CN102204026A - 连接器引导件 - Google Patents
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- CN102204026A CN102204026A CN2009801437840A CN200980143784A CN102204026A CN 102204026 A CN102204026 A CN 102204026A CN 2009801437840 A CN2009801437840 A CN 2009801437840A CN 200980143784 A CN200980143784 A CN 200980143784A CN 102204026 A CN102204026 A CN 102204026A
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- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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- H01R13/502—Bases; Cases composed of different pieces
- H01R13/506—Bases; Cases composed of different pieces assembled by snap action of the parts
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
- H01R13/508—Bases; Cases composed of different pieces assembled by a separate clip or spring
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/627—Snap or like fastening
- H01R13/6275—Latching arms not integral with the housing
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/659—Shield structure with plural ports for distinct connectors
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/65912—Specific features or arrangements of connection of shield to conductive members for shielded multiconductor cable
- H01R13/65918—Specific features or arrangements of connection of shield to conductive members for shielded multiconductor cable wherein each conductor is individually surrounded by shield
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
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- H—ELECTRICITY
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
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- H—ELECTRICITY
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- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
- H01R13/6583—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members
- H01R13/6584—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members formed by conductive elastomeric members, e.g. flat gaskets or O-rings
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- H—ELECTRICITY
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- H01R2107/00—Four or more poles
