CN1031907C - 一种用于导线连接装置的毛细管以及一种应用该毛细管形成导电连接隆起的方法 - Google Patents

一种用于导线连接装置的毛细管以及一种应用该毛细管形成导电连接隆起的方法 Download PDF

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CN1031907C
CN1031907C CN94106952A CN94106952A CN1031907C CN 1031907 C CN1031907 C CN 1031907C CN 94106952 A CN94106952 A CN 94106952A CN 94106952 A CN94106952 A CN 94106952A CN 1031907 C CN1031907 C CN 1031907C
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capillary
protuberance
plain conductor
shaping
extrusion
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CN1098819A (zh
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户村善广
别所芳宏
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

一种在半导体器件的电极接点上形成隆起以进行球形连接的毛细管，包括一挤压件，及一整形件。挤压件将金属导线的球形端固定在电极接点上。整形件使电极接点形成的隆起有一预定的高度。先从孔中进给的金属丝的一端形成一个球，向下移动毛细管及用挤压件将球形端固定在电极接点上并进给金属导线和移动毛细管以形成隆起。当毛细管向下移动时，构成挤压件的一个侧边将第二部分的金属导线切断，并由整形件将隆起整形。

Description

一种用于导线连接装置的毛细管以及一种应用该毛细管形成导电连接隆起的方法
本发明涉及一种将一个半导体器材安装到线路板的装置的方法，具体地说，本发明涉及一种用于导线连接装置的毛细管以及一种形成导电连接接点隆起的方法，该接点将半导体器件的电极接点电连接到线路板的终端电极上。近来，每个LSI芯片的电极接点的数量越来越多，连接终端的间距也缩短了，因此，现有的钎焊方法难于用于安装半导体器件。
为了解决上述问题，近来提出了多种改进的方法，这些方法中，一个半导体器件，例如一个LST芯片直接装配到线路板的输入/输出终端电极上。在这些方法中，一个将半导体器件面朝下安装在线路板上的安装芯片连接方法公认是有效的，因为该半导体器件可一次同时导电连接和线路板上许多终端电极上，而且所述的连接具有良好的机械强度，将半导体器件导电连接到线路板的终端电极上的隆起(凸出电极)借助电解涂敷、焊料槽浸渍、汽相沉积、应用导线连接方式的球形连接以及类似的方法形成。
例如，现有一般的用于导线连接装置的毛细管已由MICRO-SWLSS公司出版的连接手册以及毛细管产品目录中所公开。
图19表示一个典型现有的用于导线连接装置的毛细管100，图20是毛细管100端部110的剖面示意图。图20B表示了毛细管100的端部110详细形状。
如图20A所示，圆柱形毛细管100中设置一个孔102，一根用于连接的金属导线插入该孔。该孔102的直径约为25～50μm。从连接间距以及连接后金属导线的形状和尺寸(或一个隆起)的角度考虑，毛细管100的顶部110选择角度α为大约30°的锥形。
图20B表示了应用直径为25μm金属导线时的毛细管100的顶部110的形状。这种情况下，孔径H为38μm，顶面直径T为203μm，倒角直径CD为74μm。由于应用这种形状的毛细管100，在一个半导体器件的电极接点上形成隆起以便实现与线路板的终端电极导电连接成为可能。图20A和20B所示的毛细管通常用于连接间距与140μm或者间距更大的连接。
图21、22A和22B表示了另一个通用的用于导线连接装置的毛细管200 。该毛细管200通常应用于连接间距小于140μm的连接。如图21所示，圆柱形毛细管200的端部具有一个用于较窄连接间距的瓶颈210。瓶颈高度NH通常约为500μm，在图22A所示的实例中，高度NH为460μm。在毛细管200中设置有孔102，孔中插有一根连接用的金属导线，该孔与毛细管100的孔相同。孔102的直径范围的为25μm-50μm。
