CN1203362C - 图象模块 - Google Patents

图象模块 Download PDF

Info

Publication number
CN1203362C
CN1203362C CNB011362367A CN01136236A CN1203362C CN 1203362 C CN1203362 C CN 1203362C CN B011362367 A CNB011362367 A CN B011362367A CN 01136236 A CN01136236 A CN 01136236A CN 1203362 C CN1203362 C CN 1203362C
Authority
CN
China
Prior art keywords
sensor
lens
picture module
module according
picture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB011362367A
Other languages
English (en)
Other versions
CN1402036A (zh
Inventor
崔云河
金永俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19713697&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1203362(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN1402036A publication Critical patent/CN1402036A/zh
Application granted granted Critical
Publication of CN1203362C publication Critical patent/CN1203362C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

本发明提供了小型化及一体化的板上芯片方式的自动调焦的图象模块，它包括：包括感知画面图象数据的传感器、包括上述传感器的基板、将在外部包揽上述传感器和基板的传感器壳以及阻隔外部环境、仅通过上述传感器壳与传感器之间的光线的传感滤光器形成的图象封装组件；包括中心部位设置通过光线的透镜、外侧缠绕驱动线圈的透镜翼、为上述透镜翼的驱动线圈上提供电流并支持透镜翼的弹性部件以及形成磁场以通过电磁力上下移动上述透镜翼的磁铁的透镜翼单元。从而达到节俭电消耗量、节省制作费用的目的。

