CN1265399C - 热敏电阻器及其制造方法 - Google Patents
热敏电阻器及其制造方法 Download PDFInfo
- Publication number
- CN1265399C CN1265399C CNB021025991A CN02102599A CN1265399C CN 1265399 C CN1265399 C CN 1265399C CN B021025991 A CNB021025991 A CN B021025991A CN 02102599 A CN02102599 A CN 02102599A CN 1265399 C CN1265399 C CN 1265399C
- Authority
- CN
- China
- Prior art keywords
- electrode layer
- electrode
- thickness
- thermistor
- microns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L67/00—Network arrangements or protocols for supporting network services or applications
- H04L67/01—Protocols
- H04L67/02—Protocols based on web technology, e.g. hypertext transfer protocol [HTTP]
- H04L67/025—Protocols based on web technology, e.g. hypertext transfer protocol [HTTP] for remote control or remote monitoring of applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/226—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor using microstructures, e.g. silicon spreading resistance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L67/00—Network arrangements or protocols for supporting network services or applications
- H04L67/01—Protocols
- H04L67/02—Protocols based on web technology, e.g. hypertext transfer protocol [HTTP]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/40—Network security protocols
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L69/00—Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass
- H04L69/30—Definitions, standards or architectural aspects of layered protocol stacks
- H04L69/32—Architecture of open systems interconnection [OSI] 7-layer type protocol stacks, e.g. the interfaces between the data link level and the physical level
- H04L69/322—Intralayer communication protocols among peer entities or protocol data unit [PDU] definitions
- H04L69/329—Intralayer communication protocols among peer entities or protocol data unit [PDU] definitions in the application layer [OSI layer 7]
Abstract
Description
Claims (30)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/770,566 | 2001-01-26 | ||
US09/770,566 US6498561B2 (en) | 2001-01-26 | 2001-01-26 | Thermistor and method of manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1367497A CN1367497A (zh) | 2002-09-04 |
CN1265399C true CN1265399C (zh) | 2006-07-19 |
Family
ID=25088994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021025991A Expired - Fee Related CN1265399C (zh) | 2001-01-26 | 2002-01-24 | 热敏电阻器及其制造方法 |
Country Status (13)
Country | Link |
---|---|
US (3) | US6498561B2 (zh) |
EP (1) | EP1227308B1 (zh) |
JP (1) | JP4033331B2 (zh) |
KR (1) | KR100854413B1 (zh) |
CN (1) | CN1265399C (zh) |
AT (1) | ATE323278T1 (zh) |
AU (1) | AU776754B2 (zh) |
DE (1) | DE60210522T2 (zh) |
HK (1) | HK1048885B (zh) |
MX (1) | MXPA02000948A (zh) |
MY (1) | MY127800A (zh) |
SG (1) | SG106655A1 (zh) |
TW (1) | TW535172B (zh) |
Families Citing this family (40)
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---|---|---|---|---|
