CN103135182B - Optical element encapsulation structure and method for packing thereof - Google Patents

Optical element encapsulation structure and method for packing thereof Download PDF

Info

Publication number
CN103135182B
CN103135182B CN201110394972.XA CN201110394972A CN103135182B CN 103135182 B CN103135182 B CN 103135182B CN 201110394972 A CN201110394972 A CN 201110394972A CN 103135182 B CN103135182 B CN 103135182B
Authority
CN
China
Prior art keywords
optical
optical module
fiber waveguide
array layer
reflection groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110394972.XA
Other languages
Chinese (zh)
Other versions
CN103135182A (en
Inventor
吴开文
余泰成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201110394972.XA priority Critical patent/CN103135182B/en
Publication of CN103135182A publication Critical patent/CN103135182A/en
Application granted granted Critical
Publication of CN103135182B publication Critical patent/CN103135182B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

A kind of optical element encapsulation structure, at least one optical module including optical waveguide array layer and being fixed on this optical waveguide array layer and at least one fiber waveguide, this at least one optical module is for the conversion of photosignal.This optical waveguide array layer is formed with reflecting part, and this reflecting part is formed with reflection groove, and this reflection groove has a reflecting surface, and the optical signal that this at least one optical module sends can arrive this at least one fiber waveguide through this reflecting surface change direction and be transmitted;This at least one optical module is able to receive that this at least one fiber waveguide changes, through this reflecting surface, the optical signal that direction passes over.This optical element encapsulation structure need not lens on light assembly and carries out being directed at the transmission that can realize photosignal, improves alignment precision.The present invention also provides for a kind of optical element method for packing.

