CN103547115A - Heat radiator, electronic device and heat exchange device - Google Patents
Heat radiator, electronic device and heat exchange device Download PDFInfo
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- CN103547115A CN103547115A CN201210243375.1A CN201210243375A CN103547115A CN 103547115 A CN103547115 A CN 103547115A CN 201210243375 A CN201210243375 A CN 201210243375A CN 103547115 A CN103547115 A CN 103547115A
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- openings
- fins
- fins group
- radiator
- fin
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
Abstract
A heat radiator comprises a plate, a first fin group and a second fin group. The first fin group is arranged on the plate and provided with a plurality of first fins, and each first fin is provided with a plurality of first openings. The second fin group is arranged on the plate and adjacent to the first fin group and provided with a plurality of second fins, and each second fin is provided with a plurality of second openings. The total area of the second openings is larger than the total area of the first openings. The invention further provides an electronic device and a heat exchange device. By the heat radiator, the electronic device and the heat exchange device and through the special structural design and arrangement of the heat radiation fins, air guide effect of the heat radiation fins is improved, and heat radiation efficiency is improved.
Description
Technical field
The invention relates to a kind of radiator, electronic installation and heat-exchange device.
Background technology
Along with the development of electronic industry, make the running speed of electronic building brick and the requirement of usefulness day by day promote, but derivative heat dissipation problem is also day by day serious, performance and stability in the time of can having influence on running.In order to make the electronic installation can normal operation, generally can on heating electronic package, install radiator additional, by radiator, heat energy is derived.
Be applied at present the radiator of electronic installation, mainly to see through a plurality of stacking radiating fins heat is derived, but under the consideration of installation volume and environment, most radiating fins are to be closed in the housing of electronic installation, for example, even if see through other auxiliary heat abstractor (fan), therefore the radiating effect that can reach is also limited, has heat and is difficult for dissipation and is accumulated in the problem of enclosure interior derivative, also can make the electronic building brick of electronic installation inside damage.
Take a broad view of the existing radiator that is used in enclosed electronic installation, owing to must consider that electronic installation, in technique and the restriction designing, therefore only uses known stacking radiating fin to reach bottleneck on radiating effect simultaneously.Although shape and the micro-structural for radiating fin has improvement more at present, flow conductivity that can heat radiation fin, but in the electronic installation of relatively sealing, if must take into account feed channel and radiating rate simultaneously, can more complicated on the design of fin configuration and whole installation, will certainly increase time and cost on integrated artistic.
Therefore, how to provide a kind of and can see through Simple Design and set-up mode, just can reach increase air inflow, and the radiator of effective heat radiation speed, to increase radiating efficiency, become important topic.
Summary of the invention
In order to solve above-mentioned problem, the object of this invention is to provide and a kind ofly can see through Simple Design and set-up mode, just can reach increase air inflow, and the effective radiator of heat radiation speed.In addition, radiator according to the present invention is the radiating fin with special micro-structural and the mode of laying, can effectively increase radiating efficiency.
In order to achieve the above object, a kind of radiator according to the present invention comprises a plate body, one first fins group and one second fins group.The first fins group is arranged on plate body, and the first fins group has a plurality of the first fins, and each first fin has a plurality of the first openings.The second fins group is arranged on plate body, and neighbour is located at the first fins group.The second fins group has a plurality of the second fins, and each second fin has a plurality of the second openings.Wherein, the gross area of a plurality of the second openings is greater than the gross area of a plurality of the first openings.
In one embodiment, the first fins group neighbour is located at an air outlet.Air outlet arranges at least one fan.
In one embodiment, radiator is arranged in a housing.Housing has one first air intake vent.The second fins group neighbour is located at air intake vent.The corresponding air intake vent of a plurality of the second openings.
In one embodiment, housing also has at least one the second air intake vent.Corresponding a plurality of the first fins of the second air intake vent and a plurality of one of them part of the second fin.
In one embodiment, housing also comprises at least one side plate.Side plate is arranged on a side and the contiguous air outlet place of plate body.