US7144414B2 (en) * | 2000-06-27 | 2006-12-05 | Smith & Nephew, Inc. | Surgical procedures and instruments |
US6498561B2 (en) * | 2001-01-26 | 2002-12-24 | Cornerstone Sensors, Inc. | Thermistor and method of manufacture |
US7117732B2 (en) * | 2003-12-01 | 2006-10-10 | Societe Bic | Fuel gauge for fuel cartridges |
JP2006024829A (ja) * | 2004-07-09 | 2006-01-26 | Toshiba Corp | 半導体装置及びその製造方法 |
KR100612888B1 (ko) * | 2005-01-28 | 2006-08-14 | 삼성전자주식회사 | 온도 센서를 가진 압전 방식의 잉크젯 프린트헤드와잉크젯 프린트헤드에 온도 센서를 부착하는 방법 |
DE102008029192A1 (de) * | 2008-03-13 | 2009-09-24 | Epcos Ag | Fühler zum Erfassen einer physikalischen Größe und Verfahren zur Herstellung des Fühlers |
CN101295569B (zh) * | 2008-06-06 | 2011-04-27 | 广东风华高新科技股份有限公司 | 一种片式电阻器及其制备方法 |
WO2010005024A1 (ja) * | 2008-07-10 | 2010-01-14 | タイコ エレクトロニクス レイケム株式会社 | Ptcデバイスおよびそれを有する電気装置 |
JP5832007B2 (ja) * | 2009-12-25 | 2015-12-16 | 三菱マテリアル株式会社 | 赤外線センサ及びその製造方法 |
JP5381942B2 (ja) * | 2010-09-17 | 2014-01-08 | オムロンヘルスケア株式会社 | 電子体温計およびその製造方法 |
US8822051B2 (en) * | 2010-11-12 | 2014-09-02 | Samsung Sdi Co., Ltd. | Protection circuit module including thermistor and secondary battery pack having the same |
KR101275816B1 (ko) * | 2010-12-31 | 2013-06-18 | 삼성에스디아이 주식회사 | 배터리 모듈 |
CN102692280A (zh) * | 2011-03-24 | 2012-09-26 | 兴化市新兴电子有限公司 | Ntc温度传感器芯片电极结构 |
CN102288321A (zh) * | 2011-07-22 | 2011-12-21 | 肇庆爱晟电子科技有限公司 | 玻璃烧结封装金属探头快速响应温度传感器及其制作方法 |
TWI442418B (zh) * | 2011-08-09 | 2014-06-21 | Murata Manufacturing Co | Thermal resistance |
DE102012110849A1 (de) * | 2012-11-12 | 2014-05-15 | Epcos Ag | Temperaturfühler und Verfahren zur Herstellung eines Temperaturfühlers |
CN103400675B (zh) * | 2013-07-11 | 2016-05-11 | 苏州求是真空电子有限公司 | 氧化锌压敏电阻器及其制备方法 |
KR101646711B1 (ko) * | 2014-04-25 | 2016-08-09 | (주) 래트론 | 온도 센서 소자 및 그 제조 방법 |
DE102014110553A1 (de) * | 2014-07-25 | 2016-01-28 | Epcos Ag | Sensorelement, Sensoranordnung und Verfahren zur Herstellung eines Sensorelements |
DE102014110560A1 (de) * | 2014-07-25 | 2016-01-28 | Epcos Ag | Sensorelement, Sensoranordnung und Verfahren zur Herstellung eines Sensorelements und einer Sensoranordnung |
CN204010866U (zh) * | 2014-07-28 | 2014-12-10 | 肇庆爱晟电子科技有限公司 | 一种复合电极热敏芯片 |
CN104299738B (zh) * | 2014-09-18 | 2017-10-10 | 兴勤(常州)电子有限公司 | 一种电极电子组件及其制备方法 |
US11213423B2 (en) * | 2015-03-31 | 2022-01-04 | Zoll Circulation, Inc. | Proximal mounting of temperature sensor in intravascular temperature management catheter |
TWI555038B (zh) * | 2015-06-09 | 2016-10-21 | A negative temperature coefficient thermistor manufacturing method using a thick film material having a low resistivity and a high resistance temperature coefficient | |
CN105006317A (zh) * | 2015-08-03 | 2015-10-28 | 成都顺康电子有限责任公司 | 一种玻璃封装ptc热敏电阻及其制作方法 |
DE102016101246A1 (de) | 2015-11-02 | 2017-05-04 | Epcos Ag | Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung |
CN109791838B (zh) * | 2016-10-07 | 2022-07-19 | 世美特株式会社 | 焊接用电子零件、安装基板及温度传感器 |
