CN102768972A - Wafer drying device - Google Patents
Wafer drying device Download PDFInfo
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- CN102768972A CN102768972A CN2012102408092A CN201210240809A CN102768972A CN 102768972 A CN102768972 A CN 102768972A CN 2012102408092 A CN2012102408092 A CN 2012102408092A CN 201210240809 A CN201210240809 A CN 201210240809A CN 102768972 A CN102768972 A CN 102768972A
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Abstract
The invention discloses a wafer drying device. The wafer drying device comprises a body, a wafer clamping mechanism, a water tank, a water tank driving piece and an isopropyl alcohol (IPA) drying system, wherein the wafer clamping mechanism is arranged on the body and used for supporting a wafer which is directed along a vertical direction; the water tank is arranged on the body moveably up and down, and a rabbet which penetrates the top wall of the water tank along the vertical direction and where the wafer passes through is arranged in the top wall; the water tank driving piece is arranged on the body and connected with the water tank for driving the water tank to move up and down; and the IPA drying system is arranged on the water tank and used for drying the wafer. According to the embodiment of the invention, the wafer drying device has the advantages of small manufacturing difficulty, low manufacturing cost, high reliability and the like, and repositioning precision requirements on a mechanical arm which carries the wafer are greatly reduced.
Description
Technical field
The present invention relates to field of semiconductor manufacture, in particular to a kind of drying wafer device.
Background technology
Existing drying wafer device adopts the technology that adds oven dry that dries.But wafer will be done high speed rotary motion, can add stoving process simultaneously, like this can be influential to the resistance to overturning of wafer, and serious even can damage wafer.The rotating platform high speed rotating also can be accelerated the loss of plant equipment simultaneously.
Summary of the invention
The present invention one of is intended to solve the problems of the technologies described above at least to a certain extent or provides a kind of useful commerce to select at least.For this reason, one object of the present invention is to propose a kind of drying wafer device that can reduce widely the requirement of the repetitive positioning accuracy of the manipulator that is used to carry wafer.
For realizing above-mentioned purpose, according to embodiments of the invention a kind of drying wafer device is proposed, said drying wafer device comprises: body; Wafer fixture, said wafer fixture are located at and are used to support vertically directed wafer on the said body; Water tank, said water tank can be located on the said body up or down, and the roof of said water tank is provided with the notch that connects said roof along the vertical direction and is used for through wafer; Water tank actuator, said water tank actuator are located on the said body and link to each other with said water tank and move up and down so that drive said water tank; With the IPA drying system, said IPA drying system is located at and is used for dry said wafer on the said water tank.
Drying wafer device according to the embodiment of the invention drives the said water tank actuator that said water tank moves up and down through on said body, being provided with; Thereby, said wafer can keep said wafer motionless and said water tank is moved up and down when being carried out drying; Can reduce required precision widely like this to elevating movement (promptly moving up and down); Thereby not only can reduce the machining accuracy of said drying wafer device and the difficulty of installation and the said drying wafer device of debugging widely, and can make said drying wafer device stable action in running.Therefore, according to the said drying wafer device of the embodiment of the invention have that manufacture difficulty is little, low cost of manufacture, reliability advantages of higher.
And; Because said wafer keeps motionless and said water tank 30 to move up and down when said wafer is carried out drying; Therefore can reduce requirement widely to the repetitive positioning accuracy of the manipulator that is used to carry said wafer; Thereby can make said manipulator grasp said wafer better, more accurately, guarantee the resistance to overturning of said wafer.
In addition, drying wafer device according to the above embodiment of the present invention can also have following additional technical characterictic:
According to one embodiment of present invention, said wafer fixture comprises: support, and said is erected on the said body; Following gripper jaw support, said gripper jaw support down is L shaped, the said vertical limb of gripper jaw support down links to each other with said support and the lower end of said vertical limb is stretched in the said water tank; Gripper jaw on first and second; Last gripper jaw actuator, said go up that the gripper jaw actuator is located at that in said support and the said gripper jaw support down one goes up and with said first and second on gripper jaw link to each other so that drive that gripper jaw moves up and down on said first and second; With following gripper jaw, said gripper jaw down is located on the horizontal limb of said gripper jaw support down, and said wafer and said wafer is vertically directed is supported in the gripper jaw cooperation on the wherein said gripper jaw and said first and second down.Said wafer fixture has advantage of simple structure.And; Said wafer fixture is through being provided with on the said down gripper jaw, said first gripper jaw on the gripper jaw and said second; Thereby the said wafer of clamping more stably not only; And can more said wafer be located in the vertical direction, thereby can carry out drying to said wafer better.
