CN1186570A - 带球栅网阵列电路的柔性引线 - Google Patents

带球栅网阵列电路的柔性引线 Download PDF

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CN1186570A
CN1186570A CN96194355A CN96194355A CN1186570A CN 1186570 A CN1186570 A CN 1186570A CN 96194355 A CN96194355 A CN 96194355A CN 96194355 A CN96194355 A CN 96194355A CN 1186570 A CN1186570 A CN 1186570A
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hole
cantilever end
circuit
soldered ball
circuit structure
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伦道夫D·许莱尔
戴维J·温希特
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3M Co
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Minnesota Mining and Manufacturing Co
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Abstract

一种柔性电路结构,包括聚合物基板、在该基板中的通孔以及在该基板上设置的金属电路。电路端接在部分跨越通孔的悬臂端,接着将焊球附着到通孔。悬臂端允许焊球相对柔性电路移动,从而补偿失配和不同的热膨胀效应。

Description

带球栅网阵列电路的柔性引线
发明领域
本发明涉及柔性电路结构，具体地是指带球栅网阵列(TBGA)柔性电路结构，更具体地是指在这种电路上形成的触点。
发明背景
电子器件的通用封装结构是所谓的方形扁平封壳，其中，用聚合物作保护层密封集成电路。这种结构是正方形的，在封装外壳上有许多柔性的引线，连接到另一个电子元件，例如电路板。引线的挠度可以补偿组成方形扁平封壳的聚合物与电路板之间不同的热膨胀，因此大大防止把引线连接到电路板的焊接点的破裂或断裂。
为了容纳具有更多输入和输出引线的集成电路以及降低生产成本，现已提出用带球栅网阵列(TBGA)器件替代方形扁平封壳结构。这种TBGA器件包括柔性聚合物基板，其上至少在一侧设置金属层。基板通常以粘合方式附着到金属加强板上，焊球阵列附着到金属层所限定的电路上，从而允许连接到电路板上。令人遗憾的是，这种排列不允许焊球相对基板有更大的挠度，因此焊球与聚合物基板金属层之间的焊接连接处的破裂和断裂成为一个问题。
要求改善TBGA封装的结构，以与方形扁平封壳的性能相匹配。
发明概要
根据本发明的TBGA封装可以阻止由于封装与电路板之间热膨胀系数不同所造成的在热循环期间球栅网阵列焊接处出现的应力疲劳。根据本发明，构造的柔性电路板包括一个悬臂横梁，它跨越柔性电路一端的通孔。用一般的方法将焊球附着到该悬臂横梁。悬臂横梁较佳地向下弯曲，提供焊球相对柔性电路一定的移动能力。增加的移动能力可降低热循环期间累积的应力水平，因而增大封装的耐久性，还能改善封装与电路板之间的共面性，共面可以保证每个焊球在表面装配期间与焊膏接触。
具体说，本发明是附着焊球的一种柔性电路结构、包含一块柔性聚合物基板，它有两个主表面，至少有一个通孔通过聚合物基板延伸，在聚合物基板的至少一个主表面上设置金属，限定终止在通孔一根引线上的电子电路，引线仅仅在通孔的部分路径延伸，限定悬臂端在正交于聚合物基板主表面的方向上自由移动。通孔可以沿引线延伸，或者在邻近引线处切割聚合物基板，以增大悬臂端的有效长度，从而增大悬臂端移动的挠度和范围。
附图简述
本发明将参照附图进行描述，附图中的相同标号指几幅图上的类似部分。其中：
图1是本发明附着焊球的柔性电路结构的截面图。
图2是图1柔性电路一部分的俯视图，显示一条电路轨迹的端部。
图3是图1附着焊球的柔性电路一部分截面图和焊球附加到柔性电路上后控制焊球装置的截面图。
图4是图1附着焊球的柔性电路的截面图，显示用图3装置控制焊球的结果。
图5示出本发明柔性电路的另一个实施例。
图6示出本发明柔性电路的又一个实施例。
较佳实施例的描述
图1示出一个以10表示的柔性电路以及通常采用的环境。柔性电路10包括聚合物薄板12(通常由聚酰亚胺制成)以及为了限定电子电路至少在聚合物薄板12的一个主表面上设置的金属14，通常为铜。在图1中，金属14的上层限定信号轨迹16，下层限定接地平面18。在有些情况中，不存在接地平面18，因此聚合物薄板12只包括一层金属。
柔性电路10通常用粘合剂22附着到加强板20上。加强板20给柔性电路10提供尺寸稳定性。采用任何常规的方法，如引线键合、热压焊接或倒装片技术，通常集成电路连接到信号轨迹16和接地平面18上。
柔性电路10、其加强板20和其它元件的组装件通常附着到一个一般印刷电路板上。这种附着是通过焊球24焊接到柔性电路10上，又通过质量回流焊接到印刷电路板上。焊球24附着到柔性电路10上是通过将每个焊球24经聚合物薄板12上形成的通孔26焊接到适当的电路轨迹16上实现的。在传统的柔性电路结构中，电路轨迹16跨越通孔26，因此在相对柔性电路10的地方是坚固地维持的。这种坚固性导致在组装件上累积应力，尤其是在焊球24的焊接点上，由于温度变化的结果，各个元件改变尺寸。这种应力早晚会导致元件或其附着面积的断裂，可能导致器件出故障。
设计的本发明可以消除这种应力，它是这么设计的，提供的电路轨迹16比完全跨越通孔26短，并终止在通孔26。如图2可清楚看到，电路轨迹16终止在放大引线28中，它包括只在通孔26一部分路径上延伸的悬臂端30。
焊球24采用传统方法附着到悬臂端30，并相对于聚合物薄板12自由移动，这是由于与过去的电路轨迹不同，悬臂端30能够相对薄板12移动。通过选择悬臂端30的宽度和厚度，能够调节自由端30的挠度和弹簧常数。
图3示出通过将悬臂端30弯入到通孔26中增大焊球24的这种移动性的方法。定位器32包括在尺寸上能够接受焊球24的通道34。一旦被定位，使定位器32相对柔性电路10(向图3所示的左方)移动，使悬臂端30弯到图4所示的位置。应当理解，图3仅仅示出同时接合的许多个焊球中的一个。焊球24通常是以若干行和列排列的，因此是带和球栅网阵列的“阵列”部分。定位器将与一系列通道34一起建造，以容纳以阵列出现的数行焊球24。当然，图3仅示出偏转焊球24的一种方法，可能有其它方法。例如，有可能用与悬壁端30接触的凸起使悬臂端30自上偏离。
图4所示的悬臂端30和焊球24的最后一种结构允许焊球24在垂直和水平方向移动，以容纳由于热效应连接到其的元件的移动以及纠正由于制作容限、焊球24尺寸之差或元件翘曲这类事情造成的焊球24的任何失配。
图5示出增大悬臂端30挠度和范围的一种方法。这里，在电路轨迹16附近的方向上用聚合物薄板12制作两个切口36。该切口允许薄板12在悬臂端30附近弯入并增大有利于焊球24的移动。
图6示出增大悬臂端30挠度和范围的另一种方法。这里，改进了通孔26的形状，进一步沿电路引线28的长度向下延伸，因此增大了悬臂端30的自由长度。
因此，已经描述了一种改进的柔性电路结构，该结构提供焊球在带球栅网阵列装置中的移动，因此降低了热膨胀效应，增大了组装件容纳失配的能力。尽管本发明仅针对有限的几个实施例作了描述，但是，显然对于本领域的专业人员来说可以作许多改进。例如，可以对悬臂端30的形状作广泛变化。此外，可以采用一个切口36或不同形状的切口36来增大悬臂端30的挠度，而不是图5所示的这种切口。作为进一步的一个例子，尽管图中所示的悬臂端位于聚合物薄板相对焊球的相反一面，如果采用焊剂掩膜限定悬臂端，接着将焊球附着在其上，那么引线及其悬臂端可以与焊球位于薄板的同一面。然后，以类似上述的方法，使这种悬臂端偏转。此外，悬臂端的排列不限于柔性电路结构。这一原理同样适用于刚性印刷电路板。