Description

Optical element encapsulation structure and method for packing thereof
Technical field
The present invention relates to a kind of encapsulating structure and method for packing, particularly relate to a kind of optical element encapsulation structure and method for packing thereof.
Background technology
In recent years, information communication has the development trend of high speed, high capacity.In general, in optical communications, need to convert electrical signals to optical signal, send optical signal by fiber waveguide, then the optical signal of reception is converted to the signal of telecommunication.Optical element is utilized to carry out the conversion of the signal of telecommunication and optical signal.
General optical element encapsulation mainly takes chip on board to encapsulate (Chip on board, COB).In COB processing procedure, it usually needs carry out coupling light with lens.Complete die bond (Die Bond), after, lens are covered align optical components on crystal grain.For reaching required alignment precision, the spacing between needing lens is pre-designed, then is covered in the top of crystal grain.But, generally when being covered with lens, the spacing of lens always offsets, it is impossible to be accurately positioned all of optical element.And along with the demand the highest to transmission quantity, the also column number of optical element will certainly be increased, too increase the difficulty of whole processing procedure, thus have impact on the yield of product.
Summary of the invention
In view of foregoing, it is necessary to provide optical element encapsulation structure and method for packing thereof that a kind of alignment precision is high.
A kind of optical element encapsulation structure, at least one optical module including optical waveguide array layer and being fixed on this optical waveguide array layer and at least one fiber waveguide, this at least one optical module is for the conversion of photosignal.This optical waveguide array layer is formed with reflecting part, and this reflecting part is formed with reflection groove, and this reflection groove has a reflecting surface, and the optical signal that this at least one optical module sends can arrive this at least one fiber waveguide through this reflecting surface change direction and be transmitted;This at least one optical module is able to receive that this at least one fiber waveguide changes, through this reflecting surface, the optical signal that direction passes over.
A kind of optical element method for packing, it comprises the steps: to provide or one optical waveguide array layer of preparation;Forming reflection groove by etching on this optical waveguide array layer, this reflection groove has a reflecting surface;There is provided or prepare at least one optical module, and one end of this at least one optical module is fixed on this optical waveguide array layer adjacent to the encapsulation of this reflection groove by flip-chip;There is provided or prepare at least one fiber waveguide, and this at least one fiber waveguide is fixed at this reflection groove one end away from this least one set optical module, so that the optical signal that this at least one optical module sends can arrive this at least one fiber waveguide through this reflecting surface change direction and be transmitted;This at least one optical module is able to receive that this at least one fiber waveguide changes, through this reflecting surface, the optical signal that direction passes over.
The optical element encapsulation structure of present invention offer and method for packing, it is formed with a reflection groove at optical waveguide array layer, this reflection groove has a reflecting surface, and the optical signal that this at least one optical module sends can arrive this at least one fiber waveguide through this reflecting surface and be transmitted.Equally, the optical signal that fiber waveguide receives is reflected change direction, face and arrives this at least one optical module.This optical element encapsulation structure need not lens on light assembly and is directed at, and directly realized the transmission of photosignal by optical waveguide array, and alignment precision is high.Even and if increase optical module and column number, do not interfere with alignment precision yet.
Accompanying drawing explanation
Fig. 1 is the profile of the encapsulating structure of embodiment of the present invention.
Fig. 2 is another profile of the encapsulating structure of embodiment of the present invention.
Fig. 3 is the flow chart of the optical element method for packing of embodiment of the present invention.
Main element symbol description
Optics module 100
Substrate 10
Substrate 11
Liner 13
First liner 131
Second liner 135
Fixed layer 15
Electrical module 30
First electronic component 31
Second electronic component 35
Encapsulating structure 50
Optical waveguide array layer 51
Installing department 511
Reflecting part 513
Reflection groove 5131
Reflecting surface 5135
Installation portion 517
Conductive layer 53
Optical module 55
Light-emitting component 551
Photo detector 553
Fiber waveguide 57
Connect wire 60
Contiguous block 80
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Refer to Fig. 1 and Fig. 2, the optics module 100 of present embodiment, it is used for changing and transmitting photosignal.Optics module 100 includes substrate 10 and the electrical module 30 being layed on substrate 10 and optical element encapsulation structure 50.Electrical module 30 is electrically connected with optical element encapsulation structure 50.
