CN103413887A - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
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- CN103413887A CN103413887A CN2013103664476A CN201310366447A CN103413887A CN 103413887 A CN103413887 A CN 103413887A CN 2013103664476 A CN2013103664476 A CN 2013103664476A CN 201310366447 A CN201310366447 A CN 201310366447A CN 103413887 A CN103413887 A CN 103413887A
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Abstract
The invention relates to the technical field of LED lamp chip packaging, in particular to an LED packaging structure. The LED packaging structure comprises a support single body and an LED chip arranged on the support single body, and further comprises an optical lens covering the LED chip, wherein the support single body comprises a colloid support and a metal support, the metal support comprises a radiating functive formed by folding of a metal sheet and an electrode pin stretching out of the metal sheet, one side of the radiating functive is provided with a LED chip installation base provided with a mirror surface, and the other side of the radiating functive is a cooling fin formed by folding of the metal sheet; the colloid support surrounds the LED chip installation base and the cooling fin, and the electrode pin penetrates through the colloid support to stretch outwards. The LED packaging structure not only is good in light emitting effect, but also is simple in structure and good in radiating function.
Description
Technical field
The present invention relates to LED lamp chip encapsulation technology field, be specifically related to a kind of LED encapsulating structure.
Background technology
Light-emitting diode (Light Emitting Diode, LED) be a kind of can by electric energy conversion, be the solid-state semiconductor device of visible light, it is widely used in the fields such as display screen, traffic signals, display light source, automobile lamp, LED-backlit source, lighting source, and the LED semiconductor lighting has the distinguishing features such as long, energy-conservation, environmental protection of life-span, rich color, microminiaturization.
The LED encapsulating structure is generally that LED chip is installed on to the encapsulating structure on single support, and the heat radiation of such LED encapsulating structure normally arranges the radiating copper post on single support, and this structure assembling is comparatively complicated, the labor intensive material resources, and also radiating effect is poor; In addition; existing LED encapsulating structure is in order to realize the even reflection of light efficiency; usually reflector can be set on single support; so that the light efficiency of LED chip can be uniformly distributed; such structure is comparatively complicated, and comparatively inconvenience is installed also, can waste a large amount of manpower and materials in production process; production efficiency is lower, and cost is higher.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, a kind of LED encapsulating structure simple in structure, easy to make is provided.This LED encapsulating structure radiating effect is better, light efficiency distributes comparatively even.
A kind of LED encapsulating structure, comprise single support and be arranged at the LED chip on single support, also comprise the optical lens covered on LED chip, described single support comprises colloid support and metallic support, described metallic support comprises heat sinking function body and the extended electrode leg of sheet metal be folded to form by a sheet metal, one side of heat sinking function body is provided with the LED chip mount pad of minute surface, and the opposite side of heat sinking function body is the folding fin formed of sheet metal; Described colloid support surrounds LED chip mount pad and fin, and it is protruding that described electrode leg penetrates the colloid support.
Wherein, described optical lens is silica-gel lens.
Wherein, described optical lens is hemisphere or cylindrical.
Wherein, the surface of described LED chip mount pad is coated with the plating silver layer of minute surface.
Wherein, described metallic support is provided with weld zone, and described weld zone is surrounded by the colloid support.
Wherein, described weld zone is provided with the conductive layer through the turmeric PROCESS FOR TREATMENT.
Wherein, described weld zone comprises anodal weld zone, negative pole weld zone and weldering second class protection area under control.
Wherein, the fin of described heat sinking function body is double-layer structure.
Wherein, the fin of described heat sinking function body is three-decker.
Wherein, described fin is provided with a plurality of louvres.
Beneficial effect of the present invention: be covered with optical lens on LED chip of the present invention, can adjust the rising angle of this LED encapsulating structure, enlarged its light-emitting area, thereby improved display quality, strengthened viewing effect; The LED chip mount pad is arranged to minute surface, has the effect of reflector, and it is comparatively even that the minute surface mount pad makes light efficiency distribute, LED chip bright dipping better effects if; In addition, fin and single support are structure as a whole, and on the basis that guarantees radiating effect, have reduced the operation that the radiating copper post is installed, and have improved production efficiency, have reduced production cost.
