CN1200570A - 用于集成电路的反篡改屏蔽连接线 - Google Patents

用于集成电路的反篡改屏蔽连接线 Download PDF

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CN1200570A
CN1200570A CN98107718A CN98107718A CN1200570A CN 1200570 A CN1200570 A CN 1200570A CN 98107718 A CN98107718 A CN 98107718A CN 98107718 A CN98107718 A CN 98107718A CN 1200570 A CN1200570 A CN 1200570A
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布兰特·坎德洛尔
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Arris Technology Inc
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Abstract

一种用于集成电路(IC)的反篡改屏蔽包括一根通过一防护层,例如是IC中一环氧树脂密封层的连接线。上述连接线传递一个信号,上述连接线被装在上述密封层内,及/或最接近上述密封层处,以便对IC的拆封能引起电子导电部件的断裂,从而使处理器变为不能工作的状态。上述连接线可以以各种结构方式和上述处理器耦合,包括对内部或外部连接焊盘、引线框式触点、及/或直接与装有上述IC的计算机板相连的用法。可将一金属屏蔽层设置在有源器件及密封层的顶部之间,以防止例如是非法侵权者使用电子显微镜来观察有源器件区。

Description

用于集成电路的反篡改屏蔽连接线
本发明涉及一种对集成电路(IC)的保护，尤其是防止对IC的逆设计的方法。本发明保护在电缆及卫星电视解码器中使用的保密IC的安全是尤其有用的，以防止越权用户接收电视广播。本发明对于保护在其它应用中使用的保密IC，包括用在电子资金流通、前提访问控制、电子游戏以及类似处的终端及智能卡等也是同样有用的。
因为付费电视市场越来越受欢迎，因而对越权人存在一个巨大的商业诱导，即用其熟知的“非法侵权”来修改置于机机顶盒(例如解码器)的访问控制，以允许在未付所需预定费用的情况下对电视节目进行接收，被修改的解码器可通过各种市场由不讲道德的人买到，用以非法接收并观看电视信号。
为制造一个修改了的解码器，非法侵权者必须从正牌解码器中提取通常仅由授权的制造者知道的某种信息。该解码器典型地包括一个含有诸如密码键信息的保密(例如密码)处理器，该密码键用于对一个编码了的电视信号或其它节目服务信号(比如音频或数据)进行解码。因为保密处理器能执行访问控制功能，因此这是非法侵权者注意的焦点。据此，非法侵权者将会采用各种技术，试图从保密处理器中得到信息。
一个通用的解决技术叫做“探测”。一个保密处理器包括一个具有有源及无源器件集群的被装配为单片设备的集成电路(IC)，上述器件包括在半导体材料的单个块内相连的晶体管、电阻、电容及二极管。在探测中，象超大规模集成电路(VLST)这样的IC，受到侵袭的进攻，其中管芯(比如，IC或“芯片”)由拆封而暴露出来。在拆封时，用来密封或包围这个管芯的复合材料被有次序的去除。接着，使用测量电流及其它参数的探针监视芯片中有源器件的电信号。在这里使用的术语“篡改”即包含探测又包含拆封。
一个非法侵权者可执行以下拆封步骤来准备探测芯片。首先，在管芯还在IC封装中的情况下，从解码器板上拆下该芯片。通常的情况是把芯片安装在一个大电路板上。上述解码器板可以是一个例如在个人计算机(PC)中使用的计算机板。如果上述芯片需要从电池或类似物中得到的直流来避免自毁特性，那么在将芯片从板上拆走之前，将其电池接线焊接到芯片外部的正电压管脚(例如，Vbatt)及负电压管脚(例如，Vss)上。这样，该芯片可在其电池连线仍连接电源的情况下，被从板上拆除。如果中断了电池功率，该芯片可擦除存储在存储器中的关键信息而自行销毁。非法侵权者能通过对板上那些与电池相连的电路图形的阻抗测量来识别合适的电源管脚，然后在切断主电压(例如，Vcc)情况下，通过读取电路图形上的电压对其予以确定。
