CN1180478C - 集成电路的平面化塑料封装模块 - Google Patents
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Abstract
一种半导体模块,它包含半导体芯片、具有引线指条的引线框、和包封剂内的用来通过平衡引线指条和包封剂之间的热应力而减少弯曲并提供更加平坦的封装件的下置元件。下置元件能够是引线框的弯曲部分。它也可以是诸如模拟半导体芯片之类的分立物体。
Description
技术领域
本发明一般涉及到集成电路的塑料封装件。更确切地说是涉及到用来减少塑料封装模块弯曲和提供更加平坦的模块的改进结构。更加确切地说是涉及到提供更加平坦的模块的改进了的引线框。
背景技术
通常,集成电路芯片通过高度导电的引线框被电连接到外部。芯片的金属丝键合焊点被细软的直径为1mil的金属丝连接到更厚和更坚韧的引线框导体。芯片、细软的金属丝、和引线框的邻接部分被包封在模塑塑料中,以保护芯片和金属丝不受损伤,同时,延伸出塑料的引线框导体部分可以用来焊接到诸如印刷电路板之类的装备件的下一层。每年有成千上万的这种类型的模块在出售。
很多问题被认为与这个封装概念有联系。其中之一就是弯曲。使成品模块弯曲的高的应力能够使集成电路芯片破裂并使之不能正常工作。在封装过程中,或在芯片封装件已经被安装在客户使用的电子器件中以后,都可以出现弯曲和破裂。成品率的下降明显增加了封装芯片的成本,且使用中出现的失效会使客户恼怒。
即使芯片不破裂,封装件的弯曲也能在把模块引线框固定到印制电路板的焊接过程中导致严重的问题。如果塑料封装模块弯曲,引线端头的位置就可能移出平面,一些引线端头在焊接步骤中可能不接触到板上的焊点。为了避免这个问题,一种由JEDEC建立的工业平面化规范MS-024,规定所有的引线必须平坦,不能存在彼此偏离超过4mil的两个引线。
如果封装件由具有不同热膨胀系数的不同材料组成,就会产生封装件弯曲。硅芯片、金属引线框、和塑料包封剂通常具有非常不同的热膨胀系数,而在制造过程中或使用过程中,封装件要经历温度的明显变化。所以,需要一种塑料封装的更好解决办法,来避免能导致弯曲的温度应力,以下的本发明提供了这种解决办法。
发明内容
因此,本发明的一个目的是提供一种减少或消除塑料封装件弯曲的方法。
本发明的另一目的是提供一种减少弯曲的引线框设计。
本发明的另一目的是提供一种平衡各个力,以便在温度改变时避免弯曲的引线框。
本发明的一个特征是,引线框在一个层上具有用来电连接到芯片的元件,并在塑料包封剂内的第二层上具有用来平衡应力的额外的元件。
本发明的优点是,当封装件经受温度大改变时,应力被平衡并避免了弯曲。
本发明的这些和其它目的、特点和优点,借助于包含具有接触焊点的半导体芯片和引线框的芯片封装件被实现,该引线框具有与接触焊点隔开至少第一距离并位于邻近接触焊点的第一层上的引线指条。包封剂把芯片和部分引线框包封起来。位于第二层上的材料也在包封剂中。此材料在这一第二层上具有包含长度和宽度的面积。此材料也具有厚度、比厚度大的长度和宽度。此材料从芯片延伸第二距离,其中所述第二距离大于第一距离。第二层上的材料被用来借助于平衡引线框和包封剂之间的热应力而提供更加平坦的封装件。
本发明人认识到当芯片具有明显小于封装件的面积时,弯曲问题通常更加严重。因此,随着一代一代的芯片以更小的尺寸生产,而封装件仍然保持相同的尺寸时,弯曲问题就增大。本发明提供一种在封装件内提供更小芯片而不增加弯曲的方法。在本发明的优选实施方案中,材料是引线框的一个整体部分。这是与电连接到芯片的那部分不同的层上的包封剂中的引线框的弯曲部分。在封装完成时,此材料可以包含不电连接到引线的那部分引线框。在另外一个实施方案中,此材料是诸如第二半导体芯片的没有用金属丝电连接到芯片的键合焊点的物体。第二半导体芯片可以被安装到用来在装配过程中保持其位置的条带。
在本发明的其中一个优选方案中,包封剂具有第一热膨胀系数,引线框具有第二热膨胀系数,芯片具有第三热膨胀系数,而材料具有第四热膨胀系数,其中第四热膨胀系数明显地小于第一热膨胀系数,例如,第四热膨胀系数在上述第二和第三热膨胀系数之间,或者第四热膨胀系数约等于所述第二热膨胀系数。
在本发明的其中一个优选方案中,引线指条在包封剂外面具有用来连接到衬底的区域,引线指条延伸出用来连接到衬底的上述区域上的第一层上的包封剂,其中第二层在第一层下面。
附图说明
从附图中所述本发明的下列详细描述中,本发明的上述和其它的目的、特点、和优点将显而易见,其中:
图1a.是包含半导体芯片和具有与引线指条分离的下置部分的引线框的一个模块的三维视图;
图1b.是图1a的引线框的三维视图,示出了连接到引线框指条连接端的下置部分;
图2是另一实施方案的三维视图,示出了包含半导体芯片和具有带下置部分的引线框的一个模块;
图3是另一实施方案的三维视图,示出了包含半导体芯片和具有连接到引线指条的下置部分的引线框的一个模块;
图4a是另一实施方案的三维视图,示出了包含半导体芯片、引线框、和模拟芯片的一个模块,此模拟芯片位于引线指条的下一层;
图4b是两个实施方案的俯视图,左边的那个示出了包含由支架固定在图4a模拟芯片下一层的物体的模块,右边的那个示出了厚度相似于芯片并用条带固定到引线框连杆的物体;
图4c是图4b实施方案的剖面图;
图4d-4f是具有各种形状的物体的俯视图;以及
图4g-4i是图4d-4f实施方案的相应剖面图。
具体实施方式
本发明人认识到,通过平衡塑料封装件内的各个力,可以减少或避免弯曲。他们认识到,当引线框上面的塑料的厚度不同于引线框下面的厚度时,封装件就好象是双金属条,并根据温度而弯曲。为了减少或避免弯曲,本发明人在不同于引线框连接引线的层处的塑料中提供了额外的材料层,以便平衡各个力。在一个实施方案中,引线框材料的一部分被弯曲到不同于用作引线框其余部分的层,以便平衡各个力。在另一个实施方案中,引线指条被向下弯曲再回复向上,以便更好地平衡引线指条上的各个力。
如图1a所示,引线框22的下置连杆20在塑料包封剂26内的弯点24a和弯点24b处被弯曲到明显低于引线框22的引线指条32层30的层28。层28被选择来提供双材料弯曲力,此力使模块36的引线指条32和集成电路芯片34上的某些或全部的力得到平衡。此外,下置连杆20从邻近封装件一端的位置延伸到邻近芯片34边沿的位置,以便使下置连杆20的面积最大,并使下置效应最大。于是,封装件的弯曲被减少或消除。下置连杆20最好具有A字形形状,以便在引线指条32所提供的空间内提供最大的面积,并提供机械强度和硬度。通过在下置连杆20内部提供几个支撑杆20’,也增加了稳定性。支撑杆20’被定向为平行于制模过程中液体塑料化合物的流向,使当液体塑料化合物填充物体时,连杆不被抬起。提供下置连杆20的尽可能最大面积,就提供了最大的力来抵消更高的引线指条32的力。下置连杆20最好与引线指条32平行,但在不同的平面上。弯点24a、24b通过使用工具夹住邻近连杆20的引线框22,然后用弯曲操作完成时以及下置连杆20被置于所希望的高度并平行于引线指条32时提供足够弯曲的工具,压住连杆20而实现。下置连杆20被设计成使到邻近引线指条32的最小间隔为32mil而到标称尺寸和放置的芯片34边沿的最小间隔为23mil,以便避免模块36中的电短路或机械接合。这些尺寸具有±1mil的公差。下置连杆20也能够被提供成在包封剂26内具有向下的斜坡。
所希望的是,通过键合金属丝37连接到芯片34的键合焊点35的引线指条32位于包封剂26中高处。模块36和它所固定于其上的印制电路板(未示出)之间的应力被减少到引线指条32在模块36的包封剂26中被抬起的程度。因此,借助于把引线指条32提供成与其从包封剂26出来时那样高,就增强了到电路板的连接可靠性,同时,借助于提供下置连杆20来平衡包封剂26中的热应力,就减少了模块36内高放置所导致的应力。
在用塑料完成包封之后,引线指条32的连接端38(图1b)被切断,并把引线指条32弯曲到用以安装到印制电路板的位置。延伸出包封剂26的下置连杆20的连接端38’(图1b)被沿着包封剂26的边沿26’切断。现在,下置连杆20就与引线框22的其余部分和芯片34完全分离。
下置连杆20的引入将薄小外形塑料封装件(TSOP)的弯曲从3.5mil减少到了2mil,即减小了42%。这种40mil厚的塑料封装件使用了热膨胀系数约为13的模制包封剂,具有热膨胀系数为3.5的硅芯片以及由热膨胀系数约为4的合金42制造的引线框。引线指条32约为5mil厚,并位于距包封剂26顶部表面约9mil和距包封剂底部约26mil的地方。芯片34约为12mil厚,并且位于距包封剂26顶部表面约17mil处。引线指条32用厚约3mil的带条46a安装在芯片34上(图4)。下置连杆20被下置在比包封剂26内的引线指条32低约15mil处,以便提供弯曲改善。借助于增加下置连杆20的面积或增加下置量,能够获得弯曲的进一步改善。下置连杆20被设计成使到邻近引线指条32的最小间隔为32mil,而到芯片34端的最小间隔为23mil,以便避免模块36内的电短路或机械接合。