Description

图象模块
技术领域
本发明涉及自动透镜聚焦方式的小型薄型图象模块。
背景技术
一般的图象模块用于数码照相机及可视通信用终端器中捕获图象，将此连接于电脑，具备使可视通信或所需的内容更容易进行接受的功能。并且最近此种图象模块的使用频率也逐渐增加。
尤其是最近使用电脑的通信方法的发达与为此而组成的基础设施，其增加速度越来越大。
一般用于数码照相机或画面通信用终端器的图象传感器大致可分为电荷耦合方式(以下称为CCD)和高封装密度互补金属-氧化物半导体方式(以下称为CMOS)。
CCD方式是基于模拟线路的光学系统的典型例子。此系统中，当通过透镜进来的光照射到各种集光元件时，储存此电荷变化。并利用此电荷的大小检测明暗程度，将此输送到模拟/数码变换器以显示色彩。
另一方面，CMOS(互补性金属氧化膜半导体)图象传感器与CMOS半导体工程完全相同的系统集成于芯片上的方式。因此，通过CMOS系统，在半导体中将模拟信号和数码信号处理电路集中在一起。
CMOS图象传感器采用一般的CMOS工艺制造，生产中需要复杂的工程，与生产率较低的CCD相比，具有所需生产费用较少的优点。但是CMOS处理影象信号时，因区域小，不能象CCD一样显示微细的影象和区分精细的色彩，具有总体上画质偏差的缺点。
CMOS图象传感器因具有上述缺点，大部分的数码照相机领域中一直受冷遇。但是最近随着CMOS图象传感器技术的快速发展，在总体上短期内在大部分应用机器中代替CCD，CCD主要用于需要高分辨率图象的部分。
为适应上述技术的发展趋势，本发明是关于如上述所说明的，包括图象传感器的透镜中自动调焦装置。以下以过去的透镜部结构为参照图进行说明。
图1是根据过去技术，数码照相机或画面通信用终端器的图象传感器及透镜的焦点调整器的结构图。
首先，如图1所示，过去技术透镜焦点调整器的结构为：包括感知画面图象数据的传感器1、包括上述传感器的基板2以及在外部包揽上述传感器和基板的传感器壳3，阻挡外部光，仅通过上述传感器壳与传感器之间的光线的传感器滤光器4形成的图象封装组件；具有与上述图象封装组件相结合的螺纹的壳5；位于上述壳5的内面与螺纹5a相接合的螺纹6a的筒体6以及设置于上述筒体内的透镜7。
对于上述过去式透镜焦点调整器的工作原理，以下参照附图1详细说明。
首先使用者对准焦点时如图1所示，其特点为在内部包括透镜7的筒体6的外面形成螺纹6a，用手动调整与相对物之间的距离。
即，使用者一手抓透镜外壳部分，旋转上述螺纹6a调整焦点的方式，使用者直接看画面，将透镜7放置于离图象传感器1或远或近的地方有很多不方便，而且精密度亦不够。
发明内容
本发明为了解决上述过去技术所存在的问题而提出的，以提供具有小型化及一体化的板上芯片方式的自动调焦调整功能的图象模块，从而达到降低功耗、节省制作费用的目的。
为达到上述目的，本发明所提供的具备自动调焦功能的图象模块包括：包括感知画面图象数据的传感器、包括上述传感器的基板、将在外部包揽上述传感器和基板的传感器壳以及阻隔外部环境、仅通过上述传感器壳与传感器之间的光线的传感滤光器形成的图象封装组件；包括中心部位设置通过光线的透镜，外侧缠绕驱动线圈的透镜翼、为上述透镜翼的驱动线圈上提供电流并支持透镜翼的弹性部件以及形成磁场以通过电磁力上下移动上述透镜翼的磁铁的透镜翼单元。
附图说明
图1为过去技术所示的透镜焦点调整器的结构图；
图2为根据本发明所示的具备自动调焦功能的图象模块立体图；
图3为根据图2所示的图象模块的截面图；
图4为本发明的另一实施例的立体图；
图5为根据图4截面图。
*对于图面主要部分的符号说明
1，11：传感器      2，12：基板
3，13：传感器壳    4，14：滤光器
5：外壳            5a：外壳螺纹
6：筒体            6a：筒体螺纹
7.17：透镜         15：托架
16：弹性部件       18：透镜翼
19：线圈           20：磁铁
21：磁轭
具体实施方式
以下参照附图详细说明本发明的最佳实例。在以下说明中，不同附图中的相同构件采用相同符号。
下面根据本发明制作的个人计算机摄像头的实施例，参照附图详细说明。
图2为根据本发明所示的具备自动调焦功能的图象模块立体图；图3为根据图2所示的图象模块的截面图。
如图3所示，根据本发明具备自动调焦功能的图象模块可分为图象封装组件和透镜翼单元。上述图象封装组件包括传感器11、基板12、传感器外壳13以及传感滤光器14。此时上述传感器11的作用为感知画面图象数据。并且上述传感器位于基板12上形成板上芯片方式。上述传感器外壳13由外部罩住传感器11及基板12，传感滤光器14阻隔外部环境，仅通过上述传感器外壳13与传感器11之间的光线。
并且上述透镜翼单元起着执行机构的作用。此透镜翼单元包括由外部施加电流的弹性部件16；通过上述弹性部件流入感应电流的绕线线圈19；通过流过上述线圈的电流，形成电磁场而设置的磁铁20；受到上下方向由上述线圈及磁铁产生的电磁力的透镜翼18及连接于上述透镜翼的中央部位上下移动的透镜17。
为了本发明的正确实施，并为提高上述磁铁的效率而设置磁轭21。图4为设置磁轭的本发明的另一实施例，图5为显示附图4中安装磁轭的本发明的另一实施例的截面图。图4及图5中的上述磁轭21为‘u’字形状，增强了磁通量，从而加大了驱动力。
上述滤光器可由玻璃制成，最好是使用覆膜玻璃。并且为了支持弹性部件，在传感器外壳外侧设置托架15。
上述弹性部件可采用线圈弹簧等，必要时也可采用板型弹簧。上述托架15和上述弹性部件16相互组装时，在组装托架周围插入减振器，以防止外部振动冲击。
本发明的实施例，为支持上述弹性部件，4个上述托架位于其两端，其上、下两侧分别设置2个托架。实施时可选择多种状态，如可用两个托架支持上述弹性部件，其顶部及底部分别设置一个托架。
以下详细说明上述结构的具备自动调焦功能的图象模块的工作原理。
如图2所示，在外部上述弹性部件16的末端连接电线，并接通电流。电流通过上述弹性部件16流入缠绕于透镜翼18外部的卷轴式线圈19中。由线圈产生感应电磁力，连接于上述线圈19周围的磁铁20或永久磁铁形成磁场，在上述磁场中产生电磁力，根据弗莱明的左手定律，将上述透镜翼18沿上下方向移动。因此，调整了上述透镜翼18中连接的透镜17与图象传感器11之间的距离。
上述透镜17的驱动方向随弹性部件16中流过的电流方向的改变而改变。此时可改变的移动距离范围大约为1/10mm至1/2mm，足以满足在图象传感器11中正确形成画面的需求。可根据图象传感器上的画面图象数据来感知透镜的远近距离，利用此电流的方向和强度可调整透镜的驱动方向和移动距离。
如上述所讲，根据本发明具备自动调焦功能的图象模块可适用于与PC连接的个人计算机摄像头上，用户可利用自动化的图象分析程序根据感应电流的变化自动调整焦点，或通过观察显示器画面调整焦点，例如使用鼠标感知感应电流的变化。
本发明具备自动调焦功能的图象模块可适用于各种包括过去简单的移动显示器在内的要求调整焦点的透镜传感器装置。过去使用者用手动调整透镜或电动机、螺线管等驱动方式调整焦点，现在均可自动或简单操作按钮来调整焦点。
本发明出具的自动调焦图象模块与过去的相比，结构简单，趋于小型、薄型化，其广泛适用于个人计算机摄像头、数码照相机或画像通信用终端等多领域，且易于安装。
如同上述，本发明提供小型化及一体化的板上芯片方式的自动调焦的图象模块，可广泛适用于小型、价格低廉的各种图象应用装置，达到节俭用电消耗量、节省制作费用的效果。
以上说明根据本发明特定的实施例及适用领域相关而进行了图示及说明，在专利申请范围中显示的发明主题及领域不超越的限度内可多样改造或变化。其适用也可分为多种形状表现，此种现象在该领域中掌握通常知识的人是必知的。

