CN1075390A - 电磁屏蔽及其制造方法 - Google Patents
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Abstract
一种电子设备外壳构成对电磁辐射的屏障。这
种外壳的典型截面由三个平行层组成。外表面层和
内表面层是其内悬浮有导电填充料的聚合基材料,从
而给出了有较高导电率的表面层。中间层是其中悬
浮有高导磁率的填充料的聚合基材料,从而给出了有
较高导磁率的中间层。
Description
本发明是涉及电磁屏蔽材料,并特别地涉及容纳电子部件以提供电磁幅射屏障的罩子、外壳及其类似结构的构成。
电子设备正变得更加普通和复杂。实际上在每个家庭都有消费用电子设备,诸如电器、电话、娱乐系统等。商业已把各种电子设备用于办公室和工厂之中。即使是传统的机械装置,例如汽车,也引入了更大量和更复杂的电子部件。现代数字的计算机系统则是最高级最复杂的电子设备之一。
电子设备产生电磁辐射并被电磁辐射穿透。其辐射的频率和幅度随电子设备的不同而变化。有时这种辐射是设备的正常功能所必须的,例如在选定的调谐电磁频率上传递信息的无线电发射机便是这种情况。然而,在大多数情况下,这种辐射是在设备内部发生的电子活动造成的不希望的副产品。
在数字计算设备的情况下,电磁辐射所伴随的问题特别尖锐。一个现代计算设备通常包括大量很小的活动的电子电路部件,例如快速变换状态和传递信号的晶体管。这类元件的数目及高切换速率产生了大量的电磁辐射与此同时,在其间必须完成状态变换的短时间间隔中,使电路部件对其他设备产生的杂散电磁辐射特别敏感,这种杂散辐射能引起错误的状态转换或阻止应该发生的转换,造成电子信号出错和数据丧失。
近年来,这种电磁辐射对人类健康的潜在冲击已引起越来越多的关注。虽然还没有得到关于任何这类冲击的性质的确切证据,但各种政府部门已经提议或颁布法律、法规或规则以限制电子设备发出的辐射量。很可能随着关于电磁辐射效应的信息的增多,这种限制将会更加严厉。
已经知道屏蔽电子设备的各种技术。例如,已经知道,有足够厚度的密实连续的金属外壳提供了一个良好的电磁辐射屏障。然而,这种外壳昂贵、沉重,或者可能干扰最佳设计考虑。还知道一种涂有导电涂层(通常是导电漆)的塑造塑料外壳将提供某种程度的保护。虽然这种外壳重量较轻,但是涂层处理,包括二次表面加工,能给设备增加相当高的费用,而且它并不总能提供所希望程度的屏蔽。
所以,本发明的一个目的是提供一种屏蔽电磁辐射的有效方法和设备。
本发明的另一个目的是一种容放电子部件并屏蔽电磁辐射的增强的外罩、外壳及类似的构造。
本发明的另一目的是提供构成容放电子部件并屏蔽电磁辐射的外罩、外壳及类似构造的有效方法。
本发明的另一目的是降低容纳电子部件并屏蔽电磁辐射的外罩、外壳及类似构造的造价。
本发明的另一目的是降低含有电子部件的设备所发出的电磁辐射。
本发明的另一目的是增强对电子部件的防护,以抵御杂散电磁辐射。
下面考虑附图所作的描述及权利要求将使这些目的及其他目的变得明白。
一个电子设备含有多个位于一个外壳之内的电子电路部件。在正常运转过程中,电子电路部件发射电磁辐射。外壳构成一个屏蔽,它封闭和吸收由电子电路发出的大部分辐射。
外壳可有任意的形状,以适应于所容纳部件的轮廓,但一种典型截面包括一个设在设备外部的外表面层、一个设在内部面向电子电路的内表面层以及位于外层和内层之间的中间层。外层和内层由聚合基材料(Polymetric base material)构成,其中悬浮有导电填充材料,使外层和内层具有较高的电导率。中间层是一种聚合基材料,其中悬浮有具有高导磁率的填充材料,从而使中间层有较高的导磁率和较低的导电率。
在运转过程中,电磁辐射冲击表面层,该表面层反射大部分辐射。这种反射在导电表面层中建立起电涡流及由此产生的包围表面层的磁场。该磁场在高导磁率的中间层内集中,该中间层也吸收大部分磁场能量。因为大部分能量在中间层被吸收,所以辐射不能由电涡流发射出,而在高导电率和低导磁率的单层情况下则会发生这种电涡流辐射。
