CN103381637A - Plastic package container and manufacturing method thereof - Google Patents
Plastic package container and manufacturing method thereof Download PDFInfo
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- CN103381637A CN103381637A CN2011104583759A CN201110458375A CN103381637A CN 103381637 A CN103381637 A CN 103381637A CN 2011104583759 A CN2011104583759 A CN 2011104583759A CN 201110458375 A CN201110458375 A CN 201110458375A CN 103381637 A CN103381637 A CN 103381637A
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- container body
- identification chip
- plastic packaging
- packaging containers
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Abstract
The invention discloses a plastic package container and a manufacturing method thereof. The manufacturing method of the plastic package container comprises the following steps of 1, putting a radio frequency identification chip on the surface of a cavity of a first female mold, wherein the radio frequency identification chip orderly comprises a substrate layer, a chip antenna layer and a film coating layer and the chip antenna layer comprises antenna patterns formed from conductive printing ink on the substrate layer and also comprises an integrated circuit chip electrically connected to the antenna patterns, 2, closing a first male mold and the first female mold to form a first mold space, 3, pouring a melt raw material into the first mold space to obtain an inner wall of the plastic package container after molding, 4, opening the closed first male mold and first female mold, 5, closing the first male mold receiving the inner wall of the plastic package container and a second female mold to form a second mold space, and 6, pouring the melt raw material into the second mold space to obtain an outer wall of the plastic package container after molding. The manufacturing method can improve anti-fake and anti-wear capabilities of the plastic package container thereby improving product competitiveness.
Description
Technical field
The invention belongs to packaging field, relate in particular to a kind of plastic packaging containers and plastic packaging containers preparation method.
Background technology
The consumer goods all need verification technique from the whole supply chain that is fabricated onto retail, forge though depend on low being easy to of traditional verification technique cost of bar code or two-dimensional bar code.
Radio frequency identification (RFID, Radio Frequency Identification) can be identified destination object and obtain related data by radiofrequency signal by technology automatically, therefore the RFID technology is applied widely.Make in industry in traditional cosmetics of everyday use, packing production method based on the cosmetics of everyday use of RFID technology is that the RFID chip that will record cosmetics of everyday use information is pasted on the surface of plastic packaging containers by adhesive sticker.
Summary of the invention
The embodiment of the present invention provides a kind of plastic packaging containers and plastic packaging containers preparation method, with the RFID chip that improves existing plastic packaging containers be affixed on the surface make easy damaged and cause that it can not bring into play should effective problem.
For solving the problems of the technologies described above, the embodiment of the present invention provides following technical scheme:
On the one hand, the embodiment of the present invention provides a kind of plastic packaging containers preparation method, can comprise:
RF identification chip is put into the mold cavity surface of the first former;
Wherein, described RF identification chip comprises substrate layer, antenna component layer and coating layer successively, and described antenna component layer is included in printing conductive inks on described substrate layer and the antenna pattern that forms, and the IC chip that is electrically connected to described antenna pattern;
With the first formpiston and described the first former closure to form the first die space;
To be injected into for the raw materials melt of the container body of moulding plastics packing container among described the first die space described raw materials melt is shaped to the inwall of container body, wherein, described RF identification chip is affixed on the first surface of inwall of described container body;
Described the first formpiston and first former of closure are opened;
Wherein, the inwall of described container body is placed on described the first formpiston, and the second surface of the inwall of described container body contacts with described the first formpiston;
Close the second former to form the second die space on inwall the first formpiston that is placed with described container body;
To be injected into for the raw materials melt of the container body of moulding plastics packing container among described the second die space to mold the container body of plastic packaging containers, wherein, described RF identification chip is wrapped among the wall section of container body of described plastic packaging containers.
Optionally, the described mold cavity surface that RF identification chip is put into the first former is specially: utilize mechanical hand RF identification chip to be put into the mold cavity surface of the first former.