Claims (8)

1.一种具备自动调焦功能的图象模块，其特征在于：包括：
感知画面图象数据的传感器；
包括上述传感器的基板；
从外部罩住上述传感器和基板的传感器壳；
阻隔外部环境，仅通过上述传感器壳与传感器之间的光线的传感滤光器；
中心部位设置通过光线的透镜，在其表面缠绕驱动线圈的透镜翼；
为上述透镜翼的驱动线圈上提供电流并支持透镜翼的弹性部件；以及
形成磁场以通过电磁力上下移动上述透镜翼的磁铁。
2.根据权利要求1所述的图象模块，其特征在于：上述滤光器由玻璃制成。
3.根据权利要求1所述的图象模块，其特征在于：传感器外壳外侧设置托架以支持上述弹性部件。
4.根据权利要求1所述的图象模块，其特征在于：为增强磁铁的效率还设置有磁轭。
5.根据权利要求1所述的图象模块，其特征在于：所述传感器、基板、传感器壳、传感滤光器形成图象封装组件；所述透镜、透镜翼、弹性部件以及磁铁形成透镜翼单元。
6.根据权利要求5所述的图象模块，其特征在于：上述滤光器由玻璃制成。
7.根据权利要求5所述的图象模块，其特征在于：传感器外壳外侧设置托架以支持上述弹性部件。
8.根据权利要求5所述的图象模块，其特征在于：为增强磁铁的效率还设置有磁轭。
CNB011362367A 2001-08-29 2001-10-11 图象模块 Expired - Lifetime CN1203362C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2001-0052521A KR100431260B1 (ko) 2001-08-29 2001-08-29 이미지 모듈
KR52521/2001 2001-08-29

Publications (2)

Publication Number Publication Date
CN1402036A CN1402036A (zh) 2003-03-12
CN1203362C true CN1203362C (zh) 2005-05-25

Family

ID=19713697

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011362367A Expired - Lifetime CN1203362C (zh) 2001-08-29 2001-10-11 图象模块

Country Status (4)