第二，IC封装的密封混合物中的管芯的位置，可通过对IC封装用X射线而决定。第三，一个机械磨床可用来尽可能多地切除管芯上表层上的密封混合物而不损坏管芯。第四，使用化学腐蚀剂或等离子刻蚀剂来消除主要覆盖在将要被非法侵权的管芯区中最后一部分密封混合物。一些化学腐蚀剂对密封混合物作用得非常好，以至经常省略磨削步骤。
在当前的芯片设计中，包括那些对特殊用途IC(ASIC)的设计，一个非法侵权者通常不会在执行上述四个步骤时遇到有效阻拦。通常认为，从板上将仍附带有电池线的芯片拆下来是最精密的操作。这样，只要电池电源没有产生短路或开路，由惰性附着玻璃覆盖而保护的上述未损坏的管芯就可由非法侵权者显示出来。此外，也能很容易地避免对连接线的破坏。连接线可将芯片上的连接焊盘与安全密封封装中的封装焊盘连接起来，且连接线可设置在设备的周边，正如下文大量详细描述中所讨论的那样。上述拆封处理可避免暴露设置了关键连接焊盘的区中的芯片，即将电池电源传送到有源器件。
一种阻止探测的方法已在普通已授权美国专利4,933,898中讨论，该专利在1990年6月12日授权于Gilberg等，题目“采用导电屏蔽的保密集成电路芯片”，发明人Gilberg等。公开了用一个或更多个导电层叠加为一个IC的安全区。通过检查，导电层将上述安全区屏蔽，并将一个功率信号传递到IC。由非法侵权者消除其中的一个导电层，将会引起对上述安全区中器件提供功率的损失。然而，这种方法的实现显得稍微复杂了一些。
因此，提供一种能阻止或换句话说妨碍有非法侵权者对IC芯片进行探测的装置是合乎需要的。尤其，在连接线断裂时，对使用标准连接线改变IC，使其不工作的拆封提供一个阻挡层将是很需要的。上述阻挡层必须和已有的芯片设计相容并且实现起来不贵。本发明提供了一个具有上述及其它优点的系统。
根据本发明，提供了一种对集成电路(IC)的反篡改屏蔽。该屏蔽适合于与含有用来承载一个有源器件的基片的IC一起使用，该有源器件例如可以是一个可包含存储器、CPU及其它微电子器件的保密处理器。上述IC可有一个防护层，例如一个用来保护处理器的环氧树脂密封层。
上述反篡改屏蔽包括一个电子导电部件，例如用来传送一个允许处理器进行操作的信号的连接线。这个信号可以包括一个流经电池的正、负两端而由电池提供的一个稳态电子电流。这条线可以连接到IC的保护层，至少是其中的一部分，以至消除上述防护层将会使上述线断裂，因而引起开路。
上述线可以和各种结构的处理器相耦合。比如，上述线可以耦合在处理器外部的第一终端和处理器内部的第二终端之间。而且，上述电子导电部件可分布在处理器的微电子电路外部及/或内部的点之间。上述终端可以是处理器内的连接焊盘，或处理器外部的连接焊盘或引线框式接触点。
另一方面，上述线或其它电子导电部件可以耦合于同在处理器外的第一和第二终端之间。上述线可任意地与微电子电路的上表层交叉，和/或可分布在远离微电子电路和/或处理器的地方。
上述电子导电部件可耦合于同在处理器内的第一和第二终端之间。
在另一种结构中，电子导电部件可包含导电环氧树脂，和/或被加工为对腐蚀剂具有所需耐受度的一种物质。上述导电环氧树脂可被印为覆盖在微电子电路上的电路图形。在这种情况中，非法侵权者使用腐蚀剂消除IC防护层的做法，将会破坏导电环氧树脂，因而终止了允许处理器进行操作的信号。
在所有结构中，即使非法侵权者对管芯进行了拆封而未损坏导电环氧树脂，也因为悬浮在空间中的导电部件表现为一种难以逾越的障碍，使上述导电部件仍可能成为用机械探针或一个电子显微镜进行探测的物理障碍物。探针必须被非法侵权者不断地抬起并重放到一个新位置来试探通道的不同角度以对管芯进行探测并避免使任何一个导电部件断裂。实际上，可在网格图形中形成上述电子导电部件以便进一步破坏探测定位。
更进一步，一个金属屏蔽层可以设置在处理器和密封层顶部之间，以防止非法侵权者使用电子显微镜对例如处理器或其中包括的微电子电路进行测量(比如，映像)。对和反篡改连接线屏蔽有关的金属屏蔽的使用，提供给非法侵权者一个额外的障碍，因此使非法侵权者的工作更费时也更昂贵。
上述IC可在智能卡中实现。另外，智能卡体的一部分可以提供上述密封层。
