CN1333801A - 导热复合材料 - Google Patents
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Abstract
提供一种热导率高于22W/m°K的导热成型组合物(100)。导热组合物(100)包含30-60体积%的聚合物基体(12)。在该组合物中含有25-60体积%的第一种导热填料(116),该填料具有至少为10∶1的较高长宽比。在该组合物混合物(100)中也含有10-25体积%的第二种导热填料(114),该填料具有5∶1或更小的较低长宽比。
Description
技术领域
本发明总体上涉及一种改进的复合材料。更具体地说,本发明涉及一种易于成型(moldable)或铸塑(castable)的导热复合材料。
背景技术
在散热工业中皆知的是使用金属材料用于导热用途,例如为冷却半导体器件组件所需的热散逸。对于这些用途如散热器,一般从块状金属上将金属材料切削或机械加工成所需的形状。然而,这种金属导热制品通常非常笨重,机械加工成本高并且易于腐蚀。而且,机械加工的金属散热制品的几何形状受到与机械或切削加工过程有关的固有缺点的很大限制。结果,使用机械加工成所需形状的金属材料的要求仅由于其设计上的问题而在散热设计上存在严重的局限性,尤其是当已知其有一定的几何形状时,该要求应能达到较高的效率,但却由于机械加工金属制品的局限性而无法达到。
在已有技术中大家都知道改进散热制品的整个几何形状能显著地提高制品的总性能,即使材料是相同的。因此,改进散热器几何形状的需求要求寻找一种替换方法来机械加工块状金属材料。为了满足这个需求,在已有技术中业已进行了多种尝试,制备包含其中所述的导热填料的成型组合物,以便获得所需的导热性。使导热复合材料成型的能力能设计出几何形状较为复杂的部件,从而改进部件的性能。
在已有技术中进行的尝试包括使用填有粒状材料如氮化硼颗粒的聚合物基体。同样,业已进行了多种尝试,以期获得填有薄片状填料的聚合物基体。这些尝试事实上是可成型为复杂的几何形状,但仍不能达到金属机械加工部件所具有的所需性能的程度。另外,已知的导热塑料材料是不适宜的,因为其制造一般非常昂贵,这是由于它要使用非常昂贵的填料。再者,由于在成型过程中对填料排列的关注,故必须以极高的精密度来使这些导热复合材料成型。即使精密成型和设计,流体湍流、由于产品复杂几何形状而与模具发生碰撞等固有问题也都使其不能很好地让填料定位,这样组合物的性能比期望的要差得多。
而且,组合物的整个基体都必须令人满意,因为热传导是一种整体性能(bulk property),而非诸如电传导那样的直接路径性能。需要直接路径来导电。然而,热是在整体中进行传导的,其中用物体的整个体积来进行传导。因此,即使让高度导热的窄导管穿过导热低得多的物体,其热传导也不如在整个物体中一定程度上均匀导热的物体那么好。因此,复合材料体整个基体的导热性的一致性对整体高导热性来说是至关重要的。
鉴于上述状况,目前需要一种高度导热的复合材料。另外,需要一种可成型或铸塑成复杂产品几何形状的复合材料。也需要这样一种可成型制品,其导热性尽可能与纯金属导热材料的导热性接近,而其制造成本比较低。
发明的概述
本发明保持了已有技术中导热塑料组合物的优点。另外,它能提供目前商购组合物所没有的新优点,并克服这种目前商购组合物的许多缺点。
本发明总体上涉及新颖和独特的导热塑料复合材料,其有在热量必须从一个区域转移到另一个区域以免器件损坏的散热用途中的特殊应用。本发明的复合材料是一种能以较低的成本来制造的高度导热的复合材料。本发明的导热成型组合物具有高于22W/m°K的热导率。导热组合物包含30-60体积%的聚合物基体(polymer base matrix)。在该组合物中含有25-60体积%的第一种导热填料,该填料具有至少为10∶1的较高长宽比。在该组合物混合物中也含有10-25体积%的第二种导热填料,该填料具有5∶1或更小的较低长宽比。
在本发明组合物的成型过程中,将混合物加到模腔内,使其流成各种部件的几何形状。长宽比高的填料通常随混合物在模具中的流动而排列,但在其中固有地留下小的无规空隙。混合物中长宽比低的填料填充着混合物中长宽比高的填料之间的空隙。结果,填料组分之间的界面数目和基体厚度都大大减小,这样就使导热性和性能都优于已有技术导热复合材料的导热性和性能。
因此,本发明的一个目的是提供一种具有比已有技术复合材料高得多的热导率的导热复合材料。
本发明的一个目的是提供一种可成型的导热复合材料。
本发明的再一个目的是提供一种成本低的导热复合材料。
本发明的另一个目的是提供一种能成型为复杂部件几何形状的导热复合材料。
本发明的再一个目的是提供一种重量比金属材料明显更轻的导热复合材料。
本发明的还有一个目的是提供一种热导率接近纯金属材料的热导率的导热复合材料。
附图的简要说明
本发明特有的新颖特征将在所附的权利要求书中阐明。然而,本发明的较好实施方案连同进一步的目的和附带的优点将参考与所附附图结合在一起的下述详细描述而得以更好地理解,所述附图是:
图1是在基体中使用长宽比低的填料的已有技术导热复合材料的横截面;
图2是在基体中使用长宽比高的填料的已有技术导热复合材料的横截面,其中图示的填料是理论理想化的排列;
图3是在基体中使用长宽比高的填料的已有技术导热复合材料的横截面,其中图示的填料是成型后的实际排列;
图4是使用长宽比高的填料和长宽比低的填料的本发明导热复合材料的横截面;
图5A是具有薄片状外形的长宽比高的填料组分的顶视图;
图5B是沿图5A中5B-5B线的横截面图;
图6A是具有稻谷状外形的长宽比高的填料组分的顶视图;
图6B是沿图6A中6B-6B线的横截面图;
图7A是具有股线状外形的长宽比高的填料组分的顶视图;
图7B是沿图7A中7B-7B线的横截面图;
图8是具有胡须状外形的长宽比高的填料组分的顶视图;
图9是长宽比低的球形填料组分的顶视图;和
图10是长宽比低的颗粒填料组分的顶视图。
实施本发明的方式
首先参看图1-3,图示了容易商购的各种已有技术的复合材料10和30。尤其是,这些已有技术的复合材料10和30通常显示有如聚合物基体12和不同类型的填料14和16。为清楚和便于说明起见,这些组合物的每一种都是以放大比例来图示的。
如图1所示,提供了一种含有聚合物基体12和球形填料14的已有技术复合材料10的横截面图。在这个已有技术的例子中,基体12填有长宽比低的填料12,该填料的长度与宽度之比一般小于5∶1。例如,该混合物可以包含40体积%的基体和60体积%的粒状或球形填料。聚合物基体12基本上是不导热的,球形填料14是一种金属材料或氮化硼,其独立热导率的数量级约为400W/m°K。
可以看出导热填料在聚合物基体中的填充将使该材料具有导热性,并使材料可成型。当用作导热体时,材料10必须能将热量例如从材料的X侧传热到Y侧。在此传热过程中,热量必须从导热填料组分传到相邻的导热填料组分,从而通过从X到Y的路径。由于图1选择的填料是长宽比低的粒状或球形组分,故热量必须穿过几个填料组分之间的多个界面以及位于填料组分之间的不导热聚合物。热量必须穿过的界面越多和热量必须通过的聚合物越多,则热导率的下降就越大。而且,填料的加入量过多会阻止基体聚合物浸润,从而在最终成型产品中导致不希望有的小气泡。
现在参看图2,理想化的已有技术组合物20在聚合物基体12中使用长宽比高的填料16。图2说明了试图解决上述与在热传导的两个点之间太多界面和太多聚合物有关的问题。图2说明了理想化的组合物20,其中长宽比高的填料16在聚合物基体12中完美地排列着。在此理想化的组合物20中,长宽比高的填料16完美地排列,从而减少了热量必须穿过的界面的数目和热量必须通过的聚合物12的体积。在此理想化的组合物中,当从点X传到Y时仅遇到2或3个界面,与此相反,在图1中的组合物10要遇到7或8个界面。
尽管图2所示的组合物20是理想化和优选的,但实际上在本领域中不可能达到这种状态。这主要是由于成型部件的几何形状。如上所述,使用导热塑料组合物的一个主要原因是它可成型为较复杂的几何形状,从而达到较好的散热效果。因此,当将导热聚合物材料成型时,一般会遇到复杂的部件几何形状。
对于这些复杂的几何形状,填有填料的基体的湍流流动是常见的,从而导致填料的碰撞和不均匀的排列。尽管长宽比高的填料的平行排列显然是优选的,但这不可能达到。而且,湍流流动和与模具边缘的碰撞通常会使长宽比高的填料断裂,尤其是其长宽比大于20∶1时。图3说明了含有填料16的实际组合物30,所述填料16与聚合物12中的相邻填料16略微有点平行。图3是本领域遇到的情况,与图2所示的理论理想化的排列相反,这是与含有填料的成型材料有关的固有问题所致。从图3可以看出,与图1相比,从点X传到Y过程中的界面数或从一个填料16到另一个填料的转变数减少,然而,在传导路径上不导热聚合物材料的体积却增大,这样就大大降低了组合物从X到Y路径的总热导率。而且,长宽比高的填料16的断裂也会使组合物的热导率下降。
