up main surface 16, below and in abutting connection with the wideer lower portion of stepped recess 18, and chuck 32 is positioned in the inside line below of the stepped recess 18 on main surface 16, below, and thereunder react on the motive force that linear motor 46 applies and move, and linear motor makes specimen stage 26 move along second guide assembly 24.A pair of block member 76 reacts on limit switch and limits the travel distance of guiding block 42, and limit switch is included within the encoder heads 60 and is started by the magnet (not shown) that is affixed to base material 12.A pair of damper 78 suppresses and stops the motion of specimen stage 26, to prevent its excessively mobile guide rail 40 that breaks away from.
First replacement scheme for guide assembly 24 is magnetic preload air bearing, and it uses specimen stage bed 72 as pedestal or guide groove.Use magnetic preload air bearing must remove each guide rail 40, expose the surperficial position of specimen stage bed 72, and remove each guiding block 42, lower surface in specimen stage 26 provides the installation space that air bearing is used, and its (porous) bearing surface is oriented to respect to the surperficial position that exposes.
Fig. 5 A is the schematic diagram that is presented at the placement situation of two magnetic preload air bearing 100 in this first alternative arrangements mode.On the surface 70 in the space that steel plate or steel lamination thin-slab structure 102 are fixed between driver coil pack 52, and extend along the total length of driver coil pack 52.Two flat air bearing 100 that separate are fixed to the facial position 104 of corresponding tables of the lower surface 106 of specimen stage 26, and extend along the length of linear motor 46.Suitable air bearing can be the flat bearing series part numbers of the silicon carbide porous media S1xxxxx that obtains from Binzhou Aston city knob prestige machine parts registered company.Flaky magnet 108 is positioned in the space between the air bearing 100 on the lower surface 106 of specimen stage 26, and in the space alignment steel plate 102, make magnet 108 and the exposed surface of steel plate 102 to face with each other.Magnetic attracting force promotes flaky magnet 108 downwards towards steel plate or steel lamination thin plate 102, shown in the arrow that refers among Fig. 5 A down.And the clean power of air bearing 100 upwards promotes specimen stage 26 away from surface 70 from specimen stage bed 72, shown in two among Fig. 5 A parallel arrows that upwards refer to.Apply simultaneously in the space 110 between opposite magnetic force and the forced air bearing guide groove 114 on (porous) bearing surface 112 of air bearing 100 and surface 70 and produce air film.The weight that the effect of increasing power of air bearing 100 equals specimen stage 26 adds the twice of summation of the magnetic force of magnet 108.Linear motor 46 applies propulsive force, and produces almost the moving of zero friction of specimen stage 26 along the length of bearing guide groove 114.
Second replacement scheme about guide assembly 24 is vacuum preload air bearing, and it uses specimen stage bed 72 as pedestal or guide groove.Be similar to above-mentioned first replacement scheme about guide assembly 20, use vacuum preload air bearing must be able to remove each guide rail 40, expose the surperficial position 114 of specimen stage bed 72, and remove each guiding block 42, lower surface 106 in specimen stage 26 is provided for installing the space that vacuum preload air bearing is used, and its pressure platform is positioned to respect to exposed surface position 114.
Fig. 5 B is the schematic diagram that is presented at the placement situation of two vacuum preload air bearing 120 in the second alternative arrangements mode.Two vacuum preload air bearing 120 that separate are fixed to the surperficial position 104 of the correspondence of specimen stage 26 lower surface 106, and extend along the length of linear motor 46.Suitable air bearing is can be from the serial part numbers S20xxxx of the vacuum preload air bearing that knob prestige machine parts registered company in Binzhou Aston city obtains.Vacuum preload bearing 120 keeps down itself them simultaneously and lifts bearing guide groove 114 on the surface 70 with their itself.Each vacuum preload bearing 120 has and is divided into the platform position 122a that separates and the pressure platform of 122b.One vacuum area 124 is arranged between this platform position 122a and 122b.Apply simultaneously and the pressure of air-distribution and vacuum pressure produce air film in the pressure platform position 122a of vacuum preload air bearing 120 and the space 126 between the bearing guide groove 114 on 122b and the surface 70.Linear motor 46 applies propulsive force, and produces almost moving of zero friction of specimen stage 26 along the length of bearing guide groove 114.
The 3rd replacement scheme about guide assembly 24, under the situation that lacks specimen stage bed 72, must use the magnetic preload air bearing of first replacement scheme, or the vacuum preload air bearing of second replacement scheme and each guide rail 40 and each guiding block 42.