The accompanying drawing explanation
Fig. 1 is the schematic diagram of LED encapsulating structure of the present invention.
Fig. 2 be Fig. 1 A-A to cross-sectional view.
Fig. 3 is the reverse side structural representation of Fig. 1.
Fig. 4 is the structural representation of the sheet metal of making metallic support of the present invention.
1-single support; 2-LED chip;
3-optical lens; 11-electrode leg;
12-LED chip mount pad; 13-fin;
14-colloid support; 15-anodal weld zone;
16-negative pole weld zone; 17-weldering second class protection area under control;
18-louvre.
Embodiment
The present invention is further illustrated below in conjunction with embodiment.
Referring to Fig. 1 to Fig. 4, a kind of LED encapsulating structure, comprise single support 1 and be arranged at the LED chip 2 on single support 1, also comprise the optical lens 3 covered on LED chip 2, described single support 1 comprises colloid support 14 and metallic support, described metallic support comprises heat sinking function body and the extended electrode leg 11 of sheet metal be folded to form by a sheet metal, one side of heat sinking function body is provided with the LED chip mount pad 12 of minute surface, and the opposite side of heat sinking function body is the folding fin 13 formed of sheet metal; Described colloid support 14 surrounds LED chip mount pad 12 and fin 13, and it is protruding that described electrode leg 11 penetrates colloid support 14.
On the LED chip 2 of this LED encapsulating structure, be covered with optical lens 3, can adjust the rising angle of this LED encapsulating structure, enlarged its light-emitting area, thereby improved display quality, strengthened viewing effect; LED chip mount pad 12 is arranged to minute surface, has the effect of reflector, and it is comparatively even that the minute surface mount pad makes light efficiency distribute, LED chip 2 bright dipping better effects if; In addition, fin 13 is structure as a whole with single support 1, on the basis that guarantees radiating effect, has reduced the operation that the radiating copper post is installed, and has improved production efficiency, has reduced production cost.
Wherein, described optical lens 3 is silica-gel lens.Can certainly adopt the lens of other transparent materials as optical lens 3.
Wherein, described optical lens 3 is hemisphere or cylindrical.
Wherein, the surface of described LED chip mount pad 12 is coated with the plating silver layer of minute surface.Electroplate silver layer and can play the effect of reflection ray on the one hand, can also prevent oxidation on the other hand, guarantee the safety of circuit.
Wherein, described metallic support is provided with weld zone, and described weld zone is surrounded by colloid support 14.
Wherein, described weld zone is provided with the conductive layer through the turmeric PROCESS FOR TREATMENT.The conductive layer of crossing through the turmeric PROCESS FOR TREATMENT can effectively prevent corrosion, and conductivity is better, and stability is stronger.
Wherein, described weld zone comprises anodal weld zone 15, negative pole weld zone 16 and weldering second class protection area under control 17.According to the packaging technology of different LED chip 2 or the difference of chip functions, the anode connection terminal of electrode leg 11 or negative pole link can be communicated with weldering second class protection area under control 17, realize the protection to LED chip 2.
Wherein, the fin 13 of described heat sinking function body is double-layer structure or three-decker.The fin 13 of double-layer structure is folding simple, but heat radiation is poor with respect to three-decker; And fin 13 radiating effects of three-decker are better, the useful life of LED chip 2 is longer.
Wherein, described fin 13 is provided with a plurality of louvres 18.Louvre 18 can accelerate the heat radiation of LED chip 2, and radiating effect is better.
It is better that LED encapsulating structure of the present invention not only goes out light effect, and simple in structure, heat sinking function is better.
Above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although with reference to preferred embodiment, the present invention has been done to explain; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement technical scheme of the present invention, and not break away from essence and the scope of technical solution of the present invention.