On the other hand, the embodiment of the present invention also provides another kind of plastic packaging containers preparation method, comprising:
RF identification chip is put into the whose surfaces of the first formpiston;
Wherein, described RF identification chip comprises substrate layer, antenna component layer and coating layer successively, and described antenna component layer is included in printing conductive inks on described substrate layer and the antenna pattern that forms, and the IC chip that is electrically connected to described antenna pattern;
With the first former and described the first formpiston closure to form the 3rd die space;
To be injected into for the raw materials melt of the container body of moulding plastics packing container among described the 3rd die space described raw materials melt is shaped to the outer wall of container body, wherein, described RF identification chip is attached on the first surface of outer wall of described container body;
Described the first former and first formpiston of closure are opened;
Wherein, the outer wall of described container body is placed on described the first former, and the second surface of the outer wall of described container body contacts with described the first former;
Close the second formpiston to form the 4th die space on outer wall the first former that is placed with described container body;
To be injected into for the raw materials melt of the container body of moulding plastics packing container among described the 4th die space to mold the container body of plastic packaging containers, wherein, described RF identification chip is wrapped among the wall section of container body of described plastic packaging containers.
Optionally, the described whose surfaces that RF identification chip is put into the first formpiston is specially: utilize mechanical hand RF identification chip to be put into the whose surfaces of the first formpiston.
On the other hand, the embodiment of the present invention also provides a kind of plastic packaging containers, can comprise:
Container body and RF identification chip;
Wherein, described RF identification chip comprises substrate layer, antenna component layer and coating layer successively, described antenna component layer be included in printing conductive inks on described substrate layer and the antenna pattern that forms, and with the IC chip of the corresponding electrical connection of described antenna pattern;
Wherein, described container body and described RF identification chip are one-body molded by injection moulding or blowing;
Within described RF identification chip is coated on the wall section of described container body.
Optionally, within described RF identification chip is coated on the bottom wall part of described container body.
Optionally, within described RF identification chip is coated on the side wall portion of described container body.
Optionally, the moulding material of described container body comprises at least a of following material:
Polyethylene, polypropylene, PETG, acrylonitrile-butadiene-styrene copolymer and acrylonitritrile-styrene resin.
Optionally, the material of the substrate layer of described RF identification chip and/or coating layer comprises at least a of following material:
Polyethylene, polypropylene, PETG, acrylonitrile-butadiene-styrene copolymer and acrylonitritrile-styrene resin.
Optionally, the material of the substrate layer of described RF identification chip and coating layer is identical;
The moulding material of described container body is identical with the material of described substrate layer.
Therefore, in a kind of plastic packaging containers production program that the embodiment of the present invention provides, RF identification chip is put into the mold cavity surface of the first former; Wherein, RF identification chip comprises substrate layer, antenna component layer and coating layer successively, and the antenna component layer is included in printing conductive inks on substrate layer and the antenna pattern that forms, and the IC chip that is electrically connected to antenna pattern; With the first formpiston and the first former closure to form the first die space; To be injected into for the raw materials melt of moulding plastics packing container the first die space raw materials melt is shaped to the inwall of container body, RF identification chip is attached to the first surface of the inwall of container body; The first formpiston and first former of closure are opened, and wherein, the inwall of container body is placed on the first formpiston, and the second surface of the inwall of container body contacts with the first formpiston; Close the second former to form the second die space on inwall the first formpiston that is placed with container body; To be injected into for the raw materials melt of moulding plastics packing container the second die space to mold plastic packaging containers, wherein, RF identification chip is wrapped among the wall section of container body of plastic packaging containers, among wall section due to the container body that RF identification chip is wrapped in plastic packaging containers, make RF identification chip be difficult for destroyed and imitated, cause being easy to going to pot so can improve the RF identification chip of existing plastic packaging containers to be affixed on the surface or damage and cause that it can not bring into play should effective problem; And, the RF identification chip of the embodiment of the present invention forms its antenna pattern by printing conductive inks, compare tradition and form the antenna pattern of copper material by etching method or thermoprint method, but the complexity of relative reduce antenna pattern manufacture craft and shorten finished product Production Time, reduce metal consumption, reduce cost of manufacture.