Fig. 5 C is that demonstration is traveled by the schematic diagram of the specimen stage 26 on magnetic preload air bearing or vacuum preload air bearing 140 along the lower surface 142 of base material 12.When base material 12 was horizontal, magnetic preload or vacuum preload air bearing 140 developed enough active forces and overcome gravity own when specimen stage 26 is advanced along lower surface 142.The person familiar with the technology is appreciated that, can adopt laser optic assemblies level platform 22 similarly, and it is traveled by on magnetic preload air bearing or vacuum preload air bearing along the main surface 14 of going up of base material 12.Level platform structure can use mechanical linear guide member to replace above-mentioned air bearing.Can in this navigation system design, implement the device that other measuring position is used, for example interferometer.
The quality of base material 12 is enough to the quality of decoupling zero optical module level platform 22 and the quality that specimen stage 26 comprises the sample that is mounted thereon, and makes the guiding movement of one of them grade platform 22 and 26 can provide another grade platform insignificant motive force.Very little along the moving level platform 22 of X-axis and y-axis shift and 26 quality, can produce high acceleration and high-speed processing processing thus, and be limited in the linear motor 46 and produce heat.Because the mass centre of the mass centre of laser beam focal region RACS 28 alignment optics component level platform 22 is so the interference in optical module level platform 22 can being moved drops to minimum degree.
Laser optic assemblies level platform 22 has an opening 200 that holds RACS 28, and this RACS comprises an air bearing assembly 202 that contains scanning lens 30.When laser beam was incident in the finished surface of the target sample that supports on the specimen stage 26 along beam axis 206 (it is the optical axial of scanning lens 30) propagation and by scanning lens 30 substantially, RACS 28 can be controlled the axial location of scanning lens 30 formed laser beam focal region.
The assembly of the more detailed demonstration RACS 28 of Fig. 6 and the installation situation on laser optic assemblies level platform 22 thereof.With reference to figure 6, RACS 28 comprises a lens actuator assembly 210, and this lens actuator assembly is coupled to the scanning lens 30 in air axle bush 214 inside that are contained in air bearing assembly 202 by a yoke assembly 212.Suitable air axle bush is can be from the air axle bush dash number S307501 of Binzhou Aston city knob prestige machine parts registered company acquisition.Preferably the lens actuator assembly 210 of sound coil actuator applies one propulsive force by this yoke assembly 212, these propulsive force motion scan lens 30 and thus the focus area of mobile laser beam to along the chosen position of beam axis 206.
Sound coil actuator 210 comprise one substantially columniform shell 230 and one by a formed annulus 232 of magnetic core that is wound with copper cash.Cylinder blanket 230 aligns coaxially with annulus 232, and annulus 232 can react on the control signal (not shown) that is applied to sound coil actuator 210 and axially move into and shift out shell 230.Preferable sound coil device 210 is the LA 28-22-006Z actuators from the BEI Kimco Magnetics acquisition of California Vista.
Annulus 232 extends through a circular open 234 in the sound coil bridge material 236, this bridge material has the side member in opposite directions 238 that rests on the column 240 (Fig. 1), these columns are installed on the laser optic assemblies level platform 22, in order to laser beam focal region RACS 28 is provided support.Sound coil bridge shape thing 236 comprises a hole 244 in each of two side projections 242 in opposite directions, this hole 244 contains a tubular shell 250, and pole 252 extends through this tubular shell from the surface, top 254 of guide support 256.Each pole 252 has a free end 258.Guide support 256 surface 254 above it has an annular table abutment 260, and annulus 232 rests on this pedestal.Two mutually linear ball axle bush 264 folded, that axially align be assemblied in the tube-like envelope 250, tube-like envelope is contained in each hole 244 of side projection 242 of sound coil bridge material 236.The free end 258 of the pole 252 by ball axle bush 264 is covered by pole anchor clamps 266, in order to the hard block of the lower limit of advancing of annulus 232 to be provided along beam axis 206.
Shell 230 has a circular open 270, its be positioned to the opening 234 of the center of annulus 232, sound coil bridge material 236, and the center of the ring-type pedestal 260 of guide support 256 align coaxially.One cored steel axle 272 extends through the opening 270 of shell 230, and a hexagonal (hexagon)nut 274 connects cored steel axle 272 and a flexible tubular steel member 276 that is coupled to yoke assembly 212 as described further below to axially align mode.Hexagonal (hexagon)nut 274 is oriented to contact the surface below 278 of annulus 232, drives flexible steel member 276 in order to the axial turnover campaign that reacts on annulus 232 along a driving shaft or Z axle 280.Cored steel axle 272 by a coil spring 282 the center and along the axis of this coil spring 282, this coil spring 282 is limited between the helical spring holder 286 at the top surface 284 of shell 230 and free end 290 places that is fixed in cored steel axle 272.Under the situation of the control signal that is not applied to sound coil actuator 210, coil spring 282 is biased into annulus 232 along its mid point along the stroke of Z axle 280.