Substrate 10 is the most plate-shaped, and it is used for supporting fixing electrical module 30 and optical element encapsulation structure 50.Substrate 10 includes substrate 11, liner 13, the fixed layer 15 that is covered on liner 13.Substrate 11 can have the material formation of insulating properties with resin, glass or pottery etc..Substrate 11 can also have the material formation of electric conductivity with metal etc., preferably need to install one layer of dielectric film of formation on the installed surface of IC chip.Substrate 11 is preferably provided with the highest heat conductivity.Liner 13 usually Copper Foil, it includes being spaced the first liner 131 and the second liner 135 being located on substrate 11.Fixed layer 15 is for being fixed on liner 13 by electronic component and optical element.In the present embodiment, fixed layer 15 is the preferable adhesive layer of thermal diffusivity.
Electrical module 30 includes that at least one the first electronic component 31(being juxtaposed on the fixed layer 15 of the first liner 131 refers to Fig. 1) and at least one second electronic component 35(refer to Fig. 2).First electronic component 31 for passing to optical element encapsulation structure 50 by the signal of telecommunication.In the present embodiment, the first electronic component 31 is drive integrated circult plate (Integrated Circuit, IC).Second electronic component 35 is for receiving the signal of telecommunication that optical element encapsulation structure 50 passes over.In the present embodiment, the second electronic component 35 is transimpedance amplifier (Trans-impedance Amplifer, TIA).
Optical element encapsulation structure 50 is spaced electrical module 30 and is layed on the fixed layer 15 of substrate 10, and is electrically connected with electrical module 30.Optical element encapsulation structure 50 includes optical waveguide array layer 51, conductive layer 53, at least one optical module 55 and at least one fiber waveguide 57.
Optical waveguide array layer 51 is fixed on the fixed layer 15 on the second liner 135, is used for transmitting photosignal.Optical waveguide array layer 51 includes being sequentially connected with the installing department 511 of setting, reflecting part 513 and installation portion 517.Reflecting part 513 is formed with substantially v-shaped reflection groove 5131.In the present embodiment, reflection groove 5131 is 90 degree of V-shaped grooves, and it is formed by etching.Reflection groove 5131 includes a reflecting surface 5135, for changing optical signal that fiber waveguide 57 passes over or the direction of the optical signal that optical module 55 passes over.Reflecting surface 5135 is the one side in the remotely mounted portion of reflection groove 5,131 517.The aspect ratio installing department 511 of installation portion 517 is little, is used for installing fiber waveguide 57, makes fiber waveguide 57 be directed at reflecting surface 5135.In the present embodiment, optical waveguide array layer 51 is semiconductor optical waveguide array.
Conductive layer 53 is layed in installing department 511, is electrically connected with optical module 55 for electrical module 30.Conductive layer 53, adjacent to one end of electrical module 30, forms connection wire 60 by the way of routing (Wire Bond) and carries out electric conductivity with electrical module 30 and be connected.In the present embodiment, conductive layer 53 is transmission line.
Optical module 55 be arranged in parallel with substrate 10, and is positioned at the top of optical waveguide array layer 51.Optical module 55 is conductively connected with one end, conductive layer 53 near reflection portion 513, and the other end is positioned at the top of reflection groove 5131.Optical module 55 is encapsulated by flip-chip (Flip-Chip) mode and is fixed on conductive layer 53.This step is by depositing tin-lead ball on conductive layer 53, then optical module 55 place chip is overturn and utilized melted tin-lead ball combine with conductive layer 53.Optical module 55 includes that the light-emitting component 551(being set up in parallel refers to Fig. 1) refer to Fig. 2 with photo detector 553().Corresponding first electronic component 31 of light-emitting component 551, for the signal of telecommunication that the first electronic component 31 passes over is converted to optical signal, the optical signal vertical substrates 10 that it sends.Light-emitting component 551 generally uses planar light emitting, particularly surface-emitting laser.Light-emitting component 551 is formed by the way of routing with conductive layer 53 and is connected wire 60 and is electrically connected with.In the present embodiment, light-emitting component 551 is vertical plane radial laser instrument (Vertical Cavity Surface Emitting Laser, VCSEL).Second electronic component 35 of the corresponding electrical module 30 of photo detector 553, it is able to receive that the optical signal that reflecting surface 5135 reflects back, for the optical signal that fiber waveguide 57 passes over is converted to the signal of telecommunication.In the present embodiment, photo detector 553 is photodiode (Photo Diode, PD), it forms contiguous block 80 by ball bonding (Ball-Bond) mode and is electrically connected with conductive layer 53.
