CN1047717C - 微波电路的封装结构 - Google Patents

微波电路的封装结构 Download PDF

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CN1047717C
CN1047717C CN94115784A CN94115784A CN1047717C CN 1047717 C CN1047717 C CN 1047717C CN 94115784 A CN94115784 A CN 94115784A CN 94115784 A CN94115784 A CN 94115784A CN 1047717 C CN1047717 C CN 1047717C
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encapsulating structure
circuit
circuit unit
master slice
conductive path
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CN1109258A (zh
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小杉勇平
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NEC Corp
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Abstract

一种微波电路封装结构，包括内部容纳半导体元件和母片的电路组件；电路组件有二个接地导体层，夹在其中间的中央导体层，与中央导体层连接的中央导体电极，设置在中央导体附近的接地导体电极；上述部分在电路组件的一个表面上；以及连至另一个表面上的散热板；母片有二个接地导体层，夹于其中间的中央导体、中央导体电极、设置在母片的一个表面上的接地电极；导热弹性物夹在散热板和热辐射板之间。

Description

微波电路的封装结构
本发明涉及微波电路的封装结构，尤其是含有微波电路组件或微波集成电路组件的封装结构。
众所周知，微波或毫米波范围的波长是短的，因此，设计包括传输线路的电路配置同时将传输线路上的不均匀性抑制到低水平并确保电路或线路之间隔离，是困难的。所以微波电路封装必定是又复杂又昂贵。近些年来，微波单片式集成电路(以下简称MMIC)逐渐适合于作为高频带的半导体集成电路。然而，MMIC有许多短处，比如易产生裂缝，使得存在许多封装限制。尤其不适合于集成化分布恒定电路，这将导致大型化。
美国专利No.5,065,280提出了一种用于计算机电路的柔性IC芯片组件的结构，该结构采用了翼片式框架，装有电路组件、散热件、热辐射件和多层基片。
参照图8，该图展示了传统微波电路的封装结构，上述电路包括具有电路元件103、微波引线102和偏压供给端107的MMIC、MIC组件101，各组件排列在主板100上。这里通过形成在主板100内的外侧导电孔109，将微波引线102和偏压供给端107引至主板100的后面。通过印刷电路板等，钎焊偏压供给端107。并且借助印刷电路板104作钎焊，把微波引线102电连接到另一组件或绝缘体108。把微波引线102的连接部分用盖子106与外部隔离开而屏蔽起来。
如图8所示，由于MMIC不适合于主要由无源元件组成的分布恒定电路的集成化，有源元件被封入气密性外壳内，并且由微波带状线路和钎焊形成这些有源元件和外侧无源元件之间的连接。因此，把MMIC封入气密性外壳是昂贵的。而且要求具有精细分隔开小室的复杂和昂贵的屏蔽外壳，以防止单元电路之间不应有的电连接，这样进一步导致组装成本的提高。
所以上述已有的封装结构存在如下缺点：
(1)为把为MMIC组装到称之为头的气密性外壳中，必须花费相当大的费用，这是因为头本身很贵，而且装配费用也高；
(2)细分成小室的复杂和大型屏蔽外壳相当昂贵；
(3)把头装到屏蔽外壳，装配印刷电路板、焊接端子等，所有这一切必须手工操作，导致高的组装成本；
(4)该结构既大又重，这不利于通讯设备的小型化和减轻重量。
本发明目的在于提供一种小型低成本的微波电路封装结构；本发明的另一个目的在于提供一种具有优异热辐射效率的微波电路封装结构；本发明的进一步目的在于提供一种由电路组件单元可作互换的微波电路封装结构；本发明还有一个目的是提供一种利用上述封装结构包封微波电路。
