CN102237482A - High heat radiation LED (Light Emitting Diode) nonmetal substrate and high heat radiation LED element as well as making method thereof - Google Patents
High heat radiation LED (Light Emitting Diode) nonmetal substrate and high heat radiation LED element as well as making method thereof Download PDFInfo
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- CN102237482A CN102237482A CN 201010173565 CN201010173565A CN102237482A CN 102237482 A CN102237482 A CN 102237482A CN 201010173565 CN201010173565 CN 201010173565 CN 201010173565 A CN201010173565 A CN 201010173565A CN 102237482 A CN102237482 A CN 102237482A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Abstract
The invention relates to a high heat radiation LED (Light Emitting Diode) nonmetal substrate and a high heat radiation LED element as well as a making method thereof. The making method mainly comprises the following steps: at least one through hole is pre-molded in a crystal bonding region of a nonmetal plate body; in coordination with the copper layer electroplating step, an electroplating copper layer is coated on the external surface of the nonmetal plate body; a solid heat conducting copper column is formed in the at least one through hole; the metal layer is patterned by using an etching technology; a crystal bonding pad and a wire bonding pad are formed on the upper surface of the ceramic plate body; a heat radiation pad is formed on the lower surface of the ceramic plate body corresponding to the crystal bonding pad so that the crystal bonding pad and the heat radiation pad are integrally molded with the heat conducting copper column; and the high heat can be rapidly conducted to the heat radiation pad of the lower surface through the heat conducting copper column while the crystal bonding pad reaches the high heat.
Description
Technical field
The present invention relates to a kind of LED non-metal base plate method for making, refer to a kind of high-heat-dispersion LED non-metal base plate and method for making thereof and high-heat-dispersion LED element and method for making thereof especially.
Background technology
Be applied to that the LED wafer package generally can be divided into metal with substrate or as the non-metal base plate of ceramic substrate or silicon substrate, with the ceramic laminate body manufacture method, include four kinds of manufacture methods at present, be respectively a low temperature co-fired multi-layer ceramics plate (LTCC) or a high temperature co-firing multi-layer ceramics plate (HTCC), one and directly engage a copper base (DBC) and a direct copper facing substrate (DPC); Wherein directly adopting the thermal conductivity of ceramic laminate body with DBC and DPC substrate again is the best, yet because the DBC substrate synthesizes copper coin on ceramic laminate body, so must under the hot environment of 1065-1085 degree Celsius, just can finish, in comparison, only need the DPC substrate manufacturing method law technology of 250-350 degree environment Celsius, no matter all good on thermal conductivity and manufacture method cost than other manufacture method.
DPC manufacture of substrates step is done pretreatment cleaning with ceramic laminate body earlier at present, utilize vacuum coating mode sputter Copper Foil on ceramic laminate body again, with the gold-tinted photolithography techniques Copper Foil is carried out patterning again and make, the last thickness that increases circuit again with plating and electroless deposition mode to finish circuit.Owing to adopt sputter Copper Foil and yellow photolithographic techniques, the LED package dimension so line width probably at 10～50 μ m, therefore can effectively contract provides high power and small size LED element a preferable height heat radiation ceramic substrate.
Though ceramic laminate body has the high heat conductance characteristic, but for the high-capacity LED wafer, even if adopt the DPC heat-radiating substrate, overall thermal conductivity then is best if can promote, manufacture method with a kind of existing enhancing DPC heat-radiating substrate thermal conductivity of next proposition, at first see also shown in Fig. 9 A to 9E, it comprises following steps:
One ceramic laminate body 51 is provided;
Form electrically connect with a through hole 511 and a heat transmission through hole 512 more;
The heat conduction copper post 61 of the moulding in advance of one coupling heat transmission through hole 512 is provided;
Heat conduction copper post 61 is arranged in the heat transmission through hole 512;
Sputter ceramic laminate body 51 in its outer surface and electrically connect with forming Copper Foil 515 in the through hole 511 more; And
Patterning outer surface Copper Foil 515, to be formed with sticking brilliant pad 52 and wire pad 53 in upper surface, lower surface then is formed with the cooling pad 54 and the weld pad 55 of corresponding sticking brilliant pad 52 and wire pad 53; Wherein many conduction through holes 511 are electrically connected wire pad 53 and weld pad 55, and heat conduction copper post 60 2 ends then are to be connected with sticking brilliant pad 52 and cooling pad 54 respectively.
