CN103425066B - A kind of batch wafer operation DPS and disposal route thereof - Google Patents
A kind of batch wafer operation DPS and disposal route thereof Download PDFInfo
- Publication number
- CN103425066B CN103425066B CN201310333580.1A CN201310333580A CN103425066B CN 103425066 B CN103425066 B CN 103425066B CN 201310333580 A CN201310333580 A CN 201310333580A CN 103425066 B CN103425066 B CN 103425066B
- Authority
- CN
- China
- Prior art keywords
- batch jobs
- batch
- sets
- wafers
- jobs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention discloses a kind of batch wafer operation DPS, comprising: module is set up in batch jobs, and sets of wafers collection modules, batch jobs dynamically update module, batch jobs condition judgment module, and job result feedback module.The invention also discloses a kind of batch wafer operation method for dynamically processing, comprise the steps: to set up this batch jobs; By the sets of wafers set of these batch jobs described; Judge the described sets of wafers set completion status of these batch jobs and the completion status of previous batch jobs; Dynamically update these batch jobs described, until described previous batch jobs complete; Feed back the job result of described previous batch jobs, make these batch jobs described start or cancel.Can the present invention start the FEEDBACK CONTROL of operation to these batch jobs by the job result of the change of the sets of wafers dynamic of batch jobs and previous batch jobs, realize the production efficiency of batch jobs equipment and the maximization of yield.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, particularly relate to semiconductor manufacturing executive system (MES, and equipment automatization system (EAP ManufacturingExecutionSystem), EquipmentAutomationProcess), specifically a kind of batch wafer operation DPS and disposal route thereof.
Background technology
Current semiconductor chip fabrication technological process becomes increasingly complex various, and the production cycle is also more and more longer, and the activity duration needed for the batch jobs operation websites such as boiler tube is particularly outstanding compared with other technique websites.The equipment such as boiler tube have the longer activity duration, with batch(batch jobs, namely in batch jobs equipment sites, there is identical operating condition, can the lot(sets of wafers of simultaneously operation together, namely have the set of the wafer of same process flow, maximum 25) set) carry out the feature of operation, before batch operation for unit, need the relation (namely createbatch sets up batch jobs) creating batch and lot in MES in advance.
Chinese patent (publication number: CN102768941A) discloses the method and apparatus that a kind of batch processing board sends goods, the method performs the current formulation parameter of the formulation parameter of operation and the pending wafer set of this batch processing board by more each wafer set in batch processing board, the current process of priority processing formulation parameter same wafer group, goods is sent to batch processing board, batch processing board is obtained as early as possible can the wafer set of batch processing together with pending wafer set, thus decrease the stand-by period of sending goods, ensure correctness and the dirigibility of sending goods, avoid goods to be sent to make batch processing board cannot carry out the problem of batch processing for the wafer set of batch processing owing to lacking, therefore improve production efficiency and save the cost of semiconductor manufacturing.
Chinese patent (publication number: CN102810457A) discloses a kind of system prompt and stops sheet rule and the method carrying out batch processing, comprises the following steps: to technique all on production line, by stopping, whether sheet rule is identical classifies; By the different classes of reference process plan and can reference process plan of respectively defining, each reference process plan is defined and stops sheet rule; Be optimized GUI Program, after making all techniques after gathering stop sheet rule import system, system energy: (1) provides form, provides the prompting that can stop sheet each batch of future He can not stop sheet; (2) do in the gui when stopping sheet and can provide prompting; (3) sheet can be stopped to doing batch processing at yarn batches in GUI.Can be significantly improved by above method and stop sheet treatment effeciency, promote production capacity, reduce costs, reduce risk of error simultaneously.
Although above-mentioned two patents also disclose the method for batch processing, do not invent for the technique website with the longer activity duration.Due to from createbatch to operation, between may also have the very long stand-by period, during this period of time, may have and have the lot of identical operation condition to arrive this website with current batch, the logic of current MES and EAP can not realize the dynamic change of during this period of time batch member.This reduces the efficiency of batch implement, carry out FEEDBACK CONTROL because can the job result of last batch not start operation to a rear batch in addition.As bad in last batch job result, need to stop this equipment to carry out overhauling or adjusting operating condition, parameter and not stopping, this production efficiency of equipment and yield so then can be caused to reduce.
