CN1028937C - 一种在电路化表面覆盖着护涂层的芯片底座 - Google Patents

一种在电路化表面覆盖着护涂层的芯片底座 Download PDF

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CN1028937C
CN1028937C CN93108062A CN93108062A CN1028937C CN 1028937 C CN1028937 C CN 1028937C CN 93108062 A CN93108062 A CN 93108062A CN 93108062 A CN93108062 A CN 93108062A CN 1028937 C CN1028937 C CN 1028937C
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sealant
coating
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布兰达·迪亚尼·弗雷
查尔斯·阿诺德·约瑟夫
弗兰西斯·约汉·奥尔谢夫斯基
詹姆斯·沃伦·威尔森
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Abstract

一种具有芯片底座衬底的芯片底座，并且至少一个半导体芯片以倒装芯片结构的形式，通过焊球安装在芯片底座衬底的电路代表面上。焊球被含有环氧树脂的合成物所形成的第一种密封剂所密封。此外，位于电路化表面的至少一部分电路被含有尿烷的合成物所组成的第二种密封剂所密封，此合成物是这样选择的，使二种密封剂就具有了等于或小于277千克/厘米2的弹性模量。

Description

本发明一般涉及芯片底座，尤其涉及一种具有电路化表面的芯片底座，该电路化表面至少部分被一种具有保护性的，经过紫外线（UV）辐射处理过的涂层所覆盖。
一种半导体芯片封装的类型包括在衬底的电路化表面装有一个或多个半导体芯片，衬底可为陶瓷衬底或塑料衬底。这种半导体芯片封装通常被称为芯片底座，它通常安装在印刷电路卡或印刷电路板上。如果使用表面安装的话，那么芯片底座通常包括一个引线框或边缘引脚，它们机械地和电气地接在衬底载有芯片的表面化电路周边形成的电触点上。
在所谓的倒装芯片（flip    chip）结构中，通过在芯片底座衬底的电路化表面安装一个或更多个半导体芯片，可以容易地获得比较高的芯片连接密度。在此结构中，可用焊球将芯片面朝下地安装在衬底上的可焊接金属焊区上。然而，由于硅片的热膨胀系数（CTE）和陶瓷衬底或塑料衬底的CTE有很大的差别，因此，如果芯片底座受到热波动，那么焊球连接处就会受到较大的应力作用，这种情况会减少或降低焊球连接的疲劳寿命。这个难题可以通过使用一种CTE的焊球CTE的±30%的密封剂来密封焊球而得到解决。所使用的密封剂的成分包括环氧树脂粘合剂，如环脂肪族环氧树脂粘合剂和填充剂，如高纯度的熔融或非晶二氧化硅，这已在美国专利No.4，999，699中公开，该专利在此作为参考。正如该专利中所指出的，粘合剂在室温下的粘度不大于约1000厘泊，填充剂的最大颗粒尺寸不大于31微米。而且，粘合剂应大约占粘合剂和填充剂总重量的60%到25%，填充剂应大约占总重量的40%到75%。
芯片底座衬底的电路化表面上的电路和在较小程度上在电路化表面以倒装芯片结构安装有芯片，应加以保护，以免受机械和外界的危害。为了获得这种保护，一种技术是在芯片和该电路化表面的至少一部分电路上安装一个陶瓷盖。当使用这种陶瓷盖以获得机械和对外界的保护时，显著增加了芯片底座的成本。而且，这种陶瓷盖的存在排除了在芯片上直接安装一个散热片，以消散芯片所产生的热量的可能性。从而必须在陶瓷盖上安装散热片，同时，必须在第个芯片的上表面和陶瓷盖之间加有导热油脂以便在芯片和散热片之间获得良好的热接触。尽管用这种方法消散热量是有效的，但是如果直接在芯上安装散热片则更为方便。
前面已经提出了用含有环氧树脂粘合剂和填充剂的涂层覆盖于芯片底座衬底的电路化表面上的电路，以便用相对低的费用来对此电路提供机械和外界的保护方法，把这种填充的环氧树脂应用于芯片的上表面层（不含电路）已被证实是有效的。然而，人们已认识到将它用作保护芯片底座电路化表面的电路的保护性涂层时，该填充的环氧树脂涂层必须具备：
