CN102843628B - Earphone sounding structure and assembling method thereof - Google Patents
Earphone sounding structure and assembling method thereof Download PDFInfo
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- CN102843628B CN102843628B CN201110175647.4A CN201110175647A CN102843628B CN 102843628 B CN102843628 B CN 102843628B CN 201110175647 A CN201110175647 A CN 201110175647A CN 102843628 B CN102843628 B CN 102843628B
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- vibrating diaphragm
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Abstract
The invention provides an earphone sounding structure and an assembling method thereof. The earphone sounding structure comprises a sounding module and a fixing assembly, wherein the sounding module is provided with a first opened polar plate, a first hollow support body, a diaphragm assembly, a second hollow support body, a second opened polar plate and a second hollow fixed frame body which are sequentially stacked in an accommodating space of an earphone cap, and the fixing assembly is placed in a third fixed hole of the second hollow fixed frame body and a fourth fixed hole of the earphone cap so as to fix the sounding module on the earphone cap. Therefore, the earphone sounding structure is assembled by using a fixing mode of the fixing assembly, so that the purposes that the earphone sounding structure is installed rapidly, the cost is reduced, the assembling yield and the maintenance convenience are improved, and materials are uneasy to waste and the like can be achieved.
Description
Technical field
The present invention relates to a kind of earphone sounding structure and assemble method thereof, particularly relate to earphone sounding structure and the assemble method thereof that can reach and install rapidly, reduce costs, improve the object such as assembling yield and maintenance convenience, not easily waste material.
Background technology
In daily life, people Chang Huiyong earphone carries out listening to of music (sound), such as PlayGear Stealth, supra-aural earphone, circumaural earphone etc.
General such as its operation principle of electrostatic earphone can be divided into voltage bias type (Bias Voltage) and electret capacitance (Electret).The operation principle of voltage bias type is sustainable supply vibrating diaphragm one direct current (DC) bias (Bias), diaphragm surface is allowed to be covered with electric charge, and the synchronous and alternating voltage of positive antiphase of sustainable supply both sides pole plate, utilize the electrostatic force that positive and negative charge produces, drive diaphragm oscillations also transmission sound to be gone out; The operation principle of electret capacitance is charge to vibrating diaphragm in advance before assembling product, vibrating diaphragm is made to be full of electric charge (therefore not needing in use to access a DC bias signal to vibrating diaphragm again), and the synchronous and alternating voltage of positive antiphase of sustainable supply both sides pole plate, utilize the electrostatic force that positive and negative charge produces, drive diaphragm oscillations and transmission sound is gone out.The technology of operation principle known by the people in this field of aforementioned voltage bias type and electret capacitance, therefore no longer repeated.
Traditional earphone normally adopts the sounding component in hot pressing mode making earphone, is namely all formed with hot pressing mode by the assemblies such as vibrating diaphragm, supporter, apertured electrodes, external headphones assembly (ear cap).But, though aforementioned existing production method have automaticity higher, produce the advantages such as very fast, but shortcoming is after product hot pressing completes, when measuring sound quality, when wherein having a certain assembly bad if find, just replacing cannot be disassembled, reason is that hot pressing mode will make whole sounding component scrap after disassembling, and due to its costs rather expensive of vibrating diaphragm of electrostatic earphone, if make whole group to scrap because of the bad of other component, quite do not meet economic benefit.Moreover, tradition with hot pressing mode in assembling, cost and risk all can improve, and not easy-maintaining.
Therefore, how inventing a kind of earphone sounding structure and assemble method thereof, install rapidly, reduce costs to reaching, improve assembling yield and maintenance convenience, not easily waste the objects such as material, will be that the present invention institute is for actively disclosing part.
Summary of the invention
Because the shortcoming of above-mentioned prior art, inventor's thoughts its do not reach perfection, then exhaust its intelligence to concentrate one's attention on research and overcome, this industry accumulating experience for many years is engaged in it, and then develop a kind of earphone sounding structure and assemble method thereof, install rapidly to reaching, reduce costs, improve assembling yield and maintenance convenience, not easily waste the objects such as material.
Main purpose of the present invention is providing a kind of earphone sounding structure and assemble method thereof, and it is assembled by the fixed form with fixation kit, can reach objects such as installing rapidly, reduce costs, improve assembling yield and keep in repair convenience, not easily waste material.