According to one embodiment of present invention, the thickness of the width of said notch and said wafer is adaptive., said water tank can utilize said notch that said wafer is carried out clamping when carrying out submergence to said wafer like this.
According to one embodiment of present invention, said water tank is provided with water inlet and delivery port, and said water inlet is suitable for linking to each other with the water source.Through said delivery port and the said water inlet that links to each other with the water source are set on said water tank, thereby can make water inject said water tank and discharge said water tank from said delivery port from said water inlet.In other words, the water in the said water tank can be in recurrent state all the time, the water in the said water tank is kept clean, and then can improve the cleanliness factor of said wafer widely.
According to one embodiment of present invention; Said IPA drying system comprises first and second pipelines; Said first and second pipelines said wafer axially on the setting of turning up the soil at interval; Said first and second ducted each parts are positioned at said water tank and another part stretches out said water tank, and the said part that the said part of wherein said first pipeline is provided with first nozzle and said second pipeline is provided with second nozzle so that to two jet surface IPA steam of said wafer.Said IPA drying system has advantage of simple structure.
According to one embodiment of present invention, said first pipeline is parallel to said second pipeline, and said first nozzle is located on said first pipeline equally spacedly and said second nozzle is located on said second pipeline equally spacedly.Said like this IPA drying system can be ejected into IPA steam on two surfaces of said wafer more equably, leaves washmarking so that avoid on the surface of said wafer thereby can carry out drying to two surfaces of said wafer more equably.
According to one embodiment of present invention, said water tank actuator comprises: drive motors, said drive motors are located on the said body; And ball-screw, the screw rod of said ball-screw links to each other with said drive motors, and the nut of said ball-screw links to each other with said water tank.Move up and down through utilizing said ball-screw to drive said water tank; Thereby said water tank is moved up and down evenly; So not only can improve said drying wafer device widely in the stability in when operation, and can carry out drying to two surfaces of said wafer more equably and leave washmarking on the surface of said wafer so that avoid.
According to one embodiment of present invention, said drying wafer device also comprises tank bracket, and said water tank is located on the said tank bracket, and wherein said water tank actuator links to each other with said tank bracket so that drive said tank bracket and said water tank moves up and down.Through said tank bracket is set, can said water tank actuator directly linked to each other with said tank bracket and drive said water tank through said tank bracket moves up and down, and can avoid like this damaging said water tank, improves the useful life of said water tank.
According to one embodiment of present invention, said tank bracket comprises: level board, said water tank are located on the said level board; And vertical plate, said vertical plate is located on the said level board and from said level board and extends upward, and said vertical plate links to each other with said water tank actuator.Said tank bracket has advantage of simple structure.
According to one embodiment of present invention, said drying wafer device also comprises spherical guide, and the guide rail of said spherical guide is located on the said body and extends along the vertical direction, and the slide block of said spherical guide is located on the said vertical plate.Have the said spherical guide of the guide rail that extends along the vertical direction through setting, thereby said tank bracket and said water tank are more accurately moved along the vertical direction.
Additional aspect of the present invention and advantage part in the following description provide, and part will become obviously from the following description, or recognize through practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage obviously with are easily understood becoming the description of embodiment from combining figs, wherein:
Fig. 1 is the structural representation according to the drying wafer device of the embodiment of the invention;
Fig. 2 is the structural representation according to the drying wafer device of the embodiment of the invention; With
Fig. 3 is the cutaway view according to the drying wafer device of the embodiment of the invention.