Fiber waveguide 57 is fixed on the installation portion 517 of optical waveguide array layer 51, and be arranged in parallel with optical module 55.Fiber waveguide 57 is able to receive that the optical signal of light-emitting component 551 by reflecting surface 5135, or passes through reflecting surface 5135 by optical signal transmission to photo detector 553.In the present embodiment, fiber waveguide 57 is optical waveguide fibre, and the corresponding light-emitting component 551 of fiber waveguide 57 or a photo detector 553.
When needs transmission signal, the signal of telecommunication is delivered on the first electronic component 31 of electrical module 30, and the signal of telecommunication is delivered to the conductive layer 53 of optical element encapsulation structure 50 by the first electronic component 31 again, then arrives at light-emitting component 551.Light-emitting component 551 converts electrical signals to optical signal.Light-emitting component 551 sends the optical signal of vertical substrates 10, and optical signal arrives reflecting surface 5135, and the optical signal becoming parallel substrate 10 after reflection arrives fiber waveguide 57, can carry out long-distance transmissions.
When needs receive signal, fiber waveguide 57 receives optical signal, and optical signal is reflected face 5135 and changes direction and arrive photo detector 553 vertically upward.Photo detector 553 converts optical signals into the signal of telecommunication, passes to conductive layer 53, then is delivered to the second electronic component 35, i.e. completes the reception of signal.
Referring to Fig. 3, the present invention provides a kind of optical element method for packing, and it comprises the following steps.
Step S201: provide or prepare an optical waveguide array layer 51, optical waveguide array layer 51 includes being sequentially connected with the installing department 511 of setting, reflecting part 513 and installation portion 517, wherein, the aspect ratio installing department 511 of installation portion 517 little.
Step S202: form reflection groove 5131 by etching on reflecting part 513.In the present embodiment, reflection groove 5131 is 90 degree of V-shaped grooves.
Step S203: form conductive layer 53 on installing department 511.
Step S204: provide or prepare at least one optical module 55 including light-emitting component 551 and photo detector 553.
Step S205: the light-emitting component 551 of optical module 55 and the end face of photo detector 553 near reflection portion 513 by the way of flip-chip are fixed on conductive layer 53 side by side.
Step S206: light-emitting component 551 is formed by the way of routing with conductive layer 53 and is connected wire 60 and carries out electric conductivity connection, photo detector 553 forms contiguous block 80 by the way of ball bonding and carries out electric conductivity and be connected with conductive layer 53.
Step S207: provide or prepare at least one fiber waveguide 57, parallel for fiber waveguide 57 light-emitting component 551 and photo detector 553 are fixed on installation portion 517, so that the optical signal that this at least one optical module sends can arrive this at least one fiber waveguide through this reflecting surface change direction and be transmitted;This at least one optical module is able to receive that this at least one fiber waveguide changes, through this reflecting surface, the optical signal that direction passes over.
The optical element encapsulation structure 50 that the present invention provides, it forms a reflection groove 5131 at optical waveguide array layer 51, and reflection groove 5131 has a reflecting surface 5135.Light-emitting component 551 and photo detector 553 are fixed on one end of conductive layer 53 near reflection groove 5131 by the way of flip-chip side by side.The optical signal that light-emitting component 551 sends arrives fiber waveguide 57 after being reflected face 5135 reflection and carries out long-distance transmissions.Equally, the optical signal of fiber waveguide 57 arrives photo detector 553 after being reflected face 5135 reflection.Even if increasing the number arranged side by side of optical module 55, do not interfere with alignment precision yet.Encapsulating structure 50 need not be directed at lens, and transmits photosignal by optical waveguide array layer 51, simplifies encapsulating structure and encapsulation procedure, and alignment precision is high, improves the yield of product.
It is appreciated that the electric connection between electrical module 30 and optical element encapsulation structure 50, is not limited in by the mode of routing.
Being appreciated that reflection groove 5131 is not limited in V-shape, it may be arranged as circular arc, as long as it can be by the change direction, direction of optical signal and pass to fiber waveguide 57 or optical module 55.
It is appreciated that conductive layer 53 can omit, will directly be electrically connected with by the way of routing with optical module 55 by electrical module 30.
It is appreciated that, after step S202, can omit step S203 and step S206, and can directly by the light-emitting component 551 of optical module 55 and the end face of photo detector 553, near reflection portion 513 by the way of flip-chip is located on optical waveguide array layer 51 side by side in step S205.
It addition, those skilled in the art also can do other change, certainly, these changes done according to present invention spirit in spirit of the present invention, all should be included in scope of the present invention.