可选择地，不用来传递电信号的一条线，至少是其中的一部分，可被分布而覆盖微电子器件上以阻止对微电子器件的探测。尤其是，上述线可以形成一个网格图形，这将使非法侵权者很难定位，并在微电子器件附近移动探针尖。
图1图示了一个被拆封的集成电路的简图。
图2图示了一个采用根据本发明的反篡改连接线屏蔽的一个集成电路的剖面视图。
图3是一个采用根据本发明的反篡改连接线屏蔽的集成电路的保密处理器的顶视图。
图4是一个采用根据本发明的反探测线栅屏蔽的集成电路的保密处理器的顶视图。
一个对集成电路(IC)的反篡改装置被用来防止有源器件，例如一个在电视解码器中使用的保密处理器，被篡改(比如，逆设计)。
图1是一个被拆封的集成电路的简图。大约在100处显示的该集成电路(IC)，包括一个环氧树脂密封混合区110。若干封装管脚P通过引线W与相应的连接焊盘B相连。一个连接焊盘或一个管芯焊盘是存在于管芯130周围的许多金属连接管脚中的一个，并将被用做将一个专用的电路部件(比如，输入/输出(I/O)端口)耦合到一个相应的外部封装管脚上。焊盘间距是相邻的I/O连接焊盘B中点之间距离(例如，用微米表示)。上述管芯可包括例如是一个含有微电子设备的硅微型芯片。上述封装管脚P，线W及连接焊盘B由IC 100中传入或送出电流，并在使用前面讨论过的拆封步骤去除通常覆盖在管芯130上的环氧树脂混合物时被暴露出来。
引线连接是芯片封装处理中的一个步骤，在该处理中用细线连接在管芯I/O焊盘及封装焊盘之间。上述管芯130包括典型的有源器件150、152、154及156。尤其是，器件150可以是一个包含密码信息的保密处理器。这样，上述管芯器件由非法侵权者暴露出来，以确定上述有源器件的上述保密信息及其它操作特性。
图2是一个具有根据本发明反篡改连接线屏蔽的集成电路的剖面图。用200指示的IC，包括一个顶部环氧树脂层210及底部环氧树脂层212。图中显示了一个如连接线270耦合在连接焊盘260及262之间的电子导电部件。注意，上述电子导电部件不需要有一个圆形的剖面。这样，必须明白这里使用的术语“电子导电部件”及“线”不仅限于具有一个圆形剖面的单独的细线部件，而且还可包括具有若干缠绕或拧在一起的细线的结构、各不相同的剖面的结构、矩形剖面的结构、网眼结构、在其中用一根单线耦合在多于两个端上的结构或实际上任意的电子导电部件。特别是，上述线可由具有空间的网格图形提供，该空间足够小以防止通过网眼或很容易地在网眼中移动而进行的探测，正如以下有关图4的讨论。实际上，甚至在上述线不传递处理器进行操作所需的一个电信号时，仍可使用一个网格结构。上述仅存的网格的作用是阻挡探测。
更进一步，电子导电部件270可包括如导电环氧树脂的一种物质，该导电环氧树脂是为获取所需的导电率而用导电材料例如银添加在环氧树脂中形成的。很方便地，可选择上述环氧树脂使其对腐蚀具有的耐受度小于上述IC防护层中的耐受度，且/或能根据非法侵权者希望使用的特定的腐蚀剂而设计上述导电环氧树脂的耐受度。上述导电环氧树脂可直接印在上述管芯的表面。
这里也提供了一个玻璃保护层220。玻璃防护层涉及一种涂在遍及完整管芯整个表面一保护电路的惰性防护涂层。玻璃保护层保护上述管芯表面，使其免受化学及潮气的掺杂、装卸毁坏及减小由松动粒子引起的管芯短路的可能性。它也可阻止金属移动及其它金属分解。
屏蔽230是一个向IC200内各种器件，例如图1中的器件150-156，提供电流的金属层。如果切断提供给屏蔽的电源，则一个保密处理器件可自毁，以至存在保密处理器件中的密码数据被擦除了。另外，屏蔽230的作用是防止非法侵权者使用浏览电显微镜测试保密处理器比如一个随机存取存储器(RAM)中部件的变化(比如，电压变化)，及使屏蔽覆盖的部件间的区别变模糊。上述屏蔽可设置在包含一个或更多个防护层的密封层内，上述防护层设置在管芯250中的芯片上。钝化层240是一个包括例如是二氧化硅的表面防护层，该二氧化硅是涂覆在处于各种扩散步骤中的管芯的整个表面。管芯250是一种在其上制造及装配上述IC的物理材料。作为一个单片器件，上述管芯典型地包含硅。