如图2所示,在变通实施方案中,引线指条32a的各个部分沿着区域32a’向下设置。在这种情况下,引线指条32a拥有弯点40a和40b,以便在比引线框22a的引线指条32a的层30更低的层28处提供下置区域32a’。除了或不用下置连杆20,能够提供引线指条32a的下置部分32a’。此外,具有下置区域33’的额外的指条33可以被提供在各引线指条32a之间的通常未被占用的空间内。
如图3所示,在另一个变通实施方案中,下置连杆20a能够被连接到一个或更多个引线指条32b。在这种情况下,弯点24a’和24b’在比引线框22a的引线指条32a的层30更低的层28处提供下置连杆20a。下置连杆20a连接于其上的引线指条32b,最好被电连接到地。如图3所示,如果希望的话,下置连杆20a可以被劈开。
如图4a所示,在另一个变通实施方案中,诸如模拟半导体芯片的物体44被提供在比引线指条32的层30更低的包封剂26中的层28处。物体44提供力来平衡引线指条32所提供的力。物体44可以被放置在与集成电路芯片34大致相同的层上。在这种情况下,物体44和芯片34都被安装在用来在装配过程中固定物体44和芯片34位置的带条46a和46b上。作为变通,如图4b和图4c所示,物体44’可以被放置在比芯片34低的位置。在这种情况下,支柱50用带条把物体44连接到引线指条32a。利用支柱的高度可以控制力。支柱50能够与物体44’成一整体,并且能够在浇注或冲压操作中制造。除了半导体之外,物体44、44’能用诸如合金42、殷钢、柯伐铁镍钴合金、或铜-殷钢-铜之类的金属来制造。也能够用诸如陶瓷或液晶聚合物之类的绝缘体来制造。如图4d-4f所示,物体44、44’可以有各种各样的形状44a、44b、44c。可以设计这些形状来控制装配过程中包封剂的流动,以便分裂大的平坦表面,从而将物体44、44’锁定在包封剂内的位置上。提供局部延伸通过物体44、44’的空洞,使平坦表面破裂,从而增强了与包封剂的接触,并避免了潮气引起的问题。
虽然此处详细描述了并在附图中阐述了本发明的几种实施方案及其修正,但显然,能够在设计下置元件的过程中作出多种进一步修正而不偏离本发明的范围。在上述说明书中,没有比所附权利要求更窄地限制本发明。给出的例子只是为了阐述而不是排他性的。
Claims (38)
1.一种芯片封装件,包含:
(a)具有接触焊点的半导体芯片;
(b)具有与所述接触焊点间隔至少第一距离并位于邻近所述接触焊点的第一层上的引线指条的引线框;
(c)包封所述芯片和部分所述引线框的包封剂;以及
(d)所述包封剂内的材料,所述材料位于第二层上,并在所述第二层上具有包含长度和宽度的面积,所述材料还包含厚度,所述长度和宽度都大于所述厚度,所述材料从所述芯片延伸第二距离,其中所述第二距离大于所述第一距离,所述第二层上的所述材料通过平衡所述引线指条和所述包封剂之间的热应力而提供更加平坦的封装件。
2.权利要求1所述芯片封装件,其特征在于,其中所述芯片具有明显小于封装件的面积。
3.权利要求1所述芯片封装件,其特征在于,其中芯片具有顶部表面和延伸在所述顶部表面上的所述引线指条,其中所述第一层由所述顶部表面确定。
4.权利要求1所述芯片封装件,其特征在于,其中所述材料是引线框的一个整体部分。
5.权利要求4所述芯片封装件,其特征在于,其中所述材料包含所述引线框的弯曲部分,其中所述弯曲部分在所述包封剂内。
6.权利要求5所述芯片封装件,其特征在于,其中所述弯曲部分从邻近所述包封剂的边沿的位置延伸到邻近所述芯片边沿的位置。
7.权利要求5所述芯片封装件,其特征在于,其中所述弯曲部分具有A字形状。
8.权利要求5所述芯片封装件,其特征在于,其中所述弯曲部分包含定向为平行于浇注过程中液体塑料化合物的流向的支撑杆。
9.权利要求5所述芯片封装件,其特征在于,其中所述材料包含封装完成时不电连接到引线指条的部分所述引线框。
10.权利要求9所述芯片封装件,其特征在于,其中所述材料与引线指条充分地分隔开,以避免到引线指条的短路。
11.权利要求4所述芯片封装件,其特征在于,其中所述材料包含被弯曲的部分引线指条。
12.权利要求1所述芯片封装件,其特征在于,其中所述包封剂具有第一热膨胀系数,所述引线框具有第二热膨胀系数,所述芯片具有第三热膨胀系数,而所述材料具有第四热膨胀系数,其中所述第四热膨胀系数明显地小于所述第一热膨胀系数。
13.权利要求12所述芯片封装件,其特征在于,其中所述第四热膨胀系数在所述第二和所述第三热膨胀系数之间。
14.权利要求12所述芯片封装件,其特征在于,其中第四热膨胀系数约等于所述第二热膨胀系数。
