CN1214344C - 电子模块或标签及其制造方法、包括这种模块或标签的介质 - Google Patents

电子模块或标签及其制造方法、包括这种模块或标签的介质 Download PDF

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CN1214344C
CN1214344C CNB988114305A CN98811430A CN1214344C CN 1214344 C CN1214344 C CN 1214344C CN B988114305 A CNB988114305 A CN B988114305A CN 98811430 A CN98811430 A CN 98811430A CN 1214344 C CN1214344 C CN 1214344C
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D·埃尔巴兹
J·-C·菲达尔戈
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Jin Yatuo
Gemalto Oy
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Abstract

本发明涉及一种制造至少一个适合于变得有粘性的电子模块或标签的方法，该方法包括以下步骤：提供包括至少一个触点型和/或天线型接口的绝缘薄膜；提供一种包括可激活的粘结剂(44)和可揭去的保护薄膜的胶带(40；56；70；80)，所述胶带包括至少一个与模块或标签上的树脂区域对应的开孔，把所述胶带粘贴在支持薄膜上，使得所述开孔与树脂的区域重合，激活所述粘结剂，使得它把胶带固定在所述薄膜上；以及把覆盖树脂至少分配到所述开孔内提供的区域上，并与开孔接触。本发明还提供一种方法，其中淀积不带有保护薄膜的可激活粘结剂。

Description

电子模块或标签及其制造方法、 包括这种模块或标签的介质
本发明涉及准备集成于诸如智能卡或电子标签等电子卡片的电子模块或标签的制造方法。
这种电子模块包括至少一个微电路和接口，在传统的触点型智能卡的情况下接口可以是接触端点组件，或者在无触点智能卡和电子标签的情况下接口可以是提供无触点通信的一根或多根天线。在混合型智能卡的情况下，接口包括接触端点组件和天线。
制造智能卡用的一个标准过程在一个连续的支持薄膜上成批生产电子模块，然后切割支持薄膜，以便将模块固定在形成于卡体中的凹穴中。更准确地说，把微电路或芯片粘在携带接口的支持薄膜上，然后完成从微电路到接口的连接。然后用涂层，尤其是用一滴提供机械保护的热固树脂覆盖连线和芯片。
接下去是把电子模块固定在卡片凹穴中的操作，通常称为“制卡”。为此可将诸如氰基丙烯酸酯胶或者甚至热激活粘结剂等粘结剂放入凹穴中。或者，在所述覆盖操作之后和把模块切割出来之前可以把热激活粘结剂加热层压在薄膜上。然后，在将模块放入凹穴后通过热压重新激活粘结剂。
小芯片用的保护树脂通常直接放在支持薄膜上。相反，对于大型微电路，尤其是矩形的，为了获得可重复的形状，必须用淀积在电子模块周围的“围栏”来限制树脂滴的表面。围栏的使用使树脂的淀积变得容易，并且在某些情况下可以免去研磨操作的必要性，不然的话为了获得模块的最后厚度这是必须的。
围栏可以是用注射器(“分配”)或丝网印刷淀积的聚合物(环氧、硅氧烷、聚酯)围栏。围栏也可以是粘在支持薄膜上的压制金属框。
使用围栏的技术有一些缺点。首先，其成本比较高，使电子卡片的单位成本加大。在硅氧烷围栏的情况下，有副作用(污染被粘接表面)。淀积树脂的操作必须小心控制，以防止构成废品原因的树脂溢出。最后，在热固树脂的情况下，难以取消研磨操作。
为了避免上述缺点，另一个过程包括以下步骤：把穿孔胶带冷层压在支持薄膜上，用一个被称为“快门控制”的方法把树脂注入由胶带中的穿孔形成的开孔内，必要时，通过模压来调整其厚度，再揭去胶带，