Summary of the invention
For above-mentioned Problems existing, the present invention discloses a kind of batch wafer operation DPS and disposal route, with overcome batch jobs in prior art sets of wafers cannot dynamic change, last batch jobs cannot feedback result to the problem of later batch amount operation.
To achieve these goals, the present invention adopts following technical scheme:
A kind of batch wafer operation DPS, be applied in semiconductor manufacturing executive system and equipment automatization system, wherein, comprise: module is set up in batch jobs, set up sets of wafers collection modules that module is connected respectively with described batch jobs, batch jobs dynamically update module, the batch jobs condition judgment module be connected with described sets of wafers collection modules, and set up module with described batch jobs respectively, job result feedback module that described batch jobs condition judgment module is connected;
Described batch jobs set up module for setting up this batch jobs;
Described sets of wafers collection modules is for gathering the sets of wafers of these batch jobs described;
Described batch jobs condition judgment module is for the completion status of the sets of wafers set completion status and previous batch jobs that judge these batch jobs;
Described job result feedback module is used for after described previous batch jobs complete, and the job result of described previous batch jobs is fed back to described batch jobs and sets up module, makes these batch jobs described start or cancel;
Described batch jobs dynamically update module for before described previous batch jobs complete, and dynamically update these batch jobs that module establishment is set up in described batch jobs.
Above-mentioned batch wafer operation DPS, wherein, described batch jobs condition judgment module also comprises this batch jobs sets of wafers set completion status and judges that submodule and previous batch jobs completion status judge submodule;
This batch jobs sets of wafers set completion status described judges that submodule is for judging whether the sets of wafers of these batch jobs has been gathered, and if not, then waits for that sets of wafers set completes; If so, then continue to judge that submodule judges by described previous batch jobs completion status;
Described previous batch jobs completion status judges that submodule is for judging whether previous batch jobs complete, and if not, then waits for that previous batch jobs complete; If so, then continue, by described job result feedback module, the job result of described previous batch jobs is fed back to described batch jobs and set up module.
Above-mentioned batch wafer operation DPS, wherein, described job result feedback module the job result of described previous batch jobs is fed back to described batch jobs set up module, if the job result of described previous batch jobs as well time, these batch jobs described start; If when the job result of described previous batch jobs is bad, these batch jobs described are cancelled.
Above-mentioned batch wafer operation DPS, wherein, described batch jobs dynamically update the sets of wafers that the sets of wafers with these batch jobs described has an identical operation condition by module and dynamically update in these batch jobs described.
Above-mentioned batch wafer operation DPS, wherein, the sets of wafers of these batch jobs described is sent to implement by several wafer transfer boxes and carries out sets of wafers set by described sets of wafers collection modules.
A kind of batch wafer operation method for dynamically processing, adopts above-mentioned batch wafer operation DPS, is applied in semiconductor manufacturing executive system and equipment automatization system, wherein, comprises the steps:
Step S1, sets up this batch jobs;
Step S2, by the sets of wafers set of these batch jobs described;
Step S3, judges the described sets of wafers set completion status of these batch jobs and the completion status of previous batch jobs;
Step S4, dynamically updates these batch jobs described, repeats step S2, S3, until described previous batch jobs complete;
Step S5, after described previous batch jobs complete, feeds back the job result of described previous batch jobs, makes these batch jobs described start or cancel.
Above-mentioned batch wafer operation method for dynamically processing, wherein, in described step S3, specifically comprises:
Step S301, judges whether the sets of wafers of these batch jobs has been gathered, and if not, then waits for that sets of wafers set completes; If so, then continue to be judged by next step;
Step S302, judges whether previous batch jobs complete, and if not, then waits for that previous batch jobs complete; If so, the job result of described previous batch jobs is then fed back.
Above-mentioned batch wafer operation method for dynamically processing, wherein, in described step S5, if the job result of described previous batch jobs as well time, these batch jobs described start; If when the job result of described previous batch jobs is bad, these batch jobs described are cancelled.
Above-mentioned batch wafer operation method for dynamically processing, wherein, in described step S4, the sets of wafers sets of wafers with these batch jobs described with identical operation condition dynamically updates in these batch jobs described.
