CN1205743C - 用于表面声波器件的阵列处理的系统和方法 - Google Patents
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Abstract
一种用于制造各个微电子器件,例如表面声波器件的组件和方法使用一个非导体材料的整体阵列,该阵列带有多个隔开的延伸到该阵列内的空腔,每个空腔带有一个尺寸定成容纳一个要在其中密封的盖的凹槽。从每个空腔的内部到该阵列的一个表面设置导电路径,以便电气地和空腔内气密密封的一个器件连接。
Description
相关申请的相互参照
本申请要求2000年6月6日申请的共同拥有临时申请序号60/209,692的优先权。
技术领域
本发明一般地涉及用来处理和封装微电子器件的技术,并且更具体地涉及用于有效地封装表面声波器件的系统和方法。
背景技术
表面声波(SAW)设备广泛用于RF和IF应用,其中包括无线通信和有线电视。由于声波在SAW器件中的压电模的表面上传播,该器件的性能会受到该模所暴露的环境的影响。为了避免这种暴露,需要把SAW模密封在密封盒里。近年来,已经用陶瓷制造SAW盒并且利用线焊、焊料软熔或玻璃烧结技术用金属或者陶瓷盖密封SAW盒。
SAW技术中的最新进展,尤其是无线通信中的应用,需要更小的SAW器件,尽管几年前移动电话手机中使用的SAW滤波器长度上普遍超过12毫米,现在(在许多情况中)这种器件只有几毫米长。SAW滤波器的小型化看来会继续一段时间。
对于中等和大的盒,采用机械上夹在托架中的每个盒进行加工是可行的。模安装、导线连接和盖安装都可以利用各种常规技术自动进行。然而,当盒尺寸缩小时,每个盒和盖的固定和操纵变为更加困难和低效。为了提高这种小型盒的可制造性,SAW器件厂家正在开发用于在含有许多(通常300个或更多)盒的整体陶瓷阵列中加工SAW盒的技术。这些阵列充当模安装和对模形成电气连接(通过导线连接法、倒装片法或其它技术)的基地。尽管把SAW模安装到阵列并且进行互连的技术已被良好了解,但把盖固定到阵列上的方法是非常有限。
从现有技术器件的结构看来一些SAW厂家正在使用利用绝缘树脂(例如乙阶环氧树脂(B-staged epoxy))固定SAW盒上的杯状陶瓷盖。可以通过把杯状陶瓷盖对准并且放在加热阵列中的每个模上制造这样的器件。在装配到阵列上之前盖的密封面涂上乙阶环氧树脂。阵列带有盖之间的余隙供用于随后的个体化操作。使用乙阶环氧树脂允许在无须在相邻的盖之间使用物理阻挡物或对准物的情况下彼此非常靠近地放置各个盖。加热下的乙阶环氧树脂的发粘性在最后固化之前保持盖的就位并且帮助防止相邻盖间树脂互吸。遗憾的是,这种树脂密封技术本质上是不密封的并且允许某些气体(尤其是水蒸汽)穿过盒密封渗透。
典型地,不漏气密封的SAW滤波器盒通常是用焊料密封的平金属盖制造的。遗憾的是,目前不存在在软熔之前和软熔期间把小的焊料盖放在并且固定在阵列的上面的有效方法。采用焊料密封技术的SAW器件厂家用分离的个体化的盒和盖完成焊料密封。在大多数情况下,外部地把焊料盖安装在个体化的盒上并且在惰性气体加热室中不使用焊料熔剂下软熔。通常在软熔期间利用焊料熔剂的粘性性质帮助把电子器件保持在原位。但是,SAW器件对于电极表面上的外来材料特别敏感。该熔剂的残留物在软熔后会变成留在密封盒中并且可能沉积在SAW模的活性表面上。
和个体化盒的焊料密封不同,由于盖的尺寸很小、阵列上各盒间的余隙有限以及阵列的曲率,外部地把各焊料盖固定在阵列上的技术实现起来非常困难。另外,在软熔期间难以保持外部夹具和阵列之间的整体性。在软熔工艺处理期间必须准确地对齐外部夹具并且保持和整个阵列的紧密接触,以便有效地隔离薄盖并防止焊料在盖之间跨接。本发明减轻现有技术中遇到的与盖固定和盒密封关联的所有困难。
发明内容