现在参看图4,它图示了本发明的组合物100。组合物100包含基体112,它较好是一种聚合物材料,如液晶聚合物。填入聚合物基体112中的是长宽比低的填料114和长宽比高的填料116,两者都是高度导热的材料。本发明在相同的基体112中使用长宽比低的填料114和长宽比高的填料116。如图3所示,长宽比高的填料116的完美平行排列是不可能达到的。结果,在排列差的长宽比高的填料116之间会存在太多的空隙。本发明使用长宽比低的填料114来填充由于成型过程中湍流和复杂模具几何形状所致的相邻长宽比高的填料之间自然存在的空隙。由于在同一组合物中使用长宽比低的填料和长宽比高的填料,故转变表面的总数目可以大大减少,同时可以用先前填充在图3所示不导热聚合物中的长宽比低的填料来替代空隙。
图4所示的本发明组合物100包含基体112,它较好是由液晶聚合物制成。液晶聚合物由于其高度结晶性和其排列填入其中的填料的自然倾向而优选。各种其它类型的聚合物也可以使用。而且,若需要压铸导热体来使用,则基体可以是金属材料。
如图5-8所示,可以使用各种不同类型的长宽比高的填料,它们仍都在本发明的范围内。如图5A和5B所示,将长宽比高的填料116图示成薄片状或片状外形122,其长度为L,厚度为T。图6A和6B说明了另一种长宽比高的填料116,将其图示成稻谷状外形124,其长度为L,厚度为T。图7A和7B图示了股线状外形126,其长度为L,厚度为T。图8图示了胡须状外形128,其长度为L,厚度为T。例如,长宽比高的填料较好是2/1000-4/1000英寸厚、40/1000英寸长的碳薄片,从而达到最小长宽比约为10∶1。长宽比较好高达50∶1或甚至更高。尽管这种尺寸是较好的,但视所需的用途可以采用其它大小的长宽比高的填料。或者,也可以使用直径为200微米的碳纤维。
在图5-8所示的这些适用于本发明的每一种外形中,长度L与厚度T的长宽比至少为10∶1。而且,用作长宽比高的填料116的材料可以是铝、氧化铝、铜、镁、黄铜和碳。
现在参看图9和10,它们图示了合适的长宽比低的填料外形的两个例子。图9图示了基本上球形的填料外形130,其中该组分的直径为D。这样,这种填料外形的长宽比约为1∶1。另外,图10说明了颗粒状或粒状填料外形132用作长宽比低的填料114。这种粒状外形132的形状略微有点不规则,其高度H与宽度W之比为2∶1或类似比例。按本发明,长宽比低的填料114的长宽比为5∶1或更小。而且,用作长宽比低的填料114的材料可以是铝、氧化铝、铜、镁、黄铜和碳。长宽比低的填料的直径或宽度较好约为10/1000英寸,但视所需的用途可为不同的大小。
在本发明的复合材料混合物中,按体积计,较好的是基体112占30-60%;长宽比高的填料116占25-50%;长宽比低的填料114占10-25%。在上述所披露的范围内,可以获得高的体积填充和合适的浸润。
下面是本发明的实施例和较好的实施方案。
实施例
提供占组合物混合物50%(体积)的液晶聚合物基体。提供占组合物混合物约35%(体积)的长宽比约为50∶1、独立热导率约为800W/m°K的长宽比高的碳薄片。最后,提供15%(体积)长宽比约为4∶1并且独立热导率约为400W/m°K的氮化硼颗粒。
下述比较说明了图1和3所示的已有技术组合物的热导率与图4所示的本发明组合物的热导率相比较。
基体聚合物(按体积计) | 长宽比高的填料(按体积计) | 长宽比低的填料(按体积计) | 热导率(W/m°K) | |
已有技术(图1) | 40%LCP | N/A | 60%氮化硼颗粒 | 19 |
已有技术(图3) | 50%LCP | 50%碳纤维无规长度的混合物,长宽比为50∶1 | N/A | 22 |
本发明(图4) | 50%LCP | 35%碳纤维无规长度的混合物,长宽比为50∶1 | 15%氮化硼颗粒 | 28 |
基于上述内容,可以制得优良的可成型、高度导热的复合材料。对已有技术明显改进的本发明的组合物尝试制造这种可成型的导热材料。尤其是,本发明所提供的热导率,极大地改进了已知的组合物,从而允许部件的几何形状复杂,这样就能制得更为有效的散热器件。
本领域的技术熟练者应明白的是在不偏离本发明精神的情况下可以对所列举的实施方案作出各种改变和改进。认为所有这些改进和改变都被所附的权利要求书覆盖。
Claims (24)
1.一种高度导热的成型组合物,它的热导率高于22W/m°K,它包含:
30-60体积%的聚合物基体;
25-60体积%的第一种导热填料,所述第一种导热填料的长宽比至少为10∶1;和
10-25体积%的第二种导热填料,所述第二种导热填料的长宽比小于5∶1。
2.如权利要求1所述的成型组合物,其中所述聚合物基体是液晶聚合物。
3.如权利要求1所述的成型组合物,其中所述第一种导热填料的形状是薄片状。
4.如权利要求1所述的成型组合物,其中所述第一种导热填料的形状是稻谷状。
5.如权利要求1所述的成型组合物,其中所述第一种导热填料的形状是股线状。
6.如权利要求1所述的成型组合物,其中所述第一种导热填料的形状是胡须状。
7.如权利要求1所述的成型组合物,其中所述第一种导热填料是选自铝、氧化铝、铜、镁和黄铜的金属材料。
8.如权利要求1所述的成型组合物,其中所述第一种导热填料是碳材料。
9.如权利要求1所述的成型组合物,其中所述第二种导热填料的形状是球形。
10.如权利要求1所述的成型组合物,其中所述第二种导热填料的形状是颗粒状。
11.如权利要求1所述的成型组合物,其中所述第二种导热填料是选自铝、氧化铝、铜、镁和黄铜的金属材料。
12.如权利要求1所述的成型组合物,其中所述第二种导热填料是氮化硼。
13.如权利要求1所述的成型组合物,其中所述第二种导热填料是碳。
14.如权利要求1所述的成型组合物,其中所述聚合物基体占约50体积%;所述第一种导热填料占约35体积%;和所述第二种导热填料占约15体积%。
15.一种导热聚合物组合物,它包含聚合物、第一种导热填料和第二种导热填料的混合物,所述第一种导热填料的长宽比大于10∶1,所述第二种导热填料的长宽比小于5∶1。
16.如权利要求15所述的聚合物组合物,其中所述聚合物是液晶聚合物。
17.如权利要求15所述的聚合物组合物,其中所述第一种导热填料是碳薄片。
18.如权利要求15所述的聚合物组合物,其中所述第二种导热填料是氮化硼颗粒。
19.如权利要求15所述的聚合物组合物,其中所述组合物的热导率高于23W/m°K。
20.一种导热组合物,它包含:
基体材料;
具有较高长宽比外形的第一种导热填料;和
具有较低长宽比外形的第二种导热填料。
21.如权利要求20所述的导热组合物,其中所述基体材料是金属材料。
22.如权利要求20所述的导热组合物,其中所述基体材料是聚合物。
23.如权利要求20所述的导热组合物,其中所述第一种导热填料的长宽比至少为10∶1。
24.如权利要求20所述的导热组合物,其中所述第二种导热填料的长宽比为5∶1或更小。
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US09/239,913 US6048919A (en) | 1999-01-29 | 1999-01-29 | Thermally conductive composite material |
US09/239,913 | 1999-01-29 |
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---|---|---|---|---|
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CN102149542B (zh) * | 2008-09-08 | 2014-07-23 | 新日铁住金化学株式会社 | 高导热性聚酰亚胺膜、高导热性覆金属层合体及其制造方法 |
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CN110546758A (zh) * | 2017-06-23 | 2019-12-06 | 积水化学工业株式会社 | 散热片、散热片的制造方法以及叠层体 |
Families Citing this family (126)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6906292B2 (en) * | 1998-10-29 | 2005-06-14 | Applera Corporation | Sample tray heater module |
US6162849A (en) * | 1999-01-11 | 2000-12-19 | Ferro Corporation | Thermally conductive thermoplastic |
US6048919A (en) | 1999-01-29 | 2000-04-11 | Chip Coolers, Inc. | Thermally conductive composite material |
US7004936B2 (en) * | 2000-08-09 | 2006-02-28 | Cryocor, Inc. | Refrigeration source for a cryoablation catheter |
US6713088B2 (en) * | 1999-08-31 | 2004-03-30 | General Electric Company | Low viscosity filler composition of boron nitride particles of spherical geometry and process |