Claims (6)

1.一种附着焊球的电路结构，其特征在于包括：
有两个主表面的基板；
至少在所述基板的一个主表面上设置的金属，限定端接在悬臂端的电子电路，在正交于所述基板主表面方向上自由移动。
2.如权利要求1所述的电路结构，其特征在于：所述的基板是包含一个通孔的柔性聚合物薄板，所述的悬臂端仅跨越所述通孔的一部分。
3.如权利要求2所述的电路结构，其特征在于：所述的悬臂端被弯入所述的通孔，向所述聚合物薄板的主表面延伸，该主表面与在其上设置所述金属的主表面相反。
4.如权利要求2所述的电路结构，其特征在于：在邻近所述通孔处切割所述柔性薄板，以允许所述悬臂端相对所述聚合物薄板平面作更大移动。
5.如权利要求4所述的电路结构，其特征在于：所述的聚合物薄板包括两个从邻近所述引线的所述通孔延伸的切口。
6.如权利要求2所述的柔性电路结构，其特征在于：进一步包括穿过所述聚合物薄板的第二个孔，与所述通孔相邻并相接触，所述的第二孔设置在所述引线上，以增大所述通孔的范围，因而增大所述悬臂端移动的长度、挠度和范围。
CN96194355A 1995-06-16 1996-05-03 带球栅网阵列电路的柔性引线 Pending CN1186570A (zh)

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US08/491,229 US5602422A (en) 1995-06-16 1995-06-16 Flexible leads for tape ball grid array circuit
US08/491,229 1995-06-16

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EP (1) EP0834195A1 (zh)
JP (1) JPH11507769A (zh)
KR (1) KR19990022864A (zh)
CN (1) CN1186570A (zh)
CA (1) CA2221750A1 (zh)
MY (1) MY112645A (zh)
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CA2221750A1 (en) 1997-01-03
WO1997000537A1 (en) 1997-01-03
EP0834195A1 (en) 1998-04-08
US5602422A (en) 1997-02-11
NO975843L (no) 1998-02-16
MY112645A (en) 2001-07-31

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