从连接间距以及连接后金属导线的形状和尺寸(或一个隆起)角度考虑，毛细管200瓶颈210为锥形，其锥角β为10°。
图22B表示了应用直径约为25μm的金属导线时毛细管200的端部形状。这种情况中，孔径H为38μm、顶面直径T为152μm、倒角直径CD为64μm。由于应用这种形状的毛细管200，在一个半导体器件电极接点上形成隆起以便可能实现与线路板的终端电极导电连接。
下面将说明采用上述的用于导线连接的毛细管的一种由球形连接而形成半导体器件隆起的一般方法。例如日本2-34949号专利申请公开说明书描述了导电连接隆起，该每个隆起具有两级伸出的形状(下文统称为两级隆起)，该申请还公开了应用一种一般的毛细管形成这种二级隆起的方法。
图23A至图23D示意地表示了在IC芯片106上的电极接点103上利用毛细管101借助一般的球形连接而形成的两级隆起107的方法。
首先，如图23A所示，一根直径为25μm的金属导线104插入毛细管101的孔102。由气体火焰、电脉冲、超声振动或类似方法产生的热能作用到金属导线104的端部，其结果在该金属导线的端部形成一个直径约为该金属导线直径2～3倍的球体105。
其次，如图23B所示，通过毛细管101向下移动，金属导线104端部形成的球体105紧贴在IC芯片106的电极接点上。借助热压连接或者超声振动球105可靠地与电极接点103连接；以形成一个隆起107的基台109(第一连接步骤)。该基台的外径约为80μm-90μm，高度约为20μm-30μm。
然后，如图23C所示，在隆起107的基台109与插入毛细孔101的孔102的金属导线104连接的状态下，该毛细管101沿环形轨迹运动。具体地说，毛细管101首先在隆起107的基台109的上方向上移动，然后按环形轨迹移动。此后，当毛细管101向下移动时，金属导线被切断(第二连接，参见图23D)。如图23D所示，借助毛细管101的环形轨迹运动，金属线104在基台109上形成环状或者倒U形状。该部分形成了隆起107的顶部108，金属导线104由毛细管101的顶部侧边(1)切断。这样就形成了图24所示的两级隆起107。
根据金属导线的直径和材料，每个隆起的第一次连接和第二次连接的压力设置为20克-40克。
图24表示一个由一般的球形连接形成的典型的两级隆起的形状。该两级隆起107外径约为80μm-90μm，总高h1约为60μm-80μm。
为了使这些两级隆起高度一致，尚需完成一种整形程序。该程序中，这些隆起107对着一个光滑平板挤压(见图25)。需要该整形程序的理由是由球形连接形成各部隆起高度与用其他方法形成的隆起的高度相比，彼此差异很大，在那些使用导电粘接剂作为粘接层以便将半导体器件连接到线路板的情况下，该整形程序能获得另一个效果，即该导电粘接剂的输送量是稳定的。
如图25所示，在该整形过程中，IC芯片106面朝下配置并且压向光滑平板112。该整形载荷每个隆起约50克，该整形载荷按照金属导线的材料和直径加以调整。图26表示一个经整形后的典型的两级隆起107的形状。整形的结果两级隆起107的总高度h1统一处于40μm-50μm范围内。
上述一般的毛细管及形成一般的隆起的方法需要一个半导体器件上形成隆起的程序，以及另一个修整所形成的隆起的程序，因此生产成本高，同时还需要一个用于整形的装置。
然而，省略该整形程序会产生下述问题。首先，由球形连接产生的隆起的顶部108(整形过程之前)为环形或倒U字形，因此顶部108的顶面面积很小(参见图24)，这意味着与线路板的终端电极接触的面积小得有害。此外每个隆起的高度通常也是不一样的，因此未经整形的隆起的不能实现具有希望高度的可靠的连接。其次，在那些使用导电粘接剂做为粘接层的情况中，由于未经整形的隆起的形状，只有少量的导电粘接剂能输送到隆起的顶部，且输送量变化很大。因此，粘接剂凝固之后的粘接强度很低，不言而喻粘接可靠性差。此外，连接电阻也增大。基于上述理由，整形程序是不能省略的。
此外，利用上述一般的隆起成形方法，与其说该隆起可以产生如图24所示的典型的形状，倒不如说该隆起产生如图27A至图27C所示的另外的形状。图27A和图27B所示的隆起形状称为″二次剥落″。这就是当毛细管101切断金属导线104时，环形或倒U形部分的端部114从隆起107体上剥落。图27C所示隆起的这种形状称为″拖尾″。如果尾部115的伸出部分从隆起的侧面测量大于隆起基台直径的四分之一，该隆起不合格。当在预定位置上毛细管101的侧边没有切断金属导线104时，导致这种不合格的隆起产生。这些形状的隆起作为连接点是不合格的。