In one embodiment, radiator also comprises one the 3rd fins group.The 3rd fins group is arranged on plate body, and position is between the first fins group and the second fins group.The 3rd fins group has a plurality of the 3rd fins, and each the 3rd fin has a plurality of the 3rd openings.The gross area of a plurality of the 3rd openings is between the gross area of a plurality of the first openings and the gross area of a plurality of the second openings.
In order to achieve the above object, a kind of electronic installation according to the present invention comprises one first housing and an electronic building brick.One side of the first housing arranges a radiator.Radiator comprises a plate body, at least one first fins group and at least one the second fins group.Plate body and the first housing form an accommodation space.The first fins group is arranged on plate body, and the first fins group has a plurality of the first fins, and each first fin has a plurality of the first openings.The second fins group is arranged on plate body, and neighbour is located at the first fins group.The second fins group has a plurality of the second fins, and each second fin has a plurality of the second openings.Wherein, the gross area of a plurality of the second openings is greater than the gross area of a plurality of the first openings.Electronic building brick is arranged on accommodation space.
In one embodiment, the first fins group neighbour is located at an air outlet.Air outlet arranges at least one fan.
In one embodiment, radiator is arranged in one second housing.The second housing has one first air intake vent.The second fins group neighbour is located at air intake vent.The corresponding air intake vent of a plurality of the second openings.
In one embodiment, the second housing also has at least one the second air intake vent.Corresponding a plurality of the first fins of the second air intake vent and a plurality of one of them part of the second fin.
In one embodiment, the second housing also comprises at least one side plate.Side plate is arranged on a side and the contiguous air outlet place of plate body.
In one embodiment, radiator also comprises one the 3rd fins group.The 3rd fin is arranged on plate body, and position is between the first fins group and the second fins group.The 3rd fins group has a plurality of the 3rd fins, and each the 3rd fin has a plurality of the 3rd openings.The gross area of a plurality of the 3rd openings is between the gross area of a plurality of the first openings and the gross area of a plurality of the second openings.
In order to achieve the above object, a kind of heat-exchange device according to the present invention comprises a radiator and a heat dump.Radiator comprises a plate body, one first fins group and one second fins group.The first fins group is arranged on plate body, and the first fins group has a plurality of the first fins, and each first fin has a plurality of the first openings.The second fins group is arranged on plate body, and the second fins group has a plurality of the second fins, and each second fin has a plurality of the second openings.Wherein, the gross area of a plurality of the second openings is greater than the gross area of a plurality of the first openings.Heat dump is arranged on the opposite side of plate body with respect to radiator.
In one embodiment, the first fins group neighbour is located at an air outlet.Air outlet arranges at least one fan.
In one embodiment, radiator is arranged in a housing.Housing has one first air intake vent.The second fins group neighbour is located at air intake vent.The corresponding air intake vent of a plurality of the second openings.
In one embodiment, housing also has at least one the second air intake vent.Corresponding a plurality of the first fins of the second air intake vent and a plurality of one of them part of the second fin.
In one embodiment, housing also comprises at least one side plate.Side plate is arranged on a side and the contiguous air outlet place of plate body.
In one embodiment, radiator also comprises one the 3rd fins group.The 3rd fins group is arranged on plate body, and position is between the first fins group and the second fins group.The 3rd fins group has a plurality of the 3rd fins, and each the 3rd fin has a plurality of the 3rd openings.The gross area of a plurality of the 3rd openings is between the gross area of a plurality of the first openings and the gross area of a plurality of the second openings.
From the above, a kind of radiator provided by the present invention, electronic installation and heat-exchange device, the first fin and second fin with the opening of different spacing, and see through different the first fin and the second fins of aperture pitch is oppositely arranged according to the position of air intake vent, make the runner of a plurality of openings formation parallel air flow directions on the first fin and the second fin, and importantly, after air-flow is entered by air intake vent, can sequentially flow through the fin that aperture pitch is less, again by the larger fin of aperture pitch, in other words, the air that the present invention makes inflow radiator makes to dredging the fin that changes by close by opening density, can accelerate air-flow through the speed of fin, further improving heat radiation efficiency.
