CN1191616C - 把半导体芯片安装到柔性基片上的方法和装置 - Google Patents

把半导体芯片安装到柔性基片上的方法和装置 Download PDF

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CN1191616C
CN1191616C CNB011175710A CN01117571A CN1191616C CN 1191616 C CN1191616 C CN 1191616C CN B011175710 A CNB011175710 A CN B011175710A CN 01117571 A CN01117571 A CN 01117571A CN 1191616 C CN1191616 C CN 1191616C
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heating plate
semiconductor chip
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罗内·约瑟夫·乌尔里奇
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Besi Switzerland AG
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Abstract

分三个步骤把半导体芯片(1)安装到柔性的基片(2)上：首先在分配台(3)向基片(2)上的预定的基片点位(5)上施放胶合剂(4)，然后在接合台(6)把半导体芯片(1)放置在基片点位(5)上。最后固化胶合剂(4)。根据本发明，在硬化胶合剂(4)的过程中，借助于真空把基片(2)固定在一个平坦的支撑表面(10)上。

Description

把半导体芯片安装到柔性基片上的方法和装置
技术领域
本发明涉及用于把半导体芯片安装到柔性基片上的方法和装置。
背景技术
在半导体工业中，除了用经证实的金属基片之外，日益增多地使用诸如BGA柔性带之类的柔性基片。而且，这种柔性带越来越薄并且达到仅50微米的厚度。这导致了安装半导体芯片的困难，这些困难表现在半导体芯片和柔性带之间的胶合剂厚度不规则、半导体芯片位置倾斜(歪斜)及不正确。此外，在最终硬化前可能发生胶合剂到处流动、沾染、在不同的相中局部地分开，等等，这些可以严重地损害胶合连接的质量。还可由此产生连接垫的污染。
发明内容
本发明的目的是提出一种方法和一种装置，用之可以可靠和高质量地在柔性基片上装备上半导体基片。
根据本发明，一种用于把半导体芯片安装到柔性基片上的方法，其中在分配台向基片上的预定的基片点位施放胶合剂，在接合台把半导体芯片放置在基片点位上，并且在固化台，把胶合剂固化，其特征在于，在固化胶合剂的过程中，借助于真空把基片固定在一个平坦的支撑表面上。
根据本发明，一种用于把半导体芯片安装到柔性基片上的装置，具有一个分配台，用于向基片上施放胶合剂；和一个接合台，用于为基片装备半导体芯片，其特征在于，沿基片的输送方向在接合台后面设置一个用于固化胶合剂的加热板，该加热板有槽，可以对槽施加真空，用于向下抽吸基片。
根据本发明，上述任务的解决在于：至少在胶合剂的硬化过程中把基片在一个水平支持面上保持平坦，但是优选地在安装过程的全部关键时相中把基片在一个水平支持表面上保持平坦。
用第一方案，所谓管芯接合机的自动装配机上配备有加热板用于在施加半导体芯片后立即硬化胶合剂。加热板在面对基片的支持表面上有槽或者说槽沟，可在槽沟中施加真空把基片保持平坦直到胶合剂硬化。另外，优选地，自动装配机配备一个支撑板，支撑板也有槽或者说槽沟，可在槽沟中施加真空以在施胶合剂的过程中及放置半导体芯片的过程中把基片的整个区域抽吸到水平的表面上。
这个方案特别适用于处理所谓的阵列基片，用阵列基片把半导体芯片的基片点位相互衡接地以n行和m列的区块中安排在基片上。一般用三个步骤安装半导体芯片：在第一步骤中，在分配台向基片点位施放胶合剂。在第二步骤中，在接合台把半导体芯片放置基片点位上。在第三步骤中把胶合剂硬化。为了使胶合剂的硬化有足够的时间，这种阵列基片的处理在区块中进行如下：当一个区块以其n×m基片点位装备以半导体芯片后就立即释放真空并且沿输送方向推进基片。在此同时把支撑板和加热板沿与输送方向相反的方向向回移动到预定的开始位置。然后，向支撑板以及加热板施加真空从而使基片平坦放并且固定在支撑板上，并且还固定在加热板上。接着，在分配台对下一个n×m基片点位向基片点位施放胶合剂以及，在接合台已经施放胶合剂的基片点位上逐列地装备半导体芯片。在一列充分装备时，然后不释放真空地，把支撑板和加热板一起沿输送方向推进，以装备下一列。因此基片保持固定在支撑板和加热板上并且与它们一直移动。在装备一个区块的最后一列后，通过释放真空、推进基片和返回支撑板和加热板用说明了的方式开始下一个周期。