Above-mentioned heat-radiating substrate manufacture method mainly can be inserted the heat transmission hole of thermal column in viscous crystal region moulding in advance, after the sputter step, make these heat conduction copper post two ends be connected with sticking brilliant pad and cooling pad respectively.When the LED wafer is pasted on brilliant pad when going up, the high heat that produces when running can conduct to cooling pad downwards by heat conduction copper post fast; Improve bulk thermal conductivity thus.Yet, just, heat conduction copper post just has the good thermal conductivity effect because must being connected with sticking brilliant pad and cooling pad, so make the heat conduction copper post that this heat-radiating substrate must be prepared a size and heat transmission through hole coupling, its size is quite accurate; Moreover, appoint a heat conduction copper post step with regard to extra the inserting of DPC standard fabrication methods increase at present, certainly will improve the cost and the complexity of integral manufacturing method.
In addition, because the moulding in advance of heat conduction copper post so must guarantee heat conduction copper post and sticking brilliant pad and cooling pad bond strength on the manufacture method, is guaranteed the heat conduction quality; Be must precisely control copper thickness.Moreover, the structure of heat-radiating substrate is still challenged at present, cause is the miniaturization that becomes of healing of LED wafer size, and therefore sticking brilliant pad area also dwindles relatively, and manufacture method heat conduction copper post has the certain size limit, and can't be applied to miniaturization LED wafer package, and adopt sputter copper facing paper tinsel that the limit of its minimum precision is also arranged, to electrically connect the through hole of usefulness, the ceramic laminate body that 1mm is thick, the through hole that the aperture is 0.5mm must be worn, a conductive hole can be constituted.Therefore, present DPC heat-radiating substrate manufacture method or non-metal base plate still is further improved.
Summary of the invention
Main purpose of the present invention provides a kind of high-heat-dispersion LED non-metal base plate and method for making and high-heat-dispersion LED element and method for making thereof, and the heat transmission substrate that meets high power small size LED element can be provided.
Desiring to reach the employed major technique means of above-mentioned purpose is to make this high-heat-dispersion LED non-metal base plate method for making include:
One nonmetal plate body is provided;
On nonmetal plate body, form at least one first through hole;
Electroplate non-metal board external surface and each at least one first through hole, and form copper electroplating layer, and in each the first through hole, form solid heat conduction copper post at least in outer surface; And
Graphical copper electroplating layer is formed with at least one sticking brilliant pad and many wire pads in first surface, forms the cooling pad of corresponding sticking brilliant pad again in second surface; Wherein this solid heat conduction copper post is one-body molded with sticking brilliant pad and cooling pad.
The invention described above mainly adopts plating mode, cooperate small-bore first through hole, in wherein forming solid heat conduction copper post, and the advantage of a manufacture method step is that sticking brilliant pad and cooling pad can have the bond strength of the best with one-body molded in the plating step with solid heat conduction copper post; So also can simplify the step that plugs heat conduction copper post together, can the making of low-cost manufacture method cost meet the high heat-radiating substrate that high power small size LED wafer package is used.
The present invention's time purpose provides a kind of high-heat-dispersion LED non-metal base plate method for making that quick sealing is used that has, and meaning is after above-mentioned last one manufacture method step finishes, and advances one again and includes combination one housing in the step of nonmetal plate body first surface; Wherein the opening part of this housing is to gluing the part of crystalline substance pad and wire pad, and the sticking crystalline substance of order fills up and each wire pad partly exposes to this housing opening, for sticking crystalline substance and routing usefulness, at last as long as liquid state colloid is injected the housing opening, can finish the hot LED component package of loosing of height.
As shown in the above description, high-heat-dispersion LED non-metal base plate of the present invention includes:
One nonmetal plate body includes two first and second relative surface and at least one solid heat conduction copper posts, and wherein first surface is formed with many wire pads and at least one sticking brilliant pad, and the then corresponding at least one sticking brilliant pad of second surface is formed with cooling pad; Wherein each solid heat conduction copper post is one-body molded with cooling pad with corresponding sticking brilliant pad; And
One housing is arranged at the first surface of ceramic laminate body, and includes at least one opening, and the corresponding sticking brilliant pad of each at least one opening and each wire pad part make it expose to this housing opening, so that sticking crystalline substance and routing manufacture method are used.
Moreover high-heat-dispersion LED element of the present invention includes an external LED wafer and the adhesive body that further include of above-mentioned non-metal board; Wherein this LED wafer is sticking is located on this sticking brilliant pad, and is connected to many wire pads with lead, and adhesive body is filled in the middle opening of this housing.Because general adhesive body be liquid in manufacture method, thus the middle opening of injection housing can be passed through, not only can overflow, involution LED wafer is in wherein more accurately.