In addition, the present invention also can coordinate a housing, and at the side design side direction air intake vent of housing, and the fin with above-mentioned feature partly exposes, and what can also effectively promote side direction enters air quantity and intensity, further improving heat radiation efficiency.In actual applications, utilize radiator of the present invention can be applied in electronic installation, in the electronic installation of sealing, reach preferably radiating effect.Compared to known technology, fansink designs of the present invention can provide more intake in the electronic installation of sealing, effectively promotes the speed of electronic installation heat radiation.
Accompanying drawing explanation
Figure 1A is the schematic appearance of a kind of radiator of preferred embodiment of the present invention;
Figure 1B is the front-view schematic diagram of the radiator shown in Figure 1A;
Fig. 2 A is the schematic appearance of a kind of radiator of another preferred embodiment of the present invention;
Fig. 2 B is the schematic appearance of the radiator of another preferred embodiment of the present invention; And
Fig. 3 is the decomposed schematic diagram of a kind of electronic installation of the preferred embodiment according to the present invention.
Embodiment
Hereinafter with reference to correlative type, a kind of radiator, electronic installation and the heat-exchange device of the preferred embodiment according to the present invention is described, wherein identical assembly is illustrated the reference marks with identical.
Figure 1A is the schematic appearance of a kind of radiator of preferred embodiment of the present invention, and Figure 1B is the front-view schematic diagram of the radiator shown in Figure 1A, please also refer to shown in Figure 1A and Figure 1B, and radiator H comprises a plate body S, one first fins group 1 and one second fins group 2.In order to reach heat radiation object, radiator H has one first air intake vent I1 and an air outlet O, and air or gas through the internal structure of radiator H, carry out heat exchange via the first air intake vent I1, and the torrid zone is gone out to air outlet O completes heat radiation.Below first each architectural feature for radiator H is illustrated one by one.
The first fins group 1 and the second fins group 2 are all arranged on plate body S, and wherein, the first fins group 1 neighbour is located at air outlet O, and air outlet O arranges at least one fan (not shown).The second fins group 2 is with respect to the first fins group 1, to approach the first air intake vent I1 of radiator H.In other words, the second fins group 2 is arranged on a side that relatively approaches the first air intake vent I1 on plate body S.The first fins group 1 has a plurality of the first fins 11, and respectively first fin 11 has a plurality of the first openings 111, and has one first spacing 112 between two adjacent the first openings 111.Similarly, the second fins group 2 has a plurality of the second fins 21, and each second fin 21 also has a plurality of the second openings 211, and has one second spacing 212 between two adjacent the second openings 211." opening " of indication is to be formed on the formed breach of fin or gap by cutting method or pressing, but essence is not restricted with cutting method or pressing on using, also can see through other manufacturing process and reach identical effect, for example in other embodiments, fin is to utilize single material integrated with plate body in fact, and in forming process, form opening, can form the heat spreader structures with better intensity like this.
The gross area of a plurality of the second openings 211 is greater than the gross area of a plurality of the first openings 111.That is to say, the first spacing 112 can be to be greater than the second spacing 212, if with on the whole, compared to the distribution density comparatively dense of a plurality of the second openings 211 on a plurality of the first opening 111, the second fins 21 on the first fin 11; Or can be called under same length, the second fin 21 has compared with the second opening 211 more than the first opening 111 quantity of the first fin 11, but the present invention does not limit this.Quantity at the first opening 111 is less than under the situation of the second opening 211, the size of each first opening 111 and each the second opening 211 can be identical in fact (can certainly be not identical), and the gross area that such design can be reached a plurality of the second openings 211 on the second fin 21 is equally greater than the gross area of a plurality of first openings 111 of the first fin 11.
In the present embodiment, in the first fins group 1 and the second fins group 2, there is separately a plurality of the first fins 11 and the second fin 21, that is to say, radiator H has two groups of fins group separately with the opening of uniform distances (spacing of opening of respectively organizing fins group is not identical).See through the stacking formation fins group of a plurality of fins, can increase the number of fins of the opening with same spacing, while further strengthening different fin that the aforementioned distinguished and admirable aperture pitch of flowing through increases gradually, the effect that can make flow velocity increase.
