CN1109375C - 低串音组合式通讯接头 - Google Patents

低串音组合式通讯接头 Download PDF

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CN1109375C
CN1109375C CN99118415A CN99118415A CN1109375C CN 1109375 C CN1109375 C CN 1109375C CN 99118415 A CN99118415 A CN 99118415A CN 99118415 A CN99118415 A CN 99118415A CN 1109375 C CN1109375 C CN 1109375C
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conductor
group
communication connector
idc
combined communication
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CN1245985A (zh
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迈克尔·多尔希
安德鲁·J·施特勒德
拉塞尔·A·范德胡夫
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Panduit Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6464Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6467Means for preventing cross-talk by cross-over of signal conductors
    • H01R13/6469Means for preventing cross-talk by cross-over of signal conductors on substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/502Bases; Cases composed of different pieces
    • H01R13/506Bases; Cases composed of different pieces assembled by snap action of the parts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/031Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for multiphase cables, e.g. with contact members penetrating insulation of a plurality of conductors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/941Crosstalk suppression

Abstract

一种组合式通讯接头包括一限定一插头接口的壳体和一滑板,而滑板上安装着与导体配合的印刷线路板,以便改善串音性能。该接头还包括一线约束夹头,以便简化组合式接头的现场端接。该接头是这样安装的:将导体和印刷线路板安装在滑板上,使滑板与壳体相对固定,使线固定在线约束夹头上,然后使夹头与滑板相对固定,从而将线端接。