US7976941B2 (en) | 1999-08-31 | 2011-07-12 | Momentive Performance Materials Inc. | Boron nitride particles of spherical geometry and process for making thereof |
US20070241303A1 (en) * | 1999-08-31 | 2007-10-18 | General Electric Company | Thermally conductive composition and method for preparing the same |
DE10050601B4 (de) * | 1999-10-13 | 2013-05-08 | Murata Manufacturing Co., Ltd. | Haltevorrichtung für elektronische Bauteile und Halteverfahren für solche Bauteile |
US20010049028A1 (en) * | 2000-01-11 | 2001-12-06 | Mccullough Kevin A | Metal injection molding material with high aspect ratio filler |
US6817096B2 (en) * | 2000-01-11 | 2004-11-16 | Cool Options, Inc. | Method of manufacturing a heat pipe construction |
US6620497B2 (en) | 2000-01-11 | 2003-09-16 | Cool Options, Inc. | Polymer composition with boron nitride coated carbon flakes |
US6585039B2 (en) | 2000-02-01 | 2003-07-01 | Cool Options, Inc. | Composite overmolded heat pipe construction |
US6680015B2 (en) | 2000-02-01 | 2004-01-20 | Cool Options, Inc. | Method of manufacturing a heat sink assembly with overmolded carbon matrix |
WO2001096458A1 (de) * | 2000-06-16 | 2001-12-20 | Siemens Aktiengesellschaft | Füllstoff für wärmeleitende kunststoffe, wärmeleitender kunststoff und herstellungsverfahren dazu |
US6710109B2 (en) * | 2000-07-13 | 2004-03-23 | Cool Options, Inc. A New Hampshire Corp. | Thermally conductive and high strength injection moldable composition |
US7235514B2 (en) * | 2000-07-28 | 2007-06-26 | Tri-Mack Plastics Manufacturing Corp. | Tribological materials and structures and methods for making the same |
US20020111415A1 (en) * | 2000-07-28 | 2002-08-15 | Mack Edward J. | Thermoplastic materials with improved thermal conductivity and methods for making the same |
US6851869B2 (en) * | 2000-08-04 | 2005-02-08 | Cool Options, Inc. | Highly thermally conductive electronic connector |
US20020064701A1 (en) * | 2000-09-11 | 2002-05-30 | Hand Doris I. | Conductive liquid crystalline polymer film and method of manufacture thereof |
US6469381B1 (en) * | 2000-09-29 | 2002-10-22 | Intel Corporation | Carbon-carbon and/or metal-carbon fiber composite heat spreader |
US7128804B2 (en) * | 2000-12-29 | 2006-10-31 | Lam Research Corporation | Corrosion resistant component of semiconductor processing equipment and method of manufacture thereof |
US20080036241A1 (en) * | 2001-02-15 | 2008-02-14 | Integral Technologies, Inc. | Vehicle body, chassis, and braking systems manufactured from conductive loaded resin-based materials |
US6600633B2 (en) | 2001-05-10 | 2003-07-29 | Seagate Technology Llc | Thermally conductive overmold for a disc drive actuator assembly |
US20040243118A1 (en) * | 2001-06-01 | 2004-12-02 | Ayers Gregory M. | Device and method for positioning a catheter tip for creating a cryogenic lesion |
US6651736B2 (en) * | 2001-06-28 | 2003-11-25 | Intel Corporation | Short carbon fiber enhanced thermal grease |
US6986435B2 (en) * | 2001-08-23 | 2006-01-17 | Cool Options, Inc. | Self-heating food and beverage container made from a thermally conductive polymer composition |
US20030040563A1 (en) * | 2001-08-23 | 2003-02-27 | Sagal E. Mikhail | Substantially non-abrasive thermally conductive polymer composition containing boron nitride |
US6756005B2 (en) * | 2001-08-24 | 2004-06-29 | Cool Shield, Inc. | Method for making a thermally conductive article having an integrated surface and articles produced therefrom |
US7038009B2 (en) * | 2001-08-31 | 2006-05-02 | Cool Shield, Inc. | Thermally conductive elastomeric pad and method of manufacturing same |
KR100580895B1 (ko) * | 2001-08-31 | 2006-05-16 | 쿨 옵션스, 인코포레이티드 | 열전도성 램프 리플렉터 |
US20030139510A1 (en) * | 2001-11-13 | 2003-07-24 | Sagal E. Mikhail | Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefrom |
US6868610B2 (en) | 2001-11-15 | 2005-03-22 | The Gillette Company | Shaving razors and razor cartridges |