Specifically, a plurality of the first openings 111 on a plurality of the first fin 11, the first fins 11 in the first fins group 1 form the first flow 113 of parallel air current direction jointly in the vertical direction.Similarly, a plurality of the second openings 211 on a plurality of the second fin 21, the second fins 21 in the second fins group 2 form the second runner 213 in vertical direction jointly.In the present embodiment, take the first fins group 1 and the second fins group 2 is example, when air-flow flows to the first fins group 1 by the bottom of the second fins group 2, first can pass through a plurality of the second fins 21, because a plurality of second openings 211 of a plurality of the second fins 21 are all identical, therefore can form the second long runner 213, the air-flow that is conducive to conflux after a plurality of the second openings 211 is not interfered, and the direction of the first fin 11 flowed smoothly in the past.
In the present embodiment, radiator H can also comprise that one the 3rd fins group 3, the three fins group 3 are arranged on plate body S, and position is between the first fins group 1 and the second fins group 2.Similarly, the 3rd fins group 3 has a plurality of the 3rd fins 31, the gross area of a plurality of the 3rd openings 311 is between the gross area of a plurality of the first openings 111 and the gross area of a plurality of the second openings 211, and there is one the 3rd spacing 312 between two adjacent the 3rd openings 311, that is to say, the size of the 3rd spacing 312 also can be between the first spacing 112 and the second spacing 212.Specifically, the fin arrangement mode having for radiator H, the distribution density of a plurality of the second openings 211 is large compared with the distribution density of a plurality of the 3rd openings 311, the distribution density of a plurality of the 3rd openings 311 is greater than a plurality of the first openings 111.Certainly, the number of fin is also non-limiting, radiator can also comprise the 4th fins group, the 5th fins group between the first fins group 1 and the second fins group 2 ... or even N fins group, the place of using according to radiator, or the size of the device of fit applications and radiating requirements determine, but opening on each fin and the design concept of spacing are the relativenesses of following above-mentioned the first fins group 1, the second fins group 2 and the 3rd fins group 3.
On reality is implemented, see through the fan (not shown) of the air outlet O that is arranged on radiator H, guiding sees through the air-flow that the first air intake vent I1 of radiator H bottom enters can be by a plurality of the second openings 211 sequentially through the 3rd opening 311 and the first opening 111.Because the second spacing 212 between a plurality of second openings 211 of the second fin 21 near the first air intake vent I1 is less, the distribution density comparatively dense of a plurality of the second openings 212, and even the unit air volume that the second fin 21 tolerables of therefore close the first air intake vent I1 pass through is more with respect to the 3rd fin 31 first fins 11.Therefore, while being flowed from the second fin 21 toward the first fin 11 directions along with air-flow, its speed can increase along with the variation of the aperture pitch of each fin; On the other hand due to the not identical cause of spacing, the opening of each fin there is no not corresponding connection completely, in other words, for example the second opening 211 of the second fin 21 and the 3rd opening 311 of the 3rd fin 31 overlap on projected position and not exclusively, therefore air-flow is when through different fins group, can between two fins group, form the flow-disturbing of of short duration existence, contribute to strengthen rate of heat exchange, heat radiation device H gets rid of hot ability.
Fig. 2 A is the schematic appearance according to the radiator of another preferred embodiment of the present invention.Please refer to shown in Fig. 2 A, the radiator H of radiator H1 and previous embodiment has roughly the same structure, but radiator H1 is with four fins group as an example, and the relativeness of these four fins group is the concept configurations of following the radiator H of previous embodiment.Radiator H1 is arranged in a housing 5, and housing 5 is attached at plate body S, and housing 5 has two side plates 51 and a header board 52 forms.See through housing 5 coated if the first fins group 1 of previous embodiment is to the 4th fins group 4 substantially, make radiator H1 only see through the first air intake vent I1 air intake, can in active set, enter the air-flow of radiator H1, and air-flow is accelerated by each group runner.It should be noted that, because the spacing of the opening of each fins group is not identical, therefore respectively organize runner corresponding connection completely not.The 4th runner 413 and the 3rd runner 313 of for example take in the present embodiment are example, in the time of between air-flow is by the 4th runner 413 and the 3rd runner 313, can be in the 4th fins group 4 between the 3rd fin 31 below, form of short duration flow-disturbing phenomenon in the 4th fin 41 of the top and the 3rd fins group 3, contribute to like this to increase rate of heat exchange, improving radiating effect.Similarly, between other fins group, have equally identical effect, do not repeat them here.