图27A所示的隆起中，顶部116分为两个部分，所以不能得到足够的强度。在图27C所示的隆起中，尾部115侧向伸出。如果导电粘接剂在该尾部保持然后散布将会发生邻近的隆起短路的危险，以及电极变得非常高。如上所述，这些不希望的隆起形状可导致连接失效以及短路，因此应用这样的隆起将半导体器件非常可靠地连接到电路板上是很困难的。
图28A和28B示出了另外的不合格的隆起，它们是由一般的整形程序引起的。在这些隆起中，整形结果会使隆起的顶部产生不希望有的下陷。
本发明的技术方案是：
一种用于球形连接以便在一个半导体器件的电极接点上形成一个隆起的毛细管，该毛细管包括：一个用于将一根金属导线的类似球形端对着该电极接点挤压以确保在压力下所述类似球形端固定到所述电极接点上的挤压件；一个用于提供所述金属导线的设置在所述挤压件中的孔；一个使所述在电极接点上形成的隆起产生一个予定高度的整形件。
本发明的一个实施例中，所述的整形件是一个从毛细管的外圆周伸出的凸出部分。
本发明另一个实施例中，所述的整形件沿毛细管的外圆周配置。
本发明另一个实施例中，所述的整形件在毛细管外圆周的一个部分配置。
本发明另一个实施例中，所述的挤压件包括一个毛细管的端面，而整形件包括一个挤压隆起的底面，该整形件这样设置：从所述的端面到所述底面的高度有一个预定的测量值。该底面可以具有一具粗糙的侧面。此外，整形件包括一个与底面相邻的导向部分，该导向部分从底面向下伸出。
本发明另一个实施例中，挤压件有一个切断金属导线的侧边。
本发明另一个实施例中，所述毛细管的材料可以由陶瓷或者红宝石中选择。
本发明另一个实施例中，所述的底面可以基本上与一个连接装置的台阶平行，所说的毛细管连接到该连接装置上。
按着本发明的另一方面，提供一种利用球形连接的毛细管在一个半导体器件的电极接点上形成一个隆起的方法，该毛细管包括：一个包括毛细管端面的挤压件；一个设置在该挤压件中用于进给所述金属导线的孔；以及一个设置在毛细管外圆周的整形件。该方法包括如下步骤：(a)由所述孔中供给的金属导线一端形成一个球；(b)通过向下移动毛细管和在所述挤压件的压力下把球形端固定到所说的电极接点，以形成所述隆起的第一部分；(c)借助毛细管移动时进给金属导线，在第一部分上形成隆起的第二部分；以及(d)当毛细管向下移动时，利用所述挤压件的一个侧边将构成所述第二部分的金属导线从在所述孔中进给的金属导线上切断，同时利用所述的整形元件对所述的隆起整形。
本发明另一个实施例，所述的步骤(c)中毛细管在第一部分的上方按环形轨迹移动，并且构成所述隆起第二部分的金属导线在所述第一部分上形成环状或倒U形状。
本发明的另一个实施例中，所述整形件包括一个位于距所述端面预置高度的底面，并且在步骤(d)中，由于底面挤压所述的隆起，该形成的隆起具有预置的高度。另一种做法是在步骤(d)中，将所述的毛细管下移，直到所述端面紧靠在所述电极接点。要不然，使所述底面具有一个粗糙侧面，在步骤(d)中，所述隆起的第二部分形成一个粗糙的顶面。另一方面，也可使所述整形件包括一个与所述底面相邻的导向部分，该导向部分从底面向下伸出，在步骤(d)中，所述隆起的第二部分由该导向部分支承。
本发明的另一个实施例中，步骤(b)中，所述第一部分由热压连接形成。
本发明的另一个实施例中，步骤(b)中，所述第一部分由超声振动形成。
本发明的另一个实施例中，步骤(6)中，所述第一部分由热压连接与超声振动的共同作用形成。
本发明的另一个实施例中，金属导线的材料可为金、铜、铝、或焊料。
上述步骤(b)、(c)和(d)中，毛细管在Z方向上移动，连接装置(连接器)的台阶沿X-Y方向移动，上述运动结合形成了所需的二级隆起。
综上所述，本发明所有如下优点：
(1)提供了一个用于球形连接的毛细管，利用该毛细管可以形成隆起，使半导体器件容易并且高度可靠地连接到线路板上，该隆起不需另外附加的程序，以及提供了一个利用该毛细管形成所述隆起的方法。
(2)提供了一个用于球形连接的毛细管，利用该毛细管形成了稳定和一致的形状的隆起，防止了不合格隆起的形成，以及提供了利用该毛细管形成所述隆起的方法。
本发明上述和其它的优点，在参照附图阅读和理解以下的详细描述时，将会得到更清晰的概念。
图1是表示按照本发明第一实施例中用于球连接的一个毛细管的示意图；
图2A是图1所示毛细管端部的示意剖视图；
图2B是表示该毛细管端部详细形状的示意图；
图3表示了一个典型的连接器，本发明的毛细管与该连接器相连；
图4A至图4E是应用本发明的毛细管形成二级隆起的方法的示意图；