Embodiment
Describe embodiments of the invention below in detail, the example of said embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Be exemplary through the embodiment that is described with reference to the drawings below, be intended to be used to explain the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention; It will be appreciated that; The orientation of indications such as term " " center ", " vertically ", " laterally ", " length ", " width ", " thickness ", " on ", D score, " preceding ", " back ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", " counterclockwise " or position relation are for based on orientation shown in the drawings or position relation; only be to describe with simplifying for the ease of describing the present invention; rather than the device or the element of indication or hint indication must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.
In addition, term " first ", " second " only are used to describe purpose, and can not be interpreted as indication or hint relative importance or the implicit quantity that indicates indicated technical characterictic.Thus, one or more a plurality of these characteristics can be shown or impliedly comprised to the characteristic that is limited with " first ", " second " clearly.In description of the invention, the implication of " a plurality of " is two or more, only if clear and definite concrete qualification is arranged in addition.
In the present invention, only if clear and definite regulation and qualification are arranged in addition, broad understanding should be done in terms such as term " installation ", " linking to each other ", " connection ", " fixing ", for example, can be to be fixedly connected, and also can be to removably connect, or connect integratedly; Can be mechanical connection, also can be to be electrically connected; Can be directly to link to each other, also can link to each other indirectly through intermediary, can be the connection of two element internals.For those of ordinary skill in the art, can understand above-mentioned term concrete implication in the present invention as the case may be.
In the present invention; Only if clear and definite regulation and qualification are arranged in addition; First characteristic second characteristic it " on " or D score can comprise that first and second characteristics directly contact, can comprise that also first and second characteristics are not directly contacts but through the contact of the additional features between them.And, first characteristic second characteristic " on ", " top " and " above " comprise first characteristic directly over second characteristic and oblique upper, or only represent that the first characteristic level height is higher than second characteristic.First characteristic second characteristic " under ", " below " and " below " comprise first characteristic under second characteristic with tiltedly below, or only represent that the first characteristic level height is less than second characteristic.
Referring to figs. 1 to Fig. 3 the drying wafer device 1 according to the embodiment of the invention is described below.To shown in Figure 3, comprise body 10, wafer fixture, water tank 30, water tank actuator 40 and IPA drying system 50 like Fig. 1 according to the drying wafer device 1 of the embodiment of the invention.
Said wafer fixture is located at and is used for supporting (vertical direction A is shown in the direction of arrow of Fig. 1 to Fig. 3, and wherein vertical direction is identical with above-below direction) directed wafer 2 vertically on the body 10.Water tank 30 can be located on the body 10 up or down, and the roof 32 of water tank 30 is provided with the notch 31 that connects roof 32 along the vertical direction and is used for through wafer 2.Water tank actuator 40 is located on the body 10, and water tank actuator 40 links to each other with water tank 30 and moves up and down so that drive water tank 30.IPA drying system 50 is located at and is used for dry wafer 2 on the water tank 30.
Referring to figs. 1 through Fig. 3 drying is carried out in utilization according to 1 pair of wafer of drying wafer device 2 of the embodiment of the invention process is described below.At first; The manipulator (not shown) will not carried out dry wafer 2 and will be transported on the said wafer fixture, and water tank actuator 40 drives water tanks 30 and moves up water in water tank 30 with wafer 2 complete submergences (wafer 2 enters in the water tank 30 from notch 31) then.Water tank actuator 40 driving water tanks 30 move down then, when surface in the upper end of wafer 2, begin to utilize 50 pairs of wafers of IPA drying system 2 to carry out drying and all surface until wafer 2, have accomplished the drying to whole wafer 2 this moment.Utilize said manipulator that dried wafer 2 is walked from said wafer fixture carrying.
Drying wafer device 1 according to the embodiment of the invention drives the water tank actuator 40 that water tank 30 moves up and down through on body 10, being provided with; Thereby, wafer 2 can keep wafer 2 motionless and water tank 30 is moved up and down when being carried out drying; Can reduce required precision widely like this to elevating movement (promptly moving up and down); Thereby not only can reduce the machining accuracy of drying wafer device 1 and the difficulty of installation and debugging drying wafer device 1 widely, and can make drying wafer device 1 stable action in running.Therefore, according to the drying wafer device 1 of the embodiment of the invention have that manufacture difficulty is little, low cost of manufacture, reliability advantages of higher.