CN108281431B (zh) * | 2018-01-04 | 2021-01-05 | Tcl华星光电技术有限公司 | 一种用于薄膜晶体管阵列基板的湿制程的方法 |
US11525739B2 (en) * | 2018-05-08 | 2022-12-13 | Texas Instruments Incorporated | Thermistor die-based thermal probe |
JP2020087950A (ja) * | 2018-11-14 | 2020-06-04 | 株式会社Flosfia | サーミスタ膜、サーミスタ膜を有するサーミスタ素子およびその製造方法 |
JP2020087949A (ja) * | 2018-11-14 | 2020-06-04 | 株式会社Flosfia | サーミスタ膜、サーミスタ膜を有するサーミスタ素子およびその製造方法 |
JP2020087947A (ja) * | 2018-11-14 | 2020-06-04 | 株式会社Flosfia | サーミスタ薄膜、サーミスタ薄膜を有するサーミスタ素子およびその製造方法 |
JP2020087948A (ja) * | 2018-11-14 | 2020-06-04 | 株式会社Flosfia | サーミスタ膜、サーミスタ膜を有するサーミスタ素子およびその製造方法 |
JP2020087951A (ja) * | 2018-11-14 | 2020-06-04 | 株式会社Flosfia | 積層構造体、積層構造体を有するサーミスタ素子およびその製造方法 |
EP3994710A1 (de) * | 2019-07-05 | 2022-05-11 | TDK Electronics AG | Ntc-dünnschichtthermistor und verfahren zur herstellung eines ntc-dünnschichtthermistors |
KR20210012559A (ko) | 2019-07-25 | 2021-02-03 | 삼성에스디아이 주식회사 | 배터리 팩 |
KR20210012554A (ko) | 2019-07-25 | 2021-02-03 | 삼성에스디아이 주식회사 | 배터리 팩 |
KR102222116B1 (ko) | 2019-07-25 | 2021-03-03 | 삼성에스디아이 주식회사 | 배터리 팩 |
CN111029065A (zh) * | 2019-12-31 | 2020-04-17 | 广东爱晟电子科技有限公司 | 一种高精度高可靠Ir-Cu-Au复合电极热敏芯片 |
DE102021118566A1 (de) | 2021-07-19 | 2023-01-19 | Tdk Electronics Ag | Verfahren zur Herstellung von NTC-Senoren |
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US3256588A (en) * | 1962-10-23 | 1966-06-21 | Philco Corp | Method of fabricating thin film r-c circuits on single substrate |
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JPH0478101A (ja) * | 1990-07-19 | 1992-03-12 | Murata Mfg Co Ltd | チタン酸バリウム系正特性サーミスタ及びその製造方法 |
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US5339068A (en) * | 1992-12-18 | 1994-08-16 | Mitsubishi Materials Corp. | Conductive chip-type ceramic element and method of manufacture thereof |
JPH07297008A (ja) | 1994-03-04 | 1995-11-10 | Komatsu Ltd | 正特性サーミスタおよびこれを用いたサーミスタ装置 |
DE4429552A1 (de) * | 1994-08-19 | 1996-02-22 | Siemens Ag | Ankerhalterung für ein elektromagnetisches Relais |
EP0757393A3 (en) * | 1995-08-02 | 1999-11-03 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting element and method for fabricating the same |
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US5612560A (en) * | 1995-10-31 | 1997-03-18 | Northern Telecom Limited | Electrode structure for ferroelectric capacitors for integrated circuits |
JP3060966B2 (ja) * | 1996-10-09 | 2000-07-10 | 株式会社村田製作所 | チップ型サーミスタおよびその製造方法 |
JP3058097B2 (ja) * | 1996-10-09 | 2000-07-04 | 株式会社村田製作所 | サーミスタチップ及びその製造方法 |
IT1286007B1 (it) | 1996-11-28 | 1998-06-26 | Sgs Thomson Microelectronics | Misuratore di flusso di un fluido |
DE19705712A1 (de) * | 1997-02-14 | 1998-08-20 | Bodenseewerk Geraetetech | Spannring zum Verbinden von zylinderförmigen Baugruppen von Flugkörpern |
JP3393524B2 (ja) | 1997-03-04 | 2003-04-07 | 株式会社村田製作所 | Ntcサーミスタ素子 |
JPH10261507A (ja) | 1997-03-18 | 1998-09-29 | Murata Mfg Co Ltd | サーミスタ素子 |
JPH1194649A (ja) | 1997-09-22 | 1999-04-09 | Mitsubishi Electric Corp | 白金温度センサ |