Claims (7)

1. an optical element encapsulation structure, including optical waveguide array layer, conductive layer and be fixed at this At least one optical module on optical waveguide array layer and at least one fiber waveguide, this at least one optics group Part is for the conversion of photosignal, it is characterised in that: this optical waveguide array layer is formed with reflecting part, installing Portion and installation portion, this reflecting part is between this installing department and installation portion, and this conductive layer is layed in this installing In portion, realize electrically connecting by wire between the upper surface of this at least one optical module and this conductive layer Connecing, one end of the lower surface of this at least one optical module is fixed on this conduction by the way of flip-chip One end of this reflecting part neighbouring on layer, this reflecting part is formed with reflection groove, this at least one optical module The other end is positioned at the top of this reflection groove, and this reflection groove has a reflecting surface, this at least one optics group The optical signal that part sends can arrive this at least one fiber waveguide through this reflecting surface change direction and be transmitted; This at least one optical module is able to receive that this at least one fiber waveguide changes direction through this reflecting surface and passes The optical signal passed.
2. encapsulating structure as claimed in claim 1, it is characterised in that: the aspect ratio installing of this installation portion Portion is little, and this at least one optical module is fixed at this installing department one end adjacent to this reflecting part, should At least one fiber waveguide is installed on this installation portion.
3. encapsulating structure as claimed in claim 2, it is characterised in that: this at least one fiber waveguide with should At least one optical module and optical waveguide array layer be arranged in parallel.
4. encapsulating structure as claimed in claim 3, it is characterised in that: each optical module includes luminescence Element, this light-emitting component is fixed on the top of this optical waveguide array layer, the optical signal that this light-emitting component sends The face that can be reflected enters fiber waveguide.
5. encapsulating structure as claimed in claim 4, it is characterised in that: this each optical module also includes Photo detector, this photo detector and this light-emitting component are juxtaposed on the top of this optical waveguide array layer, are somebody's turn to do Photo detector is able to receive that the optical signal that this fiber waveguide passes over through this reflecting surface.
6. encapsulating structure as claimed in claim 5, it is characterised in that: this conductive layer and this light-emitting component And photo detector is electrically connected with.
7. an optical element method for packing, it comprises the steps:
There is provided or one optical waveguide array layer of preparation;
Forming reflection groove by etching on this optical waveguide array layer, this reflection groove has a reflecting surface;
On this optical waveguide array layer, the position of this reflection groove neighbouring forms a conductive layer;
There is provided or prepare at least one optical module, the upper surface of this at least one optical module and this conduction By the way of routing, form connection wire between Ceng carry out electric conductivity connection, this at least one optical module Lower surface one end by flip-chip adjacent to this reflection groove encapsulation be fixed on this conductive layer;
There is provided or prepare at least one fiber waveguide, and this at least one fiber waveguide is fixed at this reflection Groove is away from one end of this at least one optical module, so that the optical signal that this at least one optical module sends This at least one fiber waveguide can be arrived through this reflecting surface change direction to be transmitted;This at least one optics Assembly is able to receive that this at least one fiber waveguide changes, through this reflecting surface, the optical signal that direction passes over.
CN201110394972.XA 2011-12-02 2011-12-02 Optical element encapsulation structure and method for packing thereof Expired - Fee Related CN103135182B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110394972.XA CN103135182B (en) 2011-12-02 2011-12-02 Optical element encapsulation structure and method for packing thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110394972.XA CN103135182B (en) 2011-12-02 2011-12-02 Optical element encapsulation structure and method for packing thereof

Publications (2)

Publication Number Publication Date
CN103135182A CN103135182A (en) 2013-06-05
CN103135182B true CN103135182B (en) 2016-09-14

Family

ID=48495257

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110394972.XA Expired - Fee Related CN103135182B (en) 2011-12-02 2011-12-02 Optical element encapsulation structure and method for packing thereof

Country Status (1)

Country Link
CN (1) CN103135182B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160349451A1 (en) * 2015-05-25 2016-12-01 Centera Photonics Inc. Optical connection module
US9900102B2 (en) * 2015-12-01 2018-02-20 Intel Corporation Integrated circuit with chip-on-chip and chip-on-substrate configuration
CN107179584B (en) * 2016-03-10 2019-06-14 源杰科技股份有限公司 Optical conenctor
CN107565373A (en) * 2017-08-08 2018-01-09 广东格斯泰气密元件有限公司 A kind of VCSEL minimizes COB encapsulation making methods
CN111522102A (en) * 2019-02-01 2020-08-11 青岛海信宽带多媒体技术有限公司 Optical module

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5497438A (en) * 1993-10-01 1996-03-05 Nippon Hoso Kyokai Optical transmission and reception module having coupled optical waveguide chips
EP0744798A1 (en) * 1995-05-24 1996-11-27 Robert Bosch Gmbh Device for laser coupling
CN1299471A (en) * 1998-03-06 2001-06-13 艾利森电话股份有限公司 Optoelectric multichip module
US6327407B1 (en) * 1997-11-07 2001-12-04 Matsushita Electric Industrial Co., Ltd. Semiconductor light-receiving device, method of manufacturing the same, bidirectional optical semiconductor device, and optical transmission system
JP2002357745A (en) * 2001-05-31 2002-12-13 Kyocera Corp Optical module
US7050680B2 (en) * 2002-08-30 2006-05-23 Fionix Inc. Optical coupling device having silicon optical bench and optical fiber with angled end face
CN102023348A (en) * 2009-09-16 2011-04-20 日东电工株式会社 Opto-electric hybrid module and method of manufacturing the same
CN102135649A (en) * 2010-08-04 2011-07-27 华为技术有限公司 Manufacturing method of optical module and optical module

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5497438A (en) * 1993-10-01 1996-03-05 Nippon Hoso Kyokai Optical transmission and reception module having coupled optical waveguide chips
EP0744798A1 (en) * 1995-05-24 1996-11-27 Robert Bosch Gmbh Device for laser coupling
US6327407B1 (en) * 1997-11-07 2001-12-04 Matsushita Electric Industrial Co., Ltd. Semiconductor light-receiving device, method of manufacturing the same, bidirectional optical semiconductor device, and optical transmission system
CN1299471A (en) * 1998-03-06 2001-06-13 艾利森电话股份有限公司 Optoelectric multichip module
JP2002357745A (en) * 2001-05-31 2002-12-13 Kyocera Corp Optical module
US7050680B2 (en) * 2002-08-30 2006-05-23 Fionix Inc. Optical coupling device having silicon optical bench and optical fiber with angled end face
CN102023348A (en) * 2009-09-16 2011-04-20 日东电工株式会社 Opto-electric hybrid module and method of manufacturing the same
CN102135649A (en) * 2010-08-04 2011-07-27 华为技术有限公司 Manufacturing method of optical module and optical module

Also Published As

Publication number Publication date
CN103135182A (en) 2013-06-05

Similar Documents

Publication Publication Date Title
CN1231965C (en) Semiconductor device
US8705906B2 (en) Photoelectric conversion module
CN100521887C (en) Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly
KR101287117B1 (en) Photoelectric composite wiring module and method for manufacturing same
US7290942B2 (en) Optical transceiver modules
CN103135182B (en) Optical element encapsulation structure and method for packing thereof
CN103579376A (en) Opto-electronic system having flip-chip substrate mounting
TW201339681A (en) Lens component and optical module provided therewith
CN102736195A (en) Optical module, manufacturing method of optical module and optical communication device
CN1507065B (en) Optical transmitter receiver
KR100825732B1 (en) Opto-electronic connector module and Opto-electronic communicating module comprising the same connector module
CN112799180A (en) Optical communication module and manufacturing method thereof
CN104049323B (en) Optical module
CN101634734A (en) Optical device
US7146106B2 (en) Optic semiconductor module and manufacturing method
JP2010097169A (en) Photoelectric module, optical substrate and method of manufacturing photoelectric module
US6796723B2 (en) Submount for opto-electronic module and packaging method using the same
CN101248380A (en) Optical cable and transmitting/receiving sub-assembly
TWI507752B (en) Optical element package
TWI504959B (en) Optical element package and method for making the same
US10365446B2 (en) Optical module structure
CN103149647A (en) Optical element encapsulation structure
JP5515182B2 (en) Optical module
KR100440431B1 (en) opto-electronic submount for photo electric modules
CN101523264A (en) Photoelectric converter

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160914

Termination date: 20171202