And; Water tank 30 moves up and down owing to wafer when wafer 2 is carried out drying 2 keeps motionless; Therefore can reduce requirement widely to the repetitive positioning accuracy of the manipulator that is used to carry wafer 2; Thereby can make said manipulator better, grasping silicon wafer 2 more accurately, guaranteed the resistance to overturning of wafer 2.
Like Fig. 1 to shown in Figure 3, in some embodiments of the invention, said wafer fixture can comprise support 21, down gripper jaw 24 on the gripper jaw 23, second on the gripper jaw support 22, first, go up gripper jaw actuator 25 and following gripper jaw 26.
Advantageously; Vertically the lower end of limb 221 can be stretched in the water tank 30; Like this; Horizontal limb 222 can all be arranged in the container cavity of water tank 30, be used for through vertical limb 221 thereby can be provided with the through hole that connects said roof along the vertical direction on the said roof of water tank 30, and said through hole can be suitable with the lower end of vertical limb 221
Said wafer fixture has advantage of simple structure.And; Said wafer fixture is through being provided with down on the gripper jaw 26, first gripper jaw 24 on the gripper jaw 23 and second; Thereby clamping wafer 2 more stably not only, and can be more accurately with wafer 2 location in the vertical directions, thereby can carry out drying to wafer 2 better.Particularly, last gripper jaw actuator 25 can be a cylinder, and last gripper jaw actuator 25 also can be electric cylinder.
In one embodiment of the invention, the width of notch 31 can be adaptive with the thickness of wafer 2, when 30 pairs of wafers of water tank 2 carry out submergence, can utilize 31 pairs of wafers of notch 2 to carry out clamping like this.Advantageously, notch 31 can be a rectangular notch, and the length of notch 31 can be far longer than the width of notch 31.
Particularly; When water tank actuator 40 drives that water tanks 30 move up and after the lower end of wafer 2 gets into water tank 30; Last gripper jaw actuator 25 can drive on first on the gripper jaw 23 and second gripper jaw 24 and break away from that wafers 2 move up so that wafer 2 can be immersed in the water in the water tank 30 fully, this moment notch 31 with can cooperate supporting wafer 2 and can be of play gripper jaw 26 with wafer 2 orientation vertically.When water tank actuator 40 drives that water tanks 30 move down and after the top of wafer 2 stretches out water tank 30, last gripper jaw actuator 25 can drive on first on the gripper jaw 23 and second gripper jaw 24 and move down so that make on first on the gripper jaw 23 and second cooperate supporting wafer 2 and with wafer 2 orientation vertically of gripper jaw 24 and following gripper jaw 26.
The fetching process of wafer 2 is described referring to figs. 1 through Fig. 3 below.When placing wafer 2; At first can utilize gripper jaw actuator 25 to drive on first that gripper jaw 24 moves up so that avoid wafer 2 on the gripper jaw 23 and second; Can utilize said manipulator that wafer 2 is transported to down (following gripper jaw 26 clamping wafers 2) on the gripper jaw 26 subsequently; Can utilize gripper jaw actuator 25 to drive on first on the gripper jaw 23 and second gripper jaw 24 then moves down so that make on first on the gripper jaw 23 and second cooperate supporting wafer 2 and with wafer 2 orientation vertically, last said manipulator disengaging wafer 2 also resets of gripper jaw 24 and play gripper jaw 26.The process of taking out wafer 2 is opposite with the process of placing wafer 2, no longer describes in detail at this.
Advantageously, can be provided with water inlet and delivery port on the water tank 30, said water inlet can be suitable for linking to each other with the water source.Through said delivery port and the said water inlet that links to each other with the water source are set on water tank 30, thereby can make water inject water tank 30 and discharge water tank 30 from said delivery port from said water inlet.In other words, the water in the water tank 30 can be in recurrent state all the time, the water in the water tank 30 is kept clean, and then can improve the cleanliness factor of wafer 2 widely.Particularly, the water in the water tank 30 can be deionized water.