Description of drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or description of the Prior Art, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The schematic diagram of a kind of RF identification chip that Fig. 1-a provides for the embodiment of the present invention;
The cross-sectional view of a kind of RF identification chip that Fig. 1-b provides for the embodiment of the present invention;
The schematic flow sheet of a kind of RFID chip manufacture method that Fig. 2 provides for the embodiment of the present invention;
The schematic diagram of a kind of plastic packaging containers that Fig. 3 provides for the embodiment of the present invention;
The schematic flow sheet of a kind of plastic packaging containers preparation method that Fig. 4 provides for the embodiment of the present invention;
The former schematic diagram of the making plastic packaging containers that Fig. 5-a provides for the embodiment of the present invention;
The closed schematic diagram of the mould of the making plastic packaging containers that Fig. 5-b provides for the embodiment of the present invention;
Fig. 5-c separates schematic diagram for the mould of the making plastic packaging containers that the embodiment of the present invention provides;
The closed schematic diagram of the mould of the making plastic packaging containers that Fig. 5-d provides for the embodiment of the present invention;
A kind of container body schematic diagram that utilizes the plastic packaging containers that mould makes that Fig. 5-e provides for the embodiment of the present invention;
The schematic flow sheet of the another kind of plastic packaging containers preparation method that Fig. 6 provides for the embodiment of the present invention.
The specific embodiment
The embodiment of the present invention provides a kind of plastic packaging containers and plastic packaging containers preparation method, with the RFID chip that improves existing plastic packaging containers be affixed on the surface make easy damaged and cause that it can not bring into play should effective problem.
In order to make those skilled in the art person understand better the present invention program, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills should belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Below be elaborated respectively by specific embodiment.
At first the embodiment of the present invention provides a kind of RF identification chip, can comprise:
Substrate layer, coating layer and the antenna component layer between this substrate layer and coating layer;
Wherein, the antenna component layer comprises:
Printing conductive inks on substrate layer and the antenna pattern that forms and with the IC chip of the corresponding electrical connection of this antenna pattern.
Be illustrated below by the structure of accompanying drawing to above-mentioned RF identification chip.
Please in the lump referring to Fig. 1-a and Fig. 1-b, the cross-sectional view of a kind of RF identification chip that the schematic diagram of a kind of RF identification chip that Fig. 1-a provides for example for the embodiment of the present invention, Fig. 1-b provide for example for the embodiment of the present invention.
As shown in Fig. 1-a and Fig. 1-b, RF identification chip 20 can comprise:
Wherein, antenna component layer 22 comprises:
Printing conductive inks on substrate layer 21 and the antenna pattern 221 that forms and with the IC chip 222 of the corresponding electrical connection of this antenna pattern.
Wherein, the substrate layer of RF identification chip 20 can be plastic sheeting; The coating layer of RF identification chip also can be plastic sheeting, and wherein, this plastic film thickness is for example 0.04～0.10 millimeter, certainly also can be made as required other thickness.
For example, the material of the coating layer 23 of RF identification chip 20 and/or substrate layer 21 comprises at least a of following material: polyethylene (PE, polyethylene),
Polypropylene (PP, Polypropylene),
PETG (PET, polyethylene Terephthalate),
Acrylonitrile-butadiene-styrene copolymer (ABS, Acrylonitrile Butadiene Styrene),
Acrylonitritrile-styrene resin (AS, Acrylonitrile Styrene)
Certainly coating layer 23 and/or substrate layer 21 also can be other plastic material.
Optionally, the substrate layer 21 of RF identification chip 20 is identical with the material of coating layer 23.
The electrically conductive ink of different model or component can be cured in different ways.For example can adopt ultraviolet light to come the electrically conductive ink of cured printed to the substrate layer 21, as utilize light intensity to be 90-120mJ/em
2Ultraviolet light shine the electrically conductive ink that is printed onto on substrate layer 21 solidifying this electrically conductive ink, finally form stable antenna pattern 221 on substrate layer 21.
