CN1264256C - 具有成一体的屏蔽件的集成电路插座 - Google Patents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
- H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
Abstract
一种用于将集成电路插件(20)安装在电路板(34)上的屏蔽插座(10),包括一个有四边的绝缘材料框架。该框架的四边环绕尺寸为能够接受集成电路插件的中心腔体。接触件组件安装在该框架上。有一组导电元件的接触件组件安装在该框架的下面,以便使集成电路插件与电路板电连接。导电部件(24)布置在框架各侧边的细长开口中。该导电部件延伸到框架底部的下面,以便与电路板的相应地线区域(40)啮合,从而在将集成电路插件安装在框架内时提供用于该集成电路插件的EMI屏蔽。
Description
技术领域
本发明涉及一种用于将集成电路插件安装在电路板上的集成电路插座组件。
背景技术
插座已知可用于在电路插件的底表面上有一组接触件的集成电路。一种已知类型的该插座用于保持焊盘网格阵列(land grid array,LGA)插件。该LGA电路插件通常包括一矩形壳体或本体,该矩形壳体或本体有一组在壳体底表面上的接触件。这些接触件可与LGA插座的接触件匹配。
通常希望集成电路提供有电磁干扰(EMI)屏蔽,以便使可能影响集成电路的电子性能的电磁干扰减至最小,另外还防止该集成电路可能对其它电子装置和/或电路的干扰。这样的干扰可能对电路工作有害,尤其是在高速数字电路中。
在集成电路装置中采用EMI屏蔽是公知的,但是,该EMI屏蔽通常通过与该集成电路插座分离的屏蔽垫圈或屏蔽罩实现。例如,在一种本领域已知的屏蔽技术中,金属导电部件形成为从导电散热器的周边向下延伸。该散热器布置在LGA插座上面,这样,该散热器形成覆盖该集成电路顶表面的屏蔽,而导电部件形成环绕该集成电路的侧面的导电裙。通过该方式进行屏蔽较昂贵,通常不适于大体积的用途。在另一屏蔽系统中,导电○形环布置成环绕LGA插座,并在电路板的导电地线面和安装在LGA插座上面的散热器之间。该技术需要在安装○形环的过程中有处理多个部件的附加装配步骤,且通常也不适于大体积的用途。
发明内容
需要解决的一个问题是怎样简化装配和减小形成具有EMI屏蔽的集成电路插座的成本。
该问题通过本发明的屏蔽插座来解决。
本发明是一种用于将集成电路插件安装在电路板上的屏蔽插座。该插座包括一绝缘材料框架,该绝缘材料框架有四个侧边部分,这四个侧边部分环绕尺寸为能够接受集成电路插件的中心腔体。接触件组件安装在该框架上。该接触件组件有一组布置成预定图案的导电元件,以便与在集成电路插件上的相应接触件匹配。一个细长开口沿每个侧边部分的长度方向延伸,并垂直穿过各所述侧边部分;一个导电部件布置在各所述细长开口中。这些导电部件延伸到框架底部的下面,以便与电路板的相应地线区域啮合,从而在将集成电路插件安装在框架内时提供用于该集成电路插件的EMI屏蔽。
附图说明
下面将通过实例并参考附图介绍本发明,附图中:
图1是LGA集成电路插件组件的分解图,该集成电路插件组件包括本发明的插座组件;
图2是图1的插座组件的视图;
图3a是用于图2的插座组件的框架的俯视图;以及
图3b是用于图2的插座组件的框架的仰视图。
具体实施方式
参考图1-3b,图中所示为一种封装组件,该封装组件包括用于集成电路装置例如LGA装置的插座组件。该封装组件能够对安装在该插座组件内的集成电路进行EMI屏蔽。
尤其是,该封装组件包括一插座组件10,该插座组件10包括安装在接触件组件14上的非导体框架12。该框架12通常为正方形或矩形形状,并有四个侧边部件16,这四个侧边部件16确定了一个较浅的中心腔体18。优选是,该框架12形成为整体模制的塑料件,其尺寸适合将集成电路插件20例如LGA装于该中心腔体18内。该集成电路插件20包括在其一个表面上的多个接触件,这些接触件布置成预定的接触件图案(接触件图案未示出)。框架12包括穿过该框架12的侧边部件16延伸的细长开口22。导电屏蔽件24布置在该细长开口22内,并通过摩擦配合保持在该开口22内。在所示实施例中,该导电屏蔽件24由导电弹性聚合物、导电弹性橡胶、金属或其它任意合适的导电材料制成。在一个实施例中,该导电屏蔽件24大致为平行六面体形状,并有矩形表面。该屏蔽件24的尺寸为当该弹性导电屏蔽件24处于未压缩状态时,将稍微延伸到框架12的顶表面26上面和底表面28的下面。
框架12包括一组定位杆30,用于使接触件组件14相对于该框架12定位和用于使框架12与印刷电路板34对齐。该框架12还包括支座15,该支座15确定了集成电路装置20的安装表面20。尤其是,当集成电路装置安装在该插座组件10中时,集成电路装置20的底表面抵靠该支座15。
接触件组件14包括一绝缘板36,该绝缘板36有一组弹性导电元件38,该弹性导电元件38有上下接触端。导电元件38如美国专利6271482所述安装在绝缘板36的各开口内,该专利的公开日为2001年8月7日,并为本发明的受让人所有。该导电元件38布置成预定的与集成电路插件20的接触件图案相应的接触件图案,这样,当集成电路插件20安装在插座组件10内时,该集成电路插件的接触件与安装在绝缘板36上的相应导电元件匹配。在未压缩状态下,导电元件38从由支座15确定的安装表面上伸出大约0.254mm(0.010英寸),这样,当集成电路装置安装在该插座组件10中时,集成电路装置20的底表面上的接触件与接触元件38的顶端压紧配合。
接触件组件14利用丙烯酸粘接剂或通过其它合适的安装方法而安装在框架12的下面,并通过从绝缘板36的相应定位孔44中穿过的定位杆30而与该框架对齐。
当插座组件10安装在电路板34上时,插座组件10通过从框架12底表面伸出的定位杆30而与印刷电路板34对齐。该定位杆30与电路板34中的相应定位孔46配合,以便将该操作组件10正确保持就位,这样,该导电元件38的底端与印刷电路板34上的相应接触件配合。当插座组件10与电路板34对齐时,导电屏蔽件24与电路板34上的地线区域40接触,该地线区域与地线面电连接。与电路板34上的相应接触件配合的导电元件38的底端可以覆盖有能粘接到电路板34的接触件上的导电聚合物或其它材料。与电路板34上的相应接触件配合的导电元件38的另一接触端并不粘接到集成电路插件接触件上,这样,该集成电路插件20可拆卸地保持在该插座组件10上。
用于集成电路的封装组件为多层结构,包括安装框架48、印刷电路板34、插座组件10、集成电路插件20和导电散热器50。安装框架48包括竖直的杆52,该杆的上端有螺纹,以便接受相配合的有肩螺钉60。该杆52穿过电路板34的相应孔54、插座组件10的框架12的相应孔56和散热器50的相应孔58插入。各有肩螺钉60都有环绕的弹簧62。该有肩螺钉60穿过垫圈64,并拧入杆52的螺纹内,直到该有肩螺钉60降到最低点到达相应杆52的上端。弹簧62向整个组件施加压力,以便使散热器50的底表面保持与集成电路插件20的上表面相抵,使集成电路插件20保持与导电元件38的上端电配合,使导电元件38的底端保持与电路板34上的相应接触件的电配合,以及使导电屏蔽件24保持与散热器50和电路板34上的相应地线区域40导电相抵。在前述方式中,导电屏蔽件24和散热器50配合,以便形成集成电路插件20的有效EMI屏蔽。
在一个可选实施例中,杆52有螺纹,而相配合的螺母代替有肩螺钉60来固定该组件。
Claims (5)
1.一种屏蔽插座,用于将集成电路插件安装在电路板上,所述插座包括:一绝缘材料框架,该绝缘材料框架有四个侧边部分,这四个侧边部分环绕尺寸为能够接受所述集成电路插件的中心腔体;一接触件组件,该接触件组件安装在所述框架上,所述接触件组件有一组布置成预定图案的导电元件,以便与在所述集成电路插件上的相应接触件匹配,其特征在于:
沿各侧边部分的长度方向延伸有一个细长开口,该细长开口垂直穿过各所述侧边部分,在各所述细长开口中设有一个导电部件,所述导电部件延伸到所述框架底部的下面,以便与所述电路板的相应地线区域啮合,从而在将所述集成电路插件安装在所述框架内时提供用于所述集成电路插件的EMI屏蔽。
2.根据权利要求1所述的屏蔽插座,其中:该接触件组件包括一绝缘板,该绝缘板安装有所述导电元件,且该绝缘板安装在所述框架的下面。
3.根据权利要求1所述的屏蔽插座,其中:所述框架包括定位杆,用于使所述接触件组件与所述框架对齐和使所述框架与所述电路板对齐。
4.根据权利要求3所述的屏蔽插座,其中:所述框架包括支座,支座提供了用于所述集成电路插件的安装表面。
5.根据权利要求1所述的屏蔽插座,还包括:导电散热器,该导电散热器安装在所述框架的顶部,并与所述导电部件电连接。
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US09/943,596 | 2001-08-30 | ||
US09/943,596 US6400577B1 (en) | 2001-08-30 | 2001-08-30 | Integrated circuit socket assembly having integral shielding members |
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CN1264256C true CN1264256C (zh) | 2006-07-12 |
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2001
- 2001-08-30 US US09/943,596 patent/US6400577B1/en not_active Expired - Fee Related
- 2001-11-07 US US10/036,824 patent/US6442045B1/en not_active Expired - Lifetime
-
2002
- 2002-08-13 TW TW091118154A patent/TWI248233B/zh not_active IP Right Cessation
- 2002-08-26 CN CNB021422257A patent/CN1264256C/zh not_active Expired - Fee Related
- 2002-08-30 JP JP2002253034A patent/JP2003109717A/ja active Pending
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CN107683416A (zh) * | 2015-04-01 | 2018-02-09 | 埃克斯塞拉公司 | 具有法拉第笼的集成电路(ic)测试插座 |
Also Published As
Publication number | Publication date |
---|---|
TWI248233B (en) | 2006-01-21 |
US6400577B1 (en) | 2002-06-04 |
US6442045B1 (en) | 2002-08-27 |
JP2003109717A (ja) | 2003-04-11 |
CN1407672A (zh) | 2003-04-02 |
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