（1）能经得起标准的，加速的热老化试验。实验中，该涂层以第小时三次循环的频度，经受温度为0℃到100℃的热循环，并至少进行2000次该循环，这样仍不出现内部裂纹或者在涂层与焊球的密封物交界面上的裂纹。因为这些裂纹能使水和其它不期望的化学物质进入并腐蚀电路，所以是不希望出现的。（2）具有疏水性，原因同上。（3） 能够经得起第二种标准的热循环试验，通常被称为“装运冲击”（ship    shork）实验。在实验中，该涂层受热频度为每小时一次，每次受热循环温度为-40℃到+65℃，该循环至少要进行10次，这样仍不出现裂纹或者涂层从芯片底座衬底剥离的现象;（4）具有低的离子浓度。典型的可通过确保氯化物离子的浓度少于百分分之十来获得，这样就能避免电路的腐蚀和导体的迁移，后者会导致不期望出现的短路;和（5）能相对快的从而方便地固化。
值得注意的是，当上述填充的环氧树脂涂层从芯片底座电路表面的芯片的上表面扩展到具有较大尺寸如26mm×36mm的芯片底座电路化表面的电路上时，这些涂层就失去了作用。就是说，当此涂层受到前面所述的加速热老化实验时，涂层就必然会出现内部裂纹或者在涂层与焊球密封物的交界面上出现裂纹。此外，这些涂层通常具有疏水性。而且，当此涂层受到前述的“装载冲击”试验时，它就会出现裂纹或者从芯片底座衬底上剥离。此外，这些涂层必须在烘箱里烘相当长一段时间，如三小时才能固化，这样既费时又不方便。
因此，到目前为目止，那些从事芯片底座开发的人们一直在寻求一种保护芯片底座电路化表面上的电路的保护性涂层，但没有成功。这种涂层必须：（1）相对来说较便宜;（2）能经得起标准的热循环实验而不引起裂纹或剥离，能为电路提供有效的机械和外界的保护。（3）具有疏水性;（4）具有低的离子深度，例如氯化物离子的浓度低于百万分之十;（5）反应性相对快，容易固化;和（6）允许散热片直接安装在芯片上。
本发明的目的是提供一种芯片底座，它能在不增加费用的情况下，对其电路化表面上的电路进行外界和环境的保护。
本发明涉及一种发现，即上述的环氧树脂涂层用作芯片底座电路化表面上电路的保护性涂层，该涂层具有相对高的弹性模量，即在室温下（25℃）弹性模量大于约277千克/厘米2（69MPa）。因此，此涂层缺少经受上述的热循环实验所引起的应力的柔性，而导致出现裂纹和剥离。
本发明也涉及一种发现，即通过选取数量相对适当的丙烯酸尿烷齐聚物、丙烯酸单体和光激发剂作为涂层的成分，利用紫外线辐射，能相当快地固化，如在5秒钟以内固化，产生相对便宜的，具有疏水性的，在室温下具备弹性模量等于或小于277千克/厘米2的涂层。因此，此涂层能容量地经受热循环实验而不引起裂纹和出现剥离现象。除此以外，此涂层氯化物离子浓度小于百万分之十，因此，不会出现离子引入而发生的腐蚀和迁移现象。而且，如果不把此涂层抹在电路化表面上的芯片的上表面，那么就能容易地把散热片直按安装在芯片上。
本发明结合附图进行描述。该图是根据本发明的芯片底座的最佳实施例的横截面图，此芯片底座含有一覆盖于其至少一部分电路化表面的保护性涂层。
本发明涉及一种芯片底座，包括芯片底座衬底，例如陶瓷衬底或塑料衬底，在其电路化表面安装有至少一个倒装芯片结构的半导体芯片。在其至少一个半导体芯片和芯片底座衬底之间的焊球连接物用密封剂密封，该密封剂包括环氧树脂，其CTE在焊球CTE的±30%之内。此外，该电路化表面的至少一部分电路被一种具有保护性的，相对便宜的涂层所覆盖，涂层组成成分的选择按照本发明，应该：（1）能容易地经得起上述的热循环实验，而不出现任何的内部裂纹和在涂层和焊球密封剂交界处的界面裂纹，同时，即使在10倍的显微镜下观看也不出现剥离现象;（2）具有疏水性;（3）其氯化物离子的浓度低于百万分之十;（4）利用UV辐射能相对快且方便地固化和（5）允许把散热片直接安装在芯片上。