Above-mentioned batch wafer operation method for dynamically processing, wherein, in described step S2, is sent to implement by several wafer transfer boxes by the sets of wafers of these batch jobs described and carries out sets of wafers set.
Tool of the present invention has the following advantages or beneficial effect:
The present invention is applied in the establishment batch jobs design in MES and EAP, the FEEDBACK CONTROL of operation can be started by the job result of the change of the sets of wafers dynamic of batch jobs and previous batch jobs to these batch jobs, realize the production efficiency of batch jobs equipment and the maximization of yield.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, the present invention and feature, profile and advantage will become more apparent.Mark identical in whole accompanying drawing indicates identical part.Proportionally can not draw accompanying drawing, focus on purport of the present invention is shown.
Fig. 1 is the structured flowchart of first embodiment of the invention;
Fig. 2 is the process flow diagram of second embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, the present invention is further illustrated, but not as limiting to the invention.
The first embodiment of the present invention relates to a kind of batch wafer operation DPS, be applied in semiconductor manufacturing executive system and equipment automatization system, see Fig. 1, comprise: module is set up in batch jobs, set up sets of wafers collection modules that module is connected respectively with batch jobs, batch jobs dynamically update module, the batch jobs condition judgment module be connected with sets of wafers collection modules, and set up module with batch jobs respectively, job result feedback module that batch jobs condition judgment module is connected.
Wherein, batch jobs set up module for setting up this batch jobs, and send the data-signal of these batch jobs to batch jobs condition judgment module; Aggregated result signal according to the sets of wafers of these batch jobs of data-signal set received, and is sent to batch jobs condition judgment module by sets of wafers collection modules; Batch jobs condition judgment module judges the sets of wafers set completion status of these batch jobs and the completion status of previous batch jobs according to aggregated result signal, and when the operation of previous batch jobs completes, settling signal is sent to job result feedback module; The job result of previous batch jobs, according to the settling signal received (namely after previous batch jobs complete), is fed back to batch jobs and sets up module, make these batch jobs start or cancel by job result feedback module; Batch jobs dynamically update module (namely before previous batch jobs complete) before settling signal is sent to job result feedback module by batch jobs condition judgment module, dynamically update these batch jobs that module establishment is set up in batch jobs.
In the present embodiment, batch jobs condition judgment module also comprises this batch jobs sets of wafers set completion status and judges that submodule and previous batch jobs completion status judge submodule; This batch jobs sets of wafers set completion status judges that submodule is for judging whether the sets of wafers of these batch jobs has been gathered, and if not, then wait for that sets of wafers set completes, after sets of wafers set completes, this judged result is "Yes"; If so, then continue to judge that submodule judges by previous batch jobs completion status; Previous batch jobs completion status judges that submodule is for judging whether previous batch jobs complete, and if not, then wait for that previous batch jobs complete, after previous batch ancestors' meritorious achievements complete, this judged result is "Yes"; If so, then continue, by job result feedback module, the job result of previous batch jobs is fed back to batch jobs and set up module.
In the present embodiment, job result feedback module the job result of previous batch jobs is fed back to batch jobs set up module, if the job result of previous batch jobs as well time, these batch jobs start; If when the job result of previous batch jobs is bad, these batch jobs are cancelled, need to stop this implement to carry out overhauling or adjust operating condition, parameter, do the production efficiency and yield that can improve implement like this.And batch jobs dynamically update the sets of wafers that the sets of wafers with these batch jobs has an identical operation condition by module dynamically updates in these batch jobs, can according to the sets of wafers of these batch jobs of actual conditions dynamic conditioning in stand-by period like this before previous batch jobs complete, implement will be utilized better, improve operating efficiency.
In addition, the sets of wafers of these batch jobs is sent to implement is carried out sets of wafers set by several wafer transfer box (FOUP, FrontOpeningUnifiedPod) by sets of wafers collection modules.
The second embodiment of the present invention relates to a kind of batch wafer operation method for dynamically processing, based on above-mentioned first embodiment, see Fig. 2, comprises the steps:
Step S1, sets up this batch jobs.
