CN1301188C - 具有高冲击阻力的自锐聚晶金刚石复合件 - Google Patents

具有高冲击阻力的自锐聚晶金刚石复合件 Download PDF

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CN1301188C
CN1301188C CNB038148706A CN03814870A CN1301188C CN 1301188 C CN1301188 C CN 1301188C CN B038148706 A CNB038148706 A CN B038148706A CN 03814870 A CN03814870 A CN 03814870A CN 1301188 C CN1301188 C CN 1301188C
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罗伯特·H·弗鲁肖尔
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Abstract

一种用于切削操作的聚晶金刚石复合件，具有可更新的尖锐切削刃、高抗磨性以及高冲击强度。该聚晶金刚石是由粗的金刚石的基体和散布在该基体中的超细金刚石的大团聚颗粒构成的复合体。这些团聚颗粒生成尖锐的切削刃，这些尖锐的切削刃受到整体均匀的粗金刚石晶体基体的保护，而使其免受冲击力。这种自锐刀对剥落和突然破裂是具是高度抵抗力的。

Description

具有高冲击阻力的自锐聚晶金刚石复合件
技术领域
本发明涉及烧结聚晶金刚石复合体，所述复合体用于钻岩，耐磨损金属的机加工，以及需要金刚石表面的高抗磨性(abrasion resistance)或耐磨损性(wear resistance)的其他作业。特别地，本发明涉及这样的聚晶金刚石，所述聚晶金刚石借助催化剂在高温高压下被烧结，以形成强金刚石-金刚石结合。
背景技术
复合的聚晶金刚石复合件(polycrystalline diamond compact)或PCD被用于包括钻岩和金属机加工在内的工业应用已经有很多年了。一个限制这种PCD成功的因素在于这种PCD和加工材料(work material)之间由于摩擦所产生的热。这些热以导致聚晶金刚石层剥落的裂纹的形式造成对PCD的热损伤、造成聚晶金刚石和基底之间的分层，以及造成导致快速磨损的由金刚石到石墨的逆转变。
当PCD刀具是新的时，它通常具有圆形的几何形状，并且因此对加工材料呈现出尖锐的切削刃(cutting edge)。但是，在使用了一段时间之后，这种圆形或弧形的切削刃磨损成了不能有效穿透加工材料的平坦表面。当用于钻岩时，磨损的PCD刀具变成了产生热的摩擦支撑表面，这加速了PCD刀具的磨损并且减慢了钻的穿透速率。图1示出了在现有技术的刀具上的位置1所产生的磨损平面。
现有技术解决该问题的方法，比如在授予Dennis的美国专利No.4,784,023中所讨论的那样，利用了具有非平坦表面的基底，使得金刚石与基底之间的界面是不规则的。其结果是金刚石层具有薄的和厚的部分。聚晶金刚石较厚的部分提供较高的抗磨性，并且磨损速率较低。对包含具有非平坦界面的PCD的钻头的失效分析显示，所述刀具磨损后的切削刃是不规则的，并且与由平坦界面制成的刀具被磨损后的切削刃相比更尖锐。虽然这通常被认为是一种进步，但仍然存在值得被关注的地方。当使用非平坦基底时，在界面处出现高度局部化的应力，这将造成能够导致刀具突然失效的破裂(cracking)。
在美国专利No.4,784,023中，使用相对少的具有平坦侧壁的平行槽的不足在于应力变得集中在每条槽的顶部，更重要地，是集中在每条槽的基部，并且导致金属基底沿槽底部的边缘出现明显的破裂。这种破裂显著地削弱了基底，而基底的主要作用是为薄的聚晶金刚石层提供机械强度。其结果是，遵循美国专利No.4,784,023所提供的教导的聚晶金刚石刀具的构造不适于会遭遇反复大冲击力的切削应用，比如冲击钻探；也不适于需要考虑极度热冲击(thermal shock)的应用。图2示出了这种设计的现有技术的刀具，并且在边缘3处示出了破裂的位置。
为了克服由于金刚石层与碳化钨基底之间热膨胀性不匹配而导致的复合件中的应力问题，已经提出了其他一些构造。例如，美国专利No.5,351,772说明了使用径向延伸的凸起，所述凸起位于碳化钨基底区域的一侧上，在该侧上形成并结合有聚晶金刚石台。
美国专利No.5,011,616描述一种具有表面形貌的基底，所述表面形貌是由具有非平坦侧壁的不规则形状来形成的，使得基底材料的含量在更深地穿入金刚石层时连续地并且逐渐地减少。美国专利No.5,379,854描述了在金刚石层和基底之间具有半球面界面的基底，该半球面界面包含穿入金刚石层的脊。美国专利No.5,355,969描述了在基底和聚晶层之间由一种表面形貌确定的界面，所述表面形貌具有径向间隔的凸出和凹陷。