US6919115B2 (en) * | 2002-01-08 | 2005-07-19 | Cool Options, Inc. | Thermally conductive drive belt |
US20030170883A1 (en) * | 2002-03-11 | 2003-09-11 | Corning Incorporated | Microplate manufactured from a thermally conductive material and methods for making and using such microplates |
CN100377786C (zh) * | 2002-04-15 | 2008-04-02 | 库尔选项公司 | 热传导性生物测定盘及其制造方法 |
US20030220432A1 (en) * | 2002-04-15 | 2003-11-27 | James Miller | Thermoplastic thermally-conductive interface articles |
US7935415B1 (en) | 2002-04-17 | 2011-05-03 | Conductive Composites Company, L.L.C. | Electrically conductive composite material |
US20030236335A1 (en) * | 2002-05-13 | 2003-12-25 | Miller James D. | Thermally-conductive plastic substrates for electronic circuits and methods of manufacturing same |
US7147367B2 (en) | 2002-06-11 | 2006-12-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material with low melting alloy |
US20040034344A1 (en) * | 2002-08-16 | 2004-02-19 | Eric Ryba | Tip pressure monitoring for cryoablation catheters |
US6955673B2 (en) * | 2002-08-16 | 2005-10-18 | Cryocor, Inc. | Heat transfer segment for a cryoablation catheter |
US7270890B2 (en) | 2002-09-23 | 2007-09-18 | Siemens Power Generation, Inc. | Wear monitoring system with embedded conductors |
US20040094750A1 (en) * | 2002-11-19 | 2004-05-20 | Soemantri Widagdo | Highly filled composite containing resin and filler |
US7195625B2 (en) * | 2002-12-11 | 2007-03-27 | Cryocor, Inc. | Catheter system for performing a single step cryoablation |
US6919504B2 (en) * | 2002-12-19 | 2005-07-19 | 3M Innovative Properties Company | Flexible heat sink |
US7005573B2 (en) | 2003-02-13 | 2006-02-28 | Parker-Hannifin Corporation | Composite EMI shield |
US7326862B2 (en) * | 2003-02-13 | 2008-02-05 | Parker-Hannifin Corporation | Combination metal and plastic EMI shield |
US7235918B2 (en) * | 2003-06-11 | 2007-06-26 | Cool Options, Inc. | Thermally-conductive plastic articles having light reflecting surfaces |
US6685855B1 (en) * | 2003-06-11 | 2004-02-03 | Cool Options, Inc. | Method of making thermally-conductive casings for optical heads in optical disc players |
US6976769B2 (en) * | 2003-06-11 | 2005-12-20 | Cool Options, Inc. | Light-emitting diode reflector assembly having a heat pipe |
US7033670B2 (en) * | 2003-07-11 | 2006-04-25 | Siemens Power Generation, Inc. | LCT-epoxy polymers with HTC-oligomers and method for making the same |
US7781063B2 (en) | 2003-07-11 | 2010-08-24 | Siemens Energy, Inc. | High thermal conductivity materials with grafted surface functional groups |
US6981382B2 (en) * | 2003-07-24 | 2006-01-03 | Cryocor, Inc. | Distal end for cryoablation catheters |
US20050027289A1 (en) * | 2003-07-31 | 2005-02-03 | Thomas Castellano | Cryoablation systems and methods |
US20050225751A1 (en) * | 2003-09-19 | 2005-10-13 | Donald Sandell | Two-piece high density plate |
US20050280811A1 (en) * | 2003-09-19 | 2005-12-22 | Donald Sandell | Grooved high density plate |
US7070594B2 (en) * | 2004-02-10 | 2006-07-04 | Cryocor, Inc. | System and method for assessing ice ball formation during a cryoablation procedure |
US20050198972A1 (en) * | 2004-03-10 | 2005-09-15 | Lentz David J. | Pressure-temperature control for a cryoablation catheter system |
US8221885B2 (en) * | 2004-06-02 | 2012-07-17 | Cool Options, Inc. a corporation of the State of New Hampshire | Thermally conductive polymer compositions having low thermal expansion characteristics |
US8216672B2 (en) * | 2004-06-15 | 2012-07-10 | Siemens Energy, Inc. | Structured resin systems with high thermal conductivity fillers |
US7553781B2 (en) * | 2004-06-15 | 2009-06-30 | Siemens Energy, Inc. | Fabrics with high thermal conductivity coatings |
US7592045B2 (en) * | 2004-06-15 | 2009-09-22 | Siemens Energy, Inc. | Seeding of HTC fillers to form dendritic structures |
US20050277721A1 (en) * | 2004-06-15 | 2005-12-15 | Siemens Westinghouse Power Corporation | High thermal conductivity materials aligned within resins |
US20080050580A1 (en) * | 2004-06-15 | 2008-02-28 | Stevens Gary C | High Thermal Conductivity Mica Paper Tape |
US7553438B2 (en) * | 2004-06-15 | 2009-06-30 | Siemens Energy, Inc. | Compression of resin impregnated insulating tapes |
US20050274774A1 (en) * | 2004-06-15 | 2005-12-15 | Smith James D | Insulation paper with high thermal conductivity materials |
US20050277349A1 (en) * | 2004-06-15 | 2005-12-15 | Siemens Westinghouse Power Corporation | High thermal conductivity materials incorporated into resins |
US8030818B2 (en) * | 2004-06-15 | 2011-10-04 | Siemens Energy, Inc. | Stator coil with improved heat dissipation |
US7776392B2 (en) * | 2005-04-15 | 2010-08-17 | Siemens Energy, Inc. | Composite insulation tape with loaded HTC materials |
US20050283146A1 (en) * | 2004-06-17 | 2005-12-22 | Lentz David J | Thermally extended spiral cryotip for a cryoablation catheter |
US7156840B2 (en) * | 2004-06-29 | 2007-01-02 | Cryocor, Inc. | Pressure monitor for cryoablation catheter |
US7163535B2 (en) * | 2004-06-30 | 2007-01-16 | Cryocor, Inc. | System for detecting leaks and occlusions in a cryoablation catheter |
US7357797B2 (en) * | 2004-06-30 | 2008-04-15 | Cryocor, Inc. | System and method for varying return pressure to control tip temperature of a cryoablation catheter |
TW200635993A (en) * | 2004-12-17 | 2006-10-16 | Solvay Advanced Polymers Llc | Semi-crystalline polymer composition and article manufactured therefrom |
US7123031B2 (en) * | 2004-12-20 | 2006-10-17 | Siemens Power Generation, Inc. | System for on-line assessment of the condition of thermal coating on a turbine vane |
US20060228542A1 (en) * | 2005-04-08 | 2006-10-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material having spheroidal particulate filler |
US7651963B2 (en) * | 2005-04-15 | 2010-01-26 | Siemens Energy, Inc. | Patterning on surface with high thermal conductivity materials |
US7846853B2 (en) * | 2005-04-15 | 2010-12-07 | Siemens Energy, Inc. | Multi-layered platelet structure |
US7955661B2 (en) * | 2005-06-14 | 2011-06-07 | Siemens Energy, Inc. | Treatment of micropores in mica materials |
US7851059B2 (en) * | 2005-06-14 | 2010-12-14 | Siemens Energy, Inc. | Nano and meso shell-core control of physical properties and performance of electrically insulating composites |
US7781057B2 (en) * | 2005-06-14 | 2010-08-24 | Siemens Energy, Inc. | Seeding resins for enhancing the crystallinity of polymeric substructures |
US20070026221A1 (en) * | 2005-06-14 | 2007-02-01 | Siemens Power Generation, Inc. | Morphological forms of fillers for electrical insulation |
US8357433B2 (en) * | 2005-06-14 | 2013-01-22 | Siemens Energy, Inc. | Polymer brushes |
US7655295B2 (en) | 2005-06-14 | 2010-02-02 | Siemens Energy, Inc. | Mix of grafted and non-grafted particles in a resin |
JP2009510716A (ja) * | 2005-08-26 | 2009-03-12 | クール オプションズ,インコーポレーテッド | 超小型電子機器のダイレベル・パッケージング用熱伝導性サーモプラスチック |
DE102006001947A1 (de) * | 2005-09-12 | 2007-03-29 | Kompled Gmbh & Co. Kg | Heckleuchtenanordnung |
US20080019097A1 (en) * | 2005-10-11 | 2008-01-24 | General Electric Company | Thermal transport structure |
US7297399B2 (en) * | 2005-10-11 | 2007-11-20 | General Electric Company | Thermal transport structure and associated method |
WO2008063709A2 (en) * | 2006-06-20 | 2008-05-29 | Polyone Corporation | Thermally conductive polymer compounds containing zinc sulfide |
WO2008006443A1 (en) * | 2006-07-11 | 2008-01-17 | Dsm Ip Assets B.V. | Lamp sockets |
US7547847B2 (en) * | 2006-09-19 | 2009-06-16 | Siemens Energy, Inc. | High thermal conductivity dielectric tape |
EP2074351B2 (en) * | 2006-10-12 | 2018-05-02 | DSM IP Assets B.V. | Lighting device |
US20080166552A1 (en) * | 2006-11-06 | 2008-07-10 | Arlon, Inc. | Silicone based compositions for thermal interface materials |
US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