Description of drawings
Figure 1A to 1E is the manufacture method flow chart of high-heat-dispersion LED element first preferred embodiment of the present invention.
Fig. 2: the upper viewing view that is Fig. 1 E.
Fig. 3 A to 3E is the manufacture method flow chart of high-heat-dispersion LED element second preferred embodiment of the present invention.
Fig. 4: the upper viewing view that is Fig. 3 E.
Fig. 5: the face upwarding view that is Fig. 3 E figure.
Fig. 6: be the high-heat-dispersion LED element first preferred embodiment top view of the present invention.
Fig. 7: be the high-heat-dispersion LED element second preferred embodiment top view of the present invention.
Fig. 8 A: be the schematic diagram that Fig. 1 E is welded in a heat radiation module.
Fig. 8 B: be the schematic diagram that Fig. 3 E is welded in a circuit board.
Fig. 9 A to 9E: be existing high-heat-dispersion LED ceramic substrate manufacture method flow chart.
The main element symbol description
(10a) (10a ') the nonmetal plate body of non-metal base plate (11)
(111) first through holes (112) second through holes
(113) upper surface (114) lower surface
(115) the sticking brilliant pad of electroplated metal layer (12)
(13) wire pad (13a) external electrode
(14) cooling pad (15) weld pad
(16) conduction copper column (17) heat conduction copper post
(20) housing (21) opening
(22) sealing (30) LED wafer
(31) lead (40) heat radiation module
(40a) circuit board (50) ceramic substrate
(51) ceramic laminate body (511) first through holes
(512) second through hole (513) metal levels
(52) sticking brilliant pad (53) wire pad
(54) cooling pad (55) weld pad
(60) heat conduction copper post
Embodiment
At first see also shown in Figure 1A to 1E, be the making flow chart of the present invention's one high-heat-dispersion LED element first preferred embodiment, in the present embodiment this high-heat-dispersion LED element be in order to be welded in the heat radiation module 40 on, shown in Fig. 8 A, it includes:
One nonmetal plate body 11 is provided; This nonmetal plate body 11 is a ceramic laminate body in present embodiment, also can be a silicon substrate, and its thickness is 0.3mm to 2mm;
On nonmetal plate body 11, form at least one second through hole 112; Each second through hole 112 forms with laser drill mode or other boring processing mode in present embodiment, and its aperture is more than the 0.02mm;
Electroplate nonmetal plate body 11 outer surfaces and each second through hole 112, and form copper electroplating layer 115, and then be formed with and the integrated solid heat conduction copper post 17 of copper electroplating layer in each second through hole 112 in outer surface;
Graphical copper electroplating layer 115 is formed with at least one sticking brilliant pad 12 and many wire pads 13 in first surface, forms cooling pad 14 in the corresponding sticking brilliant pad 12 of second surface again; 17 on wherein solid heat conduction copper post is one-body molded with sticking brilliant pad 12 and cooling pad 14; So far promptly constitute the height heat radiation non-metal base plate 10a of first preferred embodiment of the invention; In present embodiment, this step is to form sticking brilliant pad 12, one cooling pad 14 and two wire pads 13;
Preparation one includes the housing 20 of at least one opening, and make housing 20 each opening 21 aim at corresponding sticking brilliant pad 12 and each wire pad 13 part, and be bonded on the surface that this nonmetal plate body 11 is formed with sticking brilliant pad 12 and each wire pad 13, as shown in Figure 2, these housing 20 peripheries are formed with breach, partly expose for each wire pad, use as outer electrode 13a; In present embodiment, this housing 20 can be glass mat or the aluminium sheet after anode treatment, and is incorporated on the nonmetal plate body 11 in the pressing mode; Again in the present embodiment, this housing 20 comprises an opening 21, with single sticking brilliant pad 12 of correspondence and wire pad 13 parts;
Prepare at least one LED wafer 30, and sticking being located on the corresponding sticking brilliant pad 12;
Each at least one LED wafer 30 is connected to lead 31 on the corresponding wire pad 13 in the routing mode; And
Inject liquid glue in housing opening 21, promptly constitute an adhesive body 22 after waiting to solidify, with LED wafer 30 involutions in wherein.