相对于碳化钨基底支撑物表面，上面所有的方案都示出了厚度变化的金刚石层。由此，在金刚石层较厚的区域，可利用的钴的量要少于金刚石层较薄的区域中的量。这一点导致了非均匀烧结的金刚石层，所述非均匀烧结的金刚石层实质上弱化了该复合件。即使钴粉与金刚石是在将复合件置于高压高温环境之前预先混合的，钴在具有纹理表面的基底中的存在仍然在烧结处理过程中在金刚石层内产生了不同钴含量的区域，并且在金刚石层内产生松软点或不良烧结的区域。
已经提出使用过渡层来更好地烧结金刚石，并且改善聚晶金刚石对基底的粘附性。
在美国专利No.4,604,106中提出了针对这些问题的一种解决方案。这种PCD利用一个或多个过渡层来分配由于在较大面积上的热膨胀差异所导致的应力，所述过渡层结合有金刚石、钨、碳化物、和钴的不同百分比的粉末混合物。该解决方案的问题在于，由于碳化物第二相的原因而出现较少的金刚石-金刚石的直接结合，导致混合物中的钴烧结碳化物(cobalt cemented carbide)削弱了这部分的金刚石层。
美国专利No.4,311,490教导了在邻近钨支撑物处使用粗金刚石颗粒，在顶部放置一层较细的金刚石颗粒作为外露的切削表面。据报道，这种构造减少了金刚石台中松软点或不良烧结区域的发生，因为较粗的颗粒在它们之间具有较大的通道，使得钴更容易扫越(sweep through)最接近碳化钨基底的金刚石，于是，使得较厚的金刚石层能够被烧结。但是，对于钻岩应用，已经发现虽然较细的金刚石导致更高的抗磨性，但是它还是会导致小得多的冲击阻力。较低的冲击阻力导致复合件刀具以金刚石层从碳化钨支撑基底破裂和剥落的方式失效。
美国专利No.5,645,617也使用了具有不同平均粒度(average particle size)的金刚石层。
层设计的问题在于，它们没有提供使切削刃不规则磨损的手段，从而也没有消除形成相对大的平坦磨损面的问题。因此，拥有这样一种手段是有益的，即控制切削刃几何形态，并且同时限制由采用非平坦界面所导致的应力。
美国专利No.5,855,996示出了结合有不同尺寸金刚石的聚晶金刚石复合件。尤其是，它描述了为了通过用尺寸较小的金刚石颗粒填充较大金刚石之间的空隙来得到更为致密填实的复合件，将亚微米尺寸的金刚石颗粒与尺寸较大的金刚石颗粒混合起来。这种途径的问题在于，均匀的致密金刚石PCD在切削界面产生均匀平坦的、钝的工作表面。由此在PCD磨损时产生的钝边缘减慢了钻岩应用中的穿透速率，产生热，并且裂纹一旦出现就会毫无阻碍地在整个PCD层继续下去。
美国专利No.6,187,068 B1教导了将金刚石分隔为非连续粒度区域的多个横向间隔的区。由较细尺寸的金刚石颗粒形成的聚晶金刚石区域提供了较高的抗磨性和较低的磨损率，由此提供了非线性切削刃。该解决方案的问题在于，不同金刚石尺寸的区域的尺寸相对大，并且在磨损过程中没有提供足够尖锐的切削刃。因此，虽然相对其他几何形态有了改善，但是仍然在工作表面产生了热。此外，不同粒度的大的几何图案沿着非连续粒度区域之间的边界产生应力，导致聚晶材料的突然破裂。图3示出了该设计的刀具(现有技术)的横截面。在不同几何形态区域之间的边缘边界4和5处出现了破裂。
发明内容
本发明提供一种聚晶金刚石复合体，包括分布在整个较大的金刚石颗粒基体中的细金刚石颗粒的集合体，其中，所述基体是由平均直径比所述集合体的金刚石成分颗粒的平均直径大至少5倍的颗粒所构成。
在本发明的实施方案中，所述的金刚石由钴烧结碳化钨基底所支撑。
在本发明的实施方案中，所述的复合体还包括空隙，来自所述空隙的催化剂已经从所述复合体中除去，所述的催化剂曾经被用来烧结所述复合体；或者，来自所述空隙的催化剂已经变得不起作用，所述的催化剂曾经被用来烧结所述复合体。
在本发明的实施方案中，所述集合体由平均粒度小于1微米的金刚石粉所组成，并且，所述的基体金刚石的平均粒度小于30微米。
在本发明的实施方案中，所述集合体的平均直径大于100微米。
在本发明的实施方案中，所述集合体的平均直径在250微米到500微米之间。
在本发明的实施方案中，所述的复合体被形成为一个层，所述的层在界面处固定于基底。
在本发明的实施方案中，所述的复合体还包括由硬性金属所形成的基底。
在本发明优选的实施方案中，所述的基底由金属碳化物所形成，所述的金属碳化物选自由碳化钨、碳化钛、碳化钽及其混合物所组成的组。
在本发明优选的实施方案中，所述的基底由IVB、VB和VIB金属的组中的碳化物所形成。优选地，所述的碳化物在存在钴、镍、铁及其合金中的至少一种粘结剂时被挤压和烧结。
在本发明优选的实施方案中，所述的复合体还包括在所述基底和所述聚晶金刚石之间的界面，所述的界面具有平坦的构造。
在本发明优选的实施方案中，所述的复合体还包括在所述基底和所述聚晶金刚石之间的界面，所述的界面是由多个间隔的、基本平行的槽所形成的，所述的槽位于所述基底和所述聚晶金刚石中的至少一个之中。优选地，所述的槽由从底壁延伸出来的间隔的侧壁所形成。优选地，所述的侧壁相对所述底壁以非垂直的角度设置。