如附图所描述的最佳实施例，根据本发明的芯片底座10，包括衬底20，例如陶瓷衬底（如矾土衬底）或塑料衬底。在此衬底20具有一电路化表面30，此表面含有电子导线（未示出）和一个例如铜制成电接触焊区40。至少一个半导体芯片50，如硅芯片，利用焊球60以倒装芯片结构式安装在电路表面30上。焊球的成分为重量分别占3%的锡和97%的铅。为了使芯片50和衬底20之间的焊球连接60牢固，延长它的疲劳寿命，焊球60用一种热膨胀系数在焊球60CTE的±30%之内的密封剂70来密封。焊球密封剂70的成分包括环氧树脂粘合剂，如环脂肪族聚环氧化合物粘合剂和填充剂，如高纯度的熔融或非晶二氧化硅，如美国专利4999699中所述。
芯片底座10还包括金属引线框或倒如用铜制成的边缘引脚，并机械地和电气地与接触焊区40连接。优选的例子已在S.R.En-gle等人于1992年2月18日递交的美国专利申请No.07，838，613中公开，并在此作参考。在引线框或边缘引脚80与接触焊区40的每一个的机械的和电气的连接处具有一个焊接区90，它的成分包括锡和铅，分别占总重量的10%和90%。在接触焊区40和引线框或边缘引脚80之间的每个焊接处至少部分，最好是全部被材料区100所密封。根据专利申请No.07838613的教导，当焊区90和材料区100之间的连接受到温度为0℃到100，循环次数为每小时三次，至少2000次这样的正弦曲线热循环作用时，焊区90出现的电阻增加小于200毫欧。根据专利申请No.078383613的教导，采用CTE为焊接区90CTE的±30%以内的填充的环氧树脂作为材料区100，就能达到上述结果。一种有用的环氧树脂是部分填入了二氧化硅填充剂的环己基二环氧树脂化合物，是美国加利福尼亚州德克斯特（Dexter）公司的产品，商品名称Hysol    FP0045。
根据本发明，除了电接触焊区40以外，在密封的焊球60的外部的位于电路化表面30的电路至少一部分最好全部被涂层110覆盖而密封，用来保护受覆盖的电路免受机械和外界的危害。涂层110也接触并至少部分环绕着密封焊球的密封剂70。正如下面将会全面地讨论，通过使用一喷射器，可把用来形成涂层110的合成物分布到电路化表面30上，分布后，该物质能容易地流到电路表面上并覆盖暴露的电路。而且，此后，利用UV辐射该合成物则相对较快并方便地固化。
根据本发明，用以形成涂层110的合成物包括三种成分：（1）丙烯酸尿烷剂聚物;（2）丙烯酸单体;和（3）光激发剂。在这三种物质中，丙烯酸尿烷剂聚物用以使相应的涂层110具有疏水性。丙烯酸单体用作丙烯酸尿烷齐聚物的稀释剂，并且当此分布的合成物受到紫外线的辐射时，它用于与后者的交联。光激发剂使交联在紫外辐射的影响下，可能实现。
本发明中，可以使用多种丙烯酸尿烷齐聚物，丙烯酸单体和光激发剂。在这方面，已经发现主要是齐聚物和单体的结合决定了相应涂层110的弹性。人们凭经验发现通过使用这样的齐聚物和单体（以及光激发剂）可以得到由丙烯酸尿烷齐聚物和丙烯酸单体所形成的有用的具有弹性的结合物，用紫外线辐射使它们固化，然后，可使用常规的拉力实验，在温室下测得所产生的涂层110的弹性模量。如果所测量的值小于或等于约277千克/厘米2，那么齐聚物和单体相应的结合物在本发明中就是有用的，至少它能产生具有有用的弹性特性的涂层110。
现已进一步发现齐聚物，单体和光激发剂的合成物决定了所产生涂层110的氯化物离子浓度，因此决定了因离子引入所产生的腐蚀和迁移的程度。而且，通过在芯片底座的电路化表面上形成相应的齐聚物，单体和光激发剂的合成物，凭经验发现即可形成有用的结合物，用紫外辐射使其固化，然后测量所产生的涂层抵抗腐蚀的能力。其方法也就是把覆盖涂层的电路化表面暴露于空气温度为85℃，相对湿度为80%的环境中1000小时，就可以确定。
如果任意一电路线路的直流电阻增加100%或更多，其电路化表面受到了严重的腐蚀，不能接受。把覆盖着涂层的电路化表面暴露于空气温度为85℃，相对湿度为80%的环境中，并受10伏的偏置电压不断作用1000小时，就可以查明迁移现象。如果在任意二个相邻电路线路之间的直流电阻小于10兆欧，其电路化表面就受到了严重的腐蚀，故不能接受。