See also shown in Fig. 2 A to 2E again, be the making flow chart of the present invention's one high-heat-dispersion LED element second preferred embodiment, the high-heat-dispersion LED element of present embodiment is in order to being soldered to circuit board 40a, and shown in Fig. 8 B, it includes:
One nonmetallic ceramics plate body 11 is provided; Nonmetal plate body 11 is a ceramic laminate body in present embodiment, also can be a silicon substrate, and its thickness is 0.3mm to 2mm;
Form many first through holes 111 and at least one second through hole 112; First through hole 111 and second through hole 112 are to form in the laser drill mode in present embodiment, and its aperture is 0.02mm to 0.15mm;
Electro-plated pottery plate body 11 outer surfaces and first and second through hole 111,112 form copper electroplating layer 115 in outer surface, and form conduction copper column 16 in each first through hole 111, and 112 of each at least one second through holes form heat conduction copper post 17;
Graphical copper electroplating layer 115 is formed with at least one sticking brilliant pad 12 and many wire pads 13 in first surface, forms at least one cooling pad 14 and many weld pads 15 of corresponding sticking brilliant pad 12 and wire pad 13 again in second surface; Wherein first through hole, 111 solid conduction copper columns 16 are one-body molded with wire pad 13 and weld pad 15, and the solid heat conduction copper post 17 of second through hole 112 is then one-body molded with sticking brilliant pad 12 and cooling pad 14; So far promptly constitute the height heat radiation non-metal base plate 10a ' of second preferred embodiment of the invention; In present embodiment, this step forms sticking brilliant pad 12, one cooling pad 14, two wire pads 13 and two weld pads 15;
Prepare one and include the housing 20 of at least one opening, and make housing 20 each opening 21 aim at corresponding sticking brilliant pad 12 and each wire pad 13 part, and be bonded on the surface that this ceramic laminate body 11 is formed with sticking brilliant pad 12 and each wire pad 13; As for the height heat radiation non-metal base plate 10a that constitutes second preferred embodiment of the invention; In present embodiment, this housing 20 can be glass mat or the aluminium sheet after anode treatment, and is incorporated on the nonmetal plate body 11 in the pressing mode; Again in the present embodiment, this housing 20 comprises an opening 21, with single sticking brilliant pad 12 of correspondence and wire pad 13 parts;
Prepare at least one LED wafer 30, and sticking being located on the corresponding sticking brilliant pad 12;
Each LED wafer 30 is connected to lead 31 on the corresponding wire pad 13 in the routing mode; And
Inject liquid glue in housing opening 21, promptly constitute an adhesive body 22 after waiting to solidify, with LED wafer 13 involutions in wherein.
In nonmetal plate body 11 steps of above-mentioned plating, at first nonmetal plate body 11 is carried out degreasing, give pickling again, activate again afterwards, form chemical copper or chemical nickel again, put into the electroplate liquid electro-coppering at last again; Therefore, after this step finished, this first and second through hole 111,112 formed solid conduction and heat conduction copper post 16,17.
In the above-mentioned graphical copper electroplating layer step, be to carry out dry film process on copper electroplating layer 115, the copper electroplating layer 115 that do not covered by dry film of etching is removed dry film afterwards more again, to the copper electroplating layer coating anti-solder ink of part, the copper electroplating layer to uncoated anti-solder ink directly sprays tin more again.Perhaps, copper electroplating layer 115 is carried out electronickelling, electrosilvering or electrogilding respectively, make stacking a treacle layer on the copper electroplating layer 115 again, or an electroless nickel layer and a plating silver layer, or stacked an electroless nickel layer and an electrogilding layer, have preferable conductance with formation; Constitute sticking brilliant pad, wire pad, cooling pad and the weld pad of high conductivity at last, be coated with anti-solder ink afterwards again.Wherein this electroless nickel layer thickness is more than the 3um, and the electrosilvering layer thickness is more than the 1um, and this electrogilding layer is more than the 0.025um.
Below further specify the structure of the high heat radiation of the present invention non-metal base plate, at first please consult Fig. 1 E and shown in Figure 2 simultaneously, the high heat radiation of the present invention non-metal base plate 10a first preferred embodiment includes:
One nonmetal plate body 11, include two first and second relative surfaces 113,114 and at least one solid heat conduction copper post 17, wherein first surface 113 is formed with many wire pads 13 and at least one sticking brilliant pad 12, and 114 of second surfaces are formed with the cooling pad 16 of corresponding at least one sticking brilliant pad 12; This at least one solid heat conduction copper post 17 is arranged in the nonmetal plate body 11 equally again, and one-body molded with cooling pad 14 with corresponding sticking brilliant pad 12; This nonmetal plate body 11 is a ceramic substrate and silicon substrate in present embodiment; The quantity of solid again heat conduction copper post 17 is looked closely the height of rate of heat dispation and is adjusted; And
One housing 20, be arranged at the first surface 111 of nonmetal plate body 11, and include at least one opening 21 and many breach, wherein each at least one opening 21 correspondence is glued brilliant pad 12 and each wire pad 13 part, make it expose to this housing opening 21, so that sticking crystalline substance and routing manufacture method usefulness, the then corresponding wire pad other parts of many breach are used to make it expose as external electrode 13a; In present embodiment, this housing 20 includes an opening 21, with single sticking brilliant pad 12 and two wire pads 13 parts of correspondence.