这种方法使用其成本不容忽略的特殊消耗品，亦即胶带。另外，为了降低这种工艺的成本，必须在同一台机器上进行胶带的切割和粘结，淀积树脂，并将胶带揭去。更有甚者，薄膜上即使残留最轻微的粘结剂都是不允许的，因为这会危害“制卡”操作。这两个目标难以有效达到，定位上最轻微的偏移都会导致高的废品率。难以涂覆冷粘结剂，后者必须在涂层形成后揭去，而不要让粘结剂在切除部分附近开始剥落，这会使树脂泄漏到预定的区域以外。
在欧洲专利申请EP-A-0 201 952中描述了另一种技术。它包括以下步骤：把穿孔胶带冷层压在薄膜上，后者不带或带有芯片和/或连接线，所述胶带包括粘结剂体和可揭去的保护薄膜；把油漆喷涂在用这种方法覆盖在芯片和连接线上的保护薄膜上；揭去起了掩模作用的保护薄膜；利用冲头/模具型工具把模块切割出来，并把该模块直接放置在凹穴内。
这一过程难以使用，其机械可靠性有问题。在切割过程中，剩余的粘结剂体粘在冲模和/或卡片上。然后带有与模块对应的开孔的第二保护薄膜放在粘结剂体上。
这个过程的缺点是涉及工艺步骤太多，要求采取第二薄膜形式的特殊消耗品，因而实现起来成本高。
本发明就要解决的问题是，提供一种制造电子卡片用的电子模块的简单、可靠而又经济的方法。
所提出的解决方法目的是不仅减少工艺步骤，而且消除使用消耗品的必要性。为此目的，本发明的原理是利用粘结剂，后者用来以围栏的形式固定或者固定覆盖树脂的限位器。
为此目的，本发明提供一种制造至少一个适合于变得有粘性的电子模块或标签的方法，所述电子模块或标签包括：支持薄膜；至少一个微电路(10；50；82)和至少一个由连线(14；54)连接在一起并置于支持薄膜上的触点型和/或天线型接口(56；72；86)；至少保护所述微电路和所述连线的覆盖树脂，所述覆盖树脂置于预定的区域之上；和可从外部激活的粘结剂，
所述方法包括以下步骤：
a)供包括至少一个触点型和/或天线型接口的绝缘薄膜，
b)提供一种胶带(40；56；70；80)，后者包括可激活的粘结剂(44)和可揭去的保护薄膜，所述胶带包括至少一个与模块或标签上的树脂的区域对应的开孔，
c)把所述胶带粘贴在支持薄膜上，使得所述开孔与树脂的区域重合，激活所述粘结剂，使得它把胶带固定在所述薄膜上，和
d)把覆盖树脂分配到所述开孔内准备填充的区域上，并与开孔接触，把在以前的各步骤中的一个之后连接到接口上的微电路固定在支持薄膜上。
在成批生产装有诸如智能卡的电子模块或装有标签和[sic]的介质的情况下，完成前述各步骤，成卷地提供支持薄膜和胶带，前者包括多个接口，后者包括多个开孔。然后把保护层从胶带揭去，并在通过激活胶带将它们粘结在卡体支持物上之前，把模块或标签切割出来。
由于不用专用消耗品来封闭树脂，所以按照本发明的方法对智能卡的制造就特别有利，因为为此目的使用固定粘结剂，而且工艺步骤数目减少，因为消除了淀积围栏的单独的操作。另外，采用先有技术已知的设备和技术，使之易于在工业上应用。
把工艺步骤数目减到最少，提高了效率并降低了制造成本。
在通常不必使用围栏的小的微电路的情况下，本发明增大连接导线周围树脂的体积，因而提供一种包装的形式，比较刚硬，因而更耐机械应力(重复弯曲和扭转)。在不增加单位成本的情况实现了可靠性的这种提高。
胶带可以在不同的阶段上，包括把微电路粘贴在支持薄膜上之前、粘贴微电路之后和将它们连接之前或之后粘贴在支持薄膜上。
按照本发明的另一个特征，胶带连同其外部保护层的总厚度至少等于保护或覆盖树脂预期的厚度。这使树脂或[sic]能够被良好地包围起来达到要求的高度。
最好简单地通过改变保护薄膜的厚度来使围栏的高度与要求的树脂高度匹配。这样，便可以使用非常薄的粘结剂层，这在制造智能卡时在粘结方面或模块相对于凹穴的动态特性方面特别有利。
可以用各种方法，尤其是喷涂、丝网印刷、正位移分配(Glob Top)等来分配在本实例中是树脂的覆盖材料。
正位移分配提供对预定的树脂淀积量，因而对其厚度的总控制。和喷涂不同，这种技术对支持薄膜上的分配区域提供总的控制，尤其是在任何形式的开孔、围栏或界限范围内的预定区域中。
本发明方法的一种变型与上述前一实施例的差别在于它包括以下步骤：
b)提供无外部保护薄膜的可激活粘结剂(44)，