Description

低串音组合式通讯接头
技术领域
本发明涉及组合式通讯接头,特别涉及使用印刷线路板设计和导体结构的组合式通讯接头,以便提供改进的串音性能并简化线的端接。
背景技术
标准的电话插座接头和大致类似结构的其它组合式接头在通讯工业里是众所周知的。然而,随着不断增加的信号传输率,存在着对具有改进的串音性能的组合式通讯接头的需要。此外,继续具有简单的现场端接能力对于这种接头来说也是非常重要的。因此,通讯接头提高性能的要求产生了这样一个需要,即用非常经济的方法制造的组合式通讯接头既能容易地现场端接,又能较好地清除串音干扰。
发明内容
本发明的一个目的是提供一种具有改进的串音性能的组合式通讯接头。
本发明的另一个目的是提供一种具有简化的现场端接能力的组合式通讯接头。
总的来说,一种组合式通讯接头包括一形成有一插头接口的壳体;一支承许多导体的导体承载滑板,各导体包括沿大致平行于插头接口的入口轴线的方向向后延伸的绝缘错位接触(IDC)部分;以及一线约束夹头,它具有使线相对于IDC部分定位的装置,所述夹头能与导体承载滑板的一部分啮合并沿着该部分滑动。该接头还使用装有电容器的印刷线路板(PCB),这些电容器与导体结构配合可改进综合串音性能。导体的IDC部分被布置成上下两排各四个IDC部分,且在两排各端处的上下IDC部分端接一线对,各排的两中间IDC部分端接一线对,而印刷线路板包括至少三层,其中,外层包含许多连接第一组导体和第二组导体的迹线,印刷线路板还包括形成于PCB中层上的电容器,以便影响接头的串音性能。
本发明还提供一种组合式通讯接头,它包括:一壳体,它限定一在第一端的插头接口;一滑板,它支承一印刷线路板并可与壳体相对固定;第一组导体,其在位于插头接口里的第一端处具有通讯接触部分,而第二端可与印刷线路板(PCB)连接;第二组导体,它包括可与PCB连接的第一端,以及在第二端处的绝缘错位接触(IDC)部分;以及一线约束夹头,它具有使线相对IDC部分定位的装置。
本发明还提供一种组合式通讯接头,包括一限定一插头接口的壳体,所述插头接口里设有第一组导体,而各导体具有按照标准的电话接线构造设置的部分;其中,所述接头还包括:第二组导体,各导体具有端接通讯电缆的线对的绝缘错位接触(IDC)部分,其中,IDC部分被设置成上下两排各四个,在两排各端部处的上下IDC部分端接一线对,而各排的两中间IDC部分端接一线对。
本发明还提供一种组合式通讯接头,包括一限定一插头接口的壳体,所述插头接口里设有第一组导体,而各导体具有按照标准的电话接线构造设置的部分;以及第二组导体,各导体具有端接通讯电缆的线对的绝缘错位接触(IDC)部分;其中,所述接头还包括:一可与第一组和第二组导体连接的印刷线路板,所述印刷线路板包括至少三层,其中,外层包含许多连接第一组导体和第二组导体的迹线;以及形成于PCB内层上的、以便影响接头的串音性能的电容器。
附图的简要说明
图1是实施本发明构思的一非固定的组合式通讯接头的前视立体图;
图2是图1中的接头的后视立体图;
图3是图1中的接头的后视立体分解图;
图4是图1中的接头的仰视立体分解图;
图5是图1中的接头的部件装配图,它显示了与壳体连接前的滑板;
图6是图1中的接头的部件装配图,它显示了在端接前的线约束夹头;
图7是图1中的接头的俯视图,它显示了在端接前的线约束夹头;
图8是沿图7中的8-8线的剖视图;
图9是沿图7中的9-9线的剖视图;
图10是沿图7中的10-10线的剖视图;
图11是沿图9中的11-11线的剖视图;
图12是双绞线和PCB上的触头结构的立体图,其中,双绞线上没有线约束夹头,而触头结构上没有壳体、滑板和IDC块;
图13是线路板顶层的平面图;
图14是第二层的平面图,它与印刷线路板的第三层相同;
图15是印刷线路板底层的平面图;
图16是PCB的平面图,其中切掉一部分,以便看到下层;以及
图17是沿图16中的17-17线的印刷线路板的剖视图。
具体实施方式
在附图中,体现本发明构思的组合式通讯接头通常用标号10表示。如图1和2所示,接头10包括一限定一插头接口14的壳体12,一导体承载滑板30,以及一用来端接具有许多通讯线28的通讯电缆70的线约束夹头20。
从图3-6中可看到,接头10包括导体承载滑板30,它支承印刷线路板(PCB)50及第一和第二组导体。第一组导体32具有在第一端处的弹性接触部分34,它们位于与标准的电话插头配合的插头接口里。这种接头界面的标准是提供从1到8共8个横向间隔的导体,其中,按照该标准,导体对由相关的线对限定。具体地说,标准的成对布置是,线4和5组成线对1,线3和6组成线对2,线1和2组成线对3,而线7和8组成线对4。如图8和1 2所示,各导体32还包括在第二端的柔性脚,从而使导体32不需要焊接就能固定在PCB 50上。
