CN1267903A - 改善化学机械抛光的均匀性 - Google Patents
改善化学机械抛光的均匀性 Download PDFInfo
- Publication number
- CN1267903A CN1267903A CN00104365A CN00104365A CN1267903A CN 1267903 A CN1267903 A CN 1267903A CN 00104365 A CN00104365 A CN 00104365A CN 00104365 A CN00104365 A CN 00104365A CN 1267903 A CN1267903 A CN 1267903A
- Authority
- CN
- China
- Prior art keywords
- slurry
- polishing pad
- pressure ram
- polishing
- distributor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Abstract
Description
Claims (35)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/271,684 US6429131B2 (en) | 1999-03-18 | 1999-03-18 | CMP uniformity |
US09/271684 | 1999-03-18 | ||
US09/271,684 | 1999-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1267903A true CN1267903A (zh) | 2000-09-27 |
CN1150600C CN1150600C (zh) | 2004-05-19 |
Family
ID=23036618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB00104365XA Expired - Fee Related CN1150600C (zh) | 1999-03-18 | 2000-03-20 | 改善化学机械抛光的均匀性 |
Country Status (7)
Country | Link |
---|---|
US (2) | US6429131B2 (zh) |
EP (1) | EP1036631B1 (zh) |
JP (1) | JP2000280166A (zh) |
KR (1) | KR100696025B1 (zh) |
CN (1) | CN1150600C (zh) |
DE (1) | DE60014994T2 (zh) |
TW (1) | TW477732B (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6429131B2 (en) * | 1999-03-18 | 2002-08-06 | Infineon Technologies Ag | CMP uniformity |
JP2001287154A (ja) * | 2000-04-06 | 2001-10-16 | Nec Corp | 研磨装置および研磨方法 |
CN1426343A (zh) * | 2000-12-22 | 2003-06-25 | 皇家菲利浦电子有限公司 | 采用上游和下游流体分配装置的化学机械抛光方法和设备 |
US20020098784A1 (en) * | 2001-01-19 | 2002-07-25 | Saket Chadda | Abrasive free polishing in copper damascene applications |
US7086933B2 (en) * | 2002-04-22 | 2006-08-08 | Applied Materials, Inc. | Flexible polishing fluid delivery system |
US6887132B2 (en) * | 2001-09-10 | 2005-05-03 | Multi Planar Technologies Incorporated | Slurry distributor for chemical mechanical polishing apparatus and method of using the same |
JP2003324085A (ja) * | 2002-05-01 | 2003-11-14 | Mitsubishi Electric Corp | 半導体ウエハの研磨装置および研磨方法 |
KR20030095465A (ko) * | 2002-06-10 | 2003-12-24 | 삼성전자주식회사 | 화학적 기계적 연마 장치 |
US6884152B2 (en) | 2003-02-11 | 2005-04-26 | Micron Technology, Inc. | Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces |
US6939210B2 (en) * | 2003-05-02 | 2005-09-06 | Applied Materials, Inc. | Slurry delivery arm |
US6984166B2 (en) * | 2003-08-01 | 2006-01-10 | Chartered Semiconductor Manufacturing Ltd. | Zone polishing using variable slurry solid content |
US6929533B2 (en) * | 2003-10-08 | 2005-08-16 | Taiwan Semiconductor Manufacturing Co., Ltd | Methods for enhancing within-wafer CMP uniformity |
US20060025049A1 (en) * | 2004-07-30 | 2006-02-02 | Applied Materials, Inc. | Spray slurry delivery system for polish performance improvement and cost reduction |
JP2006147773A (ja) * | 2004-11-18 | 2006-06-08 | Ebara Corp | 研磨装置および研磨方法 |
KR100658175B1 (ko) | 2004-12-30 | 2006-12-15 | 매그나칩 반도체 유한회사 | 화학적 기계적 연마 장치 |
US20070032180A1 (en) * | 2005-08-08 | 2007-02-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Slurry residence time enhancement system |
US7297047B2 (en) * | 2005-12-01 | 2007-11-20 | Applied Materials, Inc. | Bubble suppressing flow controller with ultrasonic flow meter |
US20070131562A1 (en) * | 2005-12-08 | 2007-06-14 | Applied Materials, Inc. | Method and apparatus for planarizing a substrate with low fluid consumption |
JP5080769B2 (ja) * | 2006-09-15 | 2012-11-21 | 株式会社東京精密 | 研磨方法及び研磨装置 |
US20080220698A1 (en) * | 2007-03-07 | 2008-09-11 | Stanley Monroe Smith | Systems and methods for efficient slurry application for chemical mechanical polishing |
US8439723B2 (en) | 2008-08-11 | 2013-05-14 | Applied Materials, Inc. | Chemical mechanical polisher with heater and method |
US8414357B2 (en) | 2008-08-22 | 2013-04-09 | Applied Materials, Inc. | Chemical mechanical polisher having movable slurry dispensers and method |
US20100041316A1 (en) * | 2008-08-14 | 2010-02-18 | Yulin Wang | Method for an improved chemical mechanical polishing system |
US8845395B2 (en) | 2008-10-31 | 2014-09-30 | Araca Inc. | Method and device for the injection of CMP slurry |
US8197306B2 (en) * | 2008-10-31 | 2012-06-12 | Araca, Inc. | Method and device for the injection of CMP slurry |
CN101758420B (zh) * | 2008-12-08 | 2016-04-20 | 香港科技大学 | 一种提供冷却的系统、装置及方法 |
WO2014109929A1 (en) | 2013-01-11 | 2014-07-17 | Applied Materials, Inc | Chemical mechanical polishing apparatus and methods |
US10293462B2 (en) * | 2013-07-23 | 2019-05-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pad conditioner and method of reconditioning planarization pad |
US9833876B2 (en) * | 2014-03-03 | 2017-12-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing apparatus and polishing method |
KR20230025100A (ko) | 2021-08-13 | 2023-02-21 | 에스케이엔펄스 주식회사 | 연마 장치 및 반도체 소자의 제조방법 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61209874A (ja) * | 1985-03-13 | 1986-09-18 | Toshiba Corp | 球体加工装置 |
JPH02262955A (ja) * | 1988-12-15 | 1990-10-25 | Nippon Steel Corp | Siインゴットのワイヤソーによる切断法 |
JP2757041B2 (ja) * | 1989-10-05 | 1998-05-25 | イビデン株式会社 | 電子回路基板の加工方法 |
JP2559300B2 (ja) * | 1991-04-20 | 1996-12-04 | コマツ電子金属株式会社 | 半導体ウェーハの研磨方法 |
JPH05138529A (ja) * | 1991-11-15 | 1993-06-01 | Yokogawa Electric Corp | 研磨装置 |
JP3291946B2 (ja) * | 1994-12-12 | 2002-06-17 | ソニー株式会社 | 化学的機械研磨装置及び化学的機械研磨法 |
JP3734289B2 (ja) | 1995-01-24 | 2006-01-11 | 株式会社荏原製作所 | ポリッシング装置 |
US5578529A (en) * | 1995-06-02 | 1996-11-26 | Motorola Inc. | Method for using rinse spray bar in chemical mechanical polishing |
JPH10309661A (ja) * | 1995-09-08 | 1998-11-24 | Matsushita Electric Ind Co Ltd | 半導体基板の研磨方法及びその装置 |
KR970018240A (ko) * | 1995-09-08 | 1997-04-30 | 모리시다 요이치 | 반도체 기판의 연마방법 및 그 장치 |
US5785585A (en) * | 1995-09-18 | 1998-07-28 | International Business Machines Corporation | Polish pad conditioner with radial compensation |
US5709593A (en) | 1995-10-27 | 1998-01-20 | Applied Materials, Inc. | Apparatus and method for distribution of slurry in a chemical mechanical polishing system |
KR0151102B1 (ko) * | 1996-02-28 | 1998-10-15 | 김광호 | 화학기계적 연마 장치 및 이를 이용한 화학기계적 연마방법 |
JPH1034535A (ja) * | 1996-07-24 | 1998-02-10 | Sony Corp | 研磨方法及び研磨装置 |
US5868608A (en) * | 1996-08-13 | 1999-02-09 | Lsi Logic Corporation | Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus |
US5928062A (en) * | 1997-04-30 | 1999-07-27 | International Business Machines Corporation | Vertical polishing device and method |
US6030487A (en) * | 1997-06-19 | 2000-02-29 | International Business Machines Corporation | Wafer carrier assembly |
US6139406A (en) | 1997-06-24 | 2000-10-31 | Applied Materials, Inc. | Combined slurry dispenser and rinse arm and method of operation |
US5997392A (en) * | 1997-07-22 | 1999-12-07 | International Business Machines Corporation | Slurry injection technique for chemical-mechanical polishing |
US5945346A (en) * | 1997-11-03 | 1999-08-31 | Motorola, Inc. | Chemical mechanical planarization system and method therefor |
US6110012A (en) * | 1998-12-24 | 2000-08-29 | Lucent Technologies Inc. | Chemical-mechanical polishing apparatus and method |
US6429131B2 (en) * | 1999-03-18 | 2002-08-06 | Infineon Technologies Ag | CMP uniformity |
-
1999
- 1999-03-18 US US09/271,684 patent/US6429131B2/en not_active Expired - Lifetime
-
2000
- 2000-02-21 EP EP00103619A patent/EP1036631B1/en not_active Expired - Lifetime
- 2000-02-21 DE DE60014994T patent/DE60014994T2/de not_active Expired - Lifetime
- 2000-03-17 KR KR1020000013585A patent/KR100696025B1/ko not_active IP Right Cessation
- 2000-03-20 CN CNB00104365XA patent/CN1150600C/zh not_active Expired - Fee Related
- 2000-03-21 JP JP2000078478A patent/JP2000280166A/ja active Pending
- 2000-05-09 TW TW089104826A patent/TW477732B/zh not_active IP Right Cessation
- 2000-08-16 US US09/639,986 patent/US6685796B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20010034134A1 (en) | 2001-10-25 |
US6429131B2 (en) | 2002-08-06 |
KR100696025B1 (ko) | 2007-03-15 |
CN1150600C (zh) | 2004-05-19 |
DE60014994T2 (de) | 2006-02-09 |
DE60014994D1 (de) | 2004-11-25 |
US6685796B1 (en) | 2004-02-03 |
EP1036631A1 (en) | 2000-09-20 |
TW477732B (en) | 2002-03-01 |
KR20010006819A (ko) | 2001-01-26 |
EP1036631B1 (en) | 2004-10-20 |
JP2000280166A (ja) | 2000-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1031467 Country of ref document: HK |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160309 Address after: German Berg, Laura Ibiza Patentee after: Infineon Technologies AG Address before: American California Patentee before: Infenion Tech. North America Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040519 Termination date: 20180320 |
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CF01 | Termination of patent right due to non-payment of annual fee |