Yoke assembly 212 comprises yoke side plate 300 (only showing among the figure) in opposite directions, and these yoke side plates at one end portion 302 places are fixed on the surface 304 of a yoke ring 306, and 308 places are fixed to the rectangle yoke support 310 of a multilayer in the other end.The scanning lens 30 that is formed with cylindrical periphery 312 and has an annular top flange 314 is installed in the yoke assembly 212, makes top flange 314 rest on the surface 304 of yoke ring 306.Be included in the interior ring of the scanning lens 30 formation air bearing assemblies 202 in air axle bush 214 inside, the surface, inside 316 of air axle bush 214 then forms the outer shroud of air bearing assembly 202.Implementing air bearing assembly 202 has increased the rigidity of scanning lens 30 in X-Y plane, but allows scanning lens 30 to move along the Z axle in a kind of mode very smooth-going, that be controlled.
Flexible steel member 276 has a free end 320, and this free end is assemblied in the depression 322 in the surface, yoke support 310 top 324, in order to yoke support 310 is moved along Z axle 280, and thus can be along beam axis 206 motion scan lens 30.An encoder heads support 326 that fixes encoder 328 and be attached to sound coil bridge material 236 is cooperated with a fixing encoder scale and this body support frame of encoder 330 of being attached on the guide support 256, in order to utilize the light diffraction principle measure guide support 256 react on annulus 232 motion and with respect to the displacement of sound coil bridge material 236.Because flexible tubular steel member 276 is affixed to annulus 232, so the displacement of measuring can represent scanning lens 30 along the position of beam axis 206.
The quarter-wave plate 340 that is fixed in the appropriate location on the installing ring 342 is located between the top flange 314 of the surface below 344 of rectangle yoke support 310 and scanning lens 30.Be affixed to the light beam deviator 346 of optical module level platform 22 (Fig. 3), for example piezoelectricity fast steering mirror is located between rectangle yoke support 310 and the quarter-wave plate 340.Fast steering mirror 346 is accepted along what beam axis 206 was propagated to enter laser beam 348, and guides this laser beam 348 by quarter-wave plate 340 and scanning lens 30.Linear Polarised Laser light beam that 340 pairs of quarter-wave plates enter is real to add circular polarization, and on the select location of the laser beam of fast steering mirror 346 guiding circular polarization with the finished surface that is incident in a target sample that is supported on the specimen stage 26.When fast steering mirror 346 was in its neutral position, the propagation path of Z axle 280, beam axis 206 and laser beam 348 was on same straight line.When operation fast steering mirror 346, the propagation path of laser beam 348 beam axis 206 that aligns substantially.
Flexible steel member 276 is rigidity in Z-direction, is submissive on the XY plane still.These character of flexible steel member 276 make it can be as acting on as the buffer, and the guiding action that will contain the air bearing assembly 202 of scanning lens 30 is kept apart from the guiding action of the lens actuator assembly 210 of motion scan lens 30.
Lens injector assembly 210 has center of gravity with air bearing assembly 202, and locatees along the Z axle.The sound coil bridge material 236 of lens injector assembly 210 has two recessed positions 350, can suitably determine the degree of depth at recessed position and the size of sectional area, to reach axially aligning of two centers of gravity.The alignment of this kind center of gravity can be eliminated the moment arm in the control system 28, and helps to reduce the tendency of the low resonant frequency vibration that exists in existing cantilever beam design thus.
Several embodiment of possible type that the laser-processing system of navigation system 10 wherein can be installed comprise semiconductor wafer or the little processing of other samples, stripping and slicing and welding processing treatment system.In wafer stripping and slicing system, laser beam 348 moves along the delineation position on the wafer surface.In wafer welding processing treatment system, pulsed laser beam 348 can move with respect to the wafer surface position of fuse, in order to shine these positions, makes that laser pulse can be local or fully remove the fuse material.
What know is for the person familiar with the technology, clearly under the prerequisite that does not deviate from the principle of the invention, can carry out many variations to the details of above-mentioned example.Therefore, scope of the present invention should be defined by claim.