Fig. 2 B is according to the schematic appearance of the radiator of another preferred embodiment of the present invention, please refer to shown in Fig. 2 B, in the present embodiment, radiator H2 has the Structure and characteristics roughly the same with the radiator H1 of previous embodiment, but radiator H2 is arranged on a housing 5a.Wherein, two side plate 51a of housing 5a do not cover these fins group completely, under such structure, housing 5a has one second air intake vent I2, be formed on side plate 51a one of them, between header board 52 and plate body S, make corresponding a plurality of the first fins 11 of the second air intake vent I2 and a plurality of second fin 21 one of them part.That is to say, except the first air intake vent I1 of bottom originally, radiator H2 also comprises a plurality of the second air intake vent I2 that air-flow is entered, and generally, sees through the throughput that the first air intake vent I1 and the second air intake vent I2 enter more, contributes to improving radiating effect.The second air intake vent I2 of indication is that air-flow directly enters the entrance between a plurality of fins.In the present embodiment, between fins group and fins group, or the spacing between a plurality of fins in each fins group can be identical, and therefore the size of formed a plurality of the second air intake vent I2 is also identical.
In the present embodiment, the aspect ratio of the height of side plate 51a and header board 52 can be 1:4, and such ratio contributes to form the water conservancy diversion effect of the fins group of strengthening different densities opening of the present invention.It should be noted that, above-mentioned side plate size, shape, all non-restrictions of the present invention, for example in other embodiments, the height of side plate and the aspect ratio of header board can be 1:3 or 1:2, when the height of side plate more approaches the height of header board, have dustproof and to prevent that foreign matter from entering the effect of radiator better.
Fig. 3 is the decomposed schematic diagram of a kind of electronic installation of the preferred embodiment according to the present invention.Please refer to shown in Fig. 3, an electronic installation 6 comprises one first housing 61, a radiator H ' and an electronic building brick 62.Wherein, radiator H ' and the radiator H of previous embodiment have roughly the same Structure and characteristics, do not repeat them here, and only have and change the housing 5 in earlier figures 2A and Fig. 2 B into second housing 64.The plate body S of radiator H ' and the first housing 61 form an accommodation space 65, and electronic building brick 62 is contained in accommodation space 65.In the present embodiment, electronic installation 6 is cabinets, but can be also that other has the electronic installation for the treatment of radiating electronic assembly, and the present invention does not limit at this.
In the present embodiment, electronic installation 6 also comprises at least one fan 63, and fan 63 is air outlet O that neighbour is located at radiator H ', discharging by the air-flow of radiator H ', strengthens radiating efficiency.In addition, radiator H ' also can be set directly at electronic building brick 62, and is connected with electronic building brick 62 through plate body S.The mode connecting can be engaging, mode chimeric or that even utilization is welded, and the present invention does not limit at this.In addition, the size of fan, number and definite connection relationship are all usingd the radiating requirements of electronic installation and structure as basis, are not restricted property, and in other embodiments, electronic installation also can comprise other radiating subassembly, for example the setting of heat pipe or water-setting pipe.
In the present embodiment, electronic installation 6 is actually and coordinates a heat-exchange device E to use, and heat exchanger E comprises aforesaid radiator H ' and a heat dump 7, wherein, the structure of the radiator H ' of heat exchanger E and each parts are identical with the radiator H of previous embodiment, do not repeat them here.Heat dump 7 is with respect to radiator H ', to be arranged on the opposite side of plate body S, specifically, by heat dump 7, the thermal energy conduction of electronic building brick 62 is arrived to a side of radiator H ', make outside cold air and inner hot-air in radiator H ', heat dump 7 and 63 circulations of fan, make the heat energy of electronic building brick 62 reach the effect of loss through heat-exchange device E.In the present embodiment, heat dump 7 is that a plurality of radiating fin (not shown) form, and in practical application, heat dump 7 can be other heat sink, and the present invention does not limit at this.