Therefore, in the present embodiment, employing electrically conductive ink print process is made the antenna pattern in RF identification chip, directly that electrically conductive ink is surperficial in substrate layer according to the Antenna Design graphic printing by print process, be conducive to simplify the production technology of RF identification chip, shorten the RF identification chip production time, reduce the production cost, avoid the waste of metal material.
For ease of better implementing the such scheme of the embodiment of the present invention, the below also provides a kind of RF identification chip preparation method for example.
Referring to Fig. 2, the embodiment of the present invention also provides a kind of RF identification chip preparation method, can comprise:
201, choose base material as the substrate layer of RF identification chip;
For instance, can select plastic sheeting as the substrate layer of RF identification chip, wherein, the raw material of substrate layer is for example at least a in PE, PP, PET, ABS and AS.Wherein, if select plastic sheeting as the substrate layer of RF identification chip, plastic film thickness is for example 0.04～0.10 millimeter, certainly also can be made as required other thickness.
202, on substrate layer printing conductive inks to form antenna pattern;
Wherein, antenna pattern forms by printing conductive inks on substrate layer, wherein, for forming antenna pattern for example 3～5 microns of the thickness of the electrically conductive ink of substrate layer printing, certainly in actual applications also can be as required on substrate layer the electrically conductive ink of other thickness of printing to form thicker or thinner antenna pattern.Wherein, electrically conductive ink can be selected model or component according to actual needs, for example can select the UVS4032E printing ink of Henkel.
The electrically conductive ink of different model or component can be cured in different ways.For example can adopt ultraviolet light to come the electrically conductive ink of cured printed to the substrate layer, as utilize light intensity to be 90-120mJ/cm
2Ultraviolet light shine the electrically conductive ink that is printed onto on substrate layer, solidifying this electrically conductive ink, finally form stable antenna pattern on substrate layer.
203, antenna pattern and IC chip are carried out the corresponding antenna component layer that is electrically connected to the formation RF identification chip;
204, on the antenna component layer overlay film to form the coating layer of RF identification chip.
For example, can select plastic sheeting as the coating layer of RF identification chip, wherein, the raw material of coating layer is for example at least a in PE, PP, PET, ABS and AS.Wherein, if select plastic sheeting as the coating layer of RF identification chip, plastic film thickness for example also can be 0.04～0.10 millimeter, certainly also can be made as required other thickness.Wherein, the hot pressing temperature in the overlay film process can be consistent with the forming temperature of thin-film material, for example, supposes that thin-film material selects PE, can adopt the forming temperature hot pressing of PE to form coating layer.
Wherein, substrate layer and coating layer can be selected same material.
Need to prove, in order to improve the adhesion between container body and RF identification chip, the material of substrate layer and coating layer can be implanted or the material of container body of pasting the plastic packaging containers of RF identification chip is determined and is consistent according to need.For example, all can select PE, PP, PET, ABS or AS etc.
In actual production process, the a collection of a plurality of RF identification chips that connect together of having produced of possibility, if produce a plurality of RF identification chips that connect together, these a plurality of RF identification chip finished products can be cut into one by one independent RF identification chip finished product, make in each independent RF identification chip finished product to comprise an antenna pattern and IC chip, namely make single RF identification chip.
Therefore, the present embodiment employing electrically conductive ink print process is made the antenna pattern in RF identification chip, directly that electrically conductive ink is surperficial in substrate layer according to the Antenna Design graphic printing by print process, be conducive to simplify the production technology of RF identification chip, shorten the RF identification chip production time, reduce the production cost, avoid the waste of metal material.
Be appreciated that, can sell separately based on the RF identification chip that the above embodiment of the present invention is made, also it can be set in other products and sell in the lump, for example can be built in it in plastic packaging containers or be pasted on the plastic packaging containers surface, in order to it is sold in the lump together with plastic packaging containers.