Please consult Fig. 3 E, Fig. 4 and shown in Figure 5 simultaneously, the high heat radiation of the present invention non-metal base plate 10a ' second preferred embodiments, it includes:
One nonmetal plate body 11, include two first and second relative surfaces 113,114, how solid conduction copper column 16 and at least one solid heat conduction copper post 17, wherein first surface 113 is formed with many wire pads 13 and at least one sticking brilliant pad 12, and 114 of second surfaces are formed with the weld pad 15 and the cooling pad 16 of corresponding many wire pads 13 and at least one sticking brilliant pad 12; How solid again conduction copper column 16 is arranged in the ceramic laminate body 11, and one-body molded with weld pad 15 with corresponding wire pad 13, this at least one solid heat conduction copper post 17 is arranged in the nonmetal plate body 11 equally, and one-body molded with cooling pad 14 with corresponding sticking brilliant pad 12; This nonmetal plate body 11 is a ceramic substrate and silicon substrate in present embodiment, and solid conduction copper column and solid heat conduction copper post are a bronze medal post; And
One housing 20 is arranged at the first surface 111 of nonmetal plate body 11, and includes at least one opening 21 with the sticking brilliant pad 12 of correspondence and each wire pad 13 part, makes it expose to this housing opening 21, so that sticking crystalline substance and routing manufacture method are used; In present embodiment, this housing 20 includes an opening 21, with single sticking brilliant pad 12 and two wire pads 13 parts of correspondence.
Please further consult shown in Fig. 1 E, the present invention uses first preferred embodiment of the high-heat-dispersion LED element that above-mentioned high heat radiation non-metal base plate 10a encapsulates, and it further includes:
At least one LED wafer 30, sticking being located on this sticking brilliant pad 12, and be connected to many wire pads 13 with lead 31; In present embodiment, single sticking crystalline substance fills up to glue on 12 and is provided with single LED wafer 30, correspondence one or how solid heat conduction copper post 17 under each sticking crystalline substance fills up again, more as shown in Figure 6, this single sticking crystalline substance fills up also can glue on 12 and is provided with many LED wafer 30, again each LED wafer 30 corresponding one or how solid heat conduction copper posts 17; And
At least one adhesive body 31 is filled in the corresponding opening 21 of this housing 20.Because general sealing 31 bodies be liquid in manufacture method, thus the opening 21 of injection housing can be passed through, not only can overflow, involution LED wafer 30 is in wherein more accurately.
Please cooperate and consult shown in Figure 7ly, be the 3rd preferred embodiment of high-heat-dispersion LED element of the present invention, can form two sticking brilliant pads 12 on this ceramic laminate body 11, is the sticking many LED wafer 30 of establishing on each sticking brilliant pad 12; Each LED wafer 30 corresponding how solid heat radiation copper posts 17 again are with acceleration LED wafer 30 rates of heat dispation.
See also shown in Fig. 8 B, when the weld pad 15 of above-mentioned LED element is welded on this circuit board 40, cooling pad 14 can fit in circuit board 40, therefore operate the high heat of generation when LED wafer 30, can conduct to cooling pad 14 fast downwards by heat conduction copper post 17, by cooling pad 14 with high heat conduction to circuit board 40, to avoid LED wafer 30 overheated.
The invention described above mainly adopts plating mode, cooperate first and second through hole of small-bore (more than the 0.02mm), in wherein forming conduction copper column and heat conduction copper post, and the advantage of a manufacture method step is that sticking brilliant pad and cooling pad can have best bond strength with one-body molded in the plating step with heat conduction copper post; The step that so also can saving plugs heat conduction copper post together can the low-cost manufacture method cost be made and be met the height heat radiation non-metal base plate that high power small size LED wafer package is used.Moreover this height heat radiation non-metal base plate is further combined with a housing, with the speed and the quality of the sealing step of quickening the LED element.
Claims (44)
1. high-heat-dispersion LED non-metal base plate method for making, it includes:
One nonmetal plate body is provided;
On nonmetal plate body, form at least one first through hole;
Plated metal plate body outer surface and this at least the first through hole, and form copper electroplating layer in outer surface, and form solid heat conduction copper post in each first through hole; And
Graphical copper electroplating layer is formed with at least one sticking brilliant pad and many wire pads in first surface, forms at least one cooling pad of corresponding sticking brilliant pad again in second surface; Wherein the first through hole heat conduction copper post is one-body molded with sticking brilliant pad and cooling pad.
2. high-heat-dispersion LED non-metal base plate method for making according to claim 1, wherein:
In forming the first through hole step, further this non-metal base plate is formed many second through holes;
In plated metal plate body step, each second through hole is electroplated, and be formed with solid conduction copper column in each second through hole; And
In graphical copper electroplating layer step, the place is formed with weld pad in the corresponding wire pad of nonmetal plate body second surface, and wherein each solid conduction copper column is one-body molded with corresponding wire pad and weld pad.
3. high-heat-dispersion LED non-metal base plate method for making according to claim 1 and 2 includes following steps again after graphical copper electroplating layer step:
Preparation one includes the housing of at least one opening, and makes each at least one opening aim at corresponding sticking brilliant pad and wire pad part, is bonded to this non-metal board body and is formed with on the surface of gluing brilliant pad and each wire pad.
4. high-heat-dispersion LED non-metal base plate method for making according to claim 3, this housing can be glass mat or the aluminium sheet after anode treatment, and is incorporated on the nonmetal plate body in the pressing mode.
5. high-heat-dispersion LED non-metal base plate method for making according to claim 4 in the nonmetal plate body step of above-mentioned plating, is at first carried out degreasing to nonmetal plate body, give pickling again, activate again afterwards, form chemical copper or chemical nickel again, put into copper electroplating liquid at last again, to form copper electroplating layer.
6. high-heat-dispersion LED non-metal base plate method for making according to claim 5, in the above-mentioned graphical copper electroplating layer step, carry out the dry film program in copper electroplating layer, the copper electroplating layer that do not covered of etching again by dry film, remove dry film afterwards again, and to parcel plating copper layer coating one deck anti-solder ink, the copper electroplating layer to uncoated anti-solder ink sprays WU again.
7. high-heat-dispersion LED non-metal base plate method for making according to claim 6, in the above-mentioned graphical copper electroplating layer step, carry out the dry film program in copper electroplating layer, the copper electroplating layer that do not covered of etching again by dry film, remove dry film afterwards again, on graphical copper electroplating layer, carry out electronickelling and electrosilvering more in regular turn, be coated with anti-solder ink at last again.
8. high-heat-dispersion LED non-metal base plate method for making according to claim 6, in the above-mentioned graphical copper electroplating layer step, on copper electroplating layer, carry out the dry film program, the copper electroplating layer that do not covered of etching again by dry film, remove dry film afterwards again, on graphical copper electroplating layer, carry out electronickelling and electrogilding more in regular turn, be coated with anti-solder ink at last again.
9. high-heat-dispersion LED non-metal base plate method for making according to claim 2, this non-metal base plate thickness is 0.3mm to 2mm, and each first through hole and each second through hole aperture are more than the 0.02mm.
10. high-heat-dispersion LED non-metal base plate method for making according to claim 7, this non-metal base plate thickness is 0.3mm to 2mm, and each first through hole and each second through hole aperture are more than the 0.02mm, and this electroless nickel layer is more than the 3um again, and this electrosilvering layer thickness is more than the 1um.
11. high-heat-dispersion LED non-metal base plate method for making according to claim 8, this non-metal base plate thickness is 0.3mm to 2mm, and each first through hole and each second through hole aperture are more than the 0.02mm, and this electronickelling depth is more than the 3um again, and this electrogilding layer is more than the 0.025um.
12. high-heat-dispersion LED non-metal base plate method for making according to claim 3, this non-metal base plate is ceramic substrate or silicon substrate.
13. a high-heat-dispersion LED non-metal base plate includes:
One nonmetal plate body, including two relative first and second surface, at least one first perforations wears and at least one solid heat conduction copper post, wherein first surface is formed with many wire pads and at least one sticking brilliant pad, and second surface then is formed with the cooling pad of corresponding at least one sticking brilliant pad; This at least one heat conduction copper cylindricality is formed in corresponding first through hole and is one-body molded with cooling pad with corresponding sticking brilliant pad again; And
One housing is arranged at the first surface of ceramic laminate body, and includes at least one opening with the sticking brilliant pad of correspondence and each wire pad part.