In sum, a kind of radiator provided by the present invention, electronic installation and heat-exchange device, the first fin and second fin with the opening of different spacing, and see through different the first fin and the second fins of aperture pitch is oppositely arranged according to the position of air intake vent, make the runner of a plurality of openings formation parallel air flow directions on the first fin and the second fin, and importantly, after air-flow is entered by air intake vent, can sequentially flow through the fin that aperture pitch is less, again by the larger fin of aperture pitch, in other words, the air that the present invention makes inflow radiator makes to dredging the fin that changes by close by opening density, can accelerate air-flow through the speed of fin, further improving heat radiation efficiency.
In addition, the present invention also can coordinate a housing, and at the side design side direction air intake vent of housing, and the fin with above-mentioned feature partly exposes, and what can also effectively promote side direction enters air quantity and intensity, further improving heat radiation efficiency.In actual applications, utilize radiator of the present invention can be applied in electronic installation, in the electronic installation of sealing, reach preferably radiating effect.Compared to known technology, fansink designs of the present invention can provide more intake in the electronic installation of sealing, effectively promotes the speed of electronic installation heat radiation.
Although the present invention discloses as above with aforesaid preferred embodiment; but this is not used for limiting the present invention; without departing from the spirit and scope of the present invention, when doing a little also moving and retouching, so being as the criterion of should defining depending on claims of protection scope of the present invention.
Claims (18)
1. a radiator, comprising:
One plate body;
One first fins group, is arranged on described plate body, and described the first fins group has a plurality of the first fins, and described in each, the first fin has a plurality of the first openings; And
One second fins group, is arranged on described plate body, and neighbour is located at described the first fins group, and described the second fins group has a plurality of the second fins, and described in each, the second fin has a plurality of the second openings,
Wherein, the gross area of described a plurality of the second openings is greater than the gross area of described a plurality of the first openings.
2. radiator according to claim 1, is characterized in that, described the first fins group neighbour is located at an air outlet, and described air outlet arranges at least one fan.
3. radiator according to claim 2, is characterized in that, described radiator is arranged in a housing, and described housing has one first air intake vent, and described the second fins group neighbour is located at described the first air intake vent, corresponding described the first air intake vent of described a plurality of the second openings.
4. radiator according to claim 3, is characterized in that, described housing also has at least one the second air intake vent, corresponding described a plurality of the first fins of described the second air intake vent and described a plurality of one of them part of the second fin.
5. radiator according to claim 3, is characterized in that, described housing also comprises at least one side plate, and described side plate is arranged on a side and the contiguous described air outlet place of described plate body.
6. radiator according to claim 1, is characterized in that, also comprises:
One the 3rd fins group, be arranged on described plate body, and position is between described the first fins group and described the second fins group, described the 3rd fins group has a plurality of the 3rd fins, described in each, the 3rd fin has a plurality of the 3rd openings, and the gross area of described a plurality of the 3rd openings is between the gross area of described a plurality of the first openings and the gross area of described a plurality of the second openings.
7. an electronic installation, comprising:
One first housing, a side of described the first housing arranges a radiator;
Described radiator, comprising:
One plate body, forms an accommodation space with described the first housing;
One first fins group, is arranged on described plate body, and described the first fins group has a plurality of the first fins, and described in each, the first fin has a plurality of the first openings; And
One second fins group, is arranged on described plate body, and neighbour is located at described the first fins group, and described the second fins group has a plurality of the second fins, and described in each, the second fin has a plurality of the second openings,
Wherein, the gross area of described a plurality of the second openings is greater than the gross area of described a plurality of the first openings; And
One electronic building brick, is arranged on described accommodation space.
8. electronic installation according to claim 7, is characterized in that, described the first fins group neighbour is located at an air outlet, and described air outlet arranges at least one fan.
9. electronic installation according to claim 8, it is characterized in that, described radiator is arranged in one second housing, and described the second housing has one first air intake vent, described the second fins group neighbour is located at described the first air intake vent, corresponding described the first air intake vent of described a plurality of the second openings.