本发明是在整个较大尺寸的金刚石颗粒基体中均匀地分布细金刚石颗粒的集合体(aggregate)。集合体尺寸的确定是要使其可作为分布在基体中的单个耐磨性非常高的大细粒，而基体(matrix)是由稍小的金刚石单晶构成。
整个复合聚晶金刚石作为被烧结在一起的各种尺寸的金刚石晶体的混合物，其中，最大的粒子实际上是由细金刚石单晶构成的块状结构。于是，沿非连续粒度的大几何成形区域没有连续的边缘边界。其结果是，当聚晶材料磨损时，形成了尖锐得多的切削刃，并且沿不同几何区域之间的边缘没有出现长的破裂线。冲击失效的出现是由于碎裂(chipping)而不是由于大面积的剥落或突然破裂所导致的。
附图说明
通过参考下面详细的说明和附图，本发明的各个特征、优点和其他用途将变得更加清楚，其中：
图1是一种现有技术的聚晶金刚石复合件的立体图；
图2是第二种现有技术的聚晶金刚石复合件的立体图；
图3是具有非连续的粒度区域的一种现有技术的聚晶金刚石复合件的立体图；
图4示出了本发明一个实施方案的放大横截面图；
图5由基底支撑的本发明的第二个实施方案；
图6示出了由具有非平坦界面的基底支撑的本发明的第三个实施方案；
图7在具有曲面的基底上形成的本发明的第四个实施方案；
图8示出了现有技术平坦磨损面的放大照片；以及
图9示出了由图5所示的刀具所产生的磨损表面的放大照片。
具体实施方式
在下面的说明中，应该理解的是，下文被说明为由聚晶金刚石、PCD所形成的复合体，或由在现有技术被时常提及的材料--烧结金刚石所形成的复合体，也可以是任何超硬的研磨材料，所述研磨材料包括但不限于合成或天然金刚石、立方体氮化硼和纤锌矿型(wurzite)氮化硼及其组合。
图4示出了本发明一个实施方案放大的横截面视图，该实施方案包括具有由极细金刚石颗粒构成的集合体7的聚晶金刚石基体6。该基体是由分布在整个较大的金刚石基体中的细金刚石颗粒的集合体所组成的，其中，该基体是由平均直径至少比所述集合体中金刚石成分的尺寸大5倍的颗粒构成的。该基体中金刚石晶体之间的空隙8由催化剂材料填充，或者这些空隙也可以是空的，如果该催化剂由酸沥滤或其他方法去除。
图5示出了本发明的第二个实施方案。在该实施方案中，该聚晶复合体是由基底9支撑的层，以形成复合件或切削元件。
基底9优选由硬性金属(hard metal)形成。在具体的实施例中，基底9由金属碳化物所形成，所述金属碳化物选自由碳化钨、碳化钛、碳化钽及其混合物组成的组。基底9也可以由IVB、VB或VIB族金属的组的碳化物所形成，并且是在存在钴、镍、铁及其合金和混合物中的至少一种催化剂或粘结剂时挤压和烧结的。所述的催化剂被用来增强或形成金刚石对金刚石键。催化剂或粘结剂可以通过酸沥滤去除，在基体中的金刚石晶体之间留下空隙8。
在图5中，在聚晶金刚石区域11和基底9之间的界面10具有平面或平直的构造。在图6所述的第三个实施方案中，基底12形成有多个等间距且通常平行的槽以形成金刚石/碳化物界面13。这些槽的侧壁可以是直的或可以形成有角度的侧壁，有角度的侧壁相对基底12的平面呈锐角或斜角设置。其他非平直表面的不规则形状也可以应用于界面13。具有本领域公知的任何其他表面形貌的界面也可以采用。
图7示出了本发明的第四个实施方案。在该实施方案中，聚晶复合体形成在具有曲面15的基底14上。
图8示出了由现有技术的PDC刀具所产生的平坦磨损面的放大照片。图9示出了由根据本发明制备的PDC刀具所产生的尖锐的磨损表面的放大照片。
实施例#1
对0.4微米金刚石粉的1克样品进行处理和过筛来获得尺寸在250微米到600微米之间的块状团聚细粒。然后，将过筛后的块状细粒的100毫克样品与400毫克的25微米金刚石粉混合。然后，将金刚石混合物放入钼杯中。最后，将钴烧结碳化钨(cobaltcemented tungsten carbide)基底放入杯中金刚石粉的顶部。然后，将该组件装入高压室中，在1450℃下挤压到45千巴，保持15分钟。在切断该室的动力(power)并使其在高压下冷却1分钟之后，卸除压力。多个复合体本体从其他的室元件中移出，然后被重叠(lapped)并研磨成最终尺寸。
在加工Barre花岗岩之后测量该刀具的抗磨性。该值大于标准PDC抗磨性的两倍。此外，相对标准PDC的而言，加工操作中的噪声和振动明显地减少了。
实施例#2
对0.4微米金刚石粉的1克样品进行处理和过筛来获得尺寸在250微米到600微米之间的块状团聚细粒。然后，将过筛后的块状细粒的100毫克样品与400毫克的尺寸从2微米到30微米的金刚石混合物相混合。所述混合物的平均颗粒尺寸为大约20微米。然后，将金刚石混合物放入钼杯中。最后，将钴烧结碳化钨基底放入杯中金刚石粉的顶部。然后，将该组件装入高压室中，在1450℃下挤压到45千巴，保持15分钟。在切断该室的动力并使其在高压下冷却1分钟之后，卸除压力。多个复合体本体从其他室元件中移出，然后被重叠并研磨为最终尺寸。
将该刀具的冲击阻力与标准PDC的冲击阻力进行比较。该刀具的破损是由于PDC金刚石层在冲击点的小的碎裂，与此形成对照的是，标准PDC刀具的破损是由于PDC金刚石较大面积的剥落。