正如讨论的，即使在上述管芯具有电池功率自毁特性时，一个如ASIC的芯片也可由非法侵权者拆封以用相对直接的方式暴露上述管芯。根据本发明，用一个或更多个电子导电部件，如象连接线270的用以连接连接焊盘和封装焊盘的标准型连接线，覆盖上述管芯以便形成一个反篡改屏蔽。尤其是，在制造管芯时，上述密封混合物处于熔化状态，并在悬浮在管芯上方的反篡改连接线周围及下方流动。当上述混合物(比如，层210)凝固后，因为对非法侵权者，为使连接线及启动保密处理器的自毁特性免受破坏(比如，断裂)而使用机械研磨设备来消除埋线层变得更困难，所以这就形成了一个惊人的障碍物。
比如，关于在由电池或类似物中得到的直流提供功率的加密芯片中，如果电子导电部件破裂，保留秘密数据的RAM上的电源将被切断，由此将引起数据被擦掉。如果电子导电部件用在一个没有电池供电的擦除特性的器件中，则电子导电部件可代替传送各种控制信号。但，即便是断开这种传送控制信号的电子导电部件而未擦除保密数据，在非法侵权者执行了必要的时耗及艰难的修补之前，这种断开将会阻碍非法侵权者的探测侵袭。
而且，甚至非法侵权者在腐蚀导电部件下的环氧树脂时，采用某种方法仔细地去除了层210而并未使电子导电部件断裂，导电部件也会由于腐蚀剂的腐蚀性而可能被腐蚀掉并被弄断。因为导电部件中的金属被选得能与用于腐蚀环氧树脂中的化学腐蚀剂反应，所以上述情况是一个事实。这样，可能需要选择一种对腐蚀剂具有比较低耐受度的金属例如铝。其它金属例如金，对腐蚀剂具有比较高的耐受度。此外，如果一个导电部件是由电池提供电源，腐蚀剂将会以更强的腐蚀性起作用。通常，可选择导电部件的材料以便对特定腐蚀剂设计提供所需的耐受度。因为可将导电环氧树脂配制为具有与环氧树脂密封层相似的对腐蚀的耐受度，所以它是非常有用的。
图3是一个具有根据本发明的反篡改连接线屏蔽的集成电路的保密处理器的简化形式的顶视图。该保密处理器150包括典型的微电子器件，比如一个RAM 300、一个中央处理器(CPU)302、一个只读存储器(ROM)304及一个数据加密标准(DES)处理器306。此外要注意，本发明同样适用于对保存非加密的然而却是专用信息的非保密处理器进行保护。这样，这里使用的术语“处理器”是指包括加密处理器、非加密处理器及实际上任何一个类型的微电子电路或微电子器件。
图3显示了在IC的一个反篡改屏蔽中诸如连接线等导电部件的各种可能的排列。必须明白并不是所有在这里显示的连接线都是需要的，特定的数目及连接线的位置都可以变化。
在一个示例的结构中，可将一个具有正电压Vbatt的信号提供给一个连接焊盘310，该焊盘与另一连接焊盘312，一根电路图形314及一个连接焊盘316电耦合。类似地，连接焊盘318上有一呈现出负电压Vss，该焊盘与一个连接焊盘320，一根电路图形322及一个连接焊盘324电耦合。上述电压在中止时，可用来提供一个电流以触发处理器150的自动擦除(比如，自毁)特性。
可将连接线耦合在处理器150外部的连接焊盘及处理器150内部(比如被设置在内部)的连接焊盘之间。例如，一个连接线313可耦合在处于RAM 300左右的外部连接焊盘312及内部连接焊盘326之间。图中显示了焊盘326放置在RAM 300之外，但可通过例如一个未显示出的电路图形将一个电信号耦合到RAM 300。
类似地，在CPU 302附近，一个连接线319可耦合在处理器150外部的连接焊盘320及处理器150内部CPU 302的连接焊盘328之间。一个连接线317可耦合在处理器150外部的连接焊盘316及处理器150内部CPU的连接焊盘332之间。在ROM 304附近，一个连接线325可耦合在ROM 304的外部连接线324和内部连接线336之间。
连接线也可耦合在处理器150内部的连接焊盘之间。比如，一个连接线331可以耦合在内部连接焊盘330和338之间。
连接线也可进一步耦合在处理器150外部的连接焊盘之间。比如，一个连接线341可以耦合在外部连接焊盘340及342之间，一个连接线345可耦合在外部连接焊盘344和346之间。