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- H—ELECTRICITY
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- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
Abstract
本发明提供一种引导框架,其可被安装在电路板上,并包括可容纳连接器在其中的开口。所述引导框架可包括设置在所述开口的相对两侧上的一对固持部件,这些固持部件被设计为连接至连接器上的接合部件。所述引导框架可包括一凸缘,该凸缘被设计为能与对接至连接器的插头连接器接合。
Description
相关申请的引用
本申请要求如下美国临时申请的优先权:申请号61/095,450,申请于2008年9月9日;中请号61/110,748,申请于2008年11月3日;申请号61/117,470,申请于2008年11月24日;申请号61/153,579,申请于2009年2月18日;申请号61/170,956,申请于2009年4月20日;申请号61/171,037,申请于2009年4月20日;以及申请号61/171,066,申请于2009年4月20日,所有这些临时申请通过引用被全部包含在本文中。
技术领域
本发明总的涉及适于传输数据的连接器,更具体地涉及用来容置适于密集连接器构造的输入/输出(I/O)连接器的引导框架。
背景技术
最近通信发展中相对不变的方向是要求提高性能。同样,也一直期望将物体制造得更紧凑(例如提高密集度)。对于用于数据通信的I/O连接器而言,这些期望产生了一些问题。利用较高的频率(有助于提高数据率)则要求在连接器中的信号端子之间形成良好的电隔离(从而例如最小化串扰)。然而,将连接器制造得更小(例如将端子布置得更密集)则会使得端子相互间更加靠近且趋于减少电隔离,这会导致信号降级。
除了期望提高性能,还期望改进制造。举例来说,随着信号频率的增加,端子的位置公差以及它们的物理特性都变得更重要。因此,希望对连接器设计加以改进,以使其便于被制造的同时仍提供一种密集且高性能的连接器。
I/O连接器被用于内部以及外部的应用中。在外部应用中,连接器设有插头连接器的接口以与电子设备连接。在内部应用中,I/O插头型连接器用于将内部电子装置连接在一起。在这种内部应用中,连接器经常被设置在电子设备内的电路板上,并且插头连接器被连接至该连接器。为了确保插头连接器能够保持与相对连接器的对接,会设置连接器引导件或引导框架。将电缆连接至电路板安装型连接器时,已知的问题是电缆的重量和运动趋势会将连接器与电路板的连接点松开,由此破坏了信号路径并导致电路板失效。因此,某些人意识到要对用于单个或多个连接器的内部引导件进行改进。
发明内容
一种引导框架,其可被设计为安装在电路板上。该引导框架具有可将连接器容纳在其中的开口。对于成套(ganged)应用,该引导框架可具有多个单独的开口。引导框架可包括两个或多个柱,所述柱被设计成用于接收螺钉或其他紧固部件,从而在操作中,该引导框架可被连接至电路板。所述柱可通过顶部横梁和底部横梁连接在一起。在一个实施方式中,底部横梁可被设计成能够接合连接器的壳体部分。顶部横梁也可被设计成能够接合壳体部分,并可包括与配对插头连接器的定位锁扣接合的开口。
附图说明
下面的详细描述中将参照附图,其中相同的参考数字标识相同的部件,其中:
图1示出了连接器的一个实施方式的透视图;
图2示出了图1的连接器的前透视图;
图3示出了连接器以其一侧平放的透视图,示出了容置于连接器内的端子组件;
图4示出了图1的连接器的正视图;
图5示出了引导部件的一个实施方式的透视图;
图6示出了图5中引导部件的透视图,其中连接器位于该引导部件上的开口内;
图7示出了图6的引导部件的另一透视图;
图8示出了连接到壳体的引导部件的一个实施方式的透视图;
图9示出了引导部件的一个实施方式的透视图;
图9A示出了图9中引导部件的正视图;
图10示出了沿图9中10-10线的截面图;
图11示出了成套的引导部件的透视图,具有位于各个引导开口中的四个连接器;
图12示出了插入一个连接器的成套的引导部件;以及
图13示出了图12中成套的引导部件的另一透视图。
具体实施方式
按照要求,下面将描述具体的实施方式。但是应当理解的是,所公开的实施方式仅仅是示范性的,所描述的特征可以以各种形式实施。因此,这里所公开的特定细节不能解释为对权利要求的限定,只能解释为权利要求的依据,以及教导本领域技术人员以实际上任何适当的方式不同地使用所描述特征的代表性依据,包括使用这里所公开的各种特征并结合可能在这里未被明确描述的各种特征。
图1示出了连接器100。该连接器100具有绝缘壳体101,如图所示,该绝缘壳体具有两个互相接合的第一和第二(或者前和后)部分或部件102、103。如图1所示,壳体101具有在相对的前表面106和后表面105之间延伸的宽体部104。对接部107为细长前端部108(nose portion)的形式,该前端部108从前表面106起向前伸出并终止于对接表面109。该对接表面109可具有一个或多个电路卡接收槽110,该电路卡接收槽110横向形成在对接表面109上,图1中示出了两个这样的槽110。