除了对由于离子引入而引起的腐蚀和迁移的要求以外，对本发明有用的光激发剂必须能够使有用的丙烯酸尿烷齐聚物能够在紫外线辐射的作用下，基本上完全地和有用的丙烯酸单体交联，紫外线辐射的强度和时间将在以下讨论，有用的光激发剂可以依据下面的实验，凭经验而找到。首先把一种光激发剂添加到包含有用的丙烯酸尿烷齐聚物和有用的丙烯酸单体的合成物中，然后把产生的合成物进行紫外线辐射，其强度和时间在以下将具体规定，就能制造出第一涂层样品。第一涂层样品所具有的断裂应力可通过常规的拉力实验来测得。该断裂应力是用来测量交联程度的，把含有同样的齐聚物，单体和光激发剂的另一种合成物，以同样的强度进行同样的UV辐射，但时间长一点或者以同样的时间，但辐射强度高一点，可以制得第二种这样的涂层样品。如果所测得的第二涂层样品的断裂应力 比第一涂层的大，那么就表明第二涂层样品受到了附加的交联。另一方面，如果第二涂层样品的断裂应力没有变化，那么就假定该第一涂层样品获得了完全的或基本完全的交联。如果为获得此种彻底的交联所需的紫外线辐射的强度和辐射时间落入了下面将要给出的范围之内，那么这种相应的光激发剂对本发明就是有用的。否则，这种光激发剂对本发明就是没有用处的。
在以上步骤所需的有用的丙烯酸尿烷齐聚物，可使用伊利诺斯州芝加哥市摩顿（Morton）公司所出售的商品名称为ZL2196和ZL1365的丙烯酸尿烷齐聚物。类似地，人们发现象异冰片基丙烯酸和2-羟基丙基丙烯酸这样的丙烯酸单体与ZL2196或ZL1365丙烯酸尿烷齐聚物相结合在发明中是有用的，同时，以下三种光激发剂和上述任何一种齐聚物和单体相混合，都可用于本发明。它们是：
1）2-甲基-1-（4-（甲硫基）-苯基）-2-吗啉代丙酮;
2）异丙基硫占吨酮;和
3）2-羟基-2-甲基-1-苯基丙烷-1-酮。
如前已提及，这种有用的合成物的三种成分的相对数量也是重要的，例如，丙烯酸尿烷齐聚物应当占该合成物重量的约35%到75%，最好占合成物重量的65%，若其所占份量小于35%，就是不理想的。因为这样此相应的涂层110就具有高于277千克/厘米2的弹性模量，因此当涂层受到如上所述的热循环实验时，它就产生内部裂纹和交界面裂纹并出现剥离现象。另一方面，其份量超过约75%也不希望，因为这样相应的合成物就具有了不希望具有的高的粘度，难以用喷射器把该合成物分散到涂层上，并导致该暴露在电路上的合成物难以流动。
丙烯酸单体应当相应地构成该有用的合成物重量的约63.5%到约2.5%，其份量超过此范围之外是不希望出现的，其原因同上。
光激发剂相应地应当占此有用的合成物的重量的约1.5%到约2.5%，其份量不足约1.5%是不好的。因为它使齐聚物和单体不能充分交联。其份量超过约2.5%也没有必要，因为2.5%足以使它们获得充分的交联。
正如上面所提到的，通过一喷射器，可以容易地把以上所限定的有用的合成物分散到衬底20的电路化表面30上。这些合成物能容易地在表面30上流动以覆盖此暴露的电路。同时，在毛细作用的影响下，涂层能容易地流到焊球密封剂70的侧面上，并覆盖和围绕此密封剂。
此有用的化合物分布好后，可以很容易用紫外线辐射使其固化。可用的柴外线（UV）的波长为200到400毫微米。可用的UV强度范围为每平方厘米5.5到6.5焦耳，相应的辐射时间为从约5到30秒。UV辐射强度低于约5.5焦耳/厘米2是不好的，因为它将导致齐聚物和单体不能充分交联。UV强度高于约6.5焦耳/厘米2也没有必要，因为在较低的辐射强度下已能实现充分交联。实际上，相对较高的辐射强度会导致粘接裂开而起反作用。能够以上述特定的强度和时间辐射紫外线的紫外线辐射源，例如UV固化系统，可从Rockville，Maryloand的Fusion UV Curing System买到，该系统装备有D和H灯。
涂层110的厚度最好超过其下的，受保护的电路厚度约0.020英寸。涂层的厚度大一点是有利的，然而，用上述特定的厚度就可以容易地获得它对机械及外界方面的有效保护。
当用上述步骤把此有用的合成物分布并用紫外线固化后，所产生的涂层110就能抵抗住循环温度从0到100℃，频度为每小时3次，至少可进行2000次的热循环，同时在10倍的光学显微镜下观察不到内部和交界面裂纹。当然，这种热循环是在一个具有控制系统的烘箱里进行的，该系统并不完全按照上述的热循环技术要求运行。实际上，每个完整的热循环期间为20/±2分钟（而不是准确的20分钟）。此外，温度从10℃上升到90℃和时间为6+3/-2分。温度从90℃下降到10℃时间也是6+3/-2分钟。而且，当烘箱到达峰值温度100+/-10℃时，其相应的停留时间为4+/-2分钟，烘箱到达最低温度0+/-10时，其相应的停留时间也是4+/-2分钟。因此，对本发明来说，表示在后者的（实际上的）热循环条件下可以看成是前者的（理想的）热循环条件。