For reaching above-mentioned purpose, earphone sounding structure of the present invention has an ear cap of an accommodation space and multiple 4th fixing hole in order to be arranged at, this earphone sounding structure comprises: a sounding module, it has the one first perforate pole plate being sequentially stacked and placed on this accommodation space, one first hollow supporting body, one vibrating diaphragm assembly, one second hollow supporting body, one second perforate pole plate and one second hollow fixed frame, this the second hollow fixed frame has multiple 3rd fixing hole, this vibrating diaphragm assembly has the vibrating diaphragm and one first hollow fixed frame that are engaged with each other, this second hollow supporting body be stacked and placed on this vibrating diaphragm assembly vibrating diaphragm on and be positioned at the first hollow fixed frame of this vibrating diaphragm assembly, this the second perforate pole plate is stacked and placed on this supporter to be positioned at the first hollow fixed frame of this vibrating diaphragm assembly in second, and
Multiple fixation kit, it inserts these the 3rd fixing holes and these the 4th fixing holes so that this sounding module is fixed on this ear cap.
Wherein, this first hollow supporting body has multiple first fixing hole, this the first hollow fixed frame has multiple second fixing hole, and these fixation kits insert these the 3rd fixing holes, the second fixing hole, the first fixing hole and these the 4th fixing holes so that this sounding module is fixed on this ear cap.
Wherein, this second hollow supporting body and this first hollow fixed frame are formed in one.
Wherein, when this earphone sounding structure is voltage bias type, the material of this vibrating diaphragm is poly-terephthaldehyde's diethylester, Polyethylene Naphthalate, Polyetherimide, Merlon or polyphenylene sulfide; When this earphone sounding structure is electret capacitance, the material of this vibrating diaphragm is fluorinated ethylene propylene copolymer, polytetrafluoroethylene, expanded PTFE, polyvinylidene fluoride or pbz polymer polymer.
Therefore, assemble by the fixed form with fixation kit, objects such as installing rapidly, reduce costs, improve assembling yield and keep in repair convenience, not easily waste material can be reached.
In addition, the assemble method of earphone sounding structure of the present invention comprises the following steps:
Stickup joint one vibrating diaphragm and one first hollow fixed frame are to form this vibrating diaphragm assembly;
Stacked one first perforate pole plate is at an accommodation space of an ear cap;
Stacked one first hollow supporting body is on this first perforate pole plate;
A stacked vibrating diaphragm assembly is on this first hollow supporting body;
Stacked one second hollow supporting body on this vibrating diaphragm assembly, this second hollow supporting body be stacked and placed on this vibrating diaphragm assembly vibrating diaphragm on and be positioned at the first hollow fixed frame of this vibrating diaphragm assembly;
Stacked one second perforate pole plate is on this second hollow supporting body, and this second perforate pole plate is stacked and placed on this second hollow supporting body and is positioned at the first hollow fixed frame of this vibrating diaphragm assembly;
Stacked one second hollow fixed frame is on this second perforate pole plate; And
Multiple fixation kit is utilized to fix this second hollow fixed frame at this ear cap.
Wherein, in the step of this second hollow fixed frame stacked on this second perforate pole plate, this second hollow fixed frame is stacked and placed on this second perforate pole plate and on the first hollow fixed frame of this vibrating diaphragm assembly.
Accompanying drawing explanation
Fig. 1 is the exploded view of the specific embodiment of the invention.
Fig. 2 is the stereogram of the specific embodiment of the invention.
Fig. 3 is the profile of the specific embodiment of the invention.
Fig. 4 is the flow chart of specific embodiment of the invention assemble method.
Fig. 5 is specific embodiment of the invention assembling schematic diagram one.
Fig. 6 is specific embodiment of the invention assembling schematic diagram two.
Fig. 7 is specific embodiment of the invention assembling schematic diagram three.
Fig. 8 is specific embodiment of the invention assembling schematic diagram four.
Fig. 9 is specific embodiment of the invention assembling schematic diagram five.
Figure 10 is specific embodiment of the invention assembling schematic diagram six.