另外，可将连接线耦合在引线框式触点及外部或内部连接焊盘或其它引线框式触点之间。比如，一连接线351可耦合在一个引线框式触点350及一个外部连接焊盘352之间。一连接线356可耦合在一个引线框式触点355及一个内部连接焊盘357之间。一个连接线361可耦合在一个引线框式触点360及另一引线框式触点362之间。如虚线所指出的，上述引线框式触点362可以是一个设置为距处理器150比距触点360更远的封装引线。注意图3中引线框式触点及连接触点的定位是不需要标度的。一个连接焊盘336可耦合在引线框式触点365及一个外部连接焊盘367之间。一连接线371可耦合杂引线框式触点370及另一引线框式触点372之间。
更进一步，一连接线可将处理器150的一连接焊盘或引线框式触点直接耦合到能承载处理器150的解码器板(例如，个人计算机(PC)板)上，或耦合到允许上述连接线传送处理器150使用的电流回路或其它信号的其它任意单元。在这种情况下，仅仅从板上或其它单元去除芯片封装，将会使反篡改连接线断裂。
另外，连接线可耦合在外部焊盘例如焊盘340和342之间，在上述焊盘处，连接线并未分布在处理器150的表面，但却分布在远离该处理器表面处例如一个回路(图中未示)。可以有一个带有触点例如触点370及372的类似结构，其中连接线371分布在远离处理器150处。这样，可将上述连接线送至一个离处理器稍微远一些的区，即预计非法侵权者有可能找不到的地方。
上述保密处理器150可被装入智能卡的IC中。智能卡典型地是一个包括IC的塑料信用卡大小的装置。将智能卡插入一个读取机是器件与IC的面接触。有各种方法将IC封装入一张卡。比如，在IC被线连至一引线框式触点后，环氧树脂在输入卡中铸塑之前变为铸塑在管芯周围。另一方法是在装配到同一张智能卡体上的触点/管芯插入之前，使用环氧树脂填充卡体上的空穴。在任何一种情况中，都可使环氧树脂密封混合物在导电部件周围流动。
更进一步，智能卡体本身形成IC密封层的一部分。而且，IC的连接线可连接到远离IC的嵌入区的智能卡体中，所以任何对智能卡的篡改都会使连接线断裂。因为使用导电环氧树脂提供智能卡内的反篡改屏蔽对卡允许了一个更低的断面，所以它有突出的优势。上述导电环氧树脂可被印制为分布在IC上的细线。
图4是一个具有根据本发明一个反探测线栅屏蔽的集成电路的保密处理器顶视图。连接线可由具有空间的网格图形提供，该空间足够小以防止探针尖从网眼穿过或很容易地在网眼内移动。实际上，甚至在不用上述线传送上述处理器操作所需的电信号时，这种结构也是有用的。在网格中存在的上述线(例如，伪线)仅仅是作为探测的障碍物。
在一个实现线栅屏蔽的例子中，处理器450包括一个微电子器件410，例如一个存储器。连接线421、423及425分别耦合在连接焊盘420和430间、422和432间及424和434间。类似地，连接线451、453及454可分别耦合在连接焊盘448和460间、452和462间及454和464之间。上述线形成了显示在大约460处的网格图形，该图形覆盖了微电子器件460。可调整网格460的面积，从而使非法侵权者可能使用的探针尖的运动加重。
上述网格460的线，可任意地传送微电子电路410进行操作所用的信号。在这种情况中，对一些或所有的上述线，最好能避免彼此接触从而避免短路。如果是这样的话，上述在避免短路的同时，可根据需要而相互替换。
当在网格或其它图形中使用伪线时，需要选择线的成分，使其对非法侵权者腐蚀IC中的环氧树脂或其它防护层所用的化学腐蚀剂具有高耐受度。如上上述，例如象金这种金属，对腐蚀剂具有较高的耐受度。
因此，可以看出在反篡改屏蔽中对连接线的使用有很多可能的方法，用来防止对芯片进行未授权的拆封。对于本发明的反篡改屏蔽，非法侵权者为拆封而使用机械磨床，这将只能在原位留下大量的密封混合物或冒折断连接线的危险。实际上，可将上述连接线布置为使大部分环氧树脂保持原状以防止线的断裂。如果线断了，可以启动芯片的自毁指令序列，或可终止所需控制信号的通路，因此非法侵权者需要时耗及艰难的修补。而且，即使上述线不启动一个自毁指令序列或不传送所需的控制信号，仅仅是存在该线也可影响通过X射线机照射芯片的企图。因为非法侵权者可能不知道将该线碰断是否会引起处理器不工作，这样，在反篡改屏蔽中，尤其是在网格图形中，仅存的“伪”连接线将被当作障碍物。在任何一种情况中如果并非不可能，则非法侵权者的工作都变得艰难、费时及昂贵。