Step S2, by the sets of wafers set of these batch jobs, is sent to implement by several wafer transfer boxes by the sets of wafers of these batch jobs and carries out sets of wafers set.
Step S3, judges the sets of wafers set completion status of these batch jobs and the completion status of previous batch jobs, is specially:
Step S301, judges whether the sets of wafers of these batch jobs has been gathered, and if not, then waits for that sets of wafers set completes; If so, then continue to be judged by next step;
Step S302, judges whether previous batch jobs complete, and if not, then waits for that previous batch jobs complete; If so, the job result of previous batch jobs is then fed back.
Step S4, dynamically updates this batch jobs, and the sets of wafers sets of wafers with these batch jobs with identical operation condition dynamically updates in these batch jobs, repeats step S2, S3, until previous batch jobs complete; Wherein, before previous batch jobs complete, the sets of wafers of these batch jobs can be dynamically updated at any time.
Step S5, after previous batch jobs complete, feeds back the job result of previous batch jobs, makes these batch jobs start or cancel; Wherein, if the job result of previous batch jobs as well time, these batch jobs start; If when the job result of previous batch jobs is bad, these batch jobs are cancelled.
Be not difficult to find, the present embodiment is embodiment of the method corresponding to those in the first embodiment, and the present embodiment can be worked in coordination with the first embodiment and be implemented.The relevant technical details mentioned in first embodiment is still effective in the present embodiment, in order to reduce repetition, repeats no more here.Correspondingly, the relevant technical details mentioned in the present embodiment also can be applicable in the first embodiment.
It is worth mentioning that, each module involved in the present embodiment is logic module, and in actual applications, a logical block can be a physical location, also can be a part for a physical location, can also realize with the combination of multiple physical location.In addition, in order to outstanding innovative part of the present invention, the unit not too close with solving technical matters relation proposed by the invention is not introduced in the present embodiment, but this does not show the unit that there is not other in the present embodiment.
It should be appreciated by those skilled in the art that those skilled in the art can realize described change case in conjunction with prior art and above-described embodiment, such change case does not affect flesh and blood of the present invention, does not repeat them here.
Above preferred embodiment of the present invention is described.It is to be appreciated that the present invention is not limited to above-mentioned particular implementation, the equipment wherein do not described in detail to the greatest extent and structure are construed as to be implemented with the common mode in this area; Any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the Method and Technology content of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or being revised as the Equivalent embodiments of equivalent variations, this does not affect flesh and blood of the present invention.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (10)
1. a batch wafer operation DPS, be applied in semiconductor manufacturing executive system and equipment automatization system, it is characterized in that, comprise: module is set up in batch jobs, set up sets of wafers collection modules that module is connected respectively with described batch jobs, batch jobs dynamically update module, the batch jobs condition judgment module be connected with described sets of wafers collection modules, and set up module with described batch jobs respectively, job result feedback module that described batch jobs condition judgment module is connected;
Described batch jobs set up module for setting up this batch jobs;
Described sets of wafers collection modules is for gathering the sets of wafers of these batch jobs described;
Described batch jobs condition judgment module is for the completion status of the sets of wafers set completion status and previous batch jobs that judge these batch jobs;
Described job result feedback module is used for after described previous batch jobs complete, and the job result of described previous batch jobs is fed back to described batch jobs and sets up module, makes these batch jobs described start or cancel;
Described batch jobs dynamically update module for before described previous batch jobs complete, and dynamically update these batch jobs that module establishment is set up in described batch jobs.
2. batch wafer operation DPS according to claim 1, is characterized in that, described batch jobs condition judgment module comprises this batch jobs sets of wafers set completion status and judges that submodule and previous batch jobs completion status judge submodule;
This batch jobs sets of wafers set completion status described judges that submodule is for judging whether the sets of wafers of these batch jobs has been gathered, and if not, then waits for that sets of wafers set completes; If so, then continue to judge that submodule judges by described previous batch jobs completion status;
Described previous batch jobs completion status judges that submodule is for judging whether previous batch jobs complete, and if not, then waits for that previous batch jobs complete; If so, then by described job result feedback module, the job result of described previous batch jobs is fed back to described batch jobs and set up module.