[primary clustering symbol description]
1 earphone sounding structure
2 ear caps
20 the 4th fixing holes
21 accommodation spaces
3 sounding modules
30 the 3rd fixing holes
31 first perforate pole plates
311 contacts
32 first hollow supporting body
321 first fixing holes
322 contacts
33 vibrating diaphragm assemblies
331 vibrating diaphragms
332 first hollow fixed frames
333 second fixing holes
34 second hollow supporting body
35 second perforate pole plates
351 contacts
36 second hollow fixed frames
37 reason line components
371 fixation kits
4 fixation kits
S1 ~ S9 step
Embodiment
For fully understanding object of the present invention, feature and effect, existing by following specific embodiment, and coordinate institute's accompanying drawings, the present invention is described in detail.
As shown in Figure 1 to Figure 3, wherein Fig. 1 is the exploded view of the specific embodiment of the invention, and Fig. 2 is the stereogram of the specific embodiment of the invention, and Fig. 3 is the profile of the specific embodiment of the invention.
Show an earphone sounding structure 1 in the drawings, and this earphone sounding structure 1 is in order to be arranged on an ear cap 2 with an accommodation space 21 and multiple 4th fixing hole 20, this earphone sounding structure 1 comprises a sounding module 3 and multiple fixation kit 4.
These the 4th fixing holes 20 in graphic are positioned at accommodation space 21 around; Sounding module 3 has one first perforate pole plate 31,1 first hollow supporting body 32, vibrating diaphragm assembly 33,1 second hollow supporting body 34,1 second perforate pole plate 35 and one second hollow fixed frame 36 of the accommodation space 21 being sequentially stacked in ear cap 2, and the second hollow fixed frame 36 has multiple 3rd fixing hole 30; These fixation kits 4 insert these the 3rd fixing holes 30 of the second hollow fixed frame 36 and these the 4th fixing holes 20 of ear cap 2, so that sounding module 3 is fixed on ear cap 2.
Therefore, assemble by with the fixed form of fixation kit 4, objects such as installing rapidly, reduce costs, improve assembling yield and keep in repair convenience, not easily waste material can be reached.Such as, after assembling sounding module 3 during test voice quality, if when finding that sounding module 3 has a certain assembly bad, fixation kit 4 can be unloaded divided by the problematic assembly of replacing, other still good assembly does not then need to change, and would not produce yet and need the whole group of problem changed as traditional.
3rd fixing hole 30 of above-mentioned fixation kit 4, second hollow fixed frame 36 is respectively five in the present embodiment with the 4th fixing hole 20 of ear cap 2, certainly also visual demand and be other quantity.
Above-mentioned sounding module 3 also can have a reason line component 37, and this reason line component 37 is fixedly stacked in the second hollow fixed frame 36 with a fixation kit 371.Circuit arrangement function can be reached by reason line component 37, the electronics signal wires (not shown) that namely outside can be accessed by this reason line component 37 is fixed on the second hollow fixed frame 36, and is directly connected with the contact of the first hollow supporting body 32 with the first perforate pole plate 31, second perforate pole plate 35.
The vibrating diaphragm assembly 33 of above-mentioned sounding module 3 also has vibrating diaphragm 331 and the one first hollow fixed frame 332 be engaged with each other.Aforesaid vibrating diaphragm 331 and the first hollow fixed frame 332, for paste joint each other, can certainly make it be engaged with each other by alternate manner, such as fixing, ultrasonic waves welding etc.
First hollow supporting body 32 of above-mentioned sounding module 3 has multiple first fixing hole 321, first hollow fixed frame 332 has multiple second fixing hole 333, and these fixation kits 4 insert these the 3rd fixing hole 30, second fixing hole 333, first fixing holes 321 and these the 4th fixing holes 20, so that sounding module 3 is fixed on ear cap 2.Therefore, also have by the first hollow supporting body 32 structural design that these the first fixing hole 321, first hollow fixed frames 332 also have these the second fixing holes 333, sounding module 3, when being fixed with fixation kit 4, can reaching and improve fastening effect.The quantity of above-mentioned first fixing hole 321 and the second fixing hole 333 be correspond to the 3rd fixing hole 30 and the 4th fixing hole 20 quantity and be respectively five.