c)这样淀积粘结剂，使得它分布在整个支持薄膜上，并在所述区域周围确定界限，并激活所述粘结剂，使之粘结到支持薄膜上，以及
d)把覆盖树脂分配在所述界限范围内的预定区域中，使得覆盖树脂在与之接触时停止散布，在前述各步骤中一个之后微电路已经固定在支持薄膜上并连接到接口。
这就不必使用保护薄膜，因而省去了固定之前去除这种薄膜的步骤。
为了把模块或天线固定在支持物上，本发明的方法还包括在将其粘接在或压在所述支持物上之前或同时激活粘结剂的步骤。
支持物最好是包括适合于接纳至少一个微电路、其连接线和所述覆盖树脂的凹穴(32，32’)的智能卡或通行证体(token body)。
本发明还提供通过上述方法获得的电子模块或标签。在电子模块包括天线的情况下，天线可以在支持薄膜的背面上形成，在这种情况下模块包括粘接在支持薄膜背面的第二胶带。
这种第二胶带构成对于天线的保护层。
本发明还提供包括电子模块的电子标签，其中接口是天线，而且是用上述方法获得的。这种标签整个由不是用“制卡”方法制成的而是保留保护层的电子模块构成。该胶带最好用来把标签固定在产品支持物上。
用这样的方法获得了单位成本低的有粘性的电子标签。
为使标签坚挺，胶带可以用，例如，玻璃纤维增强，
本发明还提供用按照本发明的方法制成的智能卡或通行证(token)。
按照本发明的一个特征，标准的智能卡可以通过整个地把模块包裹在支持凹穴中，特别是卡体中而获得，使得模块与支持物的表面齐平。
按照本发明一个有利的特征，智能卡或通行证包括适合于接纳至少一个微电路、其连接线和所述覆盖树脂的凹穴(32，32’)，支持薄膜固定在凹穴外面所述支持物的表面上。这样，很容易把一个大的标签或模块(带有尺寸几厘米的天线接口)固定在卡体上而不必在支持薄膜上要求专门的宽凹穴。
本发明还提供携带按照本发明的方法[sic]获得的多个模块或标签的支持薄膜卷。
从参照附图、以示范性的而非限制性的实例的方式给出的以下描述，本发明的其它特征和优点将显现出来，附图中：
-图1A至1J表示带有围栏的两个实施例的电子模块的传统制造方法；
-图2表示淀积胶带的操作；
-图3和4表示所述围栏两个实施例的“制卡”操作；
-图5A至5G表示按照本发明的制造智能卡的方法；
-图6A至6G表示本发明的第一实施例；以及
-图7至9表示本发明的其它实施例。
图1A至1J表示制造智能卡用电子模块的传统方法。微电路10从晶片中切割出来，并粘结在支持薄膜12上(另见图2)。接上接口的连接线14以构成电子模块。
然后，若微电路大而且呈矩形，则在支持薄膜12上用上述方法获得的电子模块的周围形成围栏。在图1D至1F所示的方法中，围栏是粘接在支持薄膜12上的压制金属框16；在图1G至1J所示的方法中，围栏是聚合物，诸如环氧树脂或聚酯树脂或硅氧烷，它们可以用注射器(“分配”)或丝网印刷的淀积技术淀积。
然后把在机械上保护电子模块用的树脂滴20淀积在电子模块周围的支持薄膜12上由围栏16或18限定的区域内。
然后把粘结薄膜22粘在用保护树脂滴20覆盖的电子模块周围，作好进行把电子模块插入智能卡体中的操作的准备。
图2表示粘贴粘结薄膜22的操作。它表示在支持薄膜12上带有一系列微电路10并由交错薄膜26保护的卷24。把交错薄膜26揭去，并卷在附属滚筒上。第三卷21提供粘结薄膜22，它是由装置28穿孔的，以形成与用保护树脂滴20覆盖的电子模块的区域对应的切孔，结果粘结薄膜22形成围绕这一区域的框子30。
然后切割支持薄膜12，以获得单个的电子模块，然后用刚粘上的粘结薄膜22把电子模块粘在智能卡卡体34的凹穴32内。对于围栏16和18的两个实施例，这个操作示于图3和4。
在热固树脂的情况下，可能有必要在切割操作之前，例如通过研磨保护树脂滴20的方法来校正由保护树脂滴20覆盖的电子模块的厚度。
如上所述，形成围栏的传统技术有许多缺点。这种操作的成本不能忽略。
所用的材料可能有有害的副作用；例如，若用硅氧烷，则在随后的工艺步骤中准备粘结的表面可能被污染。
淀积树脂必须使用精确技术，以防树脂溢出，造成废品。
热固树脂的使用造成校正由保护树脂滴20覆盖的电子模块的厚度的附加操作。
如上所述，产生围栏有另外一些技术，它们必须使用消耗材料和/或附加的工艺步骤，增大制造成本。