3. batch wafer operation DPS according to claim 1, it is characterized in that, the job result of described previous batch jobs is fed back to described batch jobs and sets up module by described job result feedback module, if the job result of described previous batch jobs as well time, these batch jobs described start; If when the job result of described previous batch jobs is bad, these batch jobs described are cancelled.
4. batch wafer operation DPS according to claim 1, it is characterized in that, described batch jobs dynamically update the sets of wafers that the sets of wafers with these batch jobs described has an identical operation condition by module and dynamically update in these batch jobs described.
5. batch wafer operation DPS according to claim 1, is characterized in that, the sets of wafers of these batch jobs described is sent to implement by several wafer transfer boxes and carries out sets of wafers set by described sets of wafers collection modules.
6. a batch wafer operation method for dynamically processing, adopts batch wafer operation DPS as claimed in claim 1, is applied in semiconductor manufacturing executive system and equipment automatization system, it is characterized in that, comprise the steps:
Step S1, sets up this batch jobs;
Step S2, by the sets of wafers set of these batch jobs described;
Step S3, judges the described sets of wafers set completion status of these batch jobs and the completion status of previous batch jobs;
Step S4, dynamically updates these batch jobs described, repeats step S2, S3, until described previous batch jobs complete;
Step S5, after described previous batch jobs complete, feeds back the job result of described previous batch jobs, makes these batch jobs described start or cancel.
7. batch wafer operation method for dynamically processing according to claim 6, is characterized in that, in described step S3, specifically comprise:
Step S301, judges whether the sets of wafers of these batch jobs has been gathered, and if not, then waits for that sets of wafers set completes; If so, then continue to be judged by next step;
Step S302, judges whether previous batch jobs complete, and if not, then waits for that previous batch jobs complete; If so, the job result of described previous batch jobs is then fed back.
8. batch wafer operation method for dynamically processing according to claim 6, is characterized in that, in described step S5, if the job result of described previous batch jobs as well time, these batch jobs described start; If when the job result of described previous batch jobs is bad, these batch jobs described are cancelled.
9. batch wafer operation method for dynamically processing according to claim 6, is characterized in that, in described step S4, the sets of wafers sets of wafers with these batch jobs described with identical operation condition dynamically updates in these batch jobs described.
10. batch wafer operation method for dynamically processing according to claim 6, is characterized in that, in described step S2, by several wafer transfer boxes, the sets of wafers of these batch jobs described is sent to implement and carries out sets of wafers set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310333580.1A CN103425066B (en) | 2013-08-02 | 2013-08-02 | A kind of batch wafer operation DPS and disposal route thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310333580.1A CN103425066B (en) | 2013-08-02 | 2013-08-02 | A kind of batch wafer operation DPS and disposal route thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103425066A CN103425066A (en) | 2013-12-04 |
| CN103425066B true CN103425066B (en) | 2015-11-25 |
Family
ID=49649976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310333580.1A Active CN103425066B (en) | 2013-08-02 | 2013-08-02 | A kind of batch wafer operation DPS and disposal route thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103425066B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104751261B (en) * | 2013-12-30 | 2018-04-27 | 中芯国际集成电路制造(上海)有限公司 | The method that the variation of technological process, the technological process to change are monitored |
| CN108615135A (en) * | 2016-12-13 | 2018-10-02 | 海太半导体（无锡）有限公司 | Semiconductor module set product goes out to keep accounts automatically system and goes out the method that keeps accounts |
| CN108615202A (en) * | 2016-12-13 | 2018-10-02 | 海太半导体（无锡）有限公司 | Engineering equipment preset parameter management system and management method after encapsulation |
| CN108303955B (en) * | 2017-11-15 | 2020-06-16 | 大连佳峰自动化股份有限公司 | Method and system for batch production of products |