KR20090117692A (ko) | 2007-03-06 | 2009-11-12 | 데이진 가부시키가이샤 | 피치계 탄소 섬유, 그 제조 방법 및 성형체 |
US8309225B2 (en) * | 2007-06-29 | 2012-11-13 | Itt Manufacturing Enterprises, Inc. | Thermally conductive structural composite material and method |
KR100963673B1 (ko) * | 2007-10-23 | 2010-06-15 | 제일모직주식회사 | 열전도성 수지 복합재 및 이를 이용한 성형품 |
US8741387B2 (en) * | 2008-10-24 | 2014-06-03 | United Technologies Corporation | Process and system for distributing particles for incorporation within a composite structure |
KR101257693B1 (ko) * | 2008-11-05 | 2013-04-24 | 제일모직주식회사 | 전기절연성 고열전도성 수지 조성물 |
US20100124683A1 (en) * | 2008-11-20 | 2010-05-20 | Mti Microfuel Cells Inc. | Heat spreader assembly for use with a direct oxidation fuel cell |
KR101297156B1 (ko) * | 2008-12-10 | 2013-08-21 | 제일모직주식회사 | 고성능 emi/rfi 차폐용 수지 복합재 |
KR101139412B1 (ko) * | 2008-12-24 | 2012-04-27 | 제일모직주식회사 | 열전도성 절연 수지 조성물 및 플라스틱 성형품 |
US8299159B2 (en) * | 2009-08-17 | 2012-10-30 | Laird Technologies, Inc. | Highly thermally-conductive moldable thermoplastic composites and compositions |
US9061134B2 (en) * | 2009-09-23 | 2015-06-23 | Ripple Llc | Systems and methods for flexible electrodes |
DE102009045063C5 (de) | 2009-09-28 | 2017-06-01 | Infineon Technologies Ag | Leistungshalbleitermodul mit angespritztem Kühlkörper, Leistungshalbleitermodulsystem und Verfahren zur Herstellung eines Leistungshalbleitermoduls |
US20110228481A1 (en) * | 2010-03-19 | 2011-09-22 | Domintech Co., Ltd. | Thermally conductive interface means |
US8529729B2 (en) | 2010-06-07 | 2013-09-10 | Lam Research Corporation | Plasma processing chamber component having adaptive thermal conductor |
CN102971365B (zh) | 2010-06-17 | 2015-07-01 | 迪睿合电子材料有限公司 | 导热性片和其制造方法 |
KR101934600B1 (ko) | 2010-06-25 | 2019-01-02 | 디에스엠 아이피 어셋츠 비.브이. | 중합체 부품의 조립물 |
KR101368315B1 (ko) * | 2010-12-31 | 2014-02-27 | 제일모직주식회사 | 밀드 피치계 탄소섬유를 포함하는 고열전도성 수지 조성물 |
TWI406894B (zh) * | 2011-01-03 | 2013-09-01 | China Steel Corp | Composite material with porous powder and its manufacturing method |
US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
JP6041157B2 (ja) * | 2011-12-27 | 2016-12-07 | パナソニックIpマネジメント株式会社 | 熱伝導性樹脂組成物 |
EP2887390A4 (en) | 2012-05-21 | 2016-03-09 | Toyo Ink Sc Holdings Co Ltd | EASILY DEFORMABLE AGGREGATES AND MANUFACTURING PROCESS THEREOF, THERMOCONDUCTIVE RESIN COMPOSITION, THERMOCONDUCTIVE MEMBER AND PROCESS FOR PRODUCING THE SAME, AND THERMALLY-CONDUCTIVE ADHESION SHEET |
US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
DE102013111306B4 (de) * | 2013-10-14 | 2016-04-14 | Ensinger Gmbh | Herstellungsverfahren für einen plasmabeschichteten Formkörper und Bauteil |
CN106459405B (zh) | 2014-06-19 | 2020-01-14 | 普立万公司 | 导热和导电尼龙混配物 |
KR101709686B1 (ko) | 2015-09-23 | 2017-02-24 | 이석 | 방열구조체용 탄소계 재료의 제조방법 및 이를 이용한 방열구조체의 제조방법 |
WO2017086226A1 (ja) * | 2015-11-19 | 2017-05-26 | 積水化学工業株式会社 | 熱硬化性材料及び硬化物 |
US10385250B2 (en) | 2016-06-14 | 2019-08-20 | Nano And Advanced Materials Institute Limited | Thermally conductive composites and method of preparing same |
WO2018164666A1 (en) | 2017-03-07 | 2018-09-13 | Covestro Llc | Two shot injection molding process for thermoplastic parts |
WO2018235920A1 (ja) * | 2017-06-23 | 2018-12-27 | 積水化学工業株式会社 | 樹脂材料、樹脂材料の製造方法及び積層体 |
US10729564B2 (en) | 2018-01-12 | 2020-08-04 | Ripple Llc | Sensor system |
FR3084202B1 (fr) * | 2018-07-20 | 2020-10-23 | Inst Supergrid | Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication |
US20220397258A1 (en) | 2019-10-15 | 2022-12-15 | Covestro Llc | Three part headlamp assembly |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3398233A (en) * | 1965-04-20 | 1968-08-20 | Dennis G Wyman | Electrical conductor of fibers embedded in an insulator |
US3673121A (en) * | 1970-01-27 | 1972-06-27 | Texas Instruments Inc | Process for making conductive polymers and resulting compositions |
US3708387A (en) * | 1970-09-11 | 1973-01-02 | Univ Drexel | Metallic modified plastic compositions and method for the preparation thereof |