在最佳实施例中,这种外壳是利用一种“共注塑方法(C-in-jeclion molding process)”制成的,在聚合基中的涂镍石墨(高导电率)从外部共注塑喷嘴注入模具,而在聚合基中的羰基铁粉末(高导磁率)则从内部共注塑喷嘴注入模具。所得到的塑造结构含有上文描述的三层,而不能在便宜的单次共注塑操作中完成。这种外壳可以由被螺栓、卡梢(snap tab)或任何常规手段固定在一起的多个共塑块组成。
在附图中:
图1是根据本发明的最佳实施例构成的典型电子设备的截面图;
图2是逻辑卡“书”式组合形式的本发明另一实施例的截面图;
图3是根据最佳实施例构成的用于典型电子设备的外壳的部分截面图;
图4描绘了制造根据最佳实施例构成的外壳所使用的共注塑设备。
图1描绘了根据本发明最佳实施例构成的典型电子设备100的截面。这个设备可以是诸如被称作个人计算机的一个小型计算机系统的系统单元。设备100包含一个外壳,在本例中它包括两部分,即安有内部部件的外壳底座部分102和构成系统单元的可见外壳的上外壳部分101,它与底座部分102一起包围和封闭了内部部件。外壳部分101和102是电接地的。内部部件包括电源103、冷却扇109、多个电路板104-108、以及相互连接这些电路板的导线111。该内部电路可通过一个或多个接口电缆110与其他电子设备(如阴极射线管显示器、键盘、调制解调器等)相连。应该理解,设备100可能包括其他未画出的部件,如磁盘驱动器。
电路板104-108包括一组电子电路部件,它们执行该设备的逻辑功能。例如,在个人计算机的情况中,这些部件通常将包括可编程微处理器芯片、各种存储器芯片、晶体振荡器、各种滤波器电容和电阻、驱动芯片等。诸如微处理器芯片和存储器芯片等的部件通常含有大量极小的置于硅片上的晶体管,以很高的速度转换状态。电路板104-108上的电子电路部件的状态变化倾向于产生射频段的电磁辐射。与此同时,这些部件对周围的辐射又很敏感。此外,电源103和风扇109等部件倾向于产生频率低得多的辐射。
外壳部分101的形状适于罩住电子部件,还要满足其他适当的设计要求,如热传导要求、美学外表等。虽部分101和102被称为外壳部分,应该理解它们并不一定要完全密封电子部件,且在外壳上可能有开口。例如,位于风扇109附近的百叶窗允许空气穿过外壳。还应该理解,在外壳中这种部分101和102的个数也是可变的。
图2显示本发明外壳部分的另一种实施例。在这一实施例中,两个外壳部分201和202被用于包围一个较大计算机系统的一部分的电路板203。外壳部分201和202为电路板203提供了机械支撑以及电磁屏蔽。在一个计算机系统的中央电子部件复合体中包含多个这类电路板组件,每个电路板组件提供不同的逻辑功能。这种电路板组件被称作“书板(book)”。在这里引入作为参考的授予Corfits等人的美国专利4,821,145号及授予Behrens等人的美国专利4,481,146号描述了这种“书板”。然而,在上述专利中并未披露根据本发明的外壳部分201和202的结构。
电子设备的外壳应构成对各种频率电磁辐射的屏障。在电路板104-8及203中包含的电子逻辑电路产生较高频率(1兆赫兹以上)的辐射。电源、风扇、及其他部件产生的辐射频率低得多。此外,由于设备的复杂性,还产生许多不同的高和低频率。为了构成对电磁辐射的有效屏障,希望的是这个屏障既具有高导电率又具有高导磁率。
对电子部件的屏蔽一般不涉及波而是涉及能量,因为从辐射源到屏蔽的距离太短(一般小于6厘米),以致近场条件占主导地位。因为1千兆赫兹(CHz)(通常电子部件产生的频谱的甚高端)的电磁辐射波长近似为30厘米,所以部件场与屏蔽直接偶合。远场或辐射波是在外壳的外部开始,它是由未被屏蔽所反射或吸收的能量造成的。
当电磁能或辐射电磁波路径上的介面呈现一个低阻抗间断面时,便构成了电磁屏蔽。高导电率材料反射电磁能量。高导磁率材料吸收电磁能量。具有上述特性的每个表面使能量有某些衰减,因此具有相同特性或具有导电率与导磁率两个特性混合特性的多层叠加对实现所需屏蔽是有用的。
单个高导电率层通常不如混合叠层有效,因为它只是反射大部分高频能量却未衰减它,而且可能会传送过去太多的低频辐射。反射在导电层中产生电涡流,所产生的场能传送外壳外部的辐射。再有,陷于单层高导电率外层内的高频能量趋向于经由互连导线及外壳上的其他孔径泄漏出去。而高导电率和高导磁率层的混合叠加构成了对这类辐射的更有效屏障。