根据本发明形成的涂层110也能容易地抵抗“运载冲击”实验，在此实验中，涂层受到的循环温度为从-40℃到+65℃。频率为每小时1个循环，至少进行10次这样的循环。这样涂层仍不会从电路化表面30上剥离，同时在10倍光学显微镜下 观察，也不出现裂纹。和前面的一样这种“运载冲击”实验是在一个具有控制系统烘箱里进行的，这种系统运行并不完全符合“运载冲击”热循环的条件。实际上，其最小的循环温度是-40+/-5℃，最大的循环温度为+65+/-5℃，除此以外，当总的热循环次数为至少10次时，该循环频率就为每小时1+/-0.1个循环（而不是准确的每小时1个循环）。而且，在最高温度和最低温度处的停留时间都是25+/-7分钟，在最高温度和最低温度之间的温度处，温度的上升或下降速率为每分钟15℃。同上，对本发明来说，后者（实际上）的热循环条件可视为前者的（理想的）热循环条件。
此用的合成物除了用于电路化表面30外，通过一喷射器，也可以容易地把它应用于芯片50的上暴露表面。这样，经过UV固化后，形成的涂层能保护芯片50和电路化表面30免受机械和外界的危害。然而，如果没有在芯片50的上表面形成涂层，那么能很容易地直接把散热片安装在芯片50的上表面上，如附图所描绘。
本发明结合最佳实施例，进行了详细地描述，在此领域熟练的人员可以理解到，在不背离本发明的精神和范围的前提下，其中的形式和细节可以做出不同的变化。

Claims (4)

1、一种芯片底座，
一个在其表面具有电子线路的衬底；
至少有一个半导体芯片通过导电的焊球安装在所述表面，焊球至少部分被第一种密封剂所密封，密封剂的成分含有环氧树脂，并且该第一密封剂的热膨胀系数(CTE)在焊球CTE的±30%之内，
第二种密封剂覆盖在密封着位于所述的衬底表面的至少一部分电子线路，同时，它接触并至少部分环绕着所述第一种密封剂的至少一部分，其特征在于：
所述第二种密封剂的组成成份含有尿烷，并且选择所述组成成以使第二种密封剂的弹性模量在25℃时，等于或小于277千克/厘米2。
2、权利要求1的芯片底座，其特征在于：所述第二种密封剂也覆盖并密封所述至少一个半导体芯片的至少一部分上暴露表面。
3、权利要求1的芯片底座，其特征在于：所述第二种密封剂是经紫外线固化的密封剂。
4、权利要求1的芯片底座，其特征在于：一个散热片直接安装在所述至少一个半导体的上暴露表面。
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ES2092216T3 (es) 1996-11-16
KR960015924B1 (ko) 1996-11-23
EP0578307A3 (en) 1994-08-24
ATE143529T1 (de) 1996-10-15
KR940002031A (ko) 1994-02-16
EP0578307B1 (en) 1996-09-25
CN1081787A (zh) 1994-02-09
US5249101A (en) 1993-09-28
DE69305012T2 (de) 1997-04-03
EP0578307A2 (en) 1994-01-12
CA2091910C (en) 1996-07-30
SG44362A1 (en) 1997-12-19
JP2501287B2 (ja) 1996-05-29
TW230272B (zh) 1994-09-11
CA2091910A1 (en) 1994-01-07
JPH0697309A (ja) 1994-04-08
MY108750A (en) 1996-11-30
DE69305012D1 (de) 1996-10-31

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