CN1230922C - 光源 - Google Patents

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CN1230922C
CN1230922C CN02119831.4A CN02119831A CN1230922C CN 1230922 C CN1230922 C CN 1230922C CN 02119831 A CN02119831 A CN 02119831A CN 1230922 C CN1230922 C CN 1230922C
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light source
platform
vestibule
light
emitting diode
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CN1383221A (zh
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桑达
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那它拉坚
约加南旦
林上全
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Annwa hi tech GeneralIP (Singapore) Pte. Ltd.
Intellectual Discovery Co Ltd
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Agilent Technologies Inc
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Abstract

本发明涉及适合于安装到印制电路板上的光源。该光源包括中心孔腔的扁平基片。发光二极管安装到覆盖孔腔底部的金属层上，并由透明密封材料进行密封。金属层提供了用于把发光二极管产生的热进行传导的路径。

Description

光源
发明背景
本发明涉及光源。具体地说，本发明涉及发光二极管(LED)组件形式的高能光源。
由硅片制成的发光二极管(LEDs)通常用于发光，从简单的低能指示灯到高能LED交通灯束以及LED矩阵视频显示中都有不同的应用。一般地，发光二极管管芯组装成密封组件，该组件含有在管芯和暴露在组件外表面的端子垫片之间的电连接件。由于组件的密封性能，这种组件可使二极管与外界电路进行简单连接，保护管芯不受外界破坏。
最近，有趋势使表面安装组件LED组件更小，这就使LED以相对较高速度可靠地安装到印制电路板基片上。通过使单个LED组件更小，就使在多个LED组件中的单位面积的LED管芯数量增加。而且，当LED安装到电路板上时，组装后的电路板厚度可以减少。
目前的表面安装LED组件有各种结构。图1表示一种类型的表面安装LED组件100，该组件包括安装到电路板基片120上的LED管芯110，采用透明材料130对LED110进行密封。该组件包括一对用于将LED连接到外界电路上的导电连接件140、142，。在LED110底面的第一电极安装并电连接到一对导电连接件的其中之一140上。非常细的导线144的一端然后“导线黏结”或焊接到LED110上表面上的第二电极上，而另一端与一对导电连接件的另一个142相连。
图1中LED组件的缺点是不利于把热从LED管芯110上散掉。电路板基片120和透明密封材料130一般由绝热材料制成，而该绝热材料把热“陷”在LED管芯110内。例如，电路板材料FR4具有0.2-0.3瓦每米开氏度的导热系数，同时密封材料Able-Bond826具有大约为2瓦每米开氏度的导热系数。导热连接件140、142具有较好的热传导性，其中铜制的导热连接件具有400瓦每米开氏度的导热系数。然而，从传导连接件散热的效率严格地由1)连接件的较小截面积以及2)连接件提供的热路径的相对较大距离来限定。
在如自动化和装饰灯等许多应用领域中，对高亮度表面安装LED组件的需求正在增加。可通过增大加在LED管芯上的电流或电压来得到较高亮度。
图1中的LED组件的不良散热性能限制了组件在高压以及随之增加的高亮度下工作的能力。如不进行有效的散热，则加在组件上的高压就会迅速地升高管芯的温度，这样会导致光提取效率降低，甚至会对管芯产生永久的破坏。
发明概要
根据本发明的第一方面，提供的光源包括：具有相对的第一和第二表面的基片，该基片限定了在第一和第二表面之间延伸的孔腔；覆盖着靠近第一表面的孔腔开口的平台；安装到孔腔内平台上的发光二极管，以及把发光二极管密封到孔腔内的透明密封材料。
根据本发明的光源具有的优点是，安装有发光二极管的平台提供了直接通往光源外表面的非常有效的散热路径。随之而来可使光源在较高电压下驱动，这样可使光源有提高的光强输出。在不影响热量从管芯经过平台传导的情况下，在基片上的孔腔可使基片由绝热材料制成。最好的是，基片的第一表面形成光源的下表面，用于把光源表面安装到电路板基片上。最优选的是，透明材料带有用于将发光二极管发出的光会聚的会聚圆顶。
按照理想的做法，孔腔包括朝第二表面向外倾斜的侧壁。例如，该侧壁可以是类似反射器杯的圆锥形。该侧壁在基片的第一表面和第二表面之间延伸，且侧壁倾斜从而把从孔腔外的发光二极管发出的光经过第二表面附近的开口反射。
在优选实施例中，平台在第一表面上面和基片侧壁上面延伸。这样的优点是，使平台牢固地保持在基片上，于是避免轻易脱开。
相应地，平台由例如金属的导热材料制成，用于将热量从发光二极管中传导出来，并这样构成，使第一表面朝向安装有发光二极管的孔腔，同时使相对的第二表面暴露在光源的外面。于是，从平台的第一表面到平台的第二表面就形成的热路径。最好的是，从平台的第一表面到第二表面的距离可最小化，使热路径的长度最小，同时使散热更有效。
根据本发明的光源还具有的优点是，通过把发光二极管安装在基片的孔腔内，使组件的体积变小。
根据本发明的第二方面，制造光源的方法包括：提供带有相对的第一和第二表面的基片；把基片的第一表面镀上金属层；经过基片从第二表面向上到第一表面上的金属层进行钻孔，于是金属层提供了覆盖靠近第一表面孔腔开口的平台；把发光二极管安装到孔腔内的平台上，以及用透明密封材料把发光二极管密封在孔腔内。
在优选实施例中，在钻孔步骤后，平台和孔腔的侧壁镀有另外的金属层。
附图说明
下面通过实例，参照附图来描述本发明的实施例。
图1为已知的表面安装LED组件的剖面侧视图；
图2为示出了本发明的表面安装LED组件的正面、平面和侧面正交投影图；
图3为在制造图2中的表面安装LED组件过程中采用的典型步骤流程图；
图4到17为图2中的表面安装LED组件在制造过程不同阶段的剖面侧视图；
图18为示出了图17中表面安装LED组件的顶部的平面图；
图19为示出了图17中表面安装LED组件的底部的平面图；
图20到22为图6到10所示的制造过程中采用的紫外线掩膜的平面图；
图23为带有圆锥状密封材料的图2中表面安装LED组件的可替代设计；
图24为示出了图5中的表面安装组件顶部的平面图。
详细说明
参见图2，图2中简略地表示出了LED组件200，该组件可通过回流焊接或可能的手工焊接而表面安装到印制电路板上。
表面安装LED组件200包括矩形平面基片210，该基片例如为环氧树脂或玻璃叠片、聚酯或聚酰胺板、双马来酰亚胺三嗪(BT)树脂板或热固性聚亚苯基醚板。该基片的上表面212包括位于上表面中心的锥形截面凹坑220。凹坑220包括大致为圆形的底面222和弯曲侧壁224，该侧壁从底面朝上表面212上的圆形边缘226同心向外倾斜。
LED组件200的发光元件由发光二极管(LED)的管芯230形成，该管芯安装在基片210凹坑220的中心部位。如LED组件的正视图中所示，两条细金线240、242一端与LED管芯230电连接，以使电流经过LED管芯的半导体结点。金线240、242的另一端与基片210的上表面212上的相应端子电连接。
上表面212上的端子随后通过一对可导电的通孔连接到基片210的下表面214上的一对导电垫片250、252上，在后面将要描述通孔的细节。暴露在基片的下表面上的该对导电垫片250、252带有两个大致平直的表面，该表面适合于把LED组件表面安装到印制电路板上。
为了有效地从LED管芯230上散热，LED组件在基片的下表面214上带有散热垫片270。垫片270通过基片210上的孔延伸到组件200的主体。垫片270有效地覆盖住下表面214附近的孔的下开口，以形成凹坑220。垫片270实际上带有凹坑的圆形底面222，并延伸成覆盖孔侧面的覆盖层以形成侧壁224。
垫片270由金属制成，最好由带镍的铜制成，并且垫片带有平台来支撑LED管芯230，同时把热从LED管芯230上传导到组件200暴露的下表面上。从LED管芯底面到垫片/平台270的暴露表面的距离相对组件整个尺寸较小，同时用于传热的垫片/平台270截面积与LED管芯230的安装表面积同样大。这样，垫片/平台270提供从管芯到组件外表面的有效传热路径。另外，垫片270的暴露表面处于可焊接到印制电路板的热沉上的理想位置上，在该热沉上可表面安装该组件。
透明或半透明密封材料260黏结到基片210的上表面212上，于是可把上表面212、金线240、242和LED管芯230上的端子密封。密封材料的形状为形成一个覆盖发光二极管的会聚椭圆圆顶。密封圆顶的椭圆形状使表面安装的LED组件更适合于如视频象素显示的应用。
圆形底面222和凹坑220的侧壁224由垫片/平台270而形成，该垫片/平台270为LED管芯230提供了镀银的镍表面。LED管芯230发出的光由圆形底面222的镀银表面和侧壁224向上反射，由密封材料260来会聚。由在基片上的孔形成的凹坑220具有两个功能，即，一是把从LED管芯230来的光反射，非常象标准反射杯；二是把热从LED管芯230有效地散掉。而且，通过把LED管芯安装到凹坑220上，组件200的高度可比如图1中所示组件100的已知组件减少得多。
如图2所示，在正视图中的椭圆圆弧长轴半径相对较大，于是就提供了大约120度的较宽视角。这种较宽视角在水平面内是很理想的，这在视频显示领域是公知的。相反，在侧视图中所示的椭圆圆弧的短轴半径相对较小，于是提供了大约60度的较窄视角。这种较窄视角在竖直面内是理想的，这在视频显示领域中也是公知的。
图2的LED组件200结构的替换在图23中示出。该组件是近似为3.2mm长、2.8mm宽、2mm高的完全方形。把密封材料260的形状改型成在发光二极管上的圆锥状圆顶，在该圆锥底部，平面部分覆盖在基片210的整个上表面上。
图3为流程图，该图通过实例方式表示出了在图2中示出的表面安装LED组件制造过程中所采用的过程步骤300到350。
考虑到速度和效率，实际上，制造过程设计成一批制造多个表面安装LED组件。制造过程开始时的材料为较大玻璃纤维叠片板，该板被分成同样矩形单元的阵列或格子。这种板可以是带有玻璃转移相位180摄氏度的FR4型基片。这种板最好是具有40个单元宽、20个单元长的单元阵列，同时有近似70毫米乘70毫米乘0.5毫米的尺寸。
在板上的每个矩形单元形成了图2中LED组件矩形基片的基础。在锯开步骤350把单个单元物理分开之前，相同过程步骤300、310、320、330和340用在每个矩形单元中。多个单元在较大板上的工艺过程可使对单元的操作更精确。在以下的描述中，将参照板上的单个矩形单元来解释所述过程步骤。然而，可以理解的是，这些步骤适用于板上的所有单元。
板加工
在制造过程中的第一步骤300包括为管芯附加步骤310制备板单元。板加工步骤300在图4到14中依次示出。
参见图4，首先通过标准电镀技术把铜410A、410B镀在裸露玻璃纤维板单元400的上下表面上。板单元400为0.36mm厚，每个铜镀膜410A、410B为0.07mm厚，于是整个板厚为0.5mm。
在镀铜的过程之后，如图5所示，用两个不同形状的钻头430、450对板上的每个矩形单元400钻孔。进一步参照图24，利用第一圆柱形状钻头430在矩形单元的相对两侧钻两个小孔420、425。这些通孔420、425在板的上下表面之间以及穿过铜镀膜410A和410B而延伸。另外，通过带有倾斜或削去端头的第二圆柱钻头450对位于矩形单元中心的板的上表面进行钻孔，形成圆锥形状截面凹坑。钻头450钻到0.45mm+/-0.02mm的深度，该深度足以确保将孔形成在板400上，但是不深到钻透下面铜镀膜410B上。在0.47mm的最大钻削深度下，孔的下开口上还覆盖有0.03mm铜镀膜。在0.43mm的最小钻削深度下，所有的0.07mm铜镀膜保留覆盖住孔440的下开口上，如图5所示。
钻头把在钻削区域的铜镀膜410去除，留出了暴露在两个通孔420、425和孔腔440上板的表面。随后这些暴露区域被涂上石墨膜，于是该单元的整个表面是不导电的。
在涂上石墨涂层后，被钻削后的单元产生一系列的光化学刻蚀过程，这些过程可选择地把金属层沉积在单元表面上的预定区域。在图6中示出了第一光化学刻蚀过程。参见图6，光化学刻蚀过程包括把光敏抗蚀剂制成的干膜600施加到单元的上下表面上。随后，光掩膜610、612分别置于干膜600的上表面上和下表面下。除了限定沉积金属层的不透明区域之外，分别在图20和21中平面示出的光掩膜610、612一般是透明的。
在光掩膜到位后，单元上下暴露在紫外线(UV)的照射中。对应于光掩膜透明区域的干膜区域可选择地通过暴露在紫外线光下而得到硬化。这些干膜的硬化区域形成了化学阻蚀膜，同时干膜的非暴露区域和非硬化区域在适当的刻蚀剂中溶解，该刻蚀剂例如为铬酸溶液或氯化铁。接着，如图7所示，在化学刻蚀去除干膜后，在单元的上下表面上形成适当掩膜700。
图8示出了用铜800然后用镍810对单元进行电解镀的结果。因为掩膜是电绝缘的，所以在掩膜区域上没有镀膜。相反，单元的余留部分是导电的(包括孔和凹坑)，于是除了掩膜区域外的任何地方均进行镀膜。在此阶段，垫片/平台270穿过组件主体在凹坑底部形成。如图8虚线所示，初始铜镀膜410B和后来的铜镀膜800在基片上孔腔的下开口结合成一体。
一旦完成了镀膜的过程，就用适当的热有机去除剂把硬化掩膜去掉，形成了图9中示出的结构。
接着第二光化学刻蚀过程仅用在单元的上表面。在此前，由光敏抗蚀材料制成的干膜605加到单元的上表面上。图22中平面示出的光掩膜614接着放在干膜上，同时单元的上表面暴露在紫外线光下。光掩膜仅使凹陷区域暴露在紫外线光下，于是干膜在凹坑上硬化，并保留定位，同时通过适当的刻蚀剂使不透光区域溶解掉。图11示出了该光掩膜的情况。
为了在导电层上产生改进的连通性，在图11中，闪金(flash gold)涂层820置于单元上。如图12所示，闪金仅仅黏结到镀镍区域，镍镀膜提供了阻止铜和金层彼此反应的钝化层。由于硬化的干膜掩盖，凹坑区不接受金镀膜。因此，凹坑能很好地保持镍镀膜具有较高的反射性。图13示出了利用适当的热有机去除剂去掉硬化掩膜区后的单元。
如图14所示，利用适当的刻蚀化学制品，可容易去除掉暴露在单元400外面的不需要的铜层，而只剩下涂有镍的凹坑和涂有金的接点。
在板加工步骤300的最后阶段是把孔420、425用如耐焊剂的热固聚合物720密封。这时该板就为管芯附加步骤准备好了。
管芯附加
在制造过程中的下一个步骤310是在凹坑440内安装LED管芯230。该管芯附加步骤的第一阶段包括在凹坑的底面上或基部上分撒或点滴有少量的导电镀银环氧树脂730。如图15所示，下一个阶段是把LED管芯230放到凹坑内镀银环氧树脂上。管芯附加步骤的最后阶段是，在烤箱内，在近似180摄氏度大约一个小时条件下，使镀银环氧树脂与单元的其他部分一起固化。固化镀银环氧树脂使管芯固定在凹坑内，提供了从管芯到垫片/平台270的下面镀镍表面的良好导热性。
导线黏结
在本实施例中采用了导线黏结步骤320，从而使LED管芯半导体接点的两侧与单元板上端的两个独立端子电连接。这两个端子由位于单元板相对两端的镀金层822、824形成。
对于两根导线826中的每一根，导线黏结过程在金导线的一端和LED管芯上黏结垫片之间产生了球窝接头828，而在该导线的另一端和单元板上镀金端子之间产生了楔形接头。在美国专利US4,600,138中描述了形成这种导线黏结的合适装置和方法。在图16中示出了最后形成的导线黏结的LED管芯。
传递模塑
在传递模塑步骤330中完成多个单元的成批加工，在该步骤中，采用已知的传递模塑工艺在单元400的上表面对环氧树脂密封剂进行模塑。模具比原来的玻璃纤维板具有相对较大的长度和宽度，该模具包括一阵列椭圆模具杯，以与板上一阵列单元对应(compliment)。模塑过程包括的第一步骤为，把模具夹持到板的上表面上，于是模具杯阵列位于与板上单元阵列对应的位置上。第二步骤为，在高温和高压条件下把模塑化合物“传递”到模具杯上。例如，模塑化合物可以是美国Dexter Hysol公司的MG18环氧树脂，该环氧树脂加热到近似150摄氏度，并在1500千帕斯卡压力下被传送到模具内。
快速模塑固化
在密封步骤后，单元阵列进行快速模塑固化步骤340，在该步骤中，单元在大约150摄氏度下，在烤箱内烤大约3小时。该固化步骤使密封环氧树脂硬化，于是可抵御外冲击和磨损。
固化的密封剂用来把从LED管芯射来的光聚集，同时也提供了避免水分以及其他材料接触和破坏LED管芯30的阻挡层。固化密封单元在图17中详细地示出。在图17中更详细地示出了图2中的许多特征，为了参照方便，相同标号用来表示相同的特征。
锯切
在最后的锯切步骤中形成单个LED组件，在该步骤中，在板阵列上的单个单元被锯开。最好是使用Disco Abrasive Systems Inc.，Mountain View，California的0.2毫米切割锯来分离出单元。在图17、18和19中示出了最后的表面安装LED组件的细节。
可以理解的是，在不脱离附加权利要求书的范围内，本发明可在具体描述以外的方式实施。例如，在凹坑内镀镍而为LED管芯呈现出镀银表面可以替代为镀银而形成镀银表面。

Claims (15)

1.一种光源包括：
具有相对的第一和第二表面的基片，该基片限定了在第一和第二表面之间延伸的孔腔，
覆盖着靠近第一表面的孔腔开口的平台，所述平台位于所述孔腔之外，并且所述平台由导热材料制成，用于把来自发光二极管的热传导出；
安装到孔腔内平台上的发光二极管，以及
把发光二极管密封到孔腔内的透明密封材料。
2.如权利要求1所述的光源，其中平台在孔腔开口外的第一表面上延伸。
3.如权利要求1所述的光源，其中孔腔包括朝第二表面向外倾斜的侧壁。
4.如权利要求3所述的光源，其中平台在侧壁上延伸。
5.如权利要求1到4中任何一项所述的光源，其中平台为发光二极管提供反射表面。
6.如权利要求1到4中任何一项所述的光源，其中平台包括朝向孔腔的第一表面和相对的第二表面；在该第一表面上安装有发光二极管，而第二表面暴露在光源的外面。
7.如权利要求1到4中任何一项所述的光源，其中平台由金属制成。
8.如权利要求7所述的光源，其中金属平台压在基片上。
9.如权利要求8所述的光源，其中金属平台包括不同金属层。
10.如权利要求1到4中任何一项所述的光源，其中基片由绝缘和绝热材料制成。
11.如权利要求1到4中任何一项所述的光源，其中透明密封材料黏结到基片的第二表面上。
12.如权利要求11所述的光源，其中对透明密封材料模塑形成发光二极管上面的会聚圆项。
13.如权利要求1到4中任何一项所述的光源，该光源还包括
在第一和第二表面之间延伸的第一导电连接件，该第一连接件在第二表面上具有连接到发光二极管上的端子，以及在第一表面上带有与外界电路连接的裸露垫片，以及
在第一和第二表面之间延伸的第二导电连接件，该第二连接件在上表面上具有连接到发光二极管上的端子，以及在第一表面上带有与外界电路连接的裸露垫片。
14.如权利要求13所述的光源，其中基片限定了第一和第二通孔，该通孔在上下表面之间延伸，第一和第二连接件的一部分分别穿过第一和第二通孔延伸。
15.制造光源的方法包括：
提供带有相对第一和第二表面的基片，
把基片的第一表面镀上金属层，
经过基片从第二表面向上到第一表面上的金属层进行钻孔，于是金属层提供了覆盖靠近第一表面孔腔开口的平台，
把发光二极管安装到孔腔内的平台上，以及
用透明密封材料把发光二极管密封在孔腔内。
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