US4098945A (en) * | 1973-07-30 | 1978-07-04 | Minnesota Mining And Manufacturing Company | Soft conductive materials |
JPS5635494A (en) * | 1979-08-30 | 1981-04-08 | Showa Denko Kk | High heat transfer electric insulating substrate |
US4367745A (en) * | 1980-05-27 | 1983-01-11 | Minnesota Mining And Manufacturing Company | Conformable electrically conductive compositions |
US4496475A (en) * | 1980-09-15 | 1985-01-29 | Potters Industries, Inc. | Conductive paste, electroconductive body and fabrication of same |
NL193609C (nl) * | 1981-12-30 | 2000-04-04 | Bekaert Sa Nv | Samengestelde streng voor verwerking als granulaat in kunststofproducten en werkwijze voor het vervaardigen van een kunststofmenggranulaat. |
JPS5964685A (ja) * | 1982-10-05 | 1984-04-12 | Shin Etsu Polymer Co Ltd | 異方導電熱接着性フイルム |
US4689250A (en) * | 1984-11-16 | 1987-08-25 | Siemens Aktiengesellschaft | Cross-linked polymer coated metal particle filler compositions |
EP0231068B1 (en) * | 1986-01-14 | 1994-03-16 | RAYCHEM CORPORATION (a Delaware corporation) | Conductive polymer composition |
US5180513A (en) * | 1987-02-06 | 1993-01-19 | Key-Tech, Inc. | Shielded plastic enclosure to house electronic equipment |
US4816184A (en) * | 1987-02-20 | 1989-03-28 | General Electric Company | Electrically conductive material for molding |
EP0280819B1 (en) * | 1987-02-28 | 1993-05-05 | Taiyo Yuden Co., Ltd. | Electrical resistors, electrical resistors paste and method for making the same |
US5011872A (en) * | 1987-12-21 | 1991-04-30 | The Carborudum Company | Thermally conductive ceramic/polymer composites |
CA1334479C (en) * | 1988-08-29 | 1995-02-21 | Minoru Yoshinaka | Conductive composition and method for making the same |
JPH0297559A (ja) * | 1988-10-03 | 1990-04-10 | Toshiba Silicone Co Ltd | 熱伝導性シリコーン組成物 |
US4992333A (en) * | 1988-11-18 | 1991-02-12 | G&H Technology, Inc. | Electrical overstress pulse protection |
JP2733076B2 (ja) * | 1988-11-28 | 1998-03-30 | 大東通信機株式会社 | Ptc組成物 |
US5011870A (en) * | 1989-02-08 | 1991-04-30 | Dow Corning Corporation | Thermally conductive organosiloxane compositions |
US5213715A (en) * | 1989-04-17 | 1993-05-25 | Western Digital Corporation | Directionally conductive polymer |
GB8913512D0 (en) * | 1989-06-13 | 1989-08-02 | Cookson Group Plc | Coated particulate metallic materials |
JP2883128B2 (ja) * | 1989-11-13 | 1999-04-19 | 三菱化学株式会社 | 導電性熱可塑性樹脂組成物 |
US5073589A (en) * | 1989-12-21 | 1991-12-17 | Dimitrije Milovich | Composite backing structure for spray metal tooling |
US5334330A (en) * | 1990-03-30 | 1994-08-02 | The Whitaker Corporation | Anisotropically electrically conductive composition with thermal dissipation capabilities |
US5175056A (en) * | 1990-06-08 | 1992-12-29 | Potters Industries, Inc. | Galvanically compatible conductive filler |
US5536568A (en) * | 1991-03-12 | 1996-07-16 | Inabagomu Co., Ltd. | Variable-resistance conductive elastomer |
JPH04332404A (ja) * | 1991-05-07 | 1992-11-19 | Nec Corp | 異方性導電材料及びこれを用いた集積回路素子の接続方法 |
US5490319A (en) * | 1992-01-29 | 1996-02-13 | Ebara Corporation | Thermotropic liquid crystal polymer composition and insulator |
EP0578245A3 (en) * | 1992-07-10 | 1994-07-27 | Mitsubishi Petrochemical Co | Process for producing a resin compound |
US5445308A (en) * | 1993-03-29 | 1995-08-29 | Nelson; Richard D. | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal |
US5443876A (en) * | 1993-12-30 | 1995-08-22 | Minnesota Mining And Manufacturing Company | Electrically conductive structured sheets |
US5582770A (en) * | 1994-06-08 | 1996-12-10 | Raychem Corporation | Conductive polymer composition |
JPH08102218A (ja) * | 1994-09-30 | 1996-04-16 | Nec Corp | 異方性導電フィルム |
US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
US5681883A (en) * | 1996-03-05 | 1997-10-28 | Advanced Ceramics Corporation | Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