用两个或者三个加热位置形成加热板可以把固化时间加倍或者提高到三倍。为了能够相对高地保持自动装配机的吞吐量，用这个方案应当使用相对快速固化的胶合胶。
在某些应用时，当胶合剂仅部分固化时，例如80％时，就可满足了。其余的在相继的处理步骤中发生，例如电线焊接杨上进行接线的过程中。
用第二个方案，胶合剂的硬化不在自动装备机上进行胶合剂的硬化，而是在烘箱中。在烘箱中渡过的时间中，它确保基片平坦地放在支撑物上。对其可以施加真空从而可以把基片吸在其上的一个有槽或者槽沟的板起所述支撑物的作用。所述板本身可以，但是不必须加热。以此方案也可以采用缓慢固化的胶合剂。
本发明还涉及在安装质量上产生显著的改进。因为在胶合剂硬化的过程中基片保持平坦，在基片和芯片之间形成恒定厚度的胶合剂层：在硬化过程中，胶合剂不再能弯曲够基片。而且达到胶合剂较大的一致性同时有合于惯例的硬化，例如胶合剂的不同成分可以分门别类地进入多银区域和少银的区域，甚至可以发生空白。
而且，基片平坦放在加热板上可以保证从加热板向胶合剂可靠的热传输。因为热传输的质量对完全硬化胶合剂所述必需的时间有决定性的影响，这点有很大的重要性。
附图说明
下面参照附图更加详细地说明本发明还涉及的实施例。附图中：
图1用于安装半导体芯片的一种装置，
图2支撑板和加热板，
图3基片，以及
图4和5一个烘箱
具体实施方式
图1示一种把半导体芯片1安装到一个柔性2上的装置的示意图。所述装置有一个分配台3，用于把胶合剂4施放在基片2的基片点位5上(图3)；一个接合台6用于用半导体芯片1装备基片点位5和一个固化台7用于硬化一个接一个地沿基片2的输送方向安排的胶合剂4。固化台7含有一个可移动的加热板9，其面对基片2的支撑表面10有槽11，对所述槽可以施放真空以向下抽吸基片2。而且，安装装置含有一个支撑板12，可以与加热板一起移动，支撑板12也有槽11，对所述槽11可以施放真空以向下抽吸基片2。可以设两个驱动器沿输送方向8以及沿与输送方向8成直角的方向13(图2)移动加热板9和支撑板12。
图2示出支撑板12和加热板9的平面图。支撑板12和加热板9机械地牢固连接，但是由一个间隙14分开。以此方式避免大量的热从加热板9传输到支撑板12上，从而只有在基片点位位于加热板9上时才开始硬胶合剂4。槽11经钻孔15连接到真空源。各个槽11的位置和选择得使基片可以在其整个区域上被向下抽吸，从而它绝对平坦地坐落在支撑板12上或者加热板9上。加热板9有两个有槽11的区域从而胶合剂可以在两个周期上固化胶合剂4。
图3示出基片2的平面图。基片点位5安排在m行17和n列18的区块16中。在所述的实施例中，m＝3而n＝4。列18到列18的距离用C标志，而从区块16到区块16的距离用B标志。
在安装装置的工作中，基片点位5按区块处理：在分配台6，向第一区块16中的基片点位5施放胶合剂。在接合台6，向第二区块19的基片点位5上放置芯片1。在固化台7，对第三和第四区块16的基片点位5进行硬化。取决于即时的台，四个区块16属于相同的基片2或者属于不同的基片2。按区块处理意味着，在处理区块16的m*n基片点位5的过程中，基片连续地保持固定在支撑板12和加热板9上。只有在区块16的m*n个基片点位5完全装备半导体芯片1时才释放真空，然后按距离B-(n-1)*C沿输送方向8推进基片2。同时，按距离(n-1)*C逆输送方向8移动支撑板12和加热板9返回到预定的开始位置。此后，向支撑板12的槽11施加真空以及向加热板9的槽施加真空，从而使基片2平坦地坐落在和固定在支撑板12以及加热板9上。接着，在分配台3把胶合剂4施放到下一个区块16的基片点位5上然后，在接合台6，已经施放胶合剂4的基片点位5上逐列地装备半导体芯片1。在一列18充分装备时，不释放真空地，按距离C和加热板9一起沿输送方向推进支撑板12，以装备下一列18。如此办理时，基片2保持固定在支撑板12和加热板9上并且与它们一直移动。在装备一个区块16的最后一列18后，通过释放真空、按距离B-(n-1)*C推进基片2和按距离(n-1)*C返回支撑板12和加热板9以说明过的方式下一个周期。
如果接合台6总是在一个预定的位置放置半导体芯片1，还沿方向13，即正交于输送方向8，移动支撑板12和加热板9，以装备放在列18内的m个基片点位。
图4示出固化胶合剂4的烘箱19的横截面。烘箱19有一个带有数个板21的板夹20，板21上有槽11，可以对槽11施加真空以向下抽吸基片2。板夹20烘箱9外相对冷的条件下加载基片2，然后向其板21的槽11施加真空，从而在开始硬化前把基片2平坦地坐落在板21上。
图5示出另一个烘箱19的截面图，烘箱19形成为一种连续烘箱。半导体芯片1的基片2一个接一个地沿馈送方向通过烘箱19。基片2坐落在板21上，板21有槽11，可以对槽11施加真空以向下抽吸基片2，从而使它们平坦地坐落在板12上。