本发明在于一种允许表面声波器件以及其它微电子器件的阵列处理的系统和方法。本发明的优选方法包括步骤:(a)形成一个非导体材料的整体阵列,该阵列具有相对的第一和第二表面并且具有多个隔开的从该第一表面延伸到该阵列内的空腔,每个空腔的尺寸为在其中容纳一个SAW器件;(b)在每个空腔靠近该第一表面形成一个凹槽,每个凹槽的宽度大于对应的空腔并且尺寸定成在凹槽内容纳一个盖;(c)从每个空腔的内部向该阵列的一个表面设置至少二条导电路径;(d)向多个空腔的每个空腔中插入一个SAW器件,每个SAW器件具有插入后和相应空腔内的导电路径电气接触的导电装置;(e)在每个插入的SAW器件上密封盖在凹槽内;以及然后(f)沿着相邻空腔之间的分割线把该阵列分割成各个SAW器件。
本发明的另一个重要方面是能在分割步骤后保持相邻空腔之间的间隔。这可以通过在密封盖和第一表面上施加带式装置达到。
本发明还包括根据上面所这明的方法制造的表面声波器件。这些器件是从一个组件形成的,该组件包括一个带有如上面所述的空腔和凹槽的整体阵列,其中每个SAW器件插入到多个空腔中的各个空腔里以电气地和从对应空腔的内部向该阵列的一个表面延伸的导电路径接触。当在每个插入的SAW器件上面密封一个盖在各个对应凹槽内后,把该阵列分割成各个SAW器件。
本发明的一个总目的是提供一种盖固定技术,当盖结合到盒上时该技术允许在阵列形式下气密地密封陶瓷SAW盒并且在各盒位置之间为随后的个体化提供足够的容隙。最好用焊料密封这些盒,尽管也可以使用其它的密封剂。在处理期间凹槽的各个壁包围盖从而防止焊料在软熔期间在盖之间的搭接,凹槽厚度和盖的厚度一样是合适的。凹槽最好是盒的一体的部分并在盒外形的顶上提供一个陶瓷“画框”。从而,可以利用一个离线自动安装机在无需外部固定设备下把盖准确地放在每个盒位置上。
为了密封各个盖,在阵列中的各个盖的顶上放一个自由运动镇重体或一块平板,然后把该组件放到一个惰性气体加热室中以进行相继的软熔。“画框”式凹槽的固有固定能力以及轻微膨胀的阵列布局使焊料密封阵列形式下的各个小覆盖区、多层陶瓷SAW盒,并且在盒的位置之间提供足够的容隙供随后通过相邻空腔之间的切割分成个体。
该焊料密封技术可以使用涂有焊料、包覆焊料和焊料生料的金属或陶瓷盖。尽管焊料密封是选取的密封方法,也可以采用树脂密封和玻璃烧结密封。密封媒介(树脂、玻璃或焊料)可以是盖的集成部分、盒阵列的集成部分或者在装配前施加到盒上或盖上。
附图说明
图1是本发明的方法中使用的组件的一部分的部分剖开的透视图。
图2是倒装片表面声波(SAW)器件的典型球焊的透视说明。
图3是本发明的组件的一部分在沿着分割线把阵列分割成各个SAW器件并且同时保持各个器件间的间隔后的剖面图。
图4是依据本发明的密封表面声波器件的透视说明。
图5和图6分别是和本发明的组件一起使用的用于盖的第一焊料配置的底视图和侧视图。
图7和图8分别是用于本发明的盖的第二焊料实施例的底视图和侧视图。
具体实施方式
现参照图1-图4说明依据本发明的一种用于表面声波器件的阵列处理的系统和方法。
在图1中,用参考数字10整体地表示用来实践本方法的一个组件10。组件10包括一个以带有上表面14和下表面16的陶瓷体12形成的阵列。该阵列包括多个空腔18,每个空腔从上表面14向陶瓷体12延伸到腔底20。由于这样的形状,在腔底20和第二表面16之间存在小尺寸的陶瓷体12(参见图3的剖面)。
该组件设置着至少二条的从每个空腔18的内部延伸到陶瓷体12的一个表面的导电路径。如图1-4中所示,通过空腔18的底部20上的导电层22、24提供这些导电路径,其中这些导电层分别和导电通路30、34电气连接,该导电通路30、34穿过陶瓷体12分别和第二表面16上接触垫片32、36端接。导电通路34还延伸成和搭接区28并和盖焊料63接触,如图3所示和在后面更详细说明那样。