Country Link
US (1) US6560047B2 (zh)
JP (1) JP2003075712A (zh)
KR (1) KR100431260B1 (zh)
CN (1) CN1203362C (zh)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100437351C (zh) * 2003-08-19 2008-11-26 鸿富锦精密工业（深圳）有限公司 立体取像数码相机模块
US6934065B2 (en) 2003-09-18 2005-08-23 Micron Technology, Inc. Microelectronic devices and methods for packaging microelectronic devices
KR20050034473A (ko) * 2003-10-09 2005-04-14 한성엘컴텍 주식회사 카메라 모듈
JP2005157290A (ja) * 2003-10-30 2005-06-16 Hitachi Maxell Ltd カメラ
US7091124B2 (en) 2003-11-13 2006-08-15 Micron Technology, Inc. Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
US8084866B2 (en) 2003-12-10 2011-12-27 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
US7583862B2 (en) 2003-11-26 2009-09-01 Aptina Imaging Corporation Packaged microelectronic imagers and methods of packaging microelectronic imagers
JP2005164955A (ja) * 2003-12-02 2005-06-23 Fujitsu Ltd 撮像デバイス、撮像デバイスの製造方法及び撮像デバイス保持機構
US7388619B2 (en) * 2003-12-11 2008-06-17 Sony Ericsson Mobile Communications Ab Mobile device with a combination camera and loudspeaker
JP3921467B2 (ja) * 2003-12-11 2007-05-30 シャープ株式会社 カメラモジュール、カメラモジュールの製造方法、電子機器及び電子機器の製造方法
KR100614763B1 (ko) * 2004-08-11 2006-08-23 주식회사 하이소닉 영상 촬영 장치
US7253397B2 (en) 2004-02-23 2007-08-07 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US20050247894A1 (en) 2004-05-05 2005-11-10 Watkins Charles M Systems and methods for forming apertures in microfeature workpieces
US7253957B2 (en) 2004-05-13 2007-08-07 Micron Technology, Inc. Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
US20050253957A1 (en) * 2004-05-13 2005-11-17 Stefan Gustavsson Mobile electronic apparatus with camera that takes pictures through lens in speaker
CN100378570C (zh) * 2004-05-14 2008-04-02 光宝科技股份有限公司 自动对焦镜头
US7498647B2 (en) 2004-06-10 2009-03-03 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7199439B2 (en) 2004-06-14 2007-04-03 Micron Technology, Inc. Microelectronic imagers and methods of packaging microelectronic imagers
US7262405B2 (en) 2004-06-14 2007-08-28 Micron Technology, Inc. Prefabricated housings for microelectronic imagers
US7294897B2 (en) 2004-06-29 2007-11-13 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7232754B2 (en) 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
CN100432824C (zh) * 2004-07-05 2008-11-12 宇东光学公司 聚焦结构
US7416913B2 (en) 2004-07-16 2008-08-26 Micron Technology, Inc. Methods of manufacturing microelectronic imaging units with discrete standoffs
US7189954B2 (en) * 2004-07-19 2007-03-13 Micron Technology, Inc. Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
US7402453B2 (en) 2004-07-28 2008-07-22 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7364934B2 (en) * 2004-08-10 2008-04-29 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7397066B2 (en) 2004-08-19 2008-07-08 Micron Technology, Inc. Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
US7223626B2 (en) 2004-08-19 2007-05-29 Micron Technology, Inc. Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
US7115961B2 (en) 2004-08-24 2006-10-03 Micron Technology, Inc. Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
US7429494B2 (en) 2004-08-24 2008-09-30 Micron Technology, Inc. Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
US7276393B2 (en) 2004-08-26 2007-10-02 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
SG120200A1 (en) * 2004-08-27 2006-03-28 Micron Technology Inc Slanted vias for electrical circuits on circuit boards and other substrates
US7511262B2 (en) 2004-08-30 2009-03-31 Micron Technology, Inc. Optical device and assembly for use with imaging dies, and wafer-label imager assembly
US20070148807A1 (en) 2005-08-22 2007-06-28 Salman Akram Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
US7300857B2 (en) 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
FR2875055B1 (fr) * 2004-09-06 2006-12-01 Kingpak Tech Inc Structure de module de capteur d'image
CN100529943C (zh) * 2004-12-11 2009-08-19 鸿富锦精密工业（深圳）有限公司 自动对焦镜头模组
CN100517047C (zh) * 2004-12-17 2009-07-22 鸿富锦精密工业（深圳）有限公司 两段式对焦装置
US7271482B2 (en) 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7303931B2 (en) * 2005-02-10 2007-12-04 Micron Technology, Inc. Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces
US7190039B2 (en) 2005-02-18 2007-03-13 Micron Technology, Inc. Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
CN1862358B (zh) * 2005-05-11 2012-03-21 华移联科（沈阳）技术有限公司 一种自动调焦装置
KR100671716B1 (ko) * 2005-06-04 2007-01-19 주식회사 하이소닉 소형 카메라장치
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US7262134B2 (en) 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7863187B2 (en) 2005-09-01 2011-01-04 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7288757B2 (en) 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
US20070097532A1 (en) * 2005-11-03 2007-05-03 Industrial Technology Research Institute Optical devices
US20070097530A1 (en) * 2005-11-03 2007-05-03 Industrial Technology Research Institute Optical devices
CN100523981C (zh) * 2005-12-26 2009-08-05 鑫视科技股份有限公司 影像撷取系统及其对焦装置
US8092102B2 (en) * 2006-05-31 2012-01-10 Flextronics Ap Llc Camera module with premolded lens housing and method of manufacture
US7749899B2 (en) 2006-06-01 2010-07-06 Micron Technology, Inc. Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
EP2055083A2 (en) * 2006-08-08 2009-05-06 Nxp B.V. Combination device of speaker and camera optical system
US7629249B2 (en) * 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US7902643B2 (en) 2006-08-31 2011-03-08 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
KR100835714B1 (ko) * 2006-09-27 2008-06-05 삼성전기주식회사 자성이 구비된 카메라 모듈 및 이의 제조방법
SG150410A1 (en) 2007-08-31 2009-03-30 Micron Technology Inc Partitioned through-layer via and associated systems and methods
CN101393378B (zh) * 2007-09-21 2010-09-29 富准精密工业(深圳)有限公司 相机自动对焦结构
US7964945B2 (en) * 2007-09-28 2011-06-21 Samsung Electro-Mechanics Co., Ltd. Glass cap molding package, manufacturing method thereof and camera module
US7884015B2 (en) 2007-12-06 2011-02-08 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
KR20090084527A (ko) 2008-02-01 2009-08-05 삼성전자주식회사 이미지 센서 모듈, 이의 제조 방법, 이를 포함하는 카메라모듈 및 카메라 모듈을 포함하는 전자 제품
US20090283665A1 (en) * 2008-05-13 2009-11-19 Eastman Kodak Company Image sensor with an aligned optical assembly
TWI427899B (zh) * 2008-07-18 2014-02-21 Hon Hai Prec Ind Co Ltd 音圈馬達組裝治具
CN109510932B (zh) * 2016-02-18 2021-05-04 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法
CN109085689A (zh) * 2018-10-30 2018-12-25 信利光电股份有限公司 一种光学镜头的及其组装方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6150353A (ja) * 1984-08-20 1986-03-12 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置
JPS6264174A (ja) * 1985-09-13 1987-03-23 Matsushita Electric Ind Co Ltd 固体撮像素子の支持体
US5321678A (en) * 1991-08-13 1994-06-14 Asahi Kogaku Kogyo Kabushiki Kaisha Optical head carriage, tracking mechanism and displacement detecting mechanism
JPH09232548A (ja) * 1996-02-20 1997-09-05 Sony Corp 固体撮像装置
JPH10134405A (ja) * 1996-10-31 1998-05-22 Victor Co Of Japan Ltd 光ピックアップのアクチュエータ
JP3758311B2 (ja) * 1997-06-25 2006-03-22 松下電器産業株式会社 撮像装置
JPH11345955A (ja) * 1998-05-29 1999-12-14 Sony Corp レンズ一体型固体撮像素子並びにそのレンズ装着方法及びレンズ装着装置
JP3506962B2 (ja) * 1998-08-10 2004-03-15 オリンパス株式会社 撮像モジュール
KR100692779B1 (ko) * 1999-09-10 2007-03-12 매그나칩 반도체 유한회사 회로기판 일체형 이미지 센서 패키지
US6483101B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
JP2001230397A (ja) * 2000-02-18 2001-08-24 Olympus Optical Co Ltd 熱防止型撮像センサ構造及びその製造方法
KR100386647B1 (ko) * 2001-03-20 2003-06-02 카스크테크놀러지 주식회사 화상 전송 장치에 사용되는 소형 광학계