图5是表示应用本发明的毛细管挤压和成形所说隆起过程的示意图；
图6表示了一种借助应用第一实施例所述毛细管的球连接方法形成的二级隆起的典型形状；
图7A至图C是本发明所述毛细管的突出部分可能形状的示意图；
图8是具有按本发明利用二级隆起而形成的装配的半导体器件(一种半导体组件)实例的示意图；
图9A和图9B表示了一处用导电粘接剂将半导体器件连接到一个线路板上的方法，所说的半导体器件具有按照本发明形成二级隆起，以及还表示了上述连接之后的半导体组件；
图10A和图10B表示了半导体组件，在该组件中，一个具有由按照本发明形成的二级隆起的半导体器件由一个各向异性的导电元件可导电地连接到一个线路板上；
图11是本发明第二实施例中一个用于球连按的毛细管的示意图；
图12A是图11所示毛细管一个端部的剖面示意图；
图12B是表示所述毛细管端部详细形状的示意图；
图13是本发明第三实施例中一个用于球连接的毛细管端部的剖面图；
图14表示了应用第三实施例所述毛细管成形的二级隆起的形状；
图15A和图15B表示了一种用导电粘接剂将一个半导体器件连接到一个电路板上的方法，所述的半导体器件具有按照本发明形成的二级隆起，还表示了连接后的半导体组件；
图16A和16B表示了半导体组件，在该组件中，一个具有按照本发明形成的二级隆起的半导体器件由一个各向异性的导电元件可导电地连接到一个线路板上；
图17是一个本发明第四实施例所述的用于球连接的毛细管端部剖面图；
图18A表示一个由第四实施例所述毛细管形成的二级隆起；
图18B表示一个在其顶部凹陷的二级隆起的形状；
图19是一个用于导线连接装置的一般的毛细管的示意图；
图20A是图19所示毛细管端部的剖面示意图；
图20B是所述毛细管端部详细形状的示意图；
图21是另一个用于导线连接装置的一般的毛细管的示意图；
图22A是图21所示毛细管端部的剖面示意图；
图22B是所述毛细管端部详细形状的示意图；
图23A到图23D示意地表示应用一个一般的毛细管的球连接方法形成一个两级隆起的方法；
图24是按照一个一般的球连接方法形成的一个典型的两级隆起的形状示意图；
图25是一个按照一般的球连接方法所述的整形过程的示意图；
图26是一个表示经过按现有球连接方法所述的整形过程后的一个典型隆起形状的示意图；
图27A到图27C表示了按照一般的球连接方法形成的不符合要求的两级隆起的形状；
图28A和图28B表示了由于一般的整形过程结果导致的不合格隆起的形状。
下面，结合附图描述本发明所述的实施例。
实施例1
图1表示了一个本发明实施例描述中的用于球连接的毛细管1。图2是上述毛细管1的端部10的剖面示意图。图2B表示了毛细管1的端部10的详细形状。
如图1所示，圆柱形毛细管1具有作为一个整形元件的配置在端部10外周的凸出部分3。该毛细管1由陶瓷或者红宝石制成。
如图2A所示，凸出部分3的底面31(一个整形平面)基本与毛细管1的端面11平行。从毛细管1的端面11到底面31所测的高度等于予置值d。底面31的面积按照连接间距和被整形的隆起顶端的直径选择。
毛细管1有一个孔2，一用于连接的金属导线插进该孔。孔2的直径取值范围为25μm-50μm。毛细管1的端部10有一个锥形面，考虑到连接间距以及连接后的金属导线的尺寸和形状(一种隆起)，该锥面角度α大约为10°-30°。
例如图2B表示了当使用的金属导线直径约为25μm时毛细管1端部10的形状。这种情况下，孔径H为38μm，端面直径T为203μm，倒角直径CD为74μm。
上述的毛细管1安装到图3所示的连接器500上。在该连接器500中，毛细管1连接一个臂510的端部，该臂起一个超声传送工具的作用。一个要连接的器件(一个IC片)位于一个连接台520上。毛细管1与臂510一起向上或向下移动。器件501水平地(X-Y方向)与连接台520一起转动。借助于垂直运动与水平运动的适当结合，毛细管1能在希望的方向上移动到相对于器件501的希望的位置。
下面叙述一种应用第一实施例所述毛细管1借助球连接而在半导体器件上形成隆起的方法。
图4A至4E示意地表示按照本发明的毛细管1借助球连接而在IC芯片6上的电极接点13上形成二级隆起7的方法。
首先，如图4A所示，一直径为25μm的金属导线4插入毛细管1的孔2内。气体火焰、电脉冲、超声振动或类似的热能作用于金属导线4的端头，其结果是在金属导线的该端上形成一个直径约为金属导线直径2-3倍的球。
金属导线由可用导线连接方法的材料制成，如金、铝和铜。金属导线4的材料和直径依据所形成的隆起7的外径、高度以及类似参数选择。