图3是根据最佳实施例的图1所示外壳101部分的放大截面图。外壳101部分包括一个设于设备100的外部并为用户所看到的外表面层301、设于内部并面向设备100内部的电子电路的一个内表面层303、以及位于外表面层和内表面层之间的一个中间层302。
在运行时,电磁辐射撞击高导电率表面层,该层反射大部分辐射,并传送过去一小部分辐射。反射在导电表面层中形成电涡流及所造成的包围该表面层的磁场。传送过去的辐射有一部分也被另一侧的导电层反射,造成虽然已大大衰减但却类似的电涡流。由涡流感应出来的磁场集中于高导磁率的中间层,该层也吸收大部分场能。有中等导磁率的两个表面层也能吸收一些场能。因为大部分能量在间层被吸收,所以辐射未被涡流传送,从而减小了由孔径泄漏的趋势,而在单一高导电率及低导磁率的单层情况就会发生这种泄漏(例如,铸塑部分上的导电漆)。
表面层301和303是由聚合基材料构成的,该材料中悬浮导电的填充材料,使表面层相对于空气和相对于中间层有较高的导电率。中间层302是由聚合基材料构成的,其中悬浮有高导磁率的填充材料,使中间层相对于表面层有较高的导磁率和较低的导电率。在该最佳实施例中,表面层301和303约0.028-0.031英寸(0.7-0.78毫米)厚,而中间层302约为0.020-0.026英寸(0.5-0.66毫米)厚。然而,应该理解,根据所希望的结构特性或其他特性,这些厚度可以有相当大的改变。
在最佳实施例中,聚合基材料是一种适于注塑的热塑性树脂。更具体地说,该种基材料最好是ABS和聚碳酸脂的混合物,按重量计,有约40%和ABS和60%的聚碳酸脂。这种适用的基材料在市场上由Dow Chemical公司销售,名字是DOW PULSE 1725(TM-商标)。然而,应该理解,根据本发明也可以使用许多其他聚合材料。
在最佳实施例中,表面层301和303按重量计含有20%的镍涂层石墨纤维,10%至20%的羰基铁粉末,其余60%-70%是聚合基材料。适用的镍涂层石墨纤维平均为3/16英寸(4.76毫米)长,其直径为7.6微米,在市场上可从American Cyanamid公司买到。适用的羰基铁粉末是可从BASF买到的细粉末。应该理解,上述填充材料的类型和浓度是可改变的。例如,可以用不同尺寸或不同的成分(例如不锈钢)的纤维来代替该最佳实施例中的镍涂层石墨)。
表面层301和303要求有较高的导电率。表面层的电阻不应高于5欧姆/平方,最好是在2欧姆/平方。因为镍涂层石墨纤维是较昂贵的填充材料(与羰基铁粉末或ABS/聚碳酸脂基材料相比),故希望镍涂层石墨纤维的用量不超过达到所需导电率必须的用量。如上述含有20%镍涂层石墨纤维的组合物足以将表面层301和303在上述表面厚度上的电阻降至2欧姆/平方左右。不同的表面层厚度会要求不同的导电填充材料浓度。羰基铁粉末作为一种附加填充材料加入到表面层组合物中,以增大导磁率。
中间层是用来吸收辐射能的,为此,它需要高导磁率。在最佳实施例中,中间层含有悬浮于ABS/聚碳酸脂聚合物基中的羰基铁粉末。因为希望有高导磁率,中间层在结构或其他要求所能支持的范围内应含有尽可能高的羰基铁粉末含量。在最佳实施例中,中间层含有按重量计88%-92%的羰基铁粉末,其余8%-12%(重量)是基聚合物。中间层中的羰基铁粉末应与表面层中使用的羰基铁粉末有相同类型。
中间层302与表面层301、303最好含有相同的聚合基材料。因为电磁屏蔽特性是由填充材料决定的,所以通常没有理由使用不同的聚合基材料。使用相同的基材料可促使各层之间的良好结合,并有助于避免由于不同的热膨胀系数、不同的凝固温度等可能引起的问题。然而,并非必须使不同层内有相同的聚合基材料。如在另一个实施例中这种基材料就可是不同的。
图4描绘了用于制造根据最佳实施例的电磁屏蔽结构所使用的共注过程。根据公知常规技术设计和制造的适当形状的注塑模具401包括两个或多个模具部分。模具401确定一个内部空腔402,它具有所要塑造部分的大小和形状,它还含有一个或多个通向内部空腔的注入管403,通过它们可注入热塑性树脂混合物。