The thickness of the vibrating diaphragm 331 of above-mentioned sounding module 3 is between 1 micron to 100 microns, and fixation kit 4 can be the assembly of screw or other tool fixed function.
As shown in Figures 1 to 10, wherein Fig. 4 is the flow chart of specific embodiment of the invention assemble method, Fig. 5 is specific embodiment of the invention assembling schematic diagram one, Fig. 6 is specific embodiment of the invention assembling schematic diagram two, Fig. 7 is specific embodiment of the invention assembling schematic diagram three, Fig. 8 be the specific embodiment of the invention assembling schematic diagram four, Fig. 9 be the specific embodiment of the invention assembling schematic diagram five, Figure 10 be the specific embodiment of the invention assembling schematic diagram six.
The assemble method of above-mentioned earphone sounding structure 1 comprises the following steps: the accommodation space 21 (S2) of stacked one first perforate pole plate 31 at an ear cap 2, as shown in Figure 6; Stacked one first hollow supporting body 32 on the first perforate pole plate 31 (S3), as shown in Figure 7; A stacked vibrating diaphragm assembly 33 on the first hollow supporting body 32 (S4), as shown in Figure 8; Stacked one second hollow supporting body 34 (S5) on vibrating diaphragm assembly 33, as shown in Figure 9, the vibrating diaphragm 331 that the second hollow supporting body 34 is stacked and placed on vibrating diaphragm assembly 33 is positioned at the first hollow fixed frame 332 of vibrating diaphragm assembly 33; Stacked one second perforate pole plate 35 is on the second hollow supporting body 34 (S6), and as shown in Figure 10, the second perforate pole plate 35 to be stacked and placed on the second hollow supporting body 34 and to be positioned at the first hollow fixed frame 332 of vibrating diaphragm assembly 33; Stacked one second hollow fixed frame 36 on the second perforate pole plate 35 (S7), as shown in Figure 2, the second hollow fixed frame 36 be stacked and placed on the second perforate pole plate 35 and vibrating diaphragm assembly 33 the first hollow fixed frame 332 on; Utilize multiple fixation kit 4 to fix the second hollow fixed frame 36 at ear cap 2 (S8), so can form earphone sounding structure 1 as shown in Figure 2.
Also can comprise the following steps: in said process that a stacked reason line component 37 is on the second hollow fixed frame 36 (S9), as shown in Figure 2, reason line component 37 is fixed on the second hollow fixed frame 36 by a fixation kit 371 is stacked, and fixation kit 371 can be the assembly of screw or other tool fixed function.
Above-mentioned stacked first perforate pole plate 31 also can comprise the following steps: that before the accommodation space 21 of ear cap 2 stickup joint one vibrating diaphragm 331 and one first hollow fixed frame 332 are to form vibrating diaphragm assembly 33 (S1), as shown in Figure 5.
Above-mentioned earphone sounding structure 1 after finishing assembly, can combine with other headset assembly (fixing), such as other earphone lid (not shown) etc. again.
In addition it should be noted that, if the first hollow supporting body 32 of above-mentioned sounding module 3 is voltage bias type framework is then conductive material (such as single-sided conductive), and its conducting surface contacts with the conducting surface of vibrating diaphragm 331, if the first hollow supporting body 32 is electret capacitance framework, tool conductivity can not be needed, in addition, electric charge is covered with vibrating diaphragm 331 by the first hollow supporting body 32 by the direct current (DC) bias of the first hollow supporting body 32 outside input for conductive material can allow makes vibrating diaphragm 331 energy electrically charged, moreover, vibrating diaphragm 331 and the first perforate pole plate 31 can be separated out a space by the thickness of the first hollow supporting body 32, make vibrating diaphragm 331 can free start within this space, vibrating diaphragm 331 and the second perforate pole plate 35 also can be separated out a space by the second hollow supporting body 34, make vibrating diaphragm 331 can free start within this space.
First perforate pole plate 31 of above-mentioned sounding module 3 and/or the second perforate pole plate 35 can be the non-conductive material of conductive material or plating conductive layer, and vibrating diaphragm 331 promotes air molecule when vibrating to be penetrated via the perforate width on the first perforate pole plate 31 and the second perforate pole plate 35 by sound, adopt copper clad laminate in the present embodiment, also can be aluminium base etc., but be not limited thereto, the material such as can conducted electricity all can be used as perforate pole plate.