其次，如图4B所示，借助向下移动毛细管1，在金属导线4端头形成的球5紧靠IC片6上的电极接点13。借助热压焊或者超声振动作用，球5固定在电极接点13，以便形成一个隆起7的基台9(第一连接步骤)。该第一连接由毛细管1的端面11完成。基台9的外径约为80-90μm，高度约为20-30μm。
第三，如图4C所示，在隆起7的基台9与插入毛细管1的孔2的金属导线4连接的状态下，毛细管1相对IC芯片6运动一个环形轨迹，具体地说，毛细管1首先在隆起7的基台9上的方向上移动，然后再完成环形轨迹。如图4D所示，借助毛细管1相对IC芯片6的环形运动，金属导线4在基台9上形成一个环形或倒U形部分，该部分构成了隆起7的顶部8。在该步骤中顶部8的高度约为40-50μm。
此后，毛细管按下述方式移动：毛细管1的端部的侧边21位于隆起7的基台9的外周，然后毛细管向下移动以便侧边切断金属导线4(图4E)。如图5所示，毛细管1继续向下移动，这样，隆起7由设置在毛细管1外周的凸出部3的底面31压缩并成形(第二连接步骤)。在该过程中，毛细管1向下移动直到端面11紧靠在电极接点13，隆起7的整个高度基本等于毛细管1端面9和凸出部3底面31之间的高度差(即预定值d)，借此，完成所述的整形。
第一连接的压力例如每个隆起可以设置在25-45克的范围内。而第二连接的压力则每个隆起可以设置为70-95克，该连接压力可依据金属导线的材料和直径调整。
图6表示一个按本施实施例球形连接方法形成的典型二级隆起的形状。该二级隆起7(柱状隆起)的外径R约为80-90μm，总高h1约为40-50μm，顶部8的顶面81的直径「为40-50μm，基台9的高度h2约为15-25μm，这些数值均能依据希望的连接间距而变化。
如上所述，按照本实施例，隆起7的整形能在隆起7的形成过程中实现。完成该过程所需的时间基本上与现有技术实施例中仅仅形成隆起107所需的时间相同。因此，节省了相当于一般整形过程的时间。
此外，按照本发明的连接方法，由于隆起7的形成、挤压和整形在一个程序中完成，故隆起7几乎不可能产生如图27A至27C所示的形状。更具体的说，如图5所示，毛细管1把隆起7挤压到顶面11并且靠在电极接点13，这样形成了隆起7的顶部8的金属导线能更容易被切断。
此外，整形时隆起7的一个侧面由毛细管1端部的一侧面处支承着，这样，如图28B所示的在整形时出现的端部凹陷就可阻止。
如上所述，按照本发明，能够阻止由一般的整形过程不能改善的具有不理想形状(不合格隆起)的隆起形成。本发明形成的隆起基本具有一致的形状，这样就可将半导体器件更可靠地连接到线路板上。
在本实施例中，从生产毛细管1(图7A)的加工性考虑，毛细管1具有圆柱形形状，以及突出部分3也具有圆柱形形状，这样，底面31也基本为圆形。在整形过程中，凸出部分3从毛细管1的外圆伸出以及为了整形隆起7而设置一个底面，凸出部分的外部形状可为任意的，例如，图7B所示的类似盘状突出部分3a，图7c所示的配置在毛细管1一侧的突出部分3b。
其次，一些典型的半导体组件中，需要将具有隆起7的半导体器件(IC芯片)安装到线路板上。下述的实施例中，附图示意地表示了这些两级隆起7的形状。
图8表示一个半导体组件600，该组件中所述具有隆起7的半导体器材通过该隆起7安装在一种柔性树脂膜上形成的引线组12(终端电极)上。在这个实施例中，隆起7由金制成，引线组12的材料可以是基体为镍并涂敷金或锡，或者可以是铝、铜或钎料。使隆起7和引线组12处于规定的位置，上述位置调整完成之后，用热连接工具加压，以便使上述金属成为合金，或实现热压连接。其结果，隆起7与在柔性树脂上成形的引线组12进入导电接触。在在热压连接的情况中，也能附加应用超声振动。不然挤压连接也可由超声振动独立完成。引线组12的材料可以是基体镍上涂敷金或锡，或者可以是铝、铜、或者是钎焊料。
图9A和图9B描述了一种方法，该方法利用导电粘接剂14将半导体器件的隆起7连接到线路板15的终端电极12上。还表示了上述连接之后获得的半导体组件700。如图9A所示，导电粘接剂14用一种输送方法或印刷方式涂敷到隆起7的顶端部，由于利用了隆起7有两级凸起部分，多余的导电粘接剂就不会粘接到隆起7上。这样只有适量的导电粘接剂能够涂敷到隆起7上。涂敷导电粘接剂14之后，如图9B所示，所述的半导体器件面朝下安装在线路板15上。隆起7以一定的方式靠在线路板15的终端电极的预定位置之后，导电粘接剂在80℃-150℃的范围内加热固化，以形成一个粘接层，结果，半导体器件的隆起7导电连接到线路电极15上的终端电极12上。这样，该半导体器件安装到线路板上。
按照本实施例，能防止包括第二次剥落和尾部在内的不合格的隆起形成能不断的被防止，而且导电粘接剂不会被该剥落和尾部区域卡住和散开。这就意味着造成邻近的隆起或电极之间短路的可能性极小，因此，就能高度可靠地将半导体器件连接到线路板上。
图10A和图10B表示一个半导体组件，该组件中，利用各向异性的导电元件可将半导体器件电连接到线路板15的终端电极12上。
如图10A所示，在半导体组件800中，一个薄的各向异性的导电元件16配置在线路板15上形成的终端电及12上。所说的半导体器件具有面朝下位于其上的隆起7。随着加热将半导体器件压向电路板15，夹在隆起7和终端电极12之间的各向异性的导电性元件16的一部分与终端电极12热压并且连接。由此获得所述的导电连接。在各向异性的导电元件16的热压部分中，各向异性的导电元件16的导电粒子被隆起7压缩，并互相连接。同时，该导电粒子浸入终端电极的表面当中，这样，终端电极和隆起7可导电地互相连接，未压缩的其余部分中，导电粒子彼此独立存在，这样保持了电绝缘性。
图10B表示一个半导体组件900，该组件应用一个厚度大于隆起7和终端电极12总厚的各向异性的导电元件16′。该各向异性的导电元件16′配置在线路板上形成的终端电极17上。然后，具有隆起7的半导体器件面朝下座落其上。随着加热将该半导体器件压向线路板15，夹在隆起7和终端电极12之间的各向异性的导电元件16′的一部分被挤压。这样，获得所说导电连接。此外，在本例中，仅仅夹在隆起7和终端电极12的部分被挤压，其余部分保持电绝缘。该各向异性的导电元件16′的其余部分起绝缘粘接剂的作用，当树脂热变固态时，半导体器件连接到线路板上。
实施例2
图11表示本发明第二实施例中用于球形连接的毛细管41。图12A是该毛细管41的端部40的剖面示意图。图12B表示毛细管41的端头详细形状。为了形成若干具有较密连接间距的隆起，毛细管41配置一个具有锥端的瓶颈400。瓶颈高度大约500μm。在图12A中，该高度为460μm。
如图11所示，圆柱形毛细管41具有一个设置在瓶颈400外周上作为一个整形元件的凸出部分43。该毛细管41由陶瓷或人造红宝石制成。如图12A所示，凸出部分43的底面431(一个整形面)基本上平行于毛细管41的端面411。从毛细管41的端面411到底面431的测量高度为一个预定值d。在毛细管41中，一根用于连结的金属导线插入孔2中，这种结构安排与毛细管1相同。孔2的直径范围约为25μm-50μm。从焊接间距以及焊接后金属导线的形状、尺寸(或者一个隆起)的角度考虑出发，毛细管41的端部(瓶颈400)具有一个锥面，其角度约为10°。
图12B表示了应用直径为25μm的金属导线时毛细管41的端部形状。在这个实例中，孔径H为38μm，顶面直径T为152μm，倒角直径CD为64μm。
例如上述毛细管41连接到图3所示的连接器500上，其状况与毛细管1相同。应用毛细管41形成两级隆起7的方法与第一实施例所述方法相同。
如上所述，甚至在较密连接间距的状态下，所述第二实施例也能象第一实施例一样，可在同一个过程中完成隆起7的形成和整形，而不需另外附加的整形程序。
按照第二实施例，可以防止具有不符合要求形状的隆起(不合格隆起)的形成，而这种不合格隆起的缺陷不能由一般的整形程序改善。同时，该实施例形成的隆起具有一致的形状，这样，半导体的器件便更可靠地连接到线路板上。
实施例3
图13是本发明第三实施例用于球形连接的毛细管51端部的剖面图。该实施例中，如图13所示，圆柱形毛细管51有一个设置在其端部外圆周上的凸部分53。凸出部分53的一个底面531(整形面)包括粗糙的侧面54，这里术语″粗造的侧面″的含义是该侧面由在各个方向上形成若干宽度为0.1μm-10μm的沟槽面而变粗糙。毛细管51的其他部分的制作与毛细管1和毛细管41相同，随所需的连接间距而定。
应用毛细管5 1形成两级隆起的方法与第一实施例所述的方法相同。在这个实施例中，隆起由设置在毛细管51的外圆的凸出部分53的底面531挤压成型的第二连接中，借助底面531上的粗糙侧面54的作用，隆起57的顶部形成一个粗糙的侧面58。在该第二连接中，为了有效地形成粗糙面58，采用超声振动。图14表示了应用毛细管51形成的两级隆起57。
图15A和15B揭示了一种将半导体器件的隆起57利用导电粘接剂14连接到线路板15上的终端电极12上的方法，该图还表示了该连结之后获得的半导体组件710。其粘接方法与图10A和图10B所述第一实施例相同。
应用具有两级伸出形状的隆起57，可以防止多余的导电粘接剂粘接到隆起57上。这样，适量的导电粘接剂能涂敷到隆起57上。该实施例中，由于粗造的侧面在隆起58的顶部形成，导电粘接剂14的粘接面能够增加。此外，导电粘接剂的导电粒子进入粗糙侧面58的沟槽中，因此可获得更可靠的导电性。这样具有较高可靠性的半导体组件便可获得。
图16A和16B分别表示半导体组件810和910，在该组件中，半导体器件通过各向异性的导电元件导电连接到线路板15的端电极12上。
半导体组件810和910的安装情况与第一实施例所述的半导体组件806和900的相同。在半导体组件810和910中，由于在隆起57的顶部形成粗糙侧面58，与导电粒子相连隆起57的表面积增加了。这样就获得了良好的导电接触。此外，粗糙侧面58的形成增加了与各向异性的导电元件16或16′的导电粒子相连的隆起57的表面积以及树脂的粘接面积。这样，增加了导电性和粘接强度，获得了可靠性高的导电连接。
所述各向异性的导电元件中每个导电粒子的尺寸范围为1μm-10μm。为了有效地获得导电连接，需要适当地选择隆起顶部形成的粗糙侧面的粗糙程度以及导电粒子的尺寸。
图13中，粗糙侧面54设置在整个凸出部分53的底面531上。粗糙侧面54可选择地设置在底面531所需的部分内。在该实施例中，毛细管51为圆柱形，而凸出部分53也为圆柱形，这样，底面531也基本为圆形，从制造的观点来看，这样便于毛细管51的加工。就从毛细管的外周伸出并设置一个用于整形隆起57的底面以及一个粗糙侧面而言，实施例1中所述的该凸出部分采用任何其它形状都是可行的，然而，在整形中，凸出部分53的底面531设置成平行于IC芯片6是需要的。
实施例4
图17是本发明第四实施例所述用于球形连接的毛细管61端部的剖面图。在该第四实施例中，如图17的示，圆柱形毛细管61有一个设置在其端部外圆周的凸出部分63。该凸出部分63的底面631包括一个整形面65和一个导向部分64。如图17所示，凸出部分63的整形面65基本平行于毛细管的端面611。由毛细管61的端面611到所述整形面65的高度为一个预定值d。该高度值依据所形成的隆起高度而定。
导向部分64是一个垂直向下伸出并沿底面631外缘周边配置的部分。该导向部分64保持第二连接(整形)中两级隆起67的顶部68，以便防止该两级隆起67产生如18B所示的凹陷。利用毛细管61形成的两级隆起67如图18A所示。
就形成的二级隆起形状能保持足够的运送的导电粘接剂量而言，导向部分64不局限于任何特定的形状，例如，所说顶部68的侧面是垂直的。
毛细管61的其余部分与毛细管1或毛细管41相同，随所需的连接间距而定。
应用毛细管61形成两级隆起67的方法与第一实施例叙述的方法相同。在该实施例中，隆起67在第二连接中由设置在毛细管外用的凸出部分63底面631的整形面65挤压并成形。在第二连接中，隆起67的顶部68由沿底面631外周形成的导向部分64支承。这样，防止了两级隆起67的顶部68的凹陷以及不合格隆起的形成。这种不合格隆起如图28A和28B所示，它在一般的整形过程中出现。
此外，由于设置了导向部分64，所有的顶部68基本上具有相等的面积，这样，可以减少隆起67的形状变化并使其形状一致。
图17中导向部分64设置在底面631的整个外周部分。该导向部分64可以选择地设置在底面上所需的外周部分。在这个实施例中，从生产毛细管61的角度出发，毛细管61为圆柱形状，凸出部分63也具有圆柱形状，这样底面631基本为圆形。就从毛细管61的外周伸出的并且设置用于隆起67整形的整形平面以及用以支承隆起67的顶部68的导向部分的凸出部分63而言，可以使用第一实施例所述的任何其它的凸出部分形状，需要的是在整形过程中凸出部分63的整形平面65平行于IC芯片6。
从上述说明可以得知，按照本发明，隆起的整形能在半导体器件的隆起形成过程中完成，这样，就可以在不需附加单独整形程序的情况下获得具有所需高度的形状的隆起，因此，不仅节省了用于该附加的整形程序的时间和成本，而且还可形成具有可靠性能的经过整形以便很容易将半导体器件连接到线路板上的隆起。更进一步，本发明可以阻止不符合要求的隆起的形成，以及能够形成明显减少变化的隆起。
因此，所述半导体器件和线路板确实的电连接并且互相结合在一起，这样就稳定可靠地完成该半导体器件的安装。本发明减少了生产过程的步骤和成本，而效果却等于或优于现有技术，这样实际应用中适用性显著提高。
本发明其它的各种变型是显而易见的，以及由本领域的普通技术人员容易制造出来，并且不超出本发明的保护范围，该保护范围由权利要求书加以确定。

Claims (21)