15.权利要求1所述芯片封装件,其特征在于,其中所述接触焊点被金属丝连接到所述引线,其中所述材料包含不用金属丝电连接到所述引线指条的物体。
16.权利要求15所述芯片封装件,其特征在于,还包含带条,其中所述带条连接所述物体和所述引线指条,用来在装配过程中固定所述物体的位置。
17.权利要求16所述芯片封装件,其特征在于,其中所述物体还包含支柱,其中所述支柱被安装到用来在装配过程中固定所述物体位置的所述带条。
18.权利要求1所述芯片封装件,其特征在于,其中所述引线指条在所述包封剂外面具有用来连接到衬底的区域,所述引线指条延伸出用来连接到衬底的所述区域上的所述第一层上的所述包封剂,其中所述第二层在第一层下面。
19.一种制造芯片封装件的方法,包含下列步骤:
(a)提供具有接触焊点的半导体芯片;
(b)提供具有与所述接触焊点间隔至少第一距离并位于邻近所述接触焊点的第一层上的引线指条的引线框;
(c)包封所述芯片和部分所述引线框;以及
(d)在所述包封剂内提供材料,所述材料位于第二层上,并在所述第二层上具有包含长度和宽度的面积,所述材料还包含厚度,所述长度和所述宽度都大于所述厚度,所述材料从所述芯片延伸第二距离,其中所述第二距离大于所述第一距离,所述第二层上的所述材料通过平衡所述引线指条和所述包封剂之间的热应力而提供更加平坦的封装件。
20.权利要求19所述方法,其特征在于,其中所述芯片具有明显小于封装件的面积。
21.权利要求19所述方法,其特征在于,其中芯片具有顶部表面以及延伸在所述顶部表面上的所述引线指条,其中所述第一层由所述顶部表面确定。
22.权利要求19所述方法,其特征在于,其中所述材料是所述引线框的一个整体部分。
23.权利要求22所述方法,其特征在于,其中所述提供步骤(b)包含弯曲所述引线框的一个部分以形成所述步骤(d)的所述材料的步骤,其中所述弯曲的一个部分在所述包封剂内。
24.权利要求23所述方法,其特征在于,其中在所述弯曲所述引线框的所述一个部分的步骤包含第一弯点和第二弯点,这样所述引线框的所述一个部分平行于所述引线框的其它部分,并位于所述引线框的所述其它部分下面与所述引线框的所述其它部分相隔一定距离。
25.权利要求24所述方法,其特征在于,其中所述弯曲步骤(b)包含用工具夹住所述引线框和压住所述引线框的所述一个部分以提供所述第一和第二弯点的步骤。
26.权利要求23所述芯片封装件,其特征在于,其中所述弯曲的一个部分从邻近所述包封剂边沿的位置延伸到邻近所述芯片边沿的位置。
27.权利要求23所述芯片封装件,其特征在于,其中所述弯曲的一个部分具有A字形状。
28.权利要求23所述方法,其特征在于,其中所述弯曲的一个部分包含封装完成时不电连接到引线指条的部分所述引线框。
29.权利要求23所述方法,其特征在于,所述提供步骤(b)包含弯曲部分引线指条的步骤。
30.权利要求23所述芯片封装件,其特征在于,其中所述弯曲部分在所述包封剂内倾斜。
31.权利要求19所述方法,其特征在于,其中所述包封剂具有第一热膨胀系数,所述引线框具有第二热膨胀系数,所述芯片具有第三热膨胀系数,而所述材料具有第四热膨胀系数,其中第四热膨胀系数明显地小于所述第一热膨胀系数。
32.权利要求31所述方法,其特征在于,其中所述第四热膨胀系数在所述第二热膨胀系数和所述第三热膨胀系数之间。
33.权利要求31所述方法,其特征在于,其中第四热膨胀系数约等于所述第二热膨胀系数。
34.权利要求19所述方法,其特征在于,其中所述接触焊点被金属丝连接到所述引线,其中所述提供步骤(d)包含提供不被金属丝电连接到所述引线指条的物体。
35.权利要求34所述芯片封装件,其特征在于还包含带条,其中所述带条连接所述物体和所述引线指条,用来在装配过程中固定所述物体的位置。
36.权利要求35所述芯片封装件,其特征在于,其中所述物体还包含支柱,其中所述支柱被安装到用来在装配过程中固定所述物体位置的所述带条。
37.权利要求19所述方法,其特征在于,其中所述引线指条在包封剂外面具有用来连接到衬底的区域,所述引线指条延伸出用来连接到衬底的所述区域上的所述第一层上的所述包封剂,其中所述第二层在所述第一层下面。
38.权利要求19所述方法,其特征在于,其中所述包封剂具有顶部表面和底部表面,且其中所述引线指条延伸出所述包封剂、距所述顶部表面比距所述底部表面更近。