Extremely shown in Figure 3 like Fig. 1; In examples more of the present invention; IPA drying system 50 can comprise first pipeline 51 and second pipeline 52; First pipeline 51 and second pipeline 52 can wafer 2 axially on the setting of turning up the soil at interval; The part of each in first pipeline 51 and second pipeline 52 can be positioned at water tank 30; And another part of each in first pipeline 51 and second pipeline 52 can stretch out water tank 30 (another part of each in first pipeline 51 and second pipeline 52 can link to each other with the IPA steam generator), wherein can be provided with on the said part of first pipeline 51 (i.e. the part that is positioned at water tank 30 of first pipeline 51) on the said part (i.e. the part that is positioned at water tank 30 of second pipeline 52) of first nozzle and second pipeline 52 and can be provided with second nozzle so that to two jet surface IPA (isopropyl alcohol) of wafer 2 steam.IPA drying system 50 has advantage of simple structure.
In a concrete example of the present invention, first pipeline 51 can be parallel to second pipeline 52, and said first nozzle can be located on first pipeline 51 equally spacedly and said second nozzle can be located on second pipeline 52 equally spacedly.In other words, said first nozzle can be that a plurality of and a plurality of said first nozzles can be located on first pipeline 51 equally spacedly, and said second nozzle can be that a plurality of and a plurality of said second nozzles can be located on second pipeline 52 equally spacedly.IPA drying system 50 can be ejected into IPA steam on two surfaces of wafer 2 more equably like this, leaves washmarking so that avoid on the surface of wafer 2 thereby can carry out drying to two surfaces of wafer 2 more equably.
Advantageously; The two ends that the water tank 30 (promptly the middle part of first pipeline 51 can be positioned at water tank 30) and first pipeline 51 can be stretched out in the two ends of first pipeline 51 can link to each other with the IPA steam generator, and the two ends that the water tank 30 (promptly the middle part of second pipeline 52 can be positioned at water tank 30) and second pipeline 52 can be stretched out in the two ends of second pipeline 52 can link to each other with the IPA steam generator.That is to say that IPA steam can get in first pipeline 51 from the two ends of first pipeline 51 simultaneously and IPA steam can get into from the two ends of second pipeline 52 in second pipeline 52 simultaneously.IPA drying system 50 can be ejected into IPA steam on two surfaces of wafer 2 more equably like this, leaves washmarking so that avoid on the surface of wafer 2 thereby can carry out drying to two surfaces of wafer 2 more equably.
To shown in Figure 3, in some embodiments of the invention, water tank actuator 40 can comprise drive motors 41 and ball-screw 42 like Fig. 1.Drive motors 41 can be located on the body 10, and the screw rod 421 of ball-screw 42 can link to each other with drive motors 41, and the nut 422 of ball-screw 42 can link to each other with water tank 30.Drive motors 41 can drive screw rod 421 rotations of ball-screw 42, and then can move up and down through the nut 422 drive water tanks 30 of ball-screw 42.Move up and down through utilizing ball-screw 42 to drive water tank 30; Thereby water tank 30 is moved up and down evenly; So not only can improve drying wafer device 1 widely in the stability in when operation, and can carry out drying to two surfaces of wafer 2 more equably and leave washmarking (wafer 2 can surface evenly) on the surface of wafer 2 so that avoid.Water tank actuator 40 can also be electric cylinder.
In an example of the present invention; Extremely shown in Figure 3 like Fig. 1; Drying wafer device 1 can also comprise tank bracket 60, and water tank 30 can be located on the tank bracket 60, and wherein water tank actuator 40 can link to each other with tank bracket 60 and moves up and down with water tank 30 so that drive tank bracket 60.Through tank bracket 60 is set, can water tank actuator 40 directly linked to each other with tank bracket 60 and drive water tank 30 through tank bracket 60 moves up and down, and can avoid damaging water tank 30 like this, improves the useful life of water tank 30.Particularly, the nut 422 of ball-screw 42 can link to each other with tank bracket 60.Tank bracket 60 can be processed by metal material, and water tank 30 can be processed by nonmetallic materials (for example plastics).