根据本发明的一种微波电路的封装结构，包括：具有半导体元件的电路组件；其上容纳电路组件的母片；装在组件上，接收来自电路组件热量的散热板；接收来自散热装置，辐射热量的辐射装置；该封装结构还包括：设置在热扩散装置和辐射装置之间的导热弹性物；沿辐射装置方向压住母片的装置；电路组件包括：其上容纳半导体元件的多层基片；多层基片有两个第一接地导体层和在两个第一接地导体层之间的第一中央导体层；第一中央导体层具有第一连接线路图形；把第一连接线路图形引至电路组件表面的第一中央导电通路；连接两个第一接地导体层的多个第一接地导电通路；多个第一接地导电通路围绕第一中央导电通路和围绕半导体元件设置。
在根据本发明微波电路封装结构中，微波信号被限制在电路组件和母片内部而无须复杂、庞大且昂贵的屏蔽外壳；另外由电路组件构成整个电路主要容纳了由半导体集成电路组成的有源元件；母片装着多个电路组件，组件批量生产的效益导致可靠性的改善和生产成本的降低。
另外，根据本发明，利用散热板来扩散装在电路组件内半导体元件产生的热量，并且经导热弹性物直接把热传递到装置的热辐射板向外放出。因此，可降低半导体元件的温度，并可延长寿命。导热弹性物可使微小误差得以缓冲，以确保优异的导热性。
图1是本发明第一实施例的剖视图；
图2(A)和2(B)是在图1中所展示实施例中分别表示母片和电路组件上的电极排布；
图3表示图1所示封装结构应用于包封微波电路器件的剖视图；
图4是第二个实施例中应用的另一个包封微波电路器件的剖视图；
图5是第三个实施例中应用的又一个包封微波电路器件的剖视图；
图6是根据第四个实施例的封装结构剖视图；
图7是根据第五个实施例的封装结构剖视图；
图8是微波电路的通常的封装结构。
参照图1显示根据本发明第一实施微波电路封装结构的剖视图。叙述将从各个部分的构成到总体构成进行。在图1，电路组件1在其内部空间至少装有一个备置了微波电路的半导体元件。电路组件1还具有通过层叠介质层和导体层获得的多层结构14。在本实施例中，结构14包含有中央导体层11c，介质层和一对在介质层上的接地导体层12c1和12c2。这二个接地导体层12c1和12c2借助接地导体通路(层间连接导体)6c被相互连接。在中央导体上形成的电路图形周围设置大量接地导体通路6c，在中央导体上通路6c的配置间距设计成小于相应于在电路组件1所处理的频率的波长的8分之一。利用中央导体通路5c把信号引出到电路组件1的表面，并且连通至具有凸台30的表面电极图形。设置接地导体通路6c，围绕中央导体通路5c，而且其顶端被连在表面上的接地电极6a(见图2)。设置热传导通路8，以释放由半导体元件4产生的热。通过具体有极佳热传导性的通路8，使所产生的热量排放到散热板3。热传导通路8是由Cu/W或Ag组合材料制成。半导体元件4容装在电路组件1内的空间里，并且用良导电体作的盖子7盖住。散热板3用粘结材料2固定在电路组件表面，上述表面还装着半导体元件4。
下面将描述母片10。母片10是由柔性有机材料构成，并且利用带多个电路组件1的大型基片10可形成较大规模电路单元。母片10至少有2个接地导体层12m1和12m2，以及在上述两层间有中央导体层11m。为了把微波信号限制在基片10里面，所以在中央导体11m的周围设置大量接地导体通路6m，该通路6m与上、下外部导体连接，接地导体通路6m需设置在至少围绕中央导体11m的电路图形，理想的是将其设置在所有看不到中央导体图形的那部分表面，使之完全封闭微波信号，通过这种方法，把微波信号的能量封闭在中央导体层11m的范围内。
对于电路组件1，与母片10的情况相类似。连接接地导体层12c1和12c2的大量接地导体通种6c设置在中央导体层11c的电路图形四周，若可能的话，以及其他所有不存在中央导体层11c的电路图形的部分。
接着将说明母片10和电路组件1的电极布局。图2(A)表示了母片10的电极排列，接地导体层12m2具有特殊的非接地导电部分，即分别为用于输入/输出信号以及DC偏压/低频信号的电极5a和9a。除了接地电极6a和电极5a及9a，所有表面皆为保护层。电极6a、5a和9a与各自的通路连接。和通路6m一样，不仅使接地电极6a围绕中央导体层电极5a排列，而且至少是在电路组件1的周围。在该图中，虚线11和13分别表明输入/输出信号线和偏压/低频信号线。如图2(B)所示，电路组件1的表面有接地电极6a和信号电极5a及9a，通过凸台30(图1)使上述电极与母片10上各自的导电电极6a、5a和9a连接。用这种连接，可以在母片10的电极上设置凸台30，而不是在电路组件1的电极上制备。因此，由于微波信号被限制在如上所述的电路组件1和母片10内部，因此，无需象传统微波电路那样要求提供复杂的屏蔽外壳，并且能实现结构紧凑的大规模微波电路。
接着将描述根据本发明的微波电路结构的冷却构成。在图1中，半导体元件4产生的热量必须有效地排放到装置的外面。为此目的通常使用的方法是利用辐射片。这样的辐射结构已被公开，如日本公开的专利申请号为No.60-21611(1985)和No.60-64503(1985)。