Also Published As

Publication number Publication date
KR100431260B1 (ko) 2004-05-12
US20030043478A1 (en) 2003-03-06
JP2003075712A (ja) 2003-03-12
CN1402036A (zh) 2003-03-12
US6560047B2 (en) 2003-05-06
KR20030019661A (ko) 2003-03-07

Similar Documents

Publication Publication Date Title
CN1203362C (zh) 图象模块
CN101604063B (zh) 相机结构
CN204903923U (zh) 摄像头模组
US7929230B2 (en) Camera lens module
CN101064779A (zh) 一种实现微型摄像头自动对焦的方法及其微型摄像头
CN104834158A (zh) 双摄像头模组
US20060228099A1 (en) Digital camera with electromagnetic focusing module
KR20100125978A (ko) 마그네트 이동 타입 이미지 촬상용 렌즈 액츄에이터
CN101034239A (zh) 用于蜂窝式电话照相机的镜头保护装置
CN1904669A (zh) 相机镜头组件用的光学图像稳定器
CN104950419A (zh) 摄像头模组
EP1715378A1 (en) Small form factor camera module with mechanical iris and shutter
CN111683197A (zh) 摄像头模组以及摄像装置
CN206020785U (zh) 一种音圈马达
CN200972530Y (zh) 微小型多段式镜头驱动装置
CN104950548A (zh) 摄像头模组
KR101184864B1 (ko) 보이스 코일 모듈
EP4212950A1 (en) Lens driving device, camera module, and optical device
CN1786808A (zh) 光学自动对焦装置
CN114845030A (zh) 摄像模组、控制方法、装置和电子设备
CN117501176A (zh) 摄像模组
CN2672677Y (zh) 镜头模组
CN115774316A (zh) 光学镜头以及摄像模组
KR100715156B1 (ko) 카메라모듈의 자동초점 액추에이터
US11714294B2 (en) Camera module

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20050525