第二组导体36各包括一在一端的、用来与PCB 50连接的柔性脚和在第二端的IDC部分38。第二组导体36的结构使IDC部分38沿着与插头接口14的入口轴线平行的方向向后延伸。入口轴线通常是在水平方向上,标准的电话插头将插入其中,以便与接头里的弹性触头配合。第二组导体36先放置在IDC块42里,而IDC块42在制造和组装过程中是有用的。IDC块42具有安装槽和便于正确地定位在滑板30上的销子。在将PCB 50和导体32和36组装在滑板30上后,将滑板30插入壳体12的后端,从而使第一组导体32的弹性接触部分34位于壳体12的插头接口14里,而IDC部分38水平延伸朝向后端,以便与线28端接,如图6所示。壳体上的闩锁使其与滑板相对固定。
从图3、4、6和8中可看到,线约束夹头20具有电缆口26,以便让扁平的或圆的电缆能够进入线约束夹头。线约束夹头20的前端包括8个纵向排列的线槽22。这样,当电缆的双绞线通过电缆口时,各线可被导入它们各自的线槽22。在线约束夹头20上可附一份画有接线图的标签,以便给使用者提供帮助。在线槽22的下面设置具有导槽25的连接壁24,以便与在滑板30后端各横向侧面上的导轨40啮合,允许夹头20沿滑板30滑动,从而在端接过程中提供适当的接线位置。
通常,在通讯接头里,在接近接头导体的各部分处会发生串音现象。即,串音会发生在插头配合端的弹性接触部分的相邻导体之间,在PCB的相邻触头之间,以及在相邻的IDC部分之间。在所示的较佳实施例里,接头的综合串音性能将提高,这是通过将可能发生的相邻导体之间的串音干扰降至最低程度和在特有的PCB设计中使用电容器以抵消所有的串音现象而实现的。
从图13-16可看到,印刷线路板50是四层线路板,并具有许多贯通所有四层的通孔,各通孔分别与第一或第二组导体32或36中的柔性脚之一对应。顶部外层52和底部外层56包含有迹线58,以便通过它们各自的导电通孔使第一组导体32和第二组导体36互相连接。两内层54是相同的,因此在图14中只画了一层。在适当的设计中使用的、以便减少串音的10个电容器60中的7个安装在中间两层54上。外层52和56上也有3个电容器60,在较佳的设计里,由于空间和电容器布局约束的原因,它们一般不安装在中间层54上。
可以看到,成对的导电迹线58相对而言具有相同的长度并相互靠近延伸,以便获得适当的、具有恢复/衰减作用的阻抗,以减少可能的远端串音(FEXT)作用。应该看到,迹线的厚度是可以调整的,以便得到所需的阻抗。此外,一些接触的线对具有在线路板相对两侧延伸的迹线58,以便使该区域内的近端串音(NEXT)降至最低程度。例如,供线对1和4用的迹线4和5及迹线7和8分别位于底板上,而供线对2和3用的迹线3和6及迹线1和2分别位于顶板上。
在PCB上增加电容是为了补偿发生在整个接头装置中的不同线对的相邻导体之间的串音。电容可以多种方式加入。电容可作为芯片加入到线路板里,也可以利用垫片或指形电容器一体形成于线路板上。
在所示的较佳实施例里,电容器是以指形或叉指式的电容器形状加入并与导体对连接。电容器是通过与它们连接的导体识别的,在该导体上加入电容,以便抵消通过一对导体中的另一导体可看到的串音现象。例如,C46表示连接导体4和6的指形电容器,它使整个接头中的导体4和6之间发生的串音与在导体5和6之间发生的串音相互抵消。
从图12中可清楚地看到,用来端接通讯电缆中的线对的IDC部分38被布置成两排各四个。触头是这样布置的,在每排各端处的上下IDC部分各端接一线对,而每排的两个中间IDC部分各端接一线对。具体地说,如上面所述的,标准的线对布置是,线4和5组成线对1,线3和6组成线对2,线1和2组成线对3,而线7和8组成线对4。在工业标准里,奇数线是线对中的端头,而偶数线是线对中的回路。如图12所示,包括触头1和2的触头对3和包括触头7和8的触头对4分别位于两排IDC部分的左右端。包括触头3和6的触头对2位于上排的两中间IDC部分处,而包括触头4和5的触头对1位于下排的两中间IDC部分处。这种特殊的IDC布置改善了串音性能,它是通过将任何额外的不需要的串音降至最低程度、同时有助于抵消在标准的插头和夹头接触结构中存在的串音现象而实现的。此外,这种IDC布局允许线对保持扭绞,以便尽可能地接近IDC,这有助于减少在接头中需要抵消的串音。这样,这种IDC布置允许简化PCB电容器设计。
因此,提供预先组装的壳体12和滑板30,其中滑板30包含印刷线路板50、第一组触头32、第二组触头36和IDC块42,并使与插头配合的弹性接触部分34位于插头接口14里,使IDC部分38水平放置,以便接纳各线28。将通讯电缆70插入线约束夹头20的电缆口26里,并使各线28插入各线槽22里和将多余的线切掉。最后,通过线约束夹头20连接壁24上的导槽25与滑板30上的导轨40啮合并向前滑动,直至获得适当的端接并通过悬臂式闩锁锁定而将线约束夹头20安装在滑板30上。
虽然显示了和描述了本发明的较佳实施例,但对于本技术领域里的技术人员来说非常显而易见的是,在不脱离本发明范围的情况下还可有许多变化和改进。在上面的介绍和附图里描述的内容只是用来说明本发明而并不是限制本发明。本发明的具体范围由附后的权利要求书限定。