| CN112309918B (en) * | 2020-10-30 | 2023-09-22 | 上海华力微电子有限公司 | Advanced process control method and system of VT-BS model and semiconductor device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6763277B1 (en) * | 2001-07-16 | 2004-07-13 | Advanced Micro Devices, Inc. | Method and apparatus for proactive dispatch system to improve line balancing |
| CN1804746A (en) * | 2004-12-23 | 2006-07-19 | 台湾积体电路制造股份有限公司 | Systems and methods for managing lot aggregation |
| CN102117730A (en) * | 2009-12-31 | 2011-07-06 | 中芯国际集成电路制造(上海)有限公司 | Method for processing parameter data of machine station in manufacturing process of semiconductor and device thereof |
| CN102768941A (en) * | 2011-05-05 | 2012-11-07 | 中芯国际集成电路制造(上海)有限公司 | Method and device for dispatching to batch machine |
| CN102810457A (en) * | 2011-05-31 | 2012-12-05 | 无锡华润上华半导体有限公司 | Method for promoting wafer stop rule and implementing batch wafer stop by system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63250702A (en) * | 1987-04-07 | 1988-10-18 | Hitachi Ltd | Sequence controller |
-
2013
- 2013-08-02 CN CN201310333580.1A patent/CN103425066B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6763277B1 (en) * | 2001-07-16 | 2004-07-13 | Advanced Micro Devices, Inc. | Method and apparatus for proactive dispatch system to improve line balancing |
| CN1804746A (en) * | 2004-12-23 | 2006-07-19 | 台湾积体电路制造股份有限公司 | Systems and methods for managing lot aggregation |
| CN102117730A (en) * | 2009-12-31 | 2011-07-06 | 中芯国际集成电路制造(上海)有限公司 | Method for processing parameter data of machine station in manufacturing process of semiconductor and device thereof |
| CN102768941A (en) * | 2011-05-05 | 2012-11-07 | 中芯国际集成电路制造(上海)有限公司 | Method and device for dispatching to batch machine |
| CN102810457A (en) * | 2011-05-31 | 2012-12-05 | 无锡华润上华半导体有限公司 | Method for promoting wafer stop rule and implementing batch wafer stop by system |
Non-Patent Citations (1)
| Title |
|---|
| 基于规则的批处理设备调度方法在半导体晶圆制造系统中应用;李程等;《上海交通大学学报》;20130228;第47卷(第2期);第230-235页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103425066A (en) | 2013-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103425066B (en) | A kind of batch wafer operation DPS and disposal route thereof | |
| CN102768941B (en) | Method and device for dispatching to batch machine | |
| US10096526B2 (en) | Die bonder and bonding method | |
| CN103064380B (en) | There is the work dispatching method of the manufacture system of multiple stage process equipment | |
| CN104538987A (en) | Control method and system for parallel connection of alternating current sides of photovoltaic inverters | |
| RU2010107287A (en) | ELECTRIC POWER DISTRIBUTION MANAGEMENT | |
| CN103346105B (en) | A kind of can according to the defect sampling observation method of technique wafer number load dynamic conditioning | |
| CN107972019A (en) | A kind of product high efficiency carrying mechanism suitable for multistation | |
| CN103215572A (en) | Semiconductor equipment technology control method and semiconductor equipment technology control device | |
| CN101625565B (en) | Automation control system and method for controlling same | |
| CN103439893B (en) | The reservation of equipment load port uses control method | |
| CN100422888C (en) | System and method for controlling batches in layers of reaction chamber | |
| CN100461055C (en) | Method for sharing semiconductive machine and manufacture system using same | |
| CN114548708B (en) | Empty wafer box management method and device, computer equipment and storage medium | |
| CN105119985A (en) | Multi-station intelligent robot and control method thereof | |
| CN105470102A (en) | Method for enhancing utilization efficiency of reaction chamber | |
| CN100419607C (en) | Wafer-based planning methods and systems | |
| CN104090522A (en) | Multilevel control system for spinning machine | |
| CN108646633A (en) | A kind of cpu control circuit plate and its working method, a kind of piezoelectric jacquard control system | |
| CN103235570A (en) | Monitoring message communication system of distributed production equipment | |
| CN203164736U (en) | A fermentation technology production device monitoring information communication system | |
| CN104834618B (en) | A kind of more apparatus scanning methods and power electronic system based on RS485 bus communications | |
| CN104751258A (en) | Product mixed-processing system and product mixed-processing method | |
| CN103579058B (en) | A kind of method of multiple batches of continuous operation | |
| CN108227508B (en) | Wafer loading and unloading platform efficiency monitoring method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |