CN1152972A - 屏蔽连接件和具有涂覆孔的板的组件 - Google Patents
屏蔽连接件和具有涂覆孔的板的组件 Download PDFInfo
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- 238000000576 coating method Methods 0.000 description 11
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- 230000004907 flux Effects 0.000 description 6
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- 239000000758 substrate Substances 0.000 description 6
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- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
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Abstract
具有至少一个屏蔽连接件(2、12、17、50)和一个板(1)的组件,各屏蔽连接件与所述板(1)的预定一侧相连接并具有至少一个信号触点元件(3),该触点元件装入板(1)的孔(7)中,该连接件具有一个屏蔽外壳(61)以屏蔽每个信号触点元件(3),其中板(1)除装配连接件(2、12、17、50)的区域。在其一侧具有一个第一连续导电层(9),而在其另一侧具有一个第二连续导电层(10),各屏蔽连接件外壳与所述导电层(9、10)这一呈电连接状态,以防止任何一个所述触点元件(3)发出的电磁辐射传播到外界。
Description
本发明涉及具有至少一个连接件和一个板的组件,每一连接件与所述板的预定的一侧相连接并具有至少一个装入板上孔中的信号触点元件,连接件具有导电的连接件屏蔽部件以屏蔽每一个信号触点元件。
这种组件可从US-A-4874319得知,该专利已转让给本专利申请的申请者,并且该发明描述了减小电磁辐射影响的连接件-板连接方式,该辐射通过从连接件伸入板中的信号触点元件而产生。已知的连接件具有一系列叶片型弹性接地触点,该触点位于连接件内的信号触点元件的相反一侧。连接件和板之间为直角连接。为达到这种直角连接,信号触点元件和叶片型接地触点均从连接件的后侧伸出并弯曲90°。但是,信号触点元件未经屏蔽穿过板上的相应穿孔,因而没有完全屏蔽。当使用非常高的频率时,如频率范围在50MHz至15GHz之间,信号触点元件仍会起到发射不必要的电磁辐射的天线作用。
US-A-4697858提出了底板和几种印刷电路板(PCB)的连接方式(图5)。底板的一侧载有各具有几个端子的芯片元件。例如如图7所示,某些芯片端子通过盲孔与底板中的内总线相连接并达到相应总线的深度。其它芯片端子通过盲孔与内部接地平面相连,盲孔达到了内部接地表面的深度。还有其它的带有信号的芯片端子通过穿透整个底板的信号触点元件与从PCB伸出的信号柱相连接。这些信号触点元件从连接件中伸出,从而可与PCB配接,并且信号触点元件位于底板上与装有芯片元件一侧相反的一侧。所述连接件都没有屏蔽,并且信号触点元件未屏蔽地穿过所述底板。底板中的总线位于两个单独的接地平面之间以得到一个适当的阻抗水平。因而没有提供EMC保护措施。
本发明源于以下问题,即在现有设备中,与板相连的连接件的信号触点元件穿透整个涂覆穿孔并在板的另一侧也产生电磁辐射,例如所述板为PCB或底板。图1展示了连接件42和板41的连接,如PCB或底板。如图所示一个信号触点元件43从连接件42中伸出并穿过涂覆穿孔40。需要了解的是“信号触点元件”指的是连接件42的那些触点元件,该连接件42在操作过程中用于负载信号即为非接地元件。
连接件42具有一个导电层47以屏蔽触点元件43。所以连接件42为同轴连接件。
在现有的连接件-板连接方式中,每一信号触点元件43在板41上与连接件42相反的一侧的穿孔中伸出或至少到达板41的另一侧,如本专利申请者于1994年4月12日提出的国际专利申请WO-NL-94/00075中的图16所示。由于从板41中伸出的信号触点元件没有屏蔽,所以它像一个天线一样发射电磁辐射,该电磁辐射会导致交叉干扰或影响邻近的电路元件。
本发明的目的是提供一种具有一个板和至少一个连接件的组件,该组件中每一连接件的每一信号触点元件都不会向外界发出不必要的电磁辐射。
为达到这个目的,根据本发明的该组件具有以下特点,所述连接件屏蔽部件具有一个包围每个触点元件的屏蔽连接件外壳,每一个孔在其内表面上具有一个导电层,并且,除了要装连接件的区域,所述板在其一侧具有一个第一连续导电层而在与第一导电层相反的一侧具有一个第二连续导电层,为了防止任何一个所述信号触点元件产生的电磁辐射传播到外界,每一屏蔽连接件外壳均与所述导电层之一相连,通过采取这些措施,各连接件和板两侧的导电层的屏蔽作用基本无泄漏地屏蔽往了发自触发元件的电磁辐射。当连接件具有同轴或双轴作用时,这种作用保留下来。通过在每个孔的内表面加一个导电层,便提供了信号触点元件与其它电路元件的连接触点区域,例如通过板内的信号层。
所述板最好具有至少一个导电盲孔和至少一个信号层,该信号层与所述导电盲孔相连接,各信号触点元件装入相应的盲孔中。
如果需要,所述导电层之一可以覆盖一绝缘层,例如为了防止所述导电层与带有一定电压的其它金属部件相连接,可采取这种方法。
在本发明组件的一个实施例中,每一连接件与板的一侧相连接而第二连接件与所述板的另一侧相连接,并且第一连接件的一个触点元件装入第一个孔中而第二连接件的一个触点元件装入第二个孔中,第一和第二孔互相对准。由于连接件可以连接在板上相反的一侧并具有对准的触点元件,所以封装密度可以增大。
在这种实施例中,板中也可以具有接地层以隔离第一和第二孔。
所述第一和第二孔可以是一个导电穿孔的一部分,并且第一连接件的所述触点元件与第二连接件的所述触点元件呈电连接状态。
每一个触点元件可以带有频率范围为50MHz至15GHz的信号。本发明的组件对每一个触点元件的天线作用都具有极好的屏蔽效果,甚至是在以上频率范围内。
各盲孔的深度可小于1.5mm并且直径可小于1.2mm。这些尺寸可以通过现有的制造方法而得到,并可应用于通常具有1.6mm厚度或更厚的PCB中的盲孔。另外,这些尺寸促进了连接件技术中微型化的发展。该技术越来越重要但需要强化防备措施以消除带信号触点元件的天线作用的不良影响,尤其在高频应用的情况下。
各信号触点元件最好采用压入配合连接方式与其相应的孔连接。这种连接具有很大的制造上的优点。但是各信号触点元件也可通过焊接与其相应的孔连接。还有一种方法,触点元件可以装入插座之中,该插座插入板的孔中。
本发明也涉及上述组件中的板,该板具有至少一个所述第一导电层位于其一侧和位于第一导电层另一侧的所述第二导电层,所述导电层除了在装配连接件的区域外都是连续的,其中用于装配所述连接件的触点元件的孔位于板上该所述区域,每一个孔都个有一个位于其内表面的导电层。
通过以下详细说明并结合附图,本发明的其它目的和进一步的适用范围会明显地呈现出来,附图中相同的参考编号代表相似的部件。
图1是以前文献中典型增强连接件和板连接在一起的组件;
图2是根据本发明连接在一起的连接件和板的组件;
图3展示了根据本发明的一些连接件与板的另一种组件;
图4是根据本发明的板中的盲孔的放大剖面图;
图5a至5d展示了图4中V-V线上盲孔可能的剖面放大图,所述盲孔与压入配合触点元件相适配,以及
图6和7展示了插座的剖面图,该插座可以插入本发明的板的孔中。
图2展示了连接器2和板1之间根据本发明进行连接的实施例。连接器2具有一导电层61。板1可以是一个印刷电路板(PCB)、一个底板或其它适当的基片。连接器2的两个信号触点元件3从连接器2伸进板1中相应的盲孔7内。为了防止来自信号触点元件3的任何辐射达到外界。连接器2来用适当的屏蔽方法进行屏蔽。如精通该工艺的人所知,这种屏蔽作用可以通过采用涂覆-导电层的塑料连接器来得到,该涂层与大地相连。或者,连接器2可以具有一个单独的金属外壳用于包围所有信号触点元件。连接器2的屏蔽层与地线或接地平面9相连接,该地线或接地平面9位于板1上连接器2一侧。地线或接地平面9和连接器2的导体层61之间的连接可以通过适当的紧固部件8来完成,精通该工艺的人会了解这一点。
每一盲孔7均涂覆一层合适的金属涂层。所述金属涂层与信号层4和/或5接触。通过选择信号层4、5和接地平面9之间的预定的距离,可以预定所述线4、5的阻抗,因此,如精通本文献的人所知,该阻抗可与连接器2相匹配。
信号触点元件装入盲孔之中,例如通过压入配合或通过焊接方法。每一个信号触点元件3可以装备一个附加的伸展部分以增强每个信号触点元件和它的相应的盲孔的电气接触(后面将参考附图给予解释)。
接地平面10布置在板1上与连接器2相反的一侧。
因为信号触点元件3均不从板1上与连接器2相反的一侧伸出,并且该侧覆有接地表面10,所以从信号触点元件3发出的辐射干扰不会进入接地表面10以下的区域(该“以下”意指与连接器2相反的接地表面10一侧,并且不限于本发明的范围内)。
如果需要,接地表面9或接地表面10或者二者均具有一个绝缘层以防止与其它电气部件或元件的短路。
图3展示了本发明组件的另一个实施例。图3中,板1与四个屏蔽的连接器2、12、17、50相。连接器17具有一个信号触点元件11并具有一个导电层62。连接器12也具有一个信号触点元件13。需要了解的是图3或图4所示的信号触点元件的数量并不受此限制。图3显示,信号触点元件11装入涂覆盲孔37中,该孔与信号层4呈电接触状态。信号层4也与涂覆盲孔27呈电接触状态,该盲孔接受连接器2的信号触点元件3之一。
连接器12和50与板1上连接器2、17相反的一侧连接。连接器12通过信号触点元件13与板1相连该元件13装入涂覆盲孔28,该涂覆盲孔28与板1中的信号线16呈电接触状态。连接器12具有一个导电层63,该导电层63通过适当的紧固部件29与接地表面10相连。为防止信号触点元件3和11产生的辐射达到板1的另一侧,板1中还有另一接地平面15以将板1的盲孔27和板1另一侧的盲孔28隔离。
位于板1一侧的盲孔可以不与其另一侧的盲孔对准。但是,如图3所示,其中的一些可以对准。图3显示,装入连接器2的信号触点元件3之一的盲孔27与板1另一侧的盲孔28对准。为防止盲孔27中的信号触点元件3和盲孔28中的信号触点元件13相互干扰,在信号触点元件3和信号触点元件13的端部之间,连续穿过另一接地平面15,如标号14简要所示。
具有对准的盲孔27和28的板1可以按以下步骤来制造:在一定的温度和压力下通过压合几个薄板层(例如8层)做成一个多层板,每一薄板层厚0.1mm并且在预定的位置上均具有适当的涂覆穿孔,所有板层的孔均对准在要求的位置上;在所述的连续基片上压上导电接地平面15;再在所述导电接地平面15上压上一层0.1mm厚的基片;然后再压上几层薄板层(例如8层),每层0.1mm厚并在预定的位置具有涂覆穿孔,所有板层的穿孔均在所述基片上对准。也可以采用其它的制造方法。例如,导电接地平面15可以是一绝缘基片,上面涂覆铜或其它的金属,如基片可为编织玻璃纤维树脂材料FR4。
原则上,在板1钻盲孔也是可以的。但是上述的堆层法用于制造多层板1更合适,因为在涂覆盲孔以后,盲孔经常为圆锥形并在板表面上具有最小的直径。这样会使触点元件更容易插入这种盲孔。另外,这种锥形的涂覆盲孔会导致涂覆盲孔和插入的触点元件接触不良。
图3还展示,连接器50具有一导电层64,该导电层通过适当的紧固部件与接地层10相连接。连接器50具有一个触点元件51伸入涂覆盲孔中并达到导电层5的深度。所以触点元件51与导电层5呈电接触状态。为防止与接地平面15短路,后者具有一个足够大的穿孔以防止与触点元件51接触。
需要了解的是,也可以用一个或多个穿透板1的涂覆穿孔来代替盲孔,该穿孔在板的一侧接触屏蔽连接件的一个触点元件而在板的另一侧接受屏蔽连接件的另一个触点元件,因而在两个触点元件之间建立起电接触状态。
图4展示了板1中盲孔7的放大图,该孔中装入一个信号触点元件3。盲孔7涂覆有导电层44,该导电层与板1中的信号线4呈电接触状态。为了使信号触点元件3更容易地插入盲孔7中,盲孔7至板1侧面的边39为斜切边。
可以看出,图4为清楚起见去掉了连接件外壳2和接地平面9。
盲孔7的最大直径最好小于1.5mm,位于板1之中盲孔7的直径最好小于1.2mm并且其深度h可以小于1.5mm。如果深度h小于1.5mm,则在3.2mm厚的印刷电路板上设两个反向的对准盲孔是可能的(如图3中的27.28)。如上所述,1994年4月12日的国际专利申请WO-NL-94/00075提出了一种压入配合,其中涂覆穿孔的直径为0.6mm,印刷电路板的厚度为1.6mm。
压入配合触点元件的剖面可以具有不同的形状。图5a至5d展示了压入配合触点元件的各种适当的形状,该触点元件与盲孔7中的导电涂层44相接。图5d中的信号触点元件3具有一个伸展部分6,当信号触点元件3装入盲孔7中时该伸展部分6在信号触点元件3和盲孔7之间产一个保持力。这种微型压入配合连接的细节在上面提到的国际专利申请WO-NL-94/00075之中有详细描述。并且关于这些保持部件6的所有详细情况通过参考方式包括在本专利申请之中。
需要了解的是,虽然图5a至5d均涉及压入配合连接,但采用焊接连接也是可以的,如采用另外的焊剂,该焊剂可建立一种永久的焊接。但是由于压入配合具有容易维修的特点,所以最好采用压入配合。再者,其中的孔不需要涂覆。
也可以采用其它的方法制造导电孔,如导电套或导电插座。
图6简要展示了一个微型插入插座71的放大剖面图,该插座插入盲孔72中。插入插座71的更详细的情况,参考了转让给Beng电子公司的US-A-3681738。由US-A-3681738提出的插入插座71的所有细节通过参考方式包括在本发明之中。插入插座71可以通过焊剂73焊接在盲孔72之中,该焊剂改善了与信号层74的接触。
图7简要展示了可用于本发明的另一种插座81。该插座81插入盲孔82,并且如果需要的话通过焊剂83与盲孔82的内壁相连接。通过采用焊剂改善了信号层84和插座81之间的电接触。插座81从转让给Berg电子公司的US-A-3504328中获知,并且其内容通过参考的方式包括在本发明之内。
对于精通本文献的人会很清楚,图6和7展示了可用于本发明的插座和孔。也可以采用其它插座。另外,也可以用穿孔来代替盲孔,并且插座的应用并不仅限于一个信号层74、84。
Claims (12)
1、具有至少一个连接件(2)和一个板(1)的组件,各连接件(2)与所述板(1)的预定一侧相连接并具有至少一个装入板(1)上孔(7)中的信号触点元件(3),连接件具有导电的连接件屏蔽部分(61)以屏蔽每个信号触点元件(3),其特征在于,所述连接件屏蔽部分(61)具有一个屏蔽连接件外壳以包围每个触点元件(3),每一个孔(7)具有一个位于其内表面的导电层(44),并且所述板(1)除了装配连接件(2、12、17、50)的区域,在其一侧具有一个第一连续导电层(9)和一个位于其另一侧的第二连续导电层(10),每一屏蔽连接器外壳与所述层(9、10)之一相连接,以防止所述信号触点元件(3)发出的电磁辐射传播到外界。
2、如权利要求1的组件,其特征在于,板(1)具有至少一个导电盲孔(7)和至少一个信号层(4、5),该信号层与所述导电盲孔(7)相连接,各信号触点元件(3)装入相应的盲孔(7)。
3、如权利要求1或2的组件,其特点为,所述导电层之一(10)覆盖一个绝缘层。
4、如权利要求1的组件,其特征在于,第一连接件(2)与板(1)的一侧相连接而第二连接件(12)与所述板的另一侧相连接,并且第一连接件(2)的一个触点元件(3)装入第一孔(27)而第二连接件(12)的一个触点元件(13)装入第二孔(28),第一(27)和第二(28)孔互相对准。
5、如权利要求4的组件,其特征在于,接地层(15)位于板(1)之中以隔离第一(27)和第二(28)孔。
6、如权利要求4的组件,其特征在于,第一(27)和第二(28)孔为一个导电穿孔的一部分,并且第一连接件(2)的所述触点元件(3)与第二连接件(12)的所述触点元件(13)呈电连接。
7、如以上权利要求之一的组件,其特征在于,各触点元件带有的信号频率范围为50MHz至15GHz。
8、如以上权利要求之一的组件,其特征在于,各盲孔的深度不小于1.5mm并且直径不小于1.2mm。
9、如以上权利要求之一的组件,其特征在于,各信号触点元件通过压入配合连接方式装入其相应的孔。
10、如权利要求1至10之一的组件,其特征在于各信号触点元件通过焊接方式装入其相应的孔。
11、如以上权利要求1至8之一的组件,其特征在于,至少一个孔(72、82)具有插入其中的一个插座(71、81)。
12、如以上权利要求之一的组件的板(1),该板(1)具有至少一个位于其一侧的所述的第一导电层(9)和位于其另一侧的所述第二导电层(10),所述层(9、10)除装配连接件的区域外是连续的,在板(1)上的所述区域中具有孔(7)用于装配所述连接件的触点元件,各孔在其内表面具有一个导电层。
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Application Number | Priority Date | Filing Date | Title |
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EP94202072.8 | 1994-07-15 | ||
EP94202072A EP0692841B1 (en) | 1994-07-15 | 1994-07-15 | Assembly of shielded connectors and a board having plated holes |
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Publication Number | Publication Date |
---|---|
CN1152972A true CN1152972A (zh) | 1997-06-25 |
CN1055572C CN1055572C (zh) | 2000-08-16 |
Family
ID=8217044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN95194166A Expired - Lifetime CN1055572C (zh) | 1994-07-15 | 1995-07-14 | 屏蔽连接件和具有涂覆孔的板的组件 |
Country Status (8)
Country | Link |
---|---|
US (2) | US5961349A (zh) |
EP (1) | EP0692841B1 (zh) |
JP (1) | JP3372042B2 (zh) |
KR (1) | KR100344516B1 (zh) |
CN (1) | CN1055572C (zh) |
DE (1) | DE69413679T2 (zh) |
TW (1) | TW379870U (zh) |
WO (1) | WO1996002958A1 (zh) |
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CN104253332A (zh) * | 2013-06-28 | 2014-12-31 | 中航光电科技股份有限公司 | 印制板部件及其制造方法 |
CN108449108A (zh) * | 2017-02-16 | 2018-08-24 | 索尼互动娱乐股份有限公司 | 通信装置 |
US10854981B2 (en) | 2017-02-16 | 2020-12-01 | Sony Interactive Entertainment Inc. | Communication apparatus |
CN108449108B (zh) * | 2017-02-16 | 2021-06-22 | 索尼互动娱乐股份有限公司 | 通信装置 |
Also Published As
Publication number | Publication date |
---|---|
JP3372042B2 (ja) | 2003-01-27 |
EP0692841B1 (en) | 1998-09-30 |
KR100344516B1 (ko) | 2002-11-30 |
DE69413679D1 (de) | 1998-11-05 |
WO1996002958A1 (en) | 1996-02-01 |
US5961349A (en) | 1999-10-05 |
DE69413679T2 (de) | 1999-04-29 |
EP0692841A1 (en) | 1996-01-17 |
JPH10506223A (ja) | 1998-06-16 |
CN1055572C (zh) | 2000-08-16 |
US6196876B1 (en) | 2001-03-06 |
KR970705200A (ko) | 1997-09-06 |
TW379870U (en) | 2000-01-11 |
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