本发明避免了上述缺点，并以低的制造成本生产由保护树脂滴20覆盖的电子模块。本发明的原理是利用随后“制卡”操作用的粘结薄膜来形成围栏。因此没有消耗材料；另外，也省去了专门形成围栏的步骤。
图5A至5G表示按照本发明的由保护树脂滴20覆盖的电子模块的一个实施例。图5A至5C表示生产支持薄膜12的两个步骤、粘结在微电路或芯片10上的步骤和形成接口连接线14的步骤。
然后，按照本发明，把例如图2所示的粘结薄膜22和由覆盖有外保护层44的粘结剂层42构成的穿孔的胶带40粘接在支持薄膜12上。然后涂上保护树脂滴20，此后揭去外保护层44，以便把电子模块粘接在智能卡卡体34的凹穴32内。
这个实施例使用热激活、热塑或热激活[sic]粘结剂，例如，BEIERSDORF TESA 8410粘结剂。
把胶带40粘接在支持薄膜12上的操作是在淀积保护树脂滴20之前进行的；它可以在粘结芯片10之前进行；在形成连接线之前或至少在这后一个步骤之后进行。只要使用不要求会激活粘结剂层42的温度的粘结芯片和连接连接线的技术就行。
例如，可以使用在室温下处于交链状态的二组分胶来粘结芯片，或利用紫外辐照或波长较短的光(“蓝光”)交链的胶。先有技术“楔焊”技术可以用来形成连接线，使用铝线超声焊接。另一种解决办法是“球焊”，利用适当的参数设置，并避免在粘结剂层42的区域使用大于70℃的温度。
胶带40包括外保护层44、亦即外部的非粘结表面来避免在制造电子模块步骤的过程中出现不希望有的粘结。
此外，胶带40连同外保护层44的厚度选为不小于保护树脂滴20的预期的厚度。若保护树脂滴20由正位移分配型淀积技术淀积，对淀积的树脂量和因而对其厚度提供总体控制，则可以使用较薄的胶带40。
保护树脂必须在低温下交链。它可以由紫外辐射激活、润湿交链或者是二组分产品。
在薄胶带的情况下，树脂的流变特性和表面张力使得重复地获得凹滴。在另一种情况下，在本发明的范围内用的“树脂”一词可以指适合于保护微电路及其连接线的任何材料。
在保护树脂滴20胶凝或完全交链之后，揭去外保护层44，以便用传统方法进行“制卡”操作。在外保护层44薄的情况下，保护树脂滴20的厚度可以通过研磨校正。
图6A至6G表示利用由紫外辐射交链的粘结剂层42和基于热固聚合物(例如，环氧树脂或尿烷聚合物)的另一个实施例，其聚合过程由紫外辐射启动，可以配合热塑配方(例如，聚酯)，以便使产品变得可激活，使产品在加热时变粘。如图6所示，揭去外保护层44后、刚好在将其装入卡体34的凹穴32之前，用紫外辐射激活粘结剂层42。因此不必施加高温来使粘结剂层42聚合。这意味着与使用加热交链的粘结剂相比，通常在高温下加压引起的凹穴32背面变形显著减小。
这种粘结剂的优点是它能暴露于80至120℃的温度下，而不会使其质量下降；这意味着热固保护树脂可以在胶带40的开孔形成的凹槽内浇铸和聚合。
因此，本发明可以生产包括接触端点组件型或天线型接口的电子模块。在其接口是天线的电子模块的情况下，本发明可以生产例如在大型零售代销商中标记商品用的电子标签。这样的电子标签尤其是可以用来检测进入监视区域的商品。标签的外保护层44不揭去，使得用户可以选择是否将其揭去。但在目的在于成批地把模块或标签固定在商品上，诸如芯片支持物或工业产品上的最佳实施例中，保护薄膜必须在切割之前揭去。在一个实例中，模块用冲压的方法切割出来，并传输到插入工具，以便将其固定到有关的产品上。
胶带的粘结剂层可以用来把电子标签粘接在产品上。
图7表示这种类型的标签，它包括支持薄膜50、微电路52、连接到包括淀积在支持薄膜50背面的金属圈的天线56的连接线54，和胶带58。微电路52嵌在保护树脂滴60内。
在这种情况下，胶带52产生恒定厚度的标签。若要求强度较高的标签，则，例如，可以使用玻璃纤维增强的胶带。
天线由金属带，例如，通过化学蚀刻或压印在例如玻璃/环氧树脂、聚酯树脂、聚酰亚胺、聚乙烯、聚丙烯等介质上的铜带或铝带制成。
天线可以处于与微电路同一侧面(支持薄膜50的正面)或另一侧(背面)上。
在前一种情况下，如图8所示，胶带70保护天线72的线圈，防止气候条件的影响，气候会使天线的特性退化，例如通过腐蚀和机械磨损。另外，该标签可以通过把线圈接地或短路而在不干扰操作的情况下处理。
在后者的情况下，如图9所示，形成围栏的胶带80粘在支持薄膜82上，而保护天线86的保护薄膜84可以粘贴在其背面上。
本发明提供触点型、无触点型或混合型智能卡用的低成本电子模块。尤其是不使用消耗材料，制造工艺步骤减少。
此外，本发明的方法使用传统设备和制造工艺步骤，这使它比较可靠。
另外，可以在低成本的情况下获得在机械强度方面高可靠性的电子标签。
在本发明使用可激活粘结剂(44)的方法的实施例中，粘结剂可以以不同的方法施加，尤其是以带子或点的形式。
类似地，粘结剂可以以薄膜，诸如热溶薄膜的形式粘贴。这样的薄膜可以像保护带状薄膜一样穿孔。
粘结剂可以是多层薄膜。粘结剂层可以用不同的方法激活，尤其是用辐射或加热的方法激活。
一种实用的分配方法使用丝网印刷技术。
依照工艺过程的不同，当粘结剂被热激活时，覆盖树脂可以是在70℃或更低的温度下聚合的单组分树脂或双组分聚合物。

Claims (14)

1.一种制造至少一个模块或电子标签的方法，所述模块或电子标签包括：薄膜支持物；至少一个微芯片(10；50；82)和至少一个由连线(14；54)连接在一起并置于薄膜支持物上的触点型接口(56；72；86)和/或天线；至少保护所述微芯片和所述连线的覆盖树脂，所述覆盖树脂置于预定区域上；和可从外部激活的粘结剂，所述方法包括以下步骤：
a)提供包括至少一个带有触点的接口和/或天线的薄膜支持物，
b)提供一种包括可激活的粘结剂(44)的材料，
c)这样施加所述材料，使得它分布在整个薄膜支持物上，并在所述预定区域周围确定界限，激活所述包括粘结剂的材料，使之粘结到薄膜支持物上，
d)把覆盖树脂分配到所述界限内的预期区域上，使得覆盖树脂在与之接触时停止散布，在前述各步骤中一个之后将微芯片固定在薄膜支持物上并连接到接口，
其特征在于，所述界限具有至少等于所述覆盖树脂的预期厚度的总厚度。
2.按照权利要求1的方法，其特征在于，所述材料是一种胶带(40；56；70；80)，该胶带包含可揭去的保护薄膜，所述可揭去的保护薄膜包含至少一个与树脂区域对应的开孔。
3.按照权利要求2的方法，其特征在于，在把所述微芯片(10)固定在薄膜支持物(12；50；82)的步骤之前进行所述胶带(40；56；70；80)的传递。
4.按照权利要求1的方法，其特征在于，所述材料包括热粘性薄膜，该薄膜包括至少一个与树脂区域对应的开孔。
5.按照权利要求1的方法，其特征在于，所述材料包括多层薄膜，该多层薄膜包括至少一个与树脂区域对应的开孔。
6.按照权利要求1的方法，其特征在于，所述包括粘结剂的材料是热激活材料，以及所述覆盖树脂在辐照下被聚合。
7.按照权利要求1的方法，其特征在于，所述包括粘结剂的材料是热激活材料，以及所述覆盖树脂是在70℃或更低温度下聚合的单组分树脂。
8.按照权利要求1的方法，其特征在于，所述包括粘结剂的材料是热激活材料，以及所述覆盖树脂是在70℃或更低温度下聚合的双组分聚合物。
9.按照权利要求1的方法，其特征在于，所述支持物是智能卡或通行证体，其中包括一个凹穴(32，32’)，准备用来接纳至少一个微芯片、其连接线和所述覆盖树脂。
10.按照权利要求1至9中任何一个方法获得的模块或电子标签。
11.按照权利要求10的模块或电子标签的智能卡或通行证。
12.按照权利要求11的智能卡或通行证，其特征在于，所述模块或电子标签完全固定在凹穴内，并与所述支持物的表面齐平。
13.按照权利要求11的智能卡或通行证，其特征在于，所述薄膜支持物固定在凹穴外侧的所述支持物的表面上。
14.包括按照权利要求1的方法获得的多个模块或电子标签的成卷的薄膜支持物。
CNB988114305A 1997-09-26 1998-09-23 电子模块或标签及其制造方法、包括这种模块或标签的介质 Expired - Lifetime CN1214344C (zh)

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