Please in the lump referring to Fig. 3, Fig. 1-a and Fig. 1-b, wherein, the schematic diagram of a kind of plastic packaging containers that Fig. 3 provides for example for the embodiment of the present invention, the cross-sectional view of a kind of RF identification chip that the schematic diagram of a kind of RF identification chip that Fig. 1-a provides for example for the embodiment of the present invention, Fig. 1-b provide for example for the embodiment of the present invention.
As shown in Figure 3, a kind of plastic packaging containers of providing of the embodiment of the present invention can comprise:
Wherein, container body 10 and RF identification chip 20 are one-body molded by injection moulding or blowing;
Within RF identification chip 20 is coated on the wall section of container body 10.
Wherein, the peristome of container body 10 is relative with bottom wall part, within RF identification chip 20 can be coated on the bottom wall part of container body 10, within RF identification chip 20 also can be coated on the side wall portion of container body 10.Be coated within the side wall portion of container body 10 as example take RF identification chip 20 in Fig. 3.
As shown in Fig. 1-a and Fig. 1-b, RF identification chip 20 can comprise successively:
Be appreciated that, RF identification chip in the present embodiment plastic packaging containers forms its antenna pattern 221 by printing conductive inks, compare tradition and form the copper antenna pattern of RF identification chip by etching method or thermoprint method, can reduce the complexity of antenna pattern manufacture craft and shorten finished product Production Time, reduce metal consumption, reduce cost of manufacture.
Wherein, the moulding material of container body 10 can comprise at least a of following material:
Polyethylene (PE, polyethylene),
Polypropylene (PP, Polypropylene),
PETG (PET, polyethylene Terephthalate),
Acrylonitrile-butadiene-styrene copolymer (ABS, Acrylonitrile Butadiene Styrene),
Acrylonitritrile-styrene resin (AS, Acrylonitrile Styrene).
Wherein, the material of substrate layer 21 and/or coating layer 23 can comprise at least a of following material:
PE, PP, PET, ABS and AS.
Certainly, the material of the moulding material of container body 10, substrate layer 21, coating layer 23 also can be selected other plastic material, does not limit herein.
In addition, in order to improve the adhesion between container body 10 and RF identification chip 20, the moulding material of container body 10 and substrate layer 21 and coating layer 23 can be selected same material, for example, all can select PE, PP or PET, ABS or AS etc.
Therefore the plastic packaging containers that the embodiment of the present invention provides comprises container body and RF identification chip; Wherein, RF identification chip comprises substrate layer, antenna component layer and coating layer successively, and the antenna component layer is included in printing conductive inks on described substrate layer and the antenna pattern that forms, and the IC chip of electrical connection corresponding to antenna pattern; Container body and RF identification chip are one-body molded by injection moulding or blowing; Within RF identification chip is coated on the wall section of container body, among wall section due to the container body that RF identification chip is wrapped in plastic packaging containers, make RF identification chip be difficult for destroyed and imitated, cause being easy to going to pot so can improve the RF identification chip of existing plastic packaging containers to be affixed on the surface or damage and cause that it can not bring into play should effective problem; And, the RF identification chip of the embodiment of the present invention forms its antenna pattern by printing conductive inks, compare tradition and form the antenna pattern of copper material by etching method or thermoprint method, but the complexity of relative reduce antenna pattern manufacture craft and shorten finished product Production Time, reduce metal consumption, reduce cost of manufacture
For ease of better implementing the such scheme of the embodiment of the present invention, the below also provides several plastic packaging containers preparation methods.
Referring to Fig. 4, a kind of plastic packaging containers preparation method that the embodiment of the present invention provides comprises:
401, RF identification chip is put into the mold cavity surface of the first former;
For example shown in Fig. 5-a, RF identification chip 20 is placed into the mold cavity surface of the first former 31.
For example can utilize mechanical hand RF identification chip 20 to be put into the mold cavity surface of the first former 31.
Wherein, RF identification chip 20 comprises substrate layer, antenna component layer and coating layer successively, and the antenna component layer is included in printing conductive inks on substrate layer and the antenna pattern that forms, and the IC chip that is electrically connected to this antenna pattern.
402, with the first formpiston and the first former closure to form the first die space;
As shown in Fig. 5-b, the first formpiston 32 and the first former 31 closures are to form the first die space 33, the first die spaces 33 in order to the inwall of the container body of moulding plastics packing container.
403, will be injected into for the raw materials melt of the container body of moulding plastics packing container the first die space take with the inwall of this material forming as container body;
Wherein, RF identification chip is attached to the first surface of the inwall of this container body;
For example shown in Fig. 5-c, in the first die space 33, the raw material (for example PE, PP, PET, ABS and AS's is at least a) that is used for the container body of moulding plastics packing container is formed as the inwall 34 of container body, and RF identification chip 20 is attached to the first surface of the inwall 34 of this container body.In addition, in order to improve the adhesion between container body and RF identification chip, the moulding material of the container body of plastic packaging containers, the substrate layer of RF identification chip and coating layer can be selected same material, such as all selecting PE, PP, PET or ABS or AS etc.
404, the first formpiston and first former of closure are opened;
Wherein, the inwall of container body is placed on the first formpiston, and the second surface of the inwall of container body contacts with the first formpiston;
First formpiston that for example will be placed with the inwall of container body is transferred to another shaping station, with the outer wall at the container body of this another shaping station moulding plastics packing container.
405, close the second former to form the second die space on the first formpiston of the inwall that is placed with container body;
As shown in Fig. 5-d, the first formpiston 32 and the second former 35 closures are to form the second die space 36, the second die spaces 36 in order to the outer wall of moulding plastics packing container.
406, will be injected into for the raw materials melt of the container body of moulding plastics packing container the second die space molding the container body outer wall of plastic packaging containers, the inwall that the outer wall parcel has been stained with RF identification chip namely forms the container body of complete plastic packaging containers;
Wherein, RF identification chip is wrapped among the wall section of container body of plastic packaging containers.
For example shown in Fig. 5-e, the first formpiston 32 and second former 35 die sinkings and the demoulding finally make the container body of the plastic packaging containers that has comprised RF identification chip 20, and RF identification chip 20 is wrapped among the wall section of container body 10 of plastic packaging containers.
Therefore, in the plastic packaging containers preparation method that the present embodiment provides, RF identification chip is put into the mold cavity surface of the first former; Wherein, RF identification chip comprises substrate layer, antenna component layer and coating layer successively, and the antenna component layer is included in printing conductive inks on substrate layer and the antenna pattern that forms, and the IC chip that is electrically connected to antenna pattern; With the first formpiston and the first former closure to form the first die space; To be injected into for the raw materials melt of the container body of moulding plastics packing container the first die space take with the inwall of material forming as container body, RF identification chip is attached to the first surface of the inwall of container body; The first formpiston and first former of closure are opened, and wherein, the inwall of container body is placed on the first formpiston, and the second surface of the inwall of container body contacts with the first formpiston; Close the second former to form the second die space on inwall the first formpiston that is placed with container body; To be injected into the second die space to mold plastic packaging containers for the raw materials melt of the container body of moulding plastics packing container, wherein, RF identification chip is wrapped among the wall section of container body of plastic packaging containers, among wall section due to the container body that RF identification chip is wrapped in plastic packaging containers, make RF identification chip be difficult for destroyed and imitated, cause being easy to going to pot so can improve the RF identification chip of existing plastic packaging containers to be affixed on the surface or damage and cause that it can not bring into play should effective problem; And, the RF identification chip of the embodiment of the present invention forms its antenna pattern by printing conductive inks, compare tradition and form the antenna pattern of copper material by etching method or thermoprint method, but the complexity of relative reduce antenna pattern manufacture craft and shorten finished product Production Time, reduce metal consumption, reduce cost of manufacture.
Also provide another kind of plastic packaging containers preparation method referring to Fig. 6, the embodiment of the present invention, can comprise:
601, RF identification chip is put into the whose surfaces of the first formpiston;
Wherein, for example can utilize mechanical hand RF identification chip to be put into the whose surfaces of the first formpiston.
Wherein, RF identification chip comprises substrate layer, antenna component layer and coating layer successively, and the antenna component layer is included in printing conductive inks on substrate layer and the antenna pattern that forms, and the IC chip that is electrically connected to this antenna pattern;
602, with the first former and the first formpiston closure to form the 3rd die space;
Wherein, the 3rd die space is in order to the outer wall of the container body of moulding plastics packing container.
603, will be injected into for the raw materials melt of the container body of moulding plastics packing container the 3rd die space take with the outer wall of material forming as container body;
Wherein, RF identification chip is attached to the first surface of the outer wall of container body;
604, the first former and first formpiston of closure are opened;
Wherein, the outer wall of container body is placed on the first former, and the second surface of the outer wall of container body contacts with the first former;
605, close the second formpiston to form the 4th die space on the first former of the outer wall that is placed with container body;
Wherein, the 4th die space is in order to the inwall of the container body of moulding plastics packing container.
606, will be injected into for the raw materials melt of the container body of moulding plastics packing container the 4th die space with the inwall of the container body that molds plastic packaging containers, and the bonding outer wall that has been stained with RF identification chip of inwall namely forms the container body of complete plastic packaging containers;
Wherein, RF identification chip is wrapped among the wall section of container body of plastic packaging containers.
Therefore, in the plastic packaging containers production program that the present embodiment provides, RF identification chip is put into the whose surfaces of the first formpiston; Wherein, RF identification chip comprises substrate layer, antenna component layer and coating layer successively, and the antenna component layer is included in printing conductive inks on substrate layer and the antenna pattern that forms, and the IC chip that is electrically connected to this antenna pattern; With the first former and the first formpiston closure to form the 3rd die space; Wherein, the 3rd die space is in order to the outer wall of moulding plastics packing container, to be injected into for the raw materials melt of the container body of moulding plastics packing container the 3rd die space take with the outer wall of material forming as container body, RF identification chip is attached to the first surface of the outer wall of container body; The first former and first formpiston of closure are opened; Wherein, the outer wall of container body is placed on the first former, and the second surface of the outer wall of container body contacts with the first former; Close the second formpiston to form the 4th die space on the first former of the outer wall that is placed with container body; To be injected into the 4th die space to mold plastic packaging containers for the raw materials melt of the container body of moulding plastics packing container; Wherein, RF identification chip is wrapped among the wall section of container body of plastic packaging containers, among wall section due to the container body that RF identification chip is wrapped in plastic packaging containers, make RF identification chip be difficult for destroyed and imitated, cause being easy to going to pot so can improve the RF identification chip of existing plastic packaging containers to be affixed on the surface or damage and cause that it can not bring into play should effective problem; And, RF identification chip in the present embodiment forms its antenna pattern by printing conductive inks, compare tradition and form the antenna pattern of copper material by etching method or thermoprint method, but the complexity of relative reduce antenna pattern manufacture craft and shorten finished product Production Time, reduce metal consumption, reduce cost of manufacture.
Above a kind of plastic packaging containers preparation method and the plastic packaging containers that the embodiment of the present invention is provided is described in detail, used specific case herein principle of the present invention and embodiment are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. a plastic packaging containers preparation method, is characterized in that, comprising:
RF identification chip is put into the mold cavity surface of the first former;
Wherein, described RF identification chip comprises substrate layer, antenna component layer and coating layer successively, and described antenna component layer is included in printing conductive inks on described substrate layer and the antenna pattern that forms, and the IC chip that is electrically connected to described antenna pattern;
With the first formpiston and described the first former closure to form the first die space;
To be injected into for the raw materials melt of the container body of moulding plastics packing container among described the first die space described raw materials melt is shaped to the inwall of container body, wherein, described RF identification chip is affixed on the first surface of inwall of described container body;
Described the first formpiston and first former of closure are opened;
Wherein, the inwall of described container body is placed on described the first formpiston, and the second surface of the inwall of described container body contacts with described the first formpiston;
Close the second former to form the second die space on inwall the first formpiston that is placed with described container body;
To be injected into for the raw materials melt of the container body of moulding plastics packing container among described the second die space to mold the container body of plastic packaging containers, wherein, described RF identification chip is wrapped among the wall section of container body of described plastic packaging containers.
2. method according to claim 1, is characterized in that, the described mold cavity surface that RF identification chip is put into the first former is specially: utilize mechanical hand RF identification chip to be put into the mold cavity surface of the first former.
3. a plastic packaging containers preparation method, is characterized in that, comprising:
RF identification chip is put into the whose surfaces of the first formpiston;
Wherein, described RF identification chip comprises substrate layer, antenna component layer and coating layer successively, and described antenna component layer is included in printing conductive inks on described substrate layer and the antenna pattern that forms, and the IC chip that is electrically connected to described antenna pattern;
With the first former and described the first formpiston closure to form the 3rd die space;
To be injected into for the raw materials melt of the container body of moulding plastics packing container among described the 3rd die space described raw materials melt is shaped to the outer wall of container body, wherein, described RF identification chip is attached on the first surface of outer wall of described container body;
Described the first former and first formpiston of closure are opened;
Wherein, the outer wall of described container body is placed on described the first former, and the second surface of the outer wall of described container body contacts with described the first former;
Close the second formpiston to form the 4th die space on outer wall the first former that is placed with described container body;
To be injected into for the raw materials melt of the container body of moulding plastics packing container among described the 4th die space to mold the container body of plastic packaging containers, wherein, described RF identification chip is wrapped among the wall section of container body of described plastic packaging containers.
4. method according to claim 3, is characterized in that, the described whose surfaces that RF identification chip is put into the first formpiston is specially: utilize mechanical hand RF identification chip to be put into the whose surfaces of the first formpiston.
5. a plastic packaging containers, is characterized in that, comprising:
Container body and RF identification chip;
Wherein, described RF identification chip comprises substrate layer, antenna component layer and coating layer successively, described antenna component layer be included in printing conductive inks on described substrate layer and the antenna pattern that forms, and with the IC chip of the corresponding electrical connection of described antenna pattern;
Wherein, described container body and described RF identification chip are one-body molded by injection moulding or blowing;
Within described RF identification chip is coated on the wall section of described container body.
6. plastic packaging containers according to claim 5, is characterized in that,
Within described RF identification chip is coated on the bottom wall part of described container body.
7. plastic packaging containers according to claim 5, is characterized in that,
Within described RF identification chip is coated on the side wall portion of described container body.
8. the described plastic packaging containers of according to claim 5 to 7 any one, is characterized in that,
The moulding material of described container body comprises at least a of following material:
Polyethylene, polypropylene, PETG, acrylonitrile-butadiene-styrene copolymer and acrylonitritrile-styrene resin.
9. the described plastic packaging containers of according to claim 5 to 7 any one, is characterized in that,
The substrate layer of described RF identification chip and/or the material of coating layer comprise at least a of following material:
Polyethylene, polypropylene, PETG, acrylonitrile-butadiene-styrene copolymer and acrylonitritrile-styrene resin.
10. the described plastic packaging containers of according to claim 5 to 7 any one, is characterized in that,
The substrate layer of described RF identification chip is identical with the material of coating layer;
The moulding material of described container body is identical with the material of described substrate layer.
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| CN201110458375.9A CN103381637B (en) | 2011-12-31 | 2011-12-31 | Plastic packaging containers and plastic packaging containers preparation method |
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| CN103381637B (en) | 2015-11-25 |
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Address after: No. 1001, Longgang Avenue, Longgang District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Lihe Technology Innovation Co.,Ltd. Address before: 518000 north of the fourth floor, building 1, Huada paper factory, Meilong Road, Futian District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BEAUTY STAR Co.,Ltd. |