然而，不可能应用该辐射结构来封装微波电路器件。并且，该方法仅可用于外部空气引入型冷却系统，而不能用于封闭类型设备。如若热辐射板被直接连在散热板上，那末热量可通过散热板直接被引至外部。但是，不可能使多个电路组件紧密地机械连接到散热板上。这里因为由于在钎焊等尺寸方面的区别，难以为所有电路组件制造高精度(同一板上)散热板平面的顶表面。但是，如果热辐射板固定到散热板，由于母片和热辐射板的热膨胀系数的不同，当应力作用到电路组件和母片的粘结电极部分时，会引起粘结部分的损坏。
在本发明的该实施例中，导热弹性物21被夹在散热板3和热辐射板20之间，并且利用弹簧40对母片10施加压力，以使散热板3和导热弹性物21紧紧接触。采用这种结构，即使散热板3的顶面与装在该处的多个电路组件的高度不一致，也可以利用导热弹性物21使这样的不平整度得到缓解。导热弹性物21是由如硅树脂和AlN制成。目前导热弹性物的热导率一般并不高于金属的，尽管如此，导热弹性物的热导率低的缺点在实践中不会产生问题，因为由半导体元件产生的热量用热扩散板扩展到宽阔的面积上。图3展示了使用本发明封装结构所包封的微波电路装置。在该图中，含有三个电路组件1，并且，辐射板20直接装在装置主体上。主体和盖子51组成气密性外壳50。通过接线端子52提供或获得输入/输出信号以及DC电源。数字53表示与母片10上的导线连接的接线端子；数字54表示一个0形环。在盖子51上，通过支撑器51安装多个弹簧40。把盖子51装到主体上，使弹簧40压住母片10，结果散热板3经导热弹性物21被压到辐射板。因此，通过散热板3、导热弹性物21和辐射板20，产生于电路组件1的热量被高效地释放，元件没有受到任何应力影响。在这种情况下，接线端子53具有弹性，所以当弹簧40挤压母片10时，接线端子53和导线间的连接变得完备了。
可给每个电路元件提供一个弹簧40，并且根据需要可增加。当电路规模小时，弹簧40数量可减少。有关弹簧类型没有限制，可以从能对母片加压的螺旋簧、片簧、塑料泡沫等之中适当选择。
图4展示另一个利用具有弹簧功能的塑料海绵结构55的封装微波电路装置，替代图3的螺旋40。图5展示了利用多个片簧57的又一个封装微波电路装置。数字56表示基板，在此情况下，这会有利于用塑料模压、将片簧57与基片56作在一起。由于施压的目的是使散热板与导热导弹性物紧密接触，所以可利用母片的弹性施加压力，甚至不用弹簧。这时，与分别设置弹簧装置的情况相比较，其结构可得到简化。但是，这要求精确地设计有关母片的变形(翅曲)总量。
由于弹性特征对于母片是必不可少的，所以母片由有机材料如环氧玻璃板制成。在该连接中，电路组件可用与母片同样的有机材料制成。另一方面，当然可以应用陶瓷材料生产电路组件。这种应用陶瓷材料的情况下必须考虚到有机材料(母片)和陶瓷材料(电路组件)之间的热膨胀的差别。由于有机和陶瓷材料之间热膨胀系数的不同，所以由温度变化产生的剪切应力施加于凸台，当应力超过容限时凸台就会被损坏。容限取决于电路组件的大小。因此，当电路组件尺寸很大，并且温度在大范围内变化时，最好在电路组件和母片之间注入树脂材料，以避免应力集中在凸台上。图6展示了提供树脂60的这种结构。
可以考虑到对根据本发明的微波电路的封装结构作各种改型。当需要在电路组件内设置大容量的外部容器或低频半导体基片时，这些元件装入与表面封装系统相应的电路组件表面。作为第五个实施例的图7展示了上述情况下的封装方式，散热板3仅限制在电路组件2的表面部分，而电路组件1装在上述部分背后，在这里装入半导体元件4。而芯片有源元件41和芯片无源元件42被装在上述表面的余下部分。这时应该注意尽量不减少散热板3的面积。
如上所述，在根据本发明微波电路封装结构中，微波信号被限制在电路组件和母片内部而无须复杂、庞大且昂贵的屏蔽外壳；另外由电路组件构成整个电路主要容纳了由半导体集成电路组成的有源元件；母片装着多个电路组件，其主要功能是相互连接或集成化，使电路组件做为一个单元的标准化变为可行；并且组件批量生产的效益导致可靠性的改善和生产成本的降低。此外，甚至发现不良电路组件时，由于可用组件单元进行替换，所以还使产量得到提高。
进而根据本发明，利用散热板来扩散装在电路组件内半导体元件产生的热量，并且经导热弹性物直接把热传递到装置的热辐射板向外放出。因此，可降低半导体元件的温度，并可延长寿命。或者相反，能从半导体元件获得最有效的输出。对于母片上有多个电路组件的情况下，甚至当难以获得散热板顶面理想平直度(同一块板)时，导致出现不均匀性，这时导热弹性物可使微小误差得以缓冲，以确保优异的导热性。
如上所述，本发明的构形可被简化如此大的程度，以致于与公知的封装结构比较，其成本可大大减少。