Above-mentioned second hollow supporting body 34 and the first hollow fixed frame 332 also can mould penetrate be reduced to one.
If voltage bias type framework, the contact 311 of above-mentioned first perforate pole plate 31 is not connected with external communication signal with the contact 351 of the second perforate pole plate 35, and the direct current (DC) bias that contact 322 and the outside of the first hollow supporting body 32 input is connected.If electret capacitance framework, then the contact 322 of the first hollow supporting body 32 does not need to connect exposed electrical signal.
Its vibrating diaphragm material of the vibrating diaphragm 331 of above-mentioned sounding module 3 can be vibrating diaphragm (the such as optional autohemagglutination terephthaldehyde diethylester (PET) of the macromolecule material that general loud speaker is commonly used in the electrostatic earphone of voltage bias type, Polyethylene Naphthalate (PEN), Polyetherimide (PEI), Merlon (PC), polyphenylene sulfide (PPS) etc., but be not limited thereto), these vibrating diaphragms need plate one deck conductive layer, one side is two-sided can be plated, only plate one side in the present embodiment, PPS or PET can be comprised gold-plated at actual execution mode, aluminize or nickel plating etc., but be not limited thereto, its vibrating diaphragm material of the vibrating diaphragm 331 of above-mentioned sounding module 3 in electret capacitance electrostatic earphone because electrostatic charge must can be possessed for a long time, therefore vibrating diaphragm can be made by single or multiple lift dielectric material (Dielectric Materials), this dielectric material inside is covered with the hole of how (micro-) meter great little, this dielectric material can be selected from fluorinated ethylene propylene copolymer (FEP), polytetrafluoroethylene (PTFE), expanded PTFE (e-PTFE), polyvinylidene fluoride (PVDF), part pbz polymer polymer (Fluorine Polymer) etc., adopt expanded PTFE (e-PTFE) in the present embodiment.
As mentioned above, the present invention meets patent three important document completely: the utilizability in novelty, progressive and industry.With novelty and progressive, the present invention assembles by the fixed form with fixation kit, can reach objects such as installing rapidly, reduce costs, improve assembling yield and keep in repair convenience, not easily waste material; With regard to the utilizability in industry, utilize the present invention the product that derives, when fully meeting the demand of existing market.
The present invention discloses with preferred embodiment hereinbefore, so has the knack of the technology person and it should be understood that this embodiment only for describing the present invention, and should not be read as and limit the scope of the invention.It should be noted, such as with change and the displacement of this embodiment equivalence, all should be set to and be covered by category of the present invention.Therefore, protection scope of the present invention is when being as the criterion with the claims person of defining.
Claims (6)
1. an earphone sounding structure, is characterized in that, it has an ear cap of an accommodation space and multiple 4th fixing hole in order to be arranged on, this earphone sounding structure comprises:
One sounding module, it has the one first perforate pole plate being sequentially stacked and placed on this accommodation space, one first hollow supporting body, one vibrating diaphragm assembly, one second hollow supporting body, one second perforate pole plate and one second hollow fixed frame, this the second hollow fixed frame has multiple 3rd fixing hole, this vibrating diaphragm assembly has the vibrating diaphragm and one first hollow fixed frame that are engaged with each other, this second hollow supporting body be stacked and placed on this vibrating diaphragm assembly vibrating diaphragm on and be positioned at the first hollow fixed frame of this vibrating diaphragm assembly, this the second perforate pole plate is stacked and placed on this supporter to be positioned at the first hollow fixed frame of this vibrating diaphragm assembly in second, and
Multiple fixation kit, it inserts these the 3rd fixing holes and these the 4th fixing holes so that this sounding module is fixed on this ear cap.
2. as required the earphone sounding structure as described in 1, it is characterized in that, this first hollow supporting body has multiple first fixing hole, this the first hollow fixed frame has multiple second fixing hole, and these fixation kits insert these the 3rd fixing holes, the second fixing hole, the first fixing hole and these the 4th fixing holes so that this sounding module is fixed on this ear cap.