Alternatively; Tank bracket 60 can comprise level board 61 and vertical plate 62; Water tank 30 can be located at (for example, water tank 30 can removably be fixed on the level board 61 through securing member (for example screw)) on the level board 61, and vertical plate 62 can be located on the level board 61; And vertical plate 62 can extend upward from level board 61, and vertical plate 62 can link to each other with water tank actuator 40.Tank bracket 60 has advantage of simple structure.Particularly, the nut 422 of ball-screw 42 can link to each other with the back surface of vertical plate 62, and wherein the back surface of vertical plate 62 is meant the surface away from water tank 30 of vertical plate 62.
Advantageously, tank bracket 60 can also comprise left plate and right plate, and each in said left plate and the said right plate can be the cardinal principle right-angled triangle.Wherein, A right-angle side of said left plate can link to each other with the left side of level board 61 and another right-angle side of said left plate can link to each other with the left side of vertical plate 62, and a right-angle side of said right plate can link to each other with the right side of level board 61 and another right-angle side of said right plate can link to each other with the right side of vertical plate 62.
In an example of the present invention; As depicted in figs. 1 and 2, drying wafer device 1 can also comprise spherical guide 70, and the guide rail of spherical guide 70 can be located on the body 10; And the guide rail of spherical guide 70 can extend along the vertical direction, and the slide block of spherical guide 70 can be located on the vertical plate 62.Have the spherical guide 70 of the guide rail that extends along the vertical direction through setting, thereby tank bracket 60 and water tank 30 are more accurately moved along the vertical direction.Particularly, the slide block of spherical guide 70 can link to each other with the back surface of vertical plate 62.
According to the drying wafer device 1 of the embodiment of the invention have that manufacture difficulty is little, low cost of manufacture, reliability advantages of higher, and reduced requirement widely to the repetitive positioning accuracy of the manipulator that is used to carry wafer 2.
In the description of this specification, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means the concrete characteristic, structure, material or the characteristics that combine this embodiment or example to describe and is contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete characteristic, structure, material or the characteristics of description can combine with suitable manner in any one or more embodiment or example.
Although illustrated and described embodiments of the invention above; It is understandable that; The foregoing description is exemplary; Can not be interpreted as limitation of the present invention, those of ordinary skill in the art can change the foregoing description under the situation that does not break away from principle of the present invention and aim within the scope of the invention, modification, replacement and modification.
Claims (10)
1. a drying wafer device is characterized in that, comprising:
Body;
Wafer fixture, said wafer fixture are located at and are used to support vertically directed wafer on the said body;
Water tank, said water tank can be located on the said body up or down, and the roof of said water tank is provided with the notch that connects said roof along the vertical direction and is used for through wafer;
Water tank actuator, said water tank actuator are located on the said body and link to each other with said water tank and move up and down so that drive said water tank; With
IPA drying system, said IPA drying system are located at and are used for dry said wafer on the said water tank.
2. drying wafer device according to claim 1 is characterized in that, said wafer fixture comprises:
Support, said is erected on the said body;
Following gripper jaw support, said gripper jaw support down is L shaped, the said vertical limb of gripper jaw support down links to each other with said support and the lower end of said vertical limb is stretched in the said water tank;
Gripper jaw on first and second;
Last gripper jaw actuator, said go up that the gripper jaw actuator is located at that in said support and the said gripper jaw support down one goes up and with said first and second on gripper jaw link to each other so that drive that gripper jaw moves up and down on said first and second; With
Following gripper jaw, said gripper jaw down are located on the horizontal limb of said gripper jaw support down, and said wafer and said wafer is vertically directed is supported in the gripper jaw cooperation on the wherein said gripper jaw and said first and second down.
3. drying wafer device according to claim 1 is characterized in that, the width of said notch and the thickness of said wafer are adaptive.
4. drying wafer device according to claim 1 is characterized in that said water tank is provided with water inlet and delivery port, and said water inlet is suitable for linking to each other with the water source.
5. drying wafer device according to claim 1; It is characterized in that; Said IPA drying system comprises first and second pipelines; Said first and second pipelines said wafer axially on the setting of turning up the soil at interval; Said first and second ducted each parts are positioned at said water tank and another part stretches out said water tank, and the said part that the said part of wherein said first pipeline is provided with first nozzle and said second pipeline is provided with second nozzle so that to two jet surface IPA steam of said wafer.