共注入喷嘴组合404用于将适当的热塑性树脂混合物通过注入管403注入空腔402。在某些情况下,可以使用多个喷嘴组合404,每个通过各自的注入管注入树脂混合物。每个喷嘴组合由二个同心喷嘴组成,即一个内喷嘴405和一个外喷嘴406。这两个同心喷嘴从各自的贮料斗得到要注入的材料,使各喷嘴能注入不同的混合物,事实上这正是共注塑的目的。通过外喷嘴406注入的混合物将勾划出空腔的边缘轮廓,成为所完成的塑造件的表面层。通过内喷嘴405注入的混合物将构成空腔的内部部分,成为所完成的塑造件的中间层。在最佳实施例中,镍涂层石墨纤维、羰基铁粉末,以及ABS/聚碳酸脂基组成的高导电率混合物通过外喷嘴406注入,而高导磁率羰基铁粉与ABS/聚碳酸脂基构成的高导磁率混合物通过内喷嘴405注入。
虽然图3中描绘的截面图显示出彼此分开的两个表面层,但事实上这两层塑造部件的边缘以及塑造在部件内部的任何穿通孔外都是彼此相连的。这种连接是共注塑过程的不可避免的结果。对部件的功能而言,导电表面层共同接地也是必须的,因此在边缘部分的这种连接并非是不利之处。
在最佳实施例中,多层屏蔽结构是利用共注塑过程注塑而成的。共注塑允许一步形成塑造部件,从而得到低造价部件。在另一种方法中,这种部件可利用两次喷射或三次喷射注塑成形,如同公知技术即样,使其部件多次通过不同模具而成形。作为又一种方法,这种部件能通过多步制造;即将构成不同层的各种混合物依次倒入模具,等待被倒入的一层凝固后再倒入下一层混合物,还有其他技术来构成根据本发明的多层结构。
在最佳实施例中,使用了三层来构成对辐射的屏障。这种三层结构是有利的,因为它可以利用共注塑技术方便而且便宜地制造出来。然而,应该理解,可以构成其他层数的屏蔽。例如,有可能构成具有三个同心喷嘴的共注入喷嘴组合,从而使五层迭层成为可能。另一种方式是,可以用多次喷射塑造技术或其他手段来构成附加层。在其他因素相同的情况下,更多的层会实现更高度的屏蔽,因为每一层都会对电磁辐射造成某些衰减。然而,附加层也增加了费用。层数的选择是设计时的一个可选择因素。
在最佳实施例中,本发明的多层屏蔽结构是电子设备外壳的一部分,它即能保护电子设备免受周围辐射,也能减小来自电子设备的辐射向外发射。然而,这种三明治式屏蔽结构能用于除电子设备外壳外的其他许多应用中。例如,根据本发明的屏蔽结构可以用于沿特定路径引导或反射辐射。作为补充实例,如果能够表明对人体健康的有害影响来自暴露于非离子化电磁辐射,那么这种屏蔽便可以用来保护人体免受周围辐射。
虽然已经描述了一个具体实施例及某些变形,本领域的专业人员会看出,在下述权利要求书的范围内可以在形式和细节上作出其他改变。
Claims (13)
1、用于具有多个电子电路的电子设备的一种外壳部分,其特征在于:
一个置于所述设备外部的外表面层,该层包括悬浮于聚合基中的导电填充料;
一个置于所述设备内部并对着所述电子电路的内表面层,该层包括悬浮于聚合基中的导电填充料;
一个置于所述外层和所述内层之间的中间层,它并与所述外层和内层相接触,该层包括悬浮于聚合基中的导磁性填充料。
2、权利要求1的外壳部分,其特征在于所述中间层中的所述导磁性填充料包括羰基铁粉末。
3、权利要求1的外壳部分,其特征在于所述导电填充料包括镍涂层石墨纤维。
4、权利要求1的外壳部分,其特征在于所述外壳部分是由共注塑过程成形的注塑部件。
5、权利要求4的外壳部分,其特征在于所述中间层中的外述导磁性填充料包括羰基铁粉。
6、权利要求4的外壳部分,其特征在于所述填充导电填充料是完全相同的并包括镍涂层石墨纤维。
7、权利要求4的外壳部分,其特征在于所述聚合基料均包括ABS和聚碳酸脂的混合物。
8、一种电磁屏蔽结构,其特征在于:
一个第一层,所述第一层包括悬浮于聚合基中的导电填充料;
一个第二层,所述第二导包括悬浮于聚合基中的导电填充料;
一个第三层,置于所述第一层和所述第二层之间,它在它们的大致全部长度上将这两层分开,所述第三层包括悬浮于聚合基的导磁性填充料。
9、权利要求8的电磁屏蔽结构,其特征在于所述结构包括由共注塑过程成形的注塑部件。
10、制造电磁屏蔽结构的一种方法,其特征在于下述步骤:
制成一个适于所述结构的形状的注塑模具;
将悬浮于聚合基材料中的导电填充料装入供共注塑过程的外喷嘴使用的贮料斗;
将悬浮于聚合基材料中的导磁性填充料装入供共注塑过程的内喷嘴使用的贮料斗;
用所述外喷嘴将所述悬浮于聚合基材料中的导电填充料注入所述注塑模具,并同时用所述内喷嘴将所述悬浮于聚合基材料中的导磁性填充料注入所述注塑模具。
11、权利要求10的方法,其特征在于所述导磁性填充料包括羰基铁粉末。
12、权利要求10的方法,其特征在于所述导电填充料包括镍涂层石墨纤维。
13、权利要求10的方法,其特征在于所述聚合基材料均包括ABS和聚碳酸脂的混合物。
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US11715914B2 (en) | 2014-01-22 | 2023-08-01 | Amphenol Corporation | High speed, high density electrical connector with shielded signal paths |
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US9947503B2 (en) | 2015-07-17 | 2018-04-17 | Siemens Healthcare Gmbh | Magnetic shielding of an X-ray emitter |
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US11539171B2 (en) | 2016-08-23 | 2022-12-27 | Amphenol Corporation | Connector configurable for high performance |
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US11469553B2 (en) | 2020-01-27 | 2022-10-11 | Fci Usa Llc | High speed connector |
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Also Published As
Publication number | Publication date |
---|---|
BR9205014A (pt) | 1993-07-06 |
US5714102A (en) | 1998-02-03 |
CA2080177A1 (en) | 1993-07-03 |
TW234236B (zh) | 1994-11-11 |
KR0119373B1 (ko) | 1998-08-01 |
US5571991A (en) | 1996-11-05 |
ES2089467T3 (es) | 1996-10-01 |
EP0550373A1 (en) | 1993-07-07 |
EP0550373B1 (en) | 1996-06-12 |
KR930017477A (ko) | 1993-08-30 |
JPH05327275A (ja) | 1993-12-10 |
SG42884A1 (en) | 1997-10-17 |
MY110820A (en) | 1999-05-31 |
CA2080177C (en) | 1997-02-25 |
HK202096A (en) | 1996-11-15 |
JPH07123197B2 (ja) | 1995-12-25 |
CN1028141C (zh) | 1995-04-05 |
DE69211518D1 (de) | 1996-07-18 |
DE69211518T2 (de) | 1996-11-28 |
ATE139406T1 (de) | 1996-06-15 |
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