3. earphone sounding structure as claimed in claim 1, it is characterized in that, this second hollow supporting body and this first hollow fixed frame are formed in one.
4. earphone sounding structure as claimed in claim 1, is characterized in that, when this earphone sounding structure is voltage bias type, the material of this vibrating diaphragm is poly-terephthaldehyde's diethylester, Polyethylene Naphthalate, Polyetherimide, Merlon or polyphenylene sulfide; When this earphone sounding structure is electret capacitance, the material of this vibrating diaphragm is fluorinated ethylene propylene copolymer, polytetrafluoroethylene, expanded PTFE, polyvinylidene fluoride or pbz polymer polymer.
5. an assemble method for earphone sounding structure, it comprises the following steps:
Stickup joint one vibrating diaphragm and one first hollow fixed frame are to form this vibrating diaphragm assembly;
Stacked one first perforate pole plate is at an accommodation space of an ear cap;
Stacked one first hollow supporting body is on this first perforate pole plate;
A stacked vibrating diaphragm assembly is on this first hollow supporting body;
Stacked one second hollow supporting body on this vibrating diaphragm assembly, this second hollow supporting body be stacked and placed on this vibrating diaphragm assembly vibrating diaphragm on and be positioned at the first hollow fixed frame of this vibrating diaphragm assembly;
Stacked one second perforate pole plate is on this second hollow supporting body, and this second perforate pole plate is stacked and placed on this second hollow supporting body and is positioned at the first hollow fixed frame of this vibrating diaphragm assembly;
Stacked one second hollow fixed frame is on this second perforate pole plate; And
Multiple fixation kit is utilized to fix this second hollow fixed frame at this ear cap.
6. the assemble method of earphone sounding structure as claimed in claim 5, it is characterized in that, in the step of this second hollow fixed frame stacked on this second perforate pole plate, this second hollow fixed frame is stacked and placed on this second perforate pole plate and on the first hollow fixed frame of this vibrating diaphragm assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110175647.4A CN102843628B (en) | 2011-06-24 | 2011-06-24 | Earphone sounding structure and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110175647.4A CN102843628B (en) | 2011-06-24 | 2011-06-24 | Earphone sounding structure and assembling method thereof |
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| Publication Number | Publication Date |
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| CN102843628A CN102843628A (en) | 2012-12-26 |
| CN102843628B true CN102843628B (en) | 2015-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110175647.4A Active CN102843628B (en) | 2011-06-24 | 2011-06-24 | Earphone sounding structure and assembling method thereof |
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| CN (1) | CN102843628B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106341748A (en) * | 2015-07-17 | 2017-01-18 | 富祐鸿科技股份有限公司 | Electrostatic earphone sounding structure |
| CN105721972A (en) * | 2016-01-22 | 2016-06-29 | 杨贺捷 | Method for manufacturing customized headset with replaceable acoustics component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3894333A (en) * | 1972-09-08 | 1975-07-15 | Uniroyal Ltd | Electromechanical transducer and method of making same |
| US3942029A (en) * | 1973-07-23 | 1976-03-02 | Sony Corporation | Electrostatic transducer |
| CN101827293A (en) * | 2010-04-26 | 2010-09-08 | 深圳亚力盛连接器有限公司 | 5.1 sound channel bass reflex type earphone and manufacture method thereof |
-
2011
- 2011-06-24 CN CN201110175647.4A patent/CN102843628B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3894333A (en) * | 1972-09-08 | 1975-07-15 | Uniroyal Ltd | Electromechanical transducer and method of making same |
| US3942029A (en) * | 1973-07-23 | 1976-03-02 | Sony Corporation | Electrostatic transducer |
| CN101827293A (en) * | 2010-04-26 | 2010-09-08 | 深圳亚力盛连接器有限公司 | 5.1 sound channel bass reflex type earphone and manufacture method thereof |
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| Publication number | Publication date |
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| CN102843628A (en) | 2012-12-26 |
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Effective date of registration: 20170629 Address after: Guangdong province Dongguan city Dalang town Dajingtou Industrial Zone second road five Shunxing No. 12 Patentee after: Dongguan Shun Shun Feng Electric Co., Ltd. Address before: China Taiwan Taoyuan County Patentee before: Fortune Grand Technology Inc. |
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