虽然是联系各种特定实施例对上述发明进行描述的，但本领域人员将能理解对所做的未脱离权利要求中声明的本发明的精神及范围的无数的修改及更正。比如，本发明并不限于与具有环氧树脂密封层的芯片一起使用，而且适于与实际上任何一种类型防护层，甚至没有防护层的芯片一起使用。比如，这项发明可以与一个设备，例如当暴露在紫外光中时可被擦除的由可编程只读存储器(EPROM)一起使用，而且适于与实际上任何一种类型防护层，甚至没有防护层的芯片一起使用。一个EPROM一般由空隙及透明窗保护着。在这种情况中，电子导电部件可被简单地安装在空隙中，并在没有环氧树脂层时，对非法侵权者形成障碍。

Claims (18)

1.一个用以防止对集成电路(IC)中有源器件进行探测的反篡改装置，该装置包括：
一条适于传送允许所述有源器件进行工作的信号的线；其中
所述线至少是部分地延伸至所述有源器件，以便在所述有源器件工作时，阻止对其进行访问。
2.如权利要求1的装置，其中：
所述线分布在第一和第二终端之间；并且
所述第一终端处于所述处理器外部而所述第二终端处于所述处理器内部。
3.如权利要求1的装置，其中：
所述线分布在第一和第二终端之间；并且
所述第一及第二终端都在所述处理器的外部。
4.如权利要求1的装置，其中：
所述线分布在第一和第二终端之间；并且
所述第一及第二终端都在所述处理器的内部。
5.如前述权利要求之一的装置，其中：
所述线形成一个网格图形。
6.如前述权利要求之一的装置，其中：
所述线，至少是一部分，被装载在所述IC的防护层内，以便在拆除所述防护层时，所述线能够断裂。
7.如前述权利要求之一的装置，进一步包括：
至少屏蔽一部分所述有源电路的金属屏蔽层。
8.如前述权利要求之一的装置，其中：
所述IC是嵌在智能卡中；且
当从所述智能卡中拆除所述IC时，所述线适于断裂。
9.一种用来防止对集成电路(IC)中有源器件进行探测的反篡改装置，该装置包括：
一种适用于对允许所述有源器件进行操作的信号进行传送的导电环氧树脂部件；其中
所述导电环氧树脂至少部分地分布于所述有源器件，以便在所述有源器件工作时防止对其进行访问。
10.如权利要求9的装置，其中：
所述导电环氧树脂部件被印在所述有源器件上至少是其中一部分上。
11.如权利要求9或10的装置，其中：
所述IC嵌在智能卡中；且
当从所述智能卡中拆除所述IC时，所述导电环氧树脂部分适于断裂。
12.如权利要求9到11之一的装置，其中：
所述导电环氧树脂部件分布在第一和第二终端之间；且
所述第一终端在所述处理器外部而所述第二终端在所述处理器内部。
13.如权利要求9到11之一的装置，其中：
所述导电环氧树脂部件分布在第一和第二终端之间；且
所述第一及第二终端都在所述处理器外部。
14.如权利要求9到11之一的装置，其中：
所述导电环氧树脂部件分布在第一和第二终端之间；且
所述第一及第二终端都在所述处理器内部。
15.如权利要求9至14之一的装置，其中：
所述导电环氧树脂部分，至少是一部分，被装载在所述IC的防护层内，以便在拆除所述防护层时，所述导电环氧树脂部件适于断裂。
16.如权利要求9到15之一的装置，进一步包括：
用来屏蔽至少一部分所述有源电路的金属屏蔽层。
17.一种用来保护集成电路(IC)中有源器件免受探测的反篡改装置，所述装置包括：
一种将线，至少是其中一部分线，分布在所述有源器件上的线布局，用来阻止对有源器件进行访问。
18.如权利要求17的装置，其中：
所述线布局形成一个网格图形。
CN98107718A 1997-02-24 1998-02-24 用于集成电路的反篡改屏蔽连接线 Pending CN1200570A (zh)

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US08/804,792 US5861662A (en) 1997-02-24 1997-02-24 Anti-tamper bond wire shield for an integrated circuit
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US5861662A (en) 1999-01-19
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