Claims (18)

1.一种组合式通讯接头,其特征在于,它包括:
一形成有一插头接口的壳体;
一支承许多导体的导体承载滑板,各导体包括沿大致平行于插头接口的入口轴线的方向向后延伸的绝缘错位接触(IDC)部分;以及
一线约束夹头,它具有使线相对于IDC部分定位的装置,所述夹头能与导体承载滑板的一部分啮合并沿着该部分滑动。
2.如权利要求1所述的组合式通讯接头,其特征在于,所述夹头包括一对连接壁,而连接壁包括与一对形成于滑板上的导轨配合的导槽。
3.如权利要求1所述的组合式通讯接头,其特征在于,所述滑板还支承着一印刷线路板(PCB),而PCB上具有降低在相关的一对导体之间的串音干扰的装置。
4.如权利要求3所述的组合式通讯接头,其特征在于,所述印刷线路板包括至少三层,其中,外层包含许多连接第一组导体和第二组导体的迹线,印刷线路板还包括形成于PCB中层上的、以便影响接头的串音性能的电容器。
5.如权利要求1所述的组合式通讯接头,其特征在于,所述滑板与壳体固定后使许多弹性接触部分位于插头接口里。
6.一种组合式通讯接头,其特征在于,它包括:
一壳体,它限定一在第一端的插头接口;
一滑板,它支承一印刷线路板并可与壳体相对固定;
第一组导体,其在位于插头接口里的第一端处具有通讯接触部分,而第二端可与印刷线路板(PCB)连接;
第二组导体,它包括可与PCB连接的第一端,以及在第二端处的绝缘错位接触(IDC)部分;以及
一线约束夹头,它具有使线相对IDC部分定位的装置。
7.如权利要求6所述的组合式通讯接头,其特征在于,所述夹头可与滑板相对固定并在滑板上滑动。
8.如权利要求6所述的组合式通讯接头,其特征在于,用来使线定位的装置包括设置在夹头前端的多个纵向排列的线槽。
9.如权利要求6所述的组合式通讯接头,其特征在于,IDC部分被安装成沿与插头接口的入口轴线平行的方向向后延伸。
10.如权利要求6所述的组合式通讯接头,其特征在于,PCB包括使导体上的串音现象降低的装置。
11.如权利要求6所述的组合式通讯接头,其特征在于,PCB共包括四层,其中,顶层和底层包括使第一组导体与第二组导体连接的迹线。
12.如权利要求11所述的组合式通讯接头,其特征在于,中间两层包括用来降低在导体上的串音现象的电容器。
13.一种组合式通讯接头,包括一限定一插头接口的壳体,所述插头接口里设有第一组导体,而各导体具有按照标准的电话接线构造设置的部分;其特征在于,所述接头还包括:
第二组导体,各导体具有端接通讯电缆的线对的绝缘错位接触(IDC)部分,其中,IDC部分被设置成上下两排各四个,在两排各端部处的上下IDC部分端接一线对,而各排的两中间IDC部分端接一线对。
14.如权利要求13所述的组合式通讯接头,其特征在于,第二组导体的第二端固定在一印刷线路板上,而该印刷线路板具有使第二组导体与第一组导体连接的迹线。
15.如权利要求13所述的组合式通讯接头,其特征在于,所述IDC部分被设置成沿与插头接口的入口轴线平行的方向向后延伸,而所述接头还包括一线约束夹头,所述夹头具有使线相对IDC部分定位的装置,所述夹头可与导体承载滑板相对固定并可沿所述滑板滑动。
16.一种组合式通讯接头,包括一限定一插头接口的壳体,所述插头接口里设有第一组导体,而各导体具有按照标准的电话接线构造设置的部分;以及第二组导体,各导体具有端接通讯电缆的线对的绝缘错位接触(IDC)部分;其特征在于,所述接头还包括:
一可与第一组和第二组导体连接的印刷线路板,所述印刷线路板包括至少三层,其中,外层包含许多连接第一组导体和第二组导体的迹线;以及
形成于PCB内层上的、以便影响接头的串音性能的电容器。
17.如权利要求16所述的组合式通讯接头,其特征在于,PCB包括两个内层,它们分别具有形成于其上的电容器。
18.如权利要求17所述的组合式通讯接头,其特征在于,两个内层是相同的。
CN99118415A 1998-08-24 1999-08-24 低串音组合式通讯接头 Expired - Lifetime CN1109375C (zh)

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HK1028845A1 (en) 2001-03-02
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EP1923970A2 (en) 2008-05-21
US6371793B1 (en) 2002-04-16
AU4468199A (en) 2000-03-09
CN1245985A (zh) 2000-03-01
BR9903885A (pt) 2000-09-05
DE69927451T2 (de) 2006-07-06
JP2000067979A (ja) 2000-03-03
EP1622234A1 (en) 2006-02-01
RU99118014A (ru) 2001-08-20
DE69927451D1 (de) 2005-11-03

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