US5834337A (en) * | 1996-03-21 | 1998-11-10 | Bryte Technologies, Inc. | Integrated circuit heat transfer element and method |
US5863467A (en) * | 1996-05-03 | 1999-01-26 | Advanced Ceramics Corporation | High thermal conductivity composite and method |
US5945217A (en) * | 1997-10-14 | 1999-08-31 | Gore Enterprise Holdings, Inc. | Thermally conductive polytrafluoroethylene article |
US6048919A (en) | 1999-01-29 | 2000-04-11 | Chip Coolers, Inc. | Thermally conductive composite material |
US6465561B1 (en) * | 1999-05-14 | 2002-10-15 | Merrill A. Yarbrough | Corrosion-resistant composition of matter having enhanced thermal conductivity, heat exchangers made therefrom, and method of making same |
JP4301468B2 (ja) * | 1999-07-07 | 2009-07-22 | 信越化学工業株式会社 | 耐熱熱伝導性シリコーンゴム複合シート及びその製造方法 |
-
1999
- 1999-01-29 US US09/239,913 patent/US6048919A/en not_active Expired - Lifetime
- 1999-10-14 CA CA002352095A patent/CA2352095C/en not_active Expired - Fee Related
- 1999-10-14 EP EP99954912A patent/EP1151033B1/en not_active Expired - Lifetime
- 1999-10-14 BR BRPI9917095-7A patent/BR9917095B1/pt not_active IP Right Cessation
- 1999-10-14 ES ES99954912T patent/ES2213395T3/es not_active Expired - Lifetime
- 1999-10-14 KR KR10-2001-7008178A patent/KR100450831B1/ko active IP Right Grant
- 1999-10-14 AU AU11141/00A patent/AU752158B2/en not_active Ceased
- 1999-10-14 WO PCT/US1999/023950 patent/WO2000044823A1/en active IP Right Grant
- 1999-10-14 DE DE1999614807 patent/DE69914807T2/de not_active Expired - Lifetime
- 1999-10-14 CN CNB998158100A patent/CN1150258C/zh not_active Expired - Fee Related
- 1999-10-14 MX MXPA01007656A patent/MXPA01007656A/es active IP Right Grant
- 1999-10-14 AT AT99954912T patent/ATE259392T1/de active
- 1999-10-14 JP JP2000596073A patent/JP4087068B2/ja not_active Expired - Fee Related
- 1999-10-14 PT PT99954912T patent/PT1151033E/pt unknown
-
2000
- 2000-03-13 TW TW089101431A patent/TWI285656B/zh not_active IP Right Cessation
- 2000-03-23 US US09/534,409 patent/US6251978B1/en not_active Expired - Lifetime
-
2002
- 2002-04-29 HK HK02103188.4A patent/HK1043141B/zh not_active IP Right Cessation
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CN101861353B (zh) * | 2007-11-16 | 2013-07-17 | 纳幕尔杜邦公司 | 导热树脂组合物 |
CN102149542B (zh) * | 2008-09-08 | 2014-07-23 | 新日铁住金化学株式会社 | 高导热性聚酰亚胺膜、高导热性覆金属层合体及其制造方法 |
TWI513575B (zh) * | 2010-03-10 | 2015-12-21 | Nippon Steel & Sumikin Chem Co | 熱傳導性聚醯亞胺薄膜及使用該薄膜之熱傳導性積層體 |
CN105579511B (zh) * | 2013-06-19 | 2018-11-09 | 3M创新有限公司 | 由聚合物/氮化硼复合物制备的组成部件、用于制备此类组成部件的聚合物/氮化硼复合物及其用途 |
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CN108353523B (zh) * | 2015-11-25 | 2020-02-25 | 株式会社巴川制纸所 | 匹配型电磁波吸收体 |
US10843445B2 (en) | 2015-11-25 | 2020-11-24 | Tomoegawa Co., Ltd. | Matched-type electromagnetic wave absorber |
CN110546758A (zh) * | 2017-06-23 | 2019-12-06 | 积水化学工业株式会社 | 散热片、散热片的制造方法以及叠层体 |
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CN110527190A (zh) * | 2019-09-05 | 2019-12-03 | 上海阿莱德实业股份有限公司 | 一种聚合物基导热界面材料及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
DE69914807T2 (de) | 2005-01-13 |
US6048919A (en) | 2000-04-11 |
KR20010099969A (ko) | 2001-11-09 |
AU1114100A (en) | 2000-08-18 |
KR100450831B1 (ko) | 2004-10-01 |
US6251978B1 (en) | 2001-06-26 |
MXPA01007656A (es) | 2004-04-21 |
PT1151033E (pt) | 2004-06-30 |
EP1151033A1 (en) | 2001-11-07 |
BR9917095A (pt) | 2001-10-30 |
WO2000044823A1 (en) | 2000-08-03 |
HK1043141A1 (en) | 2002-09-06 |
ES2213395T3 (es) | 2004-08-16 |
CA2352095C (en) | 2006-01-10 |
TWI285656B (en) | 2007-08-21 |
BR9917095B1 (pt) | 2009-12-01 |
JP2002535469A (ja) | 2002-10-22 |
CA2352095A1 (en) | 2000-08-03 |
EP1151033A4 (en) | 2002-10-30 |
EP1151033B1 (en) | 2004-02-11 |
CN1150258C (zh) | 2004-05-19 |
AU752158B2 (en) | 2002-09-05 |
DE69914807D1 (de) | 2004-03-18 |
HK1043141B (zh) | 2004-12-03 |
ATE259392T1 (de) | 2004-02-15 |
JP4087068B2 (ja) | 2008-05-14 |
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