10. electronic installation according to claim 9, is characterized in that, described the second housing also has at least one the second air intake vent, corresponding described a plurality of the first fins of described the second air intake vent and described a plurality of one of them part of the second fin.
11. electronic installations according to claim 9, is characterized in that, described the second housing also comprises at least one side plate, and described side plate is arranged on a side and the contiguous described air outlet place of described plate body.
12. electronic installations according to claim 7, is characterized in that, described radiator also comprises:
One the 3rd fins group, is arranged on described plate body, and position between described the first fins group and described the second fins group, described the 3rd fins group has a plurality of the 3rd fins, described in each, the 3rd fin has a plurality of the 3rd openings.The gross area of described a plurality of the 3rd openings is between the gross area of described a plurality of the first openings and the gross area of described a plurality of the second openings.
13. 1 kinds of heat-exchange devices, comprising:
One radiator, comprising:
One plate body;
One first fins group, is arranged on described plate body, and described the first fins group has a plurality of the first fins, and described in each, the first fin has a plurality of the first openings; And
One second fins group, is arranged on described plate body, and described the second fins group has a plurality of the second fins, and described in each, the second fin has a plurality of the second openings,
Wherein, the gross area of described a plurality of the second openings is greater than the gross area of described a plurality of the first openings; And
One heat dump, is arranged on the opposite side of described plate body with respect to described radiator.
14. heat-exchange devices according to claim 13, is characterized in that, described the first fins group neighbour is located at an air outlet, and described air outlet arranges at least one fan.
15. heat-exchange devices according to claim 14, it is characterized in that, described radiator is arranged in a housing, and described housing has one first air intake vent, described the second fins group neighbour is located at described the first air intake vent, corresponding described the first air intake vent of described a plurality of the second openings.
16. heat-exchange devices according to claim 15, is characterized in that, described housing also has at least one the second air intake vent, corresponding described a plurality of the first fins of described the second air intake vent and described a plurality of one of them part of the second fin.
17. heat-exchange devices according to claim 15, is characterized in that, described housing also comprises at least one side plate, and described side plate is arranged on a side and the contiguous described air outlet place of described plate body.
18. heat-exchange devices according to claim 13, is characterized in that, described radiator also comprises:
One the 3rd fins group, be arranged on described plate body, and position is between described the first fins group and described the second fins group, described the 3rd fins group has a plurality of the 3rd fins, described in each, the 3rd fin has a plurality of the 3rd openings, and the gross area of described a plurality of the 3rd openings is between the gross area of described a plurality of the first openings and the gross area of described a plurality of the second openings.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210243375.1A CN103547115A (en) | 2012-07-13 | 2012-07-13 | Heat radiator, electronic device and heat exchange device |
| US13/790,671 US20140014308A1 (en) | 2012-07-13 | 2013-03-08 | Heat Sink and Electronic Device and Heat Exchanger Applying the Same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210243375.1A CN103547115A (en) | 2012-07-13 | 2012-07-13 | Heat radiator, electronic device and heat exchange device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103547115A true CN103547115A (en) | 2014-01-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210243375.1A Pending CN103547115A (en) | 2012-07-13 | 2012-07-13 | Heat radiator, electronic device and heat exchange device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20140014308A1 (en) |