Claims (34)

1. a decoupling zero, multistage navigation system, it comprises:
The base material of one dimensionally stable, it has a base material thickness and relative first and second parallel in fact main surperficial position;
One first guide assembly, it is coupled to the first main surperficial position and is oriented to guide first order platform moving along first axle in order to reacting on the major drive;
One second guide assembly, it is coupled to the second main surperficial position and is oriented to react on second motive force and guides second level platform along the moving of second axis, and second axis and relative to each other laterally configuration of first axle; And
This this first and second grade platform of dimensionally stable base material decoupling zero causes the guiding movement of first and second grade platform that moving of negligible error can be provided in the direction along base material thickness.
2. navigation system according to claim 1, it more comprises:
One first motor driver combines with this first guide assembly, so that the major drive that provides first order platform to react operatedly; And
One second motor driver combines with this second guide assembly operatedly, so that second motive force that provides second level platform to react.
3. navigation system according to claim 2, wherein, each comprises a linear motor first and second motor driver.
4. navigation system according to claim 2, wherein, this first motor driver comprises two motors that are positioned on the first guide assembly either side, in order to apply first propulsive force to first order platform, and guiding first order platform moves along first axle, and wherein, this second motor driver comprises two motors that are positioned on the second guide assembly either side, in order to apply second propulsive force to second level platform, and guide its second level platform moving along second axis.
5. navigation system according to claim 4, wherein, this first order platform has one first mass centre, and wherein this first motor driver comprises two motors that are positioned on the first guide assembly either side, in order to apply first propulsive force of passing through first mass centre of first order platform in fact, in order to guide first order platform moving along the first axle guiding.
6. navigation system according to claim 5, wherein, this second level platform has one second mass centre, and wherein this second motor driver comprises two motors that are positioned on the second guide assembly either side, in order to apply second propulsive force of passing through second mass centre of second level platform in fact, and in order to guide second level platform moving along the guiding of second axis.
7. navigation system according to claim 4, it more comprises one first pair of position sensor, be positioned close to the different motor in two motors of first motor driver, and one second pair of position sensor, be positioned near the different motor in two motors of second motor driver.
8. navigation system according to claim 7, wherein, position sensor and motor are cooperated together, in order to the FEEDBACK CONTROL that is located in jointly is provided.
9. navigation system according to claim 7, wherein, the motor of position sensor and each first and second motor driver is cooperated together, in order to adjust the three-dimensional motion of first order platform and second level platform respectively.
10. navigation system according to claim 1, wherein, one of them guide assembly of first and second guide assembly comprises an air bearing that is connected with the air bearing guide groove.
11. navigation system according to claim 10, wherein, this air bearing is the type of vacuum preload.
12. navigation system according to claim 10, wherein, this air bearing is the type of magnetic preload.
13. navigation system according to claim 10, wherein, this air bearing guide groove is a surface of this base material.
14. navigation system according to claim 13, wherein, when the surface of this base material is in horizontal arrangement, constitute a below substrate surface, and air bearing develops and enough active forces, so that one of them that overcomes first and second grade platform includes the gravity on the level platform of air bearing.
15. navigation system according to claim 1, wherein, this base material comprises a slabstone.
16. navigation system according to claim 15, wherein, this slabstone is formed by granite.
17. navigation system according to claim 1, wherein, this base material comprises the plate of a ceramic material.
18. navigation system according to claim 1, wherein, this base material comprises one by the made plate of cast iron.
19. navigation system according to claim 1, wherein, this base material comprises one by the made plate of condensate composite.
20. navigation system according to claim 1, wherein, this base material is constructed as in order to operational space to be provided, and it provides the guiding movement of first and second grade platform.
21. navigation system according to claim 20, wherein, this base material comprises a slit, and one is connected to the wherein element of one-level platform of first and second grade platform operatedly, moves through this slit among the operation with another grade platform of described first and second grades of platforms links.
22. navigation system according to claim 1, wherein,
Described first and second grade platform supports the element of a laser-processing system, this first order platform supports the scanning lens with a beam axis, and one laser beam along one align substantially this beam axis propagation path and propagate by this scanning lens, and this second level platform supports the chuck of a fixing sample; And
The guiding movement cooperation of described first and second grade platform is to move this beam axis with respect to the laser beam Working position on the sample surface of this chuck institute fixing.
23. navigation system according to claim 22, wherein, this laser-processing system is carried out little processing of this sample.