依据本发明,在每个空腔18处邻近第一表面于陶瓷体12中形成盖定位凹槽26,其中每个凹槽的宽度和长度大于对应的空腔18并且尺寸定成在该凹槽内容纳盖60。从而凹槽26定义一个在把盖放到凹槽中后於盖16的下表面上和焊料63接触的搭接区28,如图3中所示那样。
现在参照图2,图中示出由压电体42形成的典型表面声波(SAW)器件40,压电体42具有一个在其上淀积带有相关焊接垫片48的第一组交指状电极46以及带有相关焊接垫片52的第二组交指状电极50。如图3中所示,在处理期间,SAW器件40在空腔18中定向成焊接垫片48、52按典型的“倒装片”方法分别和导电层22、24接触。业内人士从后面阐明的讨论会理解图3的剖面示出焊接后的组件,以便在为了分割各个器件并且进行测试翻转组件10之前把SAW器件40固定就位。
重新参照图1,在把SAW器件40放到空腔18中后,接着在空腔18的上面把盖60放在盖定位凹槽26中并且和搭接区28接触。这最好是利用自动设备完成的。
现参照图5-图8,其中示出用于具有侧面66的盖60的二种不同的适用的焊料布局。在图5和图6中,焊料接缝63被限制在底表面64的周边区域并且和搭接区28(图1)对应。在图7和图8示出的布局中,焊料接缝65应用成为盖60的整个底表面64上的一个连续层。在图3的剖面图中描述图5和图6的实施例。在处理期间,利用放在阵列中的各盖的顶上的自由运动镇重物或者一块平板把各个盖60稳固地保持就位在各自的盖定位凹槽26内,同时在惰气气体中加热以便使焊料接缝63流动。
在上面讨论的软熔步骤之后,向陶瓷体12的底表面16施加装置以在沿分割线70、72分割各个SAW器件期间保持该阵列的整体性。在一优选实施例中,该装置由一条沿着第一表面14以及盖60的顶表面62施加的带74构成。最好通过切割SAW或者其它适用的分割技术沿着分割线70、72使该阵列“个体化”(即,变成为各个独立器件)。然后,去掉带74以允许对每个SAW器件100进行进一步的处理。
如图4中所示,所得到的个体SAW器件100包括陶瓷体12的一部分,和它关联的上下表面14、16以及从各个分割线70、71形成的侧表面71、73。盖60气密地密封在盖定位凹槽26内。业内人士当然会理解SAW器件100相对于现有技术器件能明显小型化。
这结束了本发明的说明。业内人士清楚可以对这些实施例做出各种修改而不背离本发明的精神和范围。例如,尽管描述了陶瓷阵列,其它材料可以适用作为阵列材料。另外,如前面所说明那样,可以把树脂和玻璃烧结用作为适用的密封材料。类似地,可以采用其它适当的方案来实现定位凹槽的任务。
Claims (12)
1.一种用于制造SAW器件的方法,该方法包括步骤:
形成一个非导性材料的整体阵列,该阵列具有相对的第一和第二表面并且具有多个隔开的从该第一表面延伸到该阵列内的空腔,每个空腔的尺寸定成在其中容纳一个SAW模;
在每个空腔从该第一表面形成一个凹槽,每个凹槽的尺寸定成在凹槽内容纳一个盖;
从每个空腔的内部向该阵列的一个表面设置至少两条导电路径;
在多个空腔的每个空腔中面向下的插入并固定一个SAW模,每个SAW模具有插入后和相应空腔内的导电路径电气接触的导电装置,
在每个插入的SAW模上方密封一个盖在凹槽内;以及然后
沿着相邻空腔之间的分割线把该阵列分割成各个SAW器件。
2.权利要求1所述的方法,还包括在分割步骤期间通过在密封的盖以及第一表面上施加带装置保持相邻空腔之间的间隔的步骤。
3.权利要求1所述的方法,其中该盖密封步骤包括步骤:
在每个空腔上放上一个盖;
在每个盖的周边附近放上密封材料;以及然后
热处理该盒阵列-盖组合件以实现盖的密封。
4.权利要求3所述的方法,其中该密封材料包括焊料。
5.权利要求3所述的方法,其中该处理步骤包括固化该密封材料的步骤。
6.权利要求5所述的方法,其中该密封材料包括树脂。