Claims (10)

1.一种微波电路的封装结构，包括：
具有半导体元件的电路组件；
其上容纳所述电路组件的母片；
装在所述组件上，接收来自所述电路组件热量的散热板；
接收来自所述散热装置，辐射所述热量的辐射装置；
其特征在于，所述封装结构还包括：
设置在所述热扩散装置和所述辐射装置之间的导热弹性物；
沿所述辐射装置方向压住所述母片的装置；
所述电路组件包括：
其上容纳所述半导体元件的多层基片；所述多层基片有两个第一接地导体层和在两个第一接地导体层之间的第一中央导体层；所述第一中央导体层具有第一连接线路图形；
把所述第一连接线路图形引至所述电路组件表面的第一中央导电通路；
连接所述两个第一接地导体层的多个第一接地导电通路；所述多个第一接地导电通路围绕所述第一中央导电通路和围绕所述半导体元件设置。
2.按权利要求1所述封装结构，其特征是所述母片包括：
两个第二接地导体层和在两个所述第二接地导体层之间的第二中央导体层；所述第二中央导体层具有第二连接线路图形；
以及连接所述两个第二接地导体层的多个第二接地导电通路；所述多个第二接地导电通路围绕所述第二连接线路图形并在与所述第一接地导电通路相关区域配置。
3.按权利要求1所述封装结构，其特征是所述多层基片具有导热通路，把由所述半导体元件产生的热量传导至所述散热装置。
4.按权利要求1所述封装结构，其特征是所述顶压装置包括螺旋弹簧。
5.按权利要求1所述封装结构，其特征是所述顶压装置包括片弹簧。
6.按权利要求1所述封装结构，其特征是所述顶压装置包括塑料泡沫结构。
7.按权利要求2所述封装结构，其特征是是进一步包括凸台装置，把所述第一中央导电通路和所述第一接地导电通路分别连接到所述第二中央导电通路和所述第二接地导电通路。
8.按权利要求7所述封装结构，其特征是进一步包括注入所述电路组件和所述母片之间的树脂材料。
9.按权利要求1所述封装结构，其特征是进一步包括电路元件，所述电路元件与所述散热装置一起安装在所述电路组件上。
10.按权利要求1所述封装结构，其特征是还包括：
一个封装件，供封装所述电路组件、所述母片、所述散热装置、所述导热弹性体和所述顶压装置用，与所述辐射装置连接；以及
一个接插件，其端子将所述母片上的导电线路与外线路连接起来，接插件配置在所述封装件上，所述顶压装置沿所述辐射装置的方向压住所述母片时确保所述端子与所述导电线路电连接。
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CN1109258A (zh) 1995-09-27
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CA2127736A1 (en) 1995-01-13
EP0634890A1 (en) 1995-01-18
TW256982B (zh) 1995-09-11
US5500556A (en) 1996-03-19
CA2127736C (en) 1999-03-23
AU6738194A (en) 1995-01-19
DE69401040D1 (de) 1997-01-16
EP0634890B1 (en) 1996-12-04

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