US6172592B1 (en) | 1997-10-24 | 2001-01-09 | Murata Manufacturing Co., Ltd. | Thermistor with comb-shaped electrodes |
JP2000021606A (ja) * | 1998-07-06 | 2000-01-21 | Nichicon Corp | チタン酸バリウム系正特性サーミスタの電極形成方法 |
JP3633805B2 (ja) | 1998-12-14 | 2005-03-30 | 株式会社村田製作所 | セラミック電子部品 |
MY120265A (en) | 1999-03-11 | 2005-09-30 | Murata Manufacturing Co | Negative temperature coefficient thermistor |
TW487742B (en) * | 1999-05-10 | 2002-05-21 | Matsushita Electric Ind Co Ltd | Electrode for PTC thermistor, manufacture thereof, and PTC thermistor |
JP3446713B2 (ja) | 2000-03-14 | 2003-09-16 | 株式会社村田製作所 | リード端子付きセラミック電子部品 |
JP2002203703A (ja) * | 2000-12-27 | 2002-07-19 | Murata Mfg Co Ltd | チップ型正特性サーミスタ |
US6498561B2 (en) | 2001-01-26 | 2002-12-24 | Cornerstone Sensors, Inc. | Thermistor and method of manufacture |
JP5832007B2 (ja) | 2009-12-25 | 2015-12-16 | 三菱マテリアル株式会社 | 赤外線センサ及びその製造方法 |
-
2001
- 2001-01-26 US US09/770,566 patent/US6498561B2/en not_active Expired - Fee Related
- 2001-12-11 US US10/013,557 patent/US6660554B2/en not_active Expired - Lifetime
-
2002
- 2002-01-16 TW TW091100560A patent/TW535172B/zh not_active IP Right Cessation
- 2002-01-23 AU AU13539/02A patent/AU776754B2/en not_active Ceased
- 2002-01-24 SG SG200200435A patent/SG106655A1/en unknown
- 2002-01-24 CN CNB021025991A patent/CN1265399C/zh not_active Expired - Fee Related
- 2002-01-24 MY MYPI20020266A patent/MY127800A/en unknown
- 2002-01-24 KR KR1020020004097A patent/KR100854413B1/ko not_active IP Right Cessation
- 2002-01-25 AT AT02001782T patent/ATE323278T1/de not_active IP Right Cessation
- 2002-01-25 JP JP2002016483A patent/JP4033331B2/ja not_active Expired - Fee Related
- 2002-01-25 DE DE60210522T patent/DE60210522T2/de not_active Expired - Lifetime
- 2002-01-25 EP EP02001782A patent/EP1227308B1/en not_active Expired - Lifetime
- 2002-12-11 MX MXPA02000948A patent/MXPA02000948A/es active IP Right Grant
- 2002-12-23 US US10/328,216 patent/US8373535B2/en not_active Expired - Fee Related
-
2003
- 2003-02-12 HK HK03101014.7A patent/HK1048885B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1227308A1 (en) | 2002-07-31 |
DE60210522T2 (de) | 2006-12-07 |
AU776754B2 (en) | 2004-09-23 |
HK1048885A1 (en) | 2003-04-17 |
US20030128098A1 (en) | 2003-07-10 |
MY127800A (en) | 2006-12-29 |
TW535172B (en) | 2003-06-01 |
US20020101326A1 (en) | 2002-08-01 |
KR100854413B1 (ko) | 2008-08-26 |
US6660554B2 (en) | 2003-12-09 |
CN1367497A (zh) | 2002-09-04 |
JP2002305102A (ja) | 2002-10-18 |
US6498561B2 (en) | 2002-12-24 |
SG106655A1 (en) | 2004-10-29 |
HK1048885B (zh) | 2006-10-20 |
ATE323278T1 (de) | 2006-04-15 |
DE60210522D1 (de) | 2006-05-24 |
US20020101327A1 (en) | 2002-08-01 |
KR20020063121A (ko) | 2002-08-01 |
MXPA02000948A (es) | 2003-08-20 |
EP1227308B1 (en) | 2006-04-12 |
US8373535B2 (en) | 2013-02-12 |
JP4033331B2 (ja) | 2008-01-16 |
AU1353902A (en) | 2002-08-01 |
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