Claims (16)

1.一种聚晶金刚石复合体，包括分布在整个较大的金刚石颗粒基体中的细金刚石颗粒的集合体，其中，所述基体是由平均直径比所述集合体的金刚石成分颗粒的平均直径大至少5倍的颗粒所构成。
2.根据权利要求1所述的复合体，其中，所述的金刚石由钴烧结碳化钨基底所支撑。
3.根据权利要求1所述的复合体，还包括空隙，来自所述空隙的催化剂已经从所述复合体中除去，所述的催化剂曾经被用来烧结所述复合体。
4.根据权利要求1所述的复合体，还包括空隙，来自所述空隙的催化剂已经变得不起作用，所述的催化剂曾经被用来烧结所述复合体。
5.根据权利要求1所述的复合体，其中，所述集合体由平均粒度小于1微米的金刚石粉所组成，并且，所述的基体金刚石的平均粒度小于30微米。
6.根据权利要求1所述的复合体，其中，所述集合体的平均直径大于100微米。
7.根据权利要求1所述的复合体，其中，所述集合体的平均直径在250微米到500微米之间。
8.根据权利要求1所述的复合体，其中，所述的复合体被形成为一个层，所述的层在界面处固定于基底。
9.根据权利要求1所述的复合体，其中，还包括由硬性金属所形成的基底。
10.根据权利要求9所述的复合体，其中，所述的基底由金属碳化物所形成，所述的金属碳化物选自由碳化钨、碳化钛、碳化钽及其混合物所组成的组。
11.根据权利要求9所述的复合体，其中，所述的基底由IVB、VB和VIB金属的组中的碳化物所形成。
12.根据权利要求11所述的复合体，其中，所述的碳化物在存在钴、镍、铁及其合金中的至少一种粘结剂时被挤压和烧结。
13.根据权利要求9所述的复合体，其中，还包括在所述基底和所述聚晶金刚石之间的界面，所述的界面具有平坦的构造。
14.根据权利要求9所述的复合体，其中，还包括在所述基底和所述聚晶金刚石之间的界面，所述的界面是由多个间隔的、基本平行的槽所形成的，所述的槽位于所述基底和所述聚晶金刚石中的至少一个之中。
15.根据权利要求14所述的复合体，其中，所述的槽由从底壁延伸出来的间隔的侧壁所形成。
16.根据权利要求15所述的复合体，其中，所述的侧壁相对所述底壁以非垂直的角度设置。
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