7.权利要求1所述的方法,还包括步骤:
在该分割步骤之前在该第一表面和密封的各盖上装上带;
从该第二表面在保持该带在该第一表面上的连续性的情况下进行该分割步骤;并且然后
从该带取下各个SAW器件。
8.权利要求1所述的方法,还包括用非导体材料形成该整体阵列的步骤。
9.权利要求8所述的方法,其中该整体阵列由陶瓷构成。
10.权利要求1所述的方法,其中该盖密封步骤包括相对于周围环境气密地密封该空腔的步骤。
11.一种用于制造各个SAW器件的组件,包括:
一个非导体材料的整体阵列,其具有相对的第一和第二表面并具有多个隔开的从该第一表面向该阵列内部延伸的空腔,多个空腔具有插入在其中的SAW模;
每个空腔处从该第一表面延伸的凹槽,每个凹槽的尺寸定成在凹槽内容纳一个盖;
提供至少两条从每个空腔内的SAW模到该阵列的一个外表面上的导电路径的装置;
密封在每个凹槽中插入的SAW模以及对应空腔之上的盖;以及
其中可以沿着相邻空腔之间的分割线把该阵列分割成各个SAW器件。
12.权利要求11所述的组件,其中每个凹槽的尺寸大于对应空腔的尺寸以便形成一个搭接区,其中每个凹槽内密封的盖和该搭接区接合。
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DE10355921B4 (de) * | 2003-11-29 | 2005-12-22 | Festo Ag & Co. | Elektrische Schaltungsanordnung mit einem elektronischen Chip in einer Aufnahmevorrichtung des Schaltungsträgers |
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JP4086889B1 (ja) * | 2007-06-28 | 2008-05-14 | ジャパン・フィールド株式会社 | 表面処理装置 |
US9399574B2 (en) | 2009-08-13 | 2016-07-26 | Knowles Electronics Llc | MEMS package and a method for manufacturing the same |
US8987030B2 (en) * | 2009-08-13 | 2015-03-24 | Knowles Electronics, Llc | MEMS package and a method for manufacturing the same |
WO2013066343A1 (en) | 2011-11-04 | 2013-05-10 | Knowles Electronics, Llc | Embedded dielectric as a barrier in an acoustic device and method of manufacture |
US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
FR3091004B1 (fr) * | 2018-12-24 | 2020-12-04 | Soitec Silicon On Insulator | Structure de type semi-conducteur pour applications digitales et radiofréquences |
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TW508851B (en) | 2002-11-01 |
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