如图2和3所示,壳体101具有中空的内部112,该内部112容置多个绝缘连接器针座115形式的端子组件。每个这样的针座115都容纳有多个导电端子116,这些导电端子具有尾部117和接触部119,所述尾部117沿着壳体101的一个边缘118从壳体向外伸出,所述接触部119在端子接收腔125内延伸,该端子接收腔125形成在连接器的对接表面109中。在示出的实施方式中,两个边缘118和120彼此邻接。
端子组件被固定在一起成为壳体101内的单元块(block),从而端子尾部117穿过壳体101的底部延伸而出,而端子接触部119从其框架115的边缘120延伸进入壳体的前端部108。这些接触部在框架115内作为端子对布置,每个端子对都被容纳在一个卡接收槽110内并位于该卡接收槽的相对两侧上(图2和3)。接触部119为悬臂结构,在电路卡被插入槽110时该接触部用作偏离槽110的接触梁。为了允许接触部119的这种上下偏移,壳体101的前端部108具有端子接收腔125,该端子接收腔125沿每个槽110的中心线的上下方向延伸一纵向预选距离。优选地,端部124沿接近偏移点“P”的线延伸,或着最优选地,其沿着大致与偏移点“P”相符的线“D”延伸,这在下面将会进一步说明。
回到图1,壳体101的两个部分102和103沿着不规则的对接线126对接,该对接线126沿着在壳体101的前后方向延伸的路径向上延伸并通过壳体101的两个侧面。这种不规则的对接线有利于壳体的模塑,在2008年12月12日申请的,名称为“Two-Piece Thin Wall Housing”的美国临时专利申请61/122,102中有更详细的说明,在此通过引用包含该申请的全部内容。两个壳体部件102,103沿这条不规则的且非线性的对接线126互锁在一起或彼此接合。
由于这种不规则的构造,在两个壳体部件102、103中形成有一对导轨128和通道129,其中导轨128配合进通道129中。在后部壳体部件103的外侧表面上还可形成有外部肋131,并且这些肋131优选与导轨128水平对齐,用以对导轨128提供加固作用,同时其还提供了将连接器组件100定位于引导框架中的方式,下面将会更详细地描述。
现在参照图5,6和8,示出了被安装于电路板301上的引导框架300。这种引导框架300也可被称为护罩,其通常被安装在电子部件内的电路板上,该电子部件可以是路由器或服务器,并且该引导框架300用于引导配对插头连接器与连接器组件100接合。
该引导框架300可由如树脂这样的绝缘材料模塑而成,在其中的选定位置处可包括一个或多个金属加固部件。该引导框架300包括框架302,其具有多个柱和横梁,所述柱和横梁连接在一起以形成一个或多个中空内部开口。如所示出的,其包括第一柱304和第二柱305、底部横梁306和顶部横梁307,它们连接在一起形成框架302,并且该框架可提供形成延伸穿过该引导框架300的一个或多个开口310的矩形。每个这样的开口310可被构造成能在其中容纳一个单独的连接器100,从而框架302围绕壳体101的前端部108。如所示出的,第一柱304和第二柱305分别具有从开口310向后延伸的后部304′和305′。可选地,柱和横梁可具有相同的厚度,以使得它们形成的开口310的边缘大致相似。
引导框架300还可包括从第一横梁307向前水平延伸出的凸缘312。该凸缘312可用来与相对的插头连接器相互配合,并可包括横向槽314,该横向槽314的一部分由沿顶壁307的前表面317彼此隔开的两个肩部316形成。该槽314可被两极化(polarized)并被设计为接收相对的配对连接器(未示出)上的键(key)以确保与组件100的恰当对接。凸缘312还可包括一个或多个凹口318,该凹口318可被设置在凸缘312的前边缘319附近。如果设置了多个凹口,它们可在引导框架的凸缘312的横向上间隔开。凹口可从凸缘的第一表面延伸至第二表面(例如从顶表面延伸至底表面),或者它们可设有延伸通过凸缘一部分距离的凹槽。凹口318可被定位为与形成在相对的配对插头连接器上的对应接合部件相接合。如图7,9和9A所示,引导框架300可被形成为接合单一的连接器组件100,或者其可具有一个成套结构,该结构被设计为能接合多个连接器组件100,如图5,8和11,13所示。