24. navigation system according to claim 1, wherein,
Described first and second grade platform supports the element of a semiconductor wafer stripping and slicing system, and this first order platform supports a cutter sweep, and this second level platform supports the chuck of a fixing wafer; And
The guiding movement system cooperation of described first and second grade platform is moved this cutter sweep with the delineation of the wafer on the wafer surface of this chuck institute fixing position, so that with this wafer stripping and slicing.
25. navigation system according to claim 1, wherein,
Described first and second grade platform supports the element of a semiconductor wafer welding system of processing, and this first order platform supports a wafer welding processing unit (plant), and this second level platform supports the chuck of a fixing semiconductor wafer; And
The guiding movement cooperation of described first and second grade platform is in order to move this wafer welding processing unit (plant) with respect to the posetionof weld on the semiconductor wafer surface of this chuck institute fixing; And
The guiding movement cooperation of described first and second grade platform is in order to move this beam axis with respect to the laser beam Working position on the sample surface of this chuck institute fixing.
26. navigation system according to claim 25, wherein, this wafer welding processing unit (plant) is carried out semiconductor wafer welding irradiation.
27. navigation system according to claim 22, wherein, this scanning lens forms the optical module of a part, and this optical module defines first mass centre with this first order platform, and wherein this beam axis is consistent each other with first mass centre.
28. laser-processing system, wherein, one laser beam is along beam axis propagation and by lens, be used for being incident on a finished surface that is installed in the target sample on the support, this lens form the focus area of laser beam, and this support is connected on the multiaxial type navigation system operatedly, and this navigation system relative to each other moves laser beam and target sample, in order to the select location of laser beam position on finished surface, its improvements comprise:
One air bearing assembly, it comprises an air axle bush, and this air axle bush comprises lens and reacts on and is applied to the motive force on these lens and guides these lens to move along this beam axis, adjusts laser beam thus with respect to the focus area of finished surface.
29. laser-processing system according to claim 28, wherein, this air axle bush has an inner surface, and wherein, these lens have an external diameter that defines the bearing surface of these lens, the bearing surface of these lens is as the interior ring of this air bearing and operate, and the inner surface of this air axle bush is as the outer shroud of this air axle bush and operate.
30. laser-processing system, wherein, one laser beam is along beam axis propagation and by lens, be used for being incident on a finished surface that is installed in the target sample on the support, this lens form the focus area of laser beam, and this support is connected on the multiaxial type navigation system operatedly, and this navigation system relative to each other moves laser beam and target sample, in order to the select location of laser beam position on finished surface, its improvements comprise:
One air bearing assembly, it comprises an air axle bush, and this air axle bush comprises lens and reacts on and is applied to the motive force on these lens and guides these lens to move along this beam axis; And
One comprises the lens injector of a movable member, this movable member is guided and can moves and be connected to operatedly this lens along this beam axis, in order to provide motive force to move this lens along this beam axis, and adjust laser beam thus with respect to the focus area of finished surface.
31. laser-processing system according to claim 30, wherein, this lens injector comprises a sound coil actuator, and it controls the motion of this movable member.
32. laser-processing system according to claim 30, wherein, this multiaxial type navigation system and lens injector define a guide element center of gravity that is positioned on the primary importance, and the air bearing assembly that contains lens has one and is positioned at a center of gravity on the second place identical with primary importance essence.
33. laser-processing system according to claim 30, it more comprises one and isolates bending device, it is as operating as the buffer between this lens injector and the lens, with so that the guiding movement that the guiding movement of the movable member of this lens injector can put on the lens from the movable member of this lens injector keep apart.
34. laser-processing system according to claim 33, wherein, this isolation bending device is rigidity along this beam axis, and is submissive in the plane transverse to this beam axis.
CN2008800054733A 2007-02-20 2008-02-15 Decoupled, multiple stage positioning system Expired - Fee Related CN102066038B (en)

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US11/676,937 US7760331B2 (en) 2007-02-20 2007-02-20 Decoupled, multiple stage positioning system
US11/676,945 US7603785B2 (en) 2007-02-20 2007-02-20 Air bearing assembly for guiding motion of optical components of a laser processing system
US11/676,937 2007-02-20
US11/676,945 2007-02-20
PCT/US2008/054117 WO2008103611A2 (en) 2007-02-20 2008-02-15 Decoupled, multiple stage positioning system

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US7760331B2 (en) 2010-07-20
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KR101429133B1 (en) 2014-08-12
KR20140041945A (en) 2014-04-04

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