Claims (10)
1. LED encapsulating structure, comprise single support and be arranged at the LED chip on single support, it is characterized in that: also comprise the optical lens covered on LED chip, described single support comprises colloid support and metallic support, described metallic support comprises heat sinking function body and the extended electrode leg of sheet metal be folded to form by a sheet metal, one side of heat sinking function body is provided with the LED chip mount pad of minute surface, and the opposite side of heat sinking function body is the folding fin formed of sheet metal; Described colloid support surrounds LED chip mount pad and fin, and it is protruding that described electrode leg penetrates the colloid support.
2. a kind of LED encapsulating structure according to claim 1, it is characterized in that: described optical lens is silica-gel lens.
3. a kind of LED encapsulating structure according to claim 1, it is characterized in that: described optical lens is hemisphere or cylindrical.
4. a kind of LED encapsulating structure according to claim 1, it is characterized in that: the surface of described LED chip mount pad is coated with the plating silver layer of minute surface.
5. a kind of LED encapsulating structure according to claim 1, it is characterized in that: described metallic support is provided with weld zone, and described weld zone is surrounded by the colloid support.
6. a kind of LED encapsulating structure according to claim 5, it is characterized in that: described weld zone is provided with the conductive layer through the turmeric PROCESS FOR TREATMENT.
7. a kind of LED encapsulating structure according to claim 6 is characterized in that: described weld zone comprises anodal weld zone, negative pole weld zone and weldering second class protection area under control.
8. a kind of LED encapsulating structure according to claim 1, it is characterized in that: the fin of described heat sinking function body is double-layer structure.
9. a kind of LED encapsulating structure according to claim 1, it is characterized in that: the fin of described heat sinking function body is three-decker.
10. according to the described a kind of LED encapsulating structure of claim 1 to 9 any one, it is characterized in that: described fin is provided with a plurality of louvres.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103664476A CN103413887A (en) | 2013-08-21 | 2013-08-21 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103664476A CN103413887A (en) | 2013-08-21 | 2013-08-21 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103413887A true CN103413887A (en) | 2013-11-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103664476A Pending CN103413887A (en) | 2013-08-21 | 2013-08-21 | LED packaging structure |
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| Country | Link |
|---|---|
| CN (1) | CN103413887A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020163001A1 (en) * | 2001-05-04 | 2002-11-07 | Shaddock David Mulford | Surface mount light emitting device package and fabrication method |
| CN102157508A (en) * | 2011-01-26 | 2011-08-17 | 北京易光天元半导体照明科技有限公司 | Novel LED packaging light-reflecting method and device |
| CN201975391U (en) * | 2011-01-26 | 2011-09-14 | 永兴(漳州)电子科技有限公司 | LED lamp bulb with radiating holes and double lamp cups |
| CN202019000U (en) * | 2011-05-10 | 2011-10-26 | 吕能兵 | High-power LED bracket |
| CN202056570U (en) * | 2011-01-20 | 2011-11-30 | 木林森股份有限公司 | Surface-mounted LED (light-emitting diode) with lens |
-
2013
- 2013-08-21 CN CN2013103664476A patent/CN103413887A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020163001A1 (en) * | 2001-05-04 | 2002-11-07 | Shaddock David Mulford | Surface mount light emitting device package and fabrication method |
| CN202056570U (en) * | 2011-01-20 | 2011-11-30 | 木林森股份有限公司 | Surface-mounted LED (light-emitting diode) with lens |
| CN102157508A (en) * | 2011-01-26 | 2011-08-17 | 北京易光天元半导体照明科技有限公司 | Novel LED packaging light-reflecting method and device |
| CN201975391U (en) * | 2011-01-26 | 2011-09-14 | 永兴(漳州)电子科技有限公司 | LED lamp bulb with radiating holes and double lamp cups |
| CN202019000U (en) * | 2011-05-10 | 2011-10-26 | 吕能兵 | High-power LED bracket |
Non-Patent Citations (1)
| Title |
|---|
| 周志敏，纪爱华: "《漫步LED世界（驱动电路设计篇）》", 31 January 2013, article "《漫步LED世界（驱动电路设计篇）》", pages: 55 * |
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Application publication date: 20131127 |