为了有助于将连接器组件100定位在内部引导框架300中的适当位置上,该引导框架300可包括一个或多个固持部件,例如所示出的第一固持部件330和第二固持部件340。该固持部件可被设置在开口的一个或多个侧面上,如果设有两个固持部件,则可将它们定位在引导框架的开口310的相对两侧上,从而有助于将使用中受到的力分散掉。如所示出的,第一固持部件330在开口310中向下延伸,并具有端部330a和基部330b,两者共同形成了一倾斜形状,该形状可与倒置的倾斜形状鸠尾接合。类似地,第二固持部件340也具有形成倾斜结构(相比于第一固持部件330倒置倾斜)的端部341a和基部341b,并包括多面部342。该多面部342具有多个平坦表面343(在一实施方式中多于三个,例如五个图示的表面),这些平坦表面相对彼此倾斜设置,并形成大致为半六面体或半八面体的形状。这些平坦表面343可被设置为抵接连接器100中对应的相对表面,从而有助于在引导框架300中将连接器固定就位。如图所示,这两个固持部件330、340可沿一共同的纵向轴线彼此对齐,以有助于控制施加在引导框架300上的力,但这种对齐不是必须的。
为了接合引导框架300,组件100的壳体101可包括适当数量的第一接合部件150和第二接合部件152。举例来说,如果设有两个固持部件,那么设置两个接合部件是有用的。接合部件的实施方式可从图1和2中获知。如图所示,这些接合部件位于前端部108的相对的顶表面153和底表面154上。第一接合部件150可采用由两个相对边缘157形成的凹槽155形式,以此使得该凹槽155在设置于前端部108的顶表面153上的两个肩部156之间横向延伸。边缘157可以是倾斜的,这样从壳体101的前方看去时(图4),所有边缘157都以鸠尾结构接合固持部件。
类似地,壳体101还包括第二接合部件152,该第二接合部件同样为设置在壳体的前端部108的底表面154上的凹槽160形式。这个凹槽160可沿一共同的纵向轴线RA(图4)与上部凹槽155对齐。凹槽160具有两个完全不同的部分161、162。如图2所示,第一部分161具有多个彼此相邻设置的平坦表面163(即是个多面体)。平坦表面163互相连接在一起以形成半八面体的开口(图3),并且在连接器100被完全插入到引导框架300中时,这些平坦表面抵接内部引导框架300的底部固持部件340的相对的平坦表面343。这些平坦表面163、343有助于防止壳体101相对于引导框架300旋转。可以看出第一固持部件330和第二固持部件340在结构上是类似的,都被倾斜且在端部扩大,并且被定位为可允许鸠尾接合,这一鸠尾接合在排列方向上是反向的。应当注意到的是,虽然倒置定位已被确定为可简单制造且有利的,但这种倒置不是必须的。
壳体101的第二接合部件152还包括顶部部分162,其为与底部部分161连通的横向槽165形式。如图2和4所示,这个槽165可以是相比于顶部凹槽156倒置的鸠尾结构,也就是其顶部边缘宽于其底部边缘。两个腿部或纵向导轨166可设置在底部凹槽152的侧面,并且它们用于对底部接合部件152的模塑提供结构支撑,它们还可凸伸进入形成在第二横梁306上的两个通道350中。在引导框架300上还可设有另外的接合点,例如抵接壳体101的内部肩部351。还有一些特征可被用于将连接器100固定在引导开口310中,这些特征包括一个或多个纵向挤压肋370,当壳体101被插入到引导开口310中时,该挤压肋将抵接壳体101。挤压肋370可被定位在一侧上,并且在操作时,其在插入过程中变形。然而,对于更均匀的力来说,在开口的相对两侧上放置挤压肋已被确定是有一定好处的。
壳体101的前表面106设有止动表面,其与固持部件330的内表面相接触以固定壳体101在引导框架中的位置。下部固持部件340的多个平坦表面343也辅助了这一功能。可以看出,内部引导框架300的固持部件和壳体的接合部件协同作用形成了一个将引导框架与连接器组件可靠接合在一起的手段。
图11-13示出了1×4的成套引导件400,其具有四个开口402,每个开口容纳一个单一的连接器100。在该实施方式中,一些开口由可连接至电路板的两个柱限定,这与在前的实施方式相同,但该实施方式包括壁404,其通过第一横梁406和第二横梁408连接至柱。如所示出的,凸缘410延伸通过引导件400的整个宽度,并与每个开口402相关联。凸缘410包括设置在其中的凹口412(如上所讨论的,该凹口可以为孔),以用于接合相对的插头连接器(未示出)。虽然对于每个引导开口402,两个这样的凸缘开口412如图所示是对齐的,但应当理解的是,凸缘410上凹口的数量取决于使用该引导框架的插头连接器的接合结构。
正如可意识到的,所描述的特征提供了一种使内部连接器以及插头连接器在电子设备内部固定就位的方式,这不仅依靠提供一种可将内部连接器插入其中的结构,还依靠提供一种框架,该框架带有接合相对的插头连接器并将其相对于该连接器定位于适当对接位置的装置。因此,本发明的引导框架和引导部件可被认为是双向的引导件,其用于固定插头和连接器的位置。
应理解的是,上述示例的实施方式对于本领域技术人员来说显然有多种更改,例如对紧凑连接器组件和/或其部件的多种变化和更改,包括在此单独公开或要求保护的特征的组合,明确包括这种特征的其它组合或接触阵列连接器的其他可选类型。同样,在材料和构造方面也可有多种变化。这些更改和/或组合落入本发明所涉及的领域内,并落入所附权利要求的保护范围。应注意到,与惯例一样,权利要求中所用到的单一元件覆盖一个或多个这样的元件。
Claims (21)
1.一种用于安装在电路板上的引导框架,包括:
第一柱和第二柱,所述第一柱和第二柱间隔开;