6. drying wafer device according to claim 5 is characterized in that, said first pipeline is parallel to said second pipeline, and said first nozzle is located on said first pipeline equally spacedly and said second nozzle is located on said second pipeline equally spacedly.
7. drying wafer device according to claim 1 is characterized in that, said water tank actuator comprises:
Drive motors, said drive motors are located on the said body; With
Ball-screw, the screw rod of said ball-screw links to each other with said drive motors, and the nut of said ball-screw links to each other with said water tank.
8. according to each described drying wafer device among the claim 1-7; It is characterized in that; Also comprise tank bracket, said water tank is located on the said tank bracket, and wherein said water tank actuator links to each other with said tank bracket so that drive said tank bracket and said water tank moves up and down.
9. drying wafer device according to claim 8 is characterized in that, said tank bracket comprises:
Level board, said water tank are located on the said level board; With
Vertical plate, said vertical plate is located on the said level board and from said level board and extends upward, and said vertical plate links to each other with said water tank actuator.
10. according to each described drying wafer device among the claim 1-9, it is characterized in that, also comprise spherical guide, the guide rail of said spherical guide is located on the said body and extends along the vertical direction, and the slide block of said spherical guide is located on the said vertical plate.
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| CN201210240809.2A CN102768972B (en) | 2012-07-11 | 2012-07-11 | Wafer drying device |
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| CN201210240809.2A CN102768972B (en) | 2012-07-11 | 2012-07-11 | Wafer drying device |
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| CN102768972B CN102768972B (en) | 2015-02-18 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102914139A (en) * | 2012-10-19 | 2013-02-06 | 上海宏力半导体制造有限公司 | Wafer drying equipment and forming method thereof |
| CN103231303A (en) * | 2013-05-15 | 2013-08-07 | 清华大学 | Chemical mechanical polishing device |
| CN103252705A (en) * | 2013-05-15 | 2013-08-21 | 清华大学 | Chemical mechanical polishing device |
| CN103994637A (en) * | 2014-05-22 | 2014-08-20 | 京东方科技集团股份有限公司 | Base plate drying device and method |
| CN106449510A (en) * | 2016-09-26 | 2017-02-22 | 天津华海清科机电科技有限公司 | Wafer transmission device |
| CN108257894A (en) * | 2018-01-12 | 2018-07-06 | 清华大学 | Wafer drying device |
| CN108917298A (en) * | 2018-08-29 | 2018-11-30 | 欧阳小泉 | A kind of silicon wafer drying machine shutdown shaft Self-resetting mechanism |
| CN110849127A (en) * | 2019-11-11 | 2020-02-28 | 兰泽(荆门)智能科技有限公司 | Rotary pulling-up wafer drying method |
| CN114562874A (en) * | 2022-03-02 | 2022-05-31 | 浙江光特科技有限公司 | Drying treatment device used after wafer cleaning |
| CN115031509A (en) * | 2022-05-18 | 2022-09-09 | 扬州思普尔科技有限公司 | Lifting type semiconductor wafer drying device |
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| US9383136B2 (en) | 2014-05-22 | 2016-07-05 | Boe Technology Group Co. Ltd. | Substrate dry device and method for drying substrate based on substrate dry device |
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| CN108917298A (en) * | 2018-08-29 | 2018-11-30 | 欧阳小泉 | A kind of silicon wafer drying machine shutdown shaft Self-resetting mechanism |
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| CN110849127A (en) * | 2019-11-11 | 2020-02-28 | 兰泽(荆门)智能科技有限公司 | Rotary pulling-up wafer drying method |
| CN114562874A (en) * | 2022-03-02 | 2022-05-31 | 浙江光特科技有限公司 | Drying treatment device used after wafer cleaning |
| CN114562874B (en) * | 2022-03-02 | 2023-07-04 | 浙江光特科技有限公司 | Be used for wafer to wash back drying device |
| CN115031509A (en) * | 2022-05-18 | 2022-09-09 | 扬州思普尔科技有限公司 | Lifting type semiconductor wafer drying device |
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