14. high-heat-dispersion LED non-metal base plate according to claim 13, the corresponding wire pad of this housing further forms breach, makes the part wire pad expose as external electrode.
15. high-heat-dispersion LED non-metal base plate according to claim 13, this nonmetal plate body further includes many second through holes and how solid conduction copper column, and on second surface, form the weld pad of corresponding many wire pads, each solid conduction copper column is located at corresponding second through hole, and one-body molded with the weld pad of corresponding wire pad.
16. according to each described high-heat-dispersion LED non-metal base plate of claim 13 to 15, this housing can be glass mat or the aluminium sheet after anode treatment, and is pressed on the first surface of nonmetal plate body.
17. high-heat-dispersion LED non-metal base plate according to claim 13, this sticking brilliant pad, wire pad and cooling pad are the copper layer.
18. high-heat-dispersion LED non-metal base plate according to claim 17, its copper layer form an anti-solder ink layer and a WU layer more respectively.
19. high-heat-dispersion LED non-metal base plate according to claim 16 is formed with electroless nickel layer more in regular turn and electroplates a silver layer and an anti-solder ink layer on this copper electroplating layer.
20. high-heat-dispersion LED non-metal base plate according to claim 16 is formed with electroless nickel layer and electrogilding layer and an anti-solder ink layer more in regular turn on this copper electroplating layer.
21. high-heat-dispersion LED non-metal base plate according to claim 13, this non-metal base thickness is 0.3mm to 2mm, and each first through hole aperture is more than the 0.02mm, and this electroless nickel layer is that the above and electrosilvering layer thickness of 3um is more than the 1um again.
22. high-heat-dispersion LED non-metal base plate according to claim 14, this non-metal base thickness is 0.3mm to 2mm, and each first through hole aperture is more than the 0.02mm, and this electronickelling depth is more than the 3um again, and this electrogilding layer is more than the 0.025um.
23. a high-heat-dispersion LED non-metal base plate method for making, it includes:
One nonmetal plate body is provided;
On nonmetal plate body, form at least one first through hole;
Plated metal plate body outer surface and this at least the first through hole, and form copper electroplating layer in outer surface, and form solid heat conduction copper post in each first through hole;
Graphical copper electroplating layer is formed with at least one sticking brilliant pad and many wire pads in first surface, forms at least one cooling pad of corresponding sticking brilliant pad again in second surface; Wherein the heat conduction copper post in first through hole is one-body molded with sticking brilliant pad and cooling pad; And
Prepare at least one LED wafer, and sticking being located on the corresponding sticking brilliant pad;
Each LED wafer is connected on the corresponding wire pad in the routing mode; And
Inject the middle opening of liquid glue, promptly constitute an adhesive body after waiting to solidify in housing, with LED wafer involution in wherein.
24. high-heat-dispersion LED non-metal base plate method for making according to claim 23, wherein:
In forming the first through hole step, further this non-metal base plate is formed many second through holes;
In plated metal plate body step, also each second through hole is electroplated, and be formed with solid conduction copper column in each second through hole; And
In graphical copper electroplating layer step, the place is formed with weld pad in the corresponding wire pad of nonmetal plate body second surface, and wherein each solid conduction copper column is one-body molded with corresponding wire pad and weld pad.
25., after graphical copper electroplating layer step, include following steps again according to claim 23 or 24 described high-heat-dispersion LED non-metal base plate method for makings:
Preparation one includes the housing of at least one opening, and makes each at least one opening aim at corresponding sticking brilliant pad and wire pad part, is bonded to this non-metal board body and is formed with on the surface of gluing brilliant pad and each wire pad.
26. high-heat-dispersion LED non-metal base plate method for making according to claim 25, this housing can be glass mat or the aluminium sheet after anode treatment, and is incorporated on the nonmetal plate body in the pressing mode.
27. high-heat-dispersion LED non-metal base plate method for making according to claim 26, in the nonmetal plate body step of above-mentioned plating, at first nonmetal plate body is carried out degreasing, give pickling again, activate again afterwards, form chemical copper or chemical nickel again, put into copper electroplating liquid at last again, to form copper electroplating layer.
28. high-heat-dispersion LED non-metal base plate method for making according to claim 27, in the above-mentioned graphical copper electroplating layer step, carry out the dry film program in copper electroplating layer, the copper electroplating layer that do not covered of etching again by dry film, remove dry film afterwards again, and to parcel plating copper layer coating one deck anti-solder ink, the copper electroplating layer to uncoated anti-solder ink sprays WU again.