Claims (6)

1.一种用于把半导体芯片(1)安装到柔性基片(2)上的方法，其中在分配台(3)向基片(2)上的预定的基片点位(5)施放胶合剂(4)，在接合台(6)把半导体芯片(1)放置在基片点位(5)上，并且在固化台(7)，把胶合剂(4)固化，其特征在于，在固化胶合剂(4)的过程中，借助于真空把基片(2)固定在一个平坦的支撑表面(10)上。
2.权利要求1所述的方法，其特征在于，胶合剂(4)的固化发生在紧接在接合台(6)后面的加热板(9)上，该加热板(9)有槽(11)，对槽(11)可以施加真空以向下抽吸基片(2)。
3.权利要求1所述的方法，其特征在于，胶合剂(4)的固化发生在与接合台(6)分开的烘箱(19)中。
4.权利要求1或2所述的方法，用于装备具有安排在区块(16)中的基片点位(5)的柔性基片(2)，其特征在于，所述平坦的支撑表面(10)是加热板(9)的一个表面，该加热板(9)刚性连接至一个用于在施放胶合剂(4)的过程中和放置半导体芯片(1)的过程中固定柔性基片(2)的支撑板(12)，所述基片点位通过以下步骤在区块中被处理：
沿输送方向输送柔性基片(2)并利用真空固定该柔性基片(2)；
重复地将支撑板(12)和加热板(9)移动至预定数量的位置处，在每个所述位置处，在分配台(3)将粘合剂施放在基片点位(5)上，并在接合台(6)将半导体芯片(1)放置在另一基片点位(5)上；
释放所述真空；以及
沿输送方向输送所述柔性基片(2)，同时沿与所述输送方向相反的方向移动所述支撑板(12)和加热板(9)。
5.一种用于把半导体芯片(1)安装到柔性基片(2)上的装置，具有一个分配台(3)，用于向基片(2)上施放胶合剂(4)；和一个接合台(6)，用于为基片(2)装备半导体芯片(1)，其特征在于，沿基片(2)的输送方向(8)在接合台(6)后面设置一个用于固化胶合剂的加热板(9)，该加热板(9)有槽(11)，可以对槽(11)施加真空，用于向下抽吸基片(2)。
6.权利要求所述5的装置，其特征在于，对基片(2)提供一个支撑板(12)，该支撑板(12)有槽(11)，可以对槽(11)施加真空，以便在施放胶合剂(4)的过程中和放置半导体芯片(1)的过程中把基片(2)平坦地固定，并且支撑板(12)和加热板(9)刚性地彼此连接并可沿输送方向(8)移动。
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