1.一种用于球形连接以便在一个半导体器件的电极接点上形成一个隆起的毛细管，该毛细管包括：
用于将一金属导线的类似球形端对着该电极接点挤压以便在该压力下使所述类似球形端固定到所述电极接点的一个挤压件；
用于提供所述金属导线并设置在所述挤压件中的一个孔；其特征在于，它还包括：
使所述在电极接点上形成的隆起产生一予定高度的一个整形件。
2.根据权利要求1所述的毛细管，其特征在于，所述的整形件是一个从该毛细管外周伸出的凸出部分。
3.根据权利要求1所述的毛细管，其特征在于，所述的整形件沿该毛细管外周设置。
4.根据权利要求1所述的毛细管，其特征在于，所述的整形件设置在该毛细管外周的一部分上。
5.根据权利要求1所述的毛细管，其特征在于，所述的挤压件包括一个该毛细管的端面，所述的整形件包括一个用于挤压所述隆起的底面。
6.根据权利要求5所述的毛细管，其特征在于，所述整形件设置成所述底面相距端面为一预置的高度。
7.根据权利要求5所述的毛细管，其特征在于，所述的底面有一粗糙的侧面。
8.根据权利要求5所述的毛细管，其特征在于，所述的整形件包括一个与所述底而相邻的导向部分，该导向部分从所述的底面向下伸出。
9.根据权利要求1所述的毛细管，其特征在于，所述的挤压件具有一个用于切断所述金属导线的侧边。
10.根据权利要求1所述的毛细管，其特征在于，该毛细管由陶瓷或人造红宝石制成。
11.根据权利要求5所述的毛细管，其特征在于，所述的底面基本上与一个连接装置中的一台阶平行，所说的毛细管连接到该连接装置上。
12.一种应用球形连接的毛细管，该毛细管包括：一个包括该毛细管一个端面的挤压件；一个设置在该挤压件中的用于进给所述金属导线的孔；以及一个设置在该毛细管外周上的整形件，以在半导体器件的电极接点上形成一个隆起的方法，其特征在于，该方法包括如下步骤：
(a)在所述孔中进给的金属导线的一端形成一个球；
(b)通过向下移动该毛细管，并且在所述挤压件的压力作用下把所述类似的球形端固定到所说的电极接点上，以便形成所述隆起的第一部分；
(c)当毛细管移动时进给金属导线形成所述隆起的第二部分；以及
(d)当该毛细管向下移动时，利用所述挤压件的一个侧边将构成所述第二部分的金属导线从在所述孔中进给的金属导线上切断，同时利用所述的整形元件对所述的隆起整形。
13.根据权利要求12所述的方法，其特征在于，步骤(c)中所述毛细管在第一部分上方按环形轨迹移动，并用构成所述隆起第二部分的金属导线在所述第一部分上形成环状或倒U形状。
14.根据权利要求12所述的方法，其特征在于，所述整形件包括一个位于距所述端面预定高度的底面，并且在步骤(d)中，由于底面挤压所述的隆起，该形成的隆起具有预定的高度。
15.根据权利要求14所述的方法，其特征在于，在步骤(d)中，所述的毛细管向下移动直到所述端面紧靠在所述的电极接点上。
16.根据权利要求14所述的方法，其特征在于，所述底面具有一粗造的侧面，在步骤(d)中，所述隆起的第二部分形成一个粗糙的顶面。
17.根据权利要求14所述的方法，其特征在于，所述整形件包括与所述底面相邻的导向部分，该导向部分从底面向下伸出，在步骤(d)中，所述隆起的第二部分由该导向部分支承。
18.根据权利要求12所述的方法，其特征在于，在步骤(b)中，所述的第一部分由热压连接形成。
19.根据权利要求12所述的方法，其特征在于，在步骤(b)中，所述的第一部分由超声波振动形成。
20.根据权利要求12所述的方法，其特征在于，在步骤(b)中，所述的第一部分由热压焊接和超声波振动的共同作用下形成。
21.根据权利要求12所述的方法，其特征在于，金属导线的材料可由金、铜、铝或者焊料中选择。
CN94106952A 1993-04-30 1994-04-29 一种用于导线连接装置的毛细管以及一种应用该毛细管形成导电连接隆起的方法 Expired - Fee Related CN1031907C (zh)

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US5485949A (en) 1996-01-23
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EP0622149A1 (en) 1994-11-02
KR0137909B1 (ko) 1998-06-01
CN1098819A (zh) 1995-02-15

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