29. high-heat-dispersion LED non-metal base plate method for making according to claim 28, in the above-mentioned graphical copper electroplating layer step, carry out the dry film program in copper electroplating layer, the copper electroplating layer that do not covered of etching again by dry film, remove dry film afterwards again, on graphical copper electroplating layer, carry out electronickelling and electrosilvering more in regular turn, be coated with anti-solder ink at last again.
30. high-heat-dispersion LED non-metal base plate method for making according to claim 28, in the above-mentioned graphical copper electroplating layer step, on copper electroplating layer, carry out the dry film program, the copper electroplating layer that do not covered of etching again by dry film, remove dry film afterwards again, on graphical copper electroplating layer, carry out electronickelling and electrogilding more in regular turn, be coated with anti-solder ink at last again.
31. high-heat-dispersion LED non-metal base plate method for making according to claim 24, this non-metal base plate thickness is 0.3mm to 2mm, and each first through hole and each second through hole aperture are more than the 0.02mm.
32. high-heat-dispersion LED non-metal base plate method for making according to claim 29, this non-metal base plate thickness is 0.3mm to 2mm, and each first through hole and each second through hole aperture are more than the 0.02mm, and this electroless nickel layer is more than the 3um again, and the electrosilvering layer thickness is more than the 1um.
33. high-heat-dispersion LED non-metal base plate method for making according to claim 30, this non-metal base plate thickness is 0.3mm to 2mm, and each first through hole and each second through hole aperture are more than the 0.02mm, and this electronickelling depth is more than the 3um again, and this electrogilding layer is more than the 0.025um.
34. high-heat-dispersion LED non-metal base plate method for making according to claim 25, this non-metal base plate is ceramic substrate or silicon substrate.
35. a high-heat-dispersion LED non-metal base plate includes:
One nonmetal plate body, including two relative first and second surface, at least one first perforations wears and at least one solid heat conduction copper post, wherein first surface is formed with many wire pads and at least one sticking brilliant pad, and second surface then is formed with the cooling pad of corresponding at least one sticking brilliant pad; This at least one heat conduction copper cylindricality is formed in corresponding first through hole and is one-body molded with cooling pad with corresponding sticking brilliant pad again; And
One housing is arranged at the first surface of ceramic laminate body, and includes at least one opening with the sticking brilliant pad of correspondence and each wire pad part;
At least one wafer is bonded on the corresponding sticking brilliant pad, and is connected to corresponding wire pad with lead; And
At least one adhesive body is filled in the corresponding opening of this housing.
36. high-heat-dispersion LED non-metal base plate according to claim 35, the corresponding wire pad of this housing further forms breach, makes the part wire pad expose as external electrode.
37. high-heat-dispersion LED non-metal base plate according to claim 36, this nonmetal plate body further includes many second through holes and how solid conduction copper column, and on second surface, form the weld pad of corresponding many wire pads, each solid conduction copper column is located at corresponding second through hole, and one-body molded with the weld pad of corresponding wire pad.
38. according to each described high-heat-dispersion LED non-metal base plate of claim 35 to 37, this housing can be glass mat or the aluminium sheet after anode treatment, and is pressed on the first surface of nonmetal plate body.
39. according to the described high-heat-dispersion LED non-metal base plate of claim 38, this sticking brilliant pad, wire pad and cooling pad are the copper layer.
40. according to the described high-heat-dispersion LED non-metal base plate of claim 39, its copper layer forms an anti-solder ink layer and a WU layer more respectively.
41., be formed with electroless nickel layer on this copper layer more in regular turn and electroplate a silver layer and an anti-solder ink layer according to the described high-heat-dispersion LED non-metal base plate of claim 39.
42., be formed with electroless nickel layer and electrogilding layer and an anti-solder ink layer on this copper electroplating layer more in regular turn according to the described high-heat-dispersion LED non-metal base plate of claim 39.
43. high-heat-dispersion LED non-metal base plate according to claim 35, this non-metal base thickness is 0.3mm to 2mm, and each first through hole aperture is more than the 0.02mm, and reaching the electrosilvering layer thickness more than this electroless nickel layer 3um again is more than the 1um.
44. high-heat-dispersion LED non-metal base plate according to claim 36, this non-metal base thickness is 0.3mm to 2mm, and each first through hole aperture is more than the 0.02mm, and this electronickelling depth is more than the 3um again, and this electrogilding layer is more than the 0.025um.
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Application publication date: 20111109 |