顶部横梁,其连接所述第一柱和第二柱;
底部横梁,其连接所述第一柱和第二柱,所述第一柱和第二柱、所述顶部横梁和所述底部横梁形成包括四个侧边的开口;以及
第一固持部件和第二固持部件,所述第一固持部件和第二固持部件位于所述开口的相对两侧上。
2.根据权利要求1所述的引导框架,其特征在于,所述第一固持部件被设置在所述顶部横梁上,所述第二固持部件被设置在所述底部横梁上。
3.根据权利要求2所述的引导框架,其特征在于,所述第一固持部件和第二固持部件的每一个都包括具有第一宽度的端部和具有第二宽度的基部,所述第一宽度大于所述第二宽度。
4.根据权利要求3所述的引导框架,其特征在于,所述第二固持部件的基部是多面体。
5.根据权利要求2所述的引导框架,其特征在于,所述第一固持部件和第二固持部件沿一共同的纵向轴线定位。
6.根据权利要求2所述的引导框架,其特征在于,所述第一固持部件和第二固持部件中的至少一个具有倾斜的鸠尾形状。
7.根据权利要求1所述的引导框架,其特征在于,还包括从所述开口向前延伸的凸缘,所述凸缘包括用于接合相对的第二连接器的接合部分。
8.根据权利要求7所述的引导框架,其特征在于,所述接合部分包括设置在所述凸缘上的凹口。
9.根据权利要求1所述的引导框架,其特征在于,还包括在所述开口中的第一挤压肋和第二挤压肋,这些挤压肋位于所述开口的相对两侧上。
10.一种连接器系统,包括:
连接器,其包括具有卡接收槽的壳体,所述壳体支撑多个针座,所述多个针座的每个都支撑有与所述卡接收槽的相对两侧对齐的两个端子;以及
引导框架,所述引导框架包括间隔开并通过顶部横梁和底部横梁连接的第一柱和第二柱,这些柱和横梁形成具有四个侧边的开口,所述引导框架还包括位于所述开口的相对两侧上的第一固持部件和第二固持部件。
11.根据权利要求10所述的系统,其特征在于,所述第一固持部件被设置在所述顶部横梁上,所述第二固持部件被设置在所述底部横梁上,并且所述第一固持部件和第二固持部件中的每一个都包括具有第一宽度的端部和具有第二宽度的基部,所述第一宽度大于所述第二宽度。
12.根据权利要求10所述的系统,其特征在于,所述开口为第一开口,所述引导框架还包括由所述第一柱和第二柱的中至少一个支撑的第二开口,所述第二开口包括位于其相对两侧上的第三固持部件和第四固持部件。
13.根据权利要求12所述的系统,其特征在于,所述引导框架包括在所述第一开口和所述第二开口上方延伸的凸缘,所述凸缘从这些开口向前延伸。
14.根据权利要求12所述的系统,其特征在于,带有所述壳体的所述连接器包括具有第一壳体的第一连接器,所述系统还包括具有第二壳体的第二连接器,所述第二壳体与所述第一壳体不同,所述第二壳体位于在所述第二开口中。
15.一种引导框架,包括:
第一柱和第二柱,所述第一柱和第二柱间隔开,并被构造成能通过紧固件固定于电路板;
顶部横梁;
底部横梁,所述第一柱和第二柱、所述顶部横梁和所述底部横梁梁提供了具有开口的框架,所述开口包括四个侧边;
第一固持部件和第二固持部件,所述第一固持部件和第二固持部件位于所述开口的相对两侧上;以及
凸缘表面,其由所述框架支撑并位于所述框架上方,所述凸缘表面被构造成能与配对连接器的定位锁扣接合。
16.根据权利要求15所述的引导框架,其特征在于,所述凸缘表面位于凸缘上,所述凸缘包括至少一个凹口,所述凹口至少部分地在所述凸缘的所述凸缘表面和底部表面之间延伸。
17.根据权利要求15所述的引导框架,其特征在于,所述凸缘表面包括至少两个凹口,所述凹口在所述凸缘表面和底部表面之间延伸。
18.根据权利要求15所述的引导框架,其特征在于,所述第一固持部件和第二固持部件具有相对的鸠尾形状。
19.根据权利要求15所述的引导框架,其特征在于,所述顶部横梁为第一顶部横梁,所述底部横梁为第一底部横梁,所述引导框架还包括通过第二顶部横梁和第二底部横梁连接至所述第一柱的壁,所述壁、所述第二顶部横梁、所述第二底部横梁以及所述第一柱形成了第二开口。
20.根据权利要求19所述的引导框架,其特征在于,所述凸缘从所述第一开口和所述第二开口起向前延伸。
21.根据权利要求15所述的引导构架,其特征在于,所述凸缘表面位于凸缘上,在所述凸缘和所述顶部横梁之间设有一槽,所述槽被构造成接收设置在配对插头连接器上的键。
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Country Status (6)
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US (18) | US8342881B2 (zh) |
JP (6) | JP5044721B2 (zh) |
CN (20) | CN102210064B (zh) |
MY (3) | MY159114A (zh) |
TW (9) | TWM399472U (zh) |
WO (9) | WO2010030622A1 (zh) |
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