| CN (1) | CN103547115A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107368165A (en) * | 2017-07-18 | 2017-11-21 | 浦江县顺光科技有限公司 | A kind of Simple radiator |
| CN107831871A (en) * | 2017-12-04 | 2018-03-23 | 上海航天科工电器研究院有限公司 | A kind of new wind-cooling heat dissipating cabinet |
| TWI813026B (en) * | 2021-09-24 | 2023-08-21 | 艾姆勒科技股份有限公司 | Two-phase immersion-cooled heat-dissipation substrate |
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| WO2015157523A1 (en) * | 2014-04-10 | 2015-10-15 | Advanced Thermal Solutions, Inc. | Multiple flow entrance heat sink |
| US9928317B2 (en) * | 2015-02-02 | 2018-03-27 | Mentor Graphics Corporation | Additive design of heat sinks |
| US9800323B2 (en) * | 2015-03-13 | 2017-10-24 | Mission Microwave Technologies, Inc. | Satellite transmitter system |
| US20170363375A1 (en) * | 2015-06-30 | 2017-12-21 | Georgia Tech Research Corporation | Heat exchanger with variable density feature arrays |
| US11003808B2 (en) * | 2015-09-30 | 2021-05-11 | Siemens Industry Software Inc. | Subtractive design for heat sink improvement |
| US10153629B2 (en) * | 2016-07-21 | 2018-12-11 | Abb Schweiz Ag | Thermal cooling interface for electrical joints |
| PL3577406T3 (en) * | 2017-02-03 | 2021-10-04 | Asetek Danmark A/S | Liquid cooling systems for heat generating devices |
| CN109996420B (en) * | 2017-12-29 | 2020-12-22 | 讯凯国际股份有限公司 | Combined radiating fin structure |
| JP6810101B2 (en) * | 2018-06-06 | 2021-01-06 | 株式会社神戸製鋼所 | Laminated heat exchanger |
| EP3608617B1 (en) * | 2018-08-06 | 2020-12-16 | LEONARDO S.p.A. | Heat exchanger for an aircraft |
| US11937403B2 (en) * | 2019-10-23 | 2024-03-19 | Lumentum Operations Llc | Progressive heatsink |
| EP3989689A1 (en) * | 2020-10-23 | 2022-04-27 | Siemens Aktiengesellschaft | Cooling body assembly and power converter assembly |
| US20230262937A1 (en) * | 2022-02-11 | 2023-08-17 | Quanta Computer Inc. | Combination heat sink |
| WO2023181913A1 (en) * | 2022-03-24 | 2023-09-28 | ニデック株式会社 | Heat dissipation member and semiconductor module |
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| US6263955B1 (en) * | 1996-06-27 | 2001-07-24 | Kaveh Azar | Heat sink with open region |
| US20040037036A1 (en) * | 2000-12-27 | 2004-02-26 | Masumi Suzuki | Heat sink and electronic device with heat sink |
| US20100172091A1 (en) * | 2008-11-28 | 2010-07-08 | Fuji Electric Systems Co., Ltd. | Cooling apparatus for semiconductor chips |
| CN101848621A (en) * | 2009-03-24 | 2010-09-29 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
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| US6343016B1 (en) * | 2000-12-20 | 2002-01-29 | Enlight Corporation | Heat sink |
| US7027300B2 (en) * | 2003-09-16 | 2006-04-11 | Mobility Electronics, Inc. | Compact electronics plenum |
| US7203064B2 (en) * | 2003-12-12 | 2007-04-10 | Intel Corporation | Heat exchanger with cooling channels having varying geometry |
| DE102008060777B4 (en) * | 2008-12-05 | 2010-12-02 | Fujitsu Siemens Computers Gmbh | Arrangement for cooling heat-generating computer components |
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- 2012-07-13 CN CN201210243375.1A patent/CN103547115A/en active Pending
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- 2013-03-08 US US13/790,671 patent/US20140014308A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6263955B1 (en) * | 1996-06-27 | 2001-07-24 | Kaveh Azar | Heat sink with open region |
| US20040037036A1 (en) * | 2000-12-27 | 2004-02-26 | Masumi Suzuki | Heat sink and electronic device with heat sink |
| US20100172091A1 (en) * | 2008-11-28 | 2010-07-08 | Fuji Electric Systems Co., Ltd. | Cooling apparatus for semiconductor chips |
| CN101848621A (en) * | 2009-03-24 | 2010-09-29 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107368165A (en) * | 2017-07-18 | 2017-11-21 | 浦江县顺光科技有限公司 | A kind of Simple radiator |
| CN107831871A (en) * | 2017-12-04 | 2018-03-23 | 上海航天科工电器研究院有限公司 | A kind of new wind-cooling heat dissipating cabinet |
| TWI813026B (en) * | 2021-09-24 | 2023-08-21 | 艾姆勒科技股份有限公司 | Two-phase immersion-cooled heat-dissipation substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140014308A1 (en) | 2014-01-16 |
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Application publication date: 20140129 |