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KR0184076B1 (ko) * | 1995-11-28 | 1999-03-20 | 김광호 | 상하 접속 수단이 패키지 내부에 형성되어 있는 3차원 적층형 패키지 |
JP3108856B2 (ja) | 1995-12-28 | 2000-11-13 | ローム株式会社 | 樹脂パッケージ型半導体装置およびこれを実装した電子回路基板 |
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KR0174983B1 (ko) * | 1996-05-10 | 1999-02-01 | 김광호 | 유체상태의 접착제를 이용한 반도체 칩 실장 방법 및 그에 이용되는 loc형 반도체 칩 패키지의 리드 프레임 |
US5733800A (en) * | 1996-05-21 | 1998-03-31 | Micron Technology, Inc. | Underfill coating for LOC package |
JPH09312367A (ja) | 1996-05-23 | 1997-12-02 | Mitsubishi Electric Corp | 高周波半導体装置 |
JPH1070230A (ja) * | 1996-08-27 | 1998-03-10 | Hitachi Cable Ltd | Loc用リードフレーム |
KR100216991B1 (ko) * | 1996-09-11 | 1999-09-01 | 윤종용 | 접착층이 형성된 리드 프레임 |
US6522299B2 (en) * | 1999-04-08 | 2003-02-18 | Cypress Semiconductor Corp. | PC card retractable antenna |
-
2000
- 2000-06-28 US US09/605,173 patent/US6603195B1/en not_active Expired - Lifetime
-
2001
- 2001-06-04 KR KR10-2001-0031081A patent/KR100444242B1/ko not_active IP Right Cessation
- 2001-06-07 CA CA002350057A patent/CA2350057A1/en not_active Abandoned
- 2001-06-21 MY MYPI20012927A patent/MY119889A/en unknown
- 2001-06-22 TW TW090115294A patent/TWI231026B/zh not_active IP Right Cessation
- 2001-06-27 JP JP2001194587A patent/JP2002043494A/ja active Pending
- 2001-06-27 CN CNB011226374A patent/CN1180478C/zh not_active Expired - Fee Related
- 2001-06-28 BR BR0102606-2A patent/BR0102606A/pt not_active IP Right Cessation
-
2002
- 2002-06-03 HK HK02104209.7A patent/HK1042591B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK1042591B (zh) | 2005-05-13 |
CA2350057A1 (en) | 2001-12-28 |
MY119889A (en) | 2005-07-29 |
HK1042591A1 (en) | 2002-08-16 |
KR100444242B1 (ko) | 2004-08-11 |
US6603195B1 (en) | 2003-08-05 |
TWI231026B (en) | 2005-04-11 |
BR0102606A (pt) | 2002-02-13 |
KR20020001521A (ko) | 2002-01-09 |
JP2002043494A (ja) | 2002-02-